LED lamp panel

By adopting a combination design of circuit substrate and mixed light structure board in the LED light board, and taking advantage of the light reflection and transmission of reflectors and semi-transparent and semi-reflective films, the problem of poor light uniformity of the LED light board is solved, achieving more uniform light distribution and improving production efficiency.

CN223425137UActive Publication Date: 2025-10-10CHANGSHA HKC OPTOELECTRONICS CO LTD +1
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Patent Information

Application Number
CN202422986609.2
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-04
Publication Date
2025-10-10
Estimated Expiration
2034-12-04

AI Technical Summary

Technical Problem

Existing LED light panels have gaps between adjacent LEDs, resulting in poor light uniformity.

Method used

A stacked circuit substrate and a light-mixing structure board are used. The circuit substrate is provided with an array of reflectors and light sources. The light-mixing structure board is provided with a light trough and a semi-transparent and semi-reflective film. The reflectors reflect light, and the semi-transparent and semi-reflective film transmits and reflects light to uniform the brightness of the light source area. The density of the reflection points is differentiated to reduce the brightness difference.

Benefits of technology

It improves the light uniformity of the LED light panel, simplifies the production process, reduces material and cost consumption, and improves production efficiency and stability.

✦ Generated by Eureka AI based on patent content.

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    Figure CN223425137U_ABST
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Abstract

The LED lamp panel comprises a circuit substrate and a light mixing structural plate which are arranged in a stacked mode, a semi-transparent and semi-reflective film is arranged on the side, away from the circuit substrate, of the light mixing structural plate, a plurality of reflecting parts and a plurality of light source parts are arranged on the side, facing the light mixing structural plate, of the circuit substrate, and the reflecting parts and the light source parts are arranged in an array mode. Four light source parts are annularly arranged on the periphery of each reflecting part, a plurality of lamp grooves are formed in the side, facing the circuit substrate, of the light mixing structural plate, the lamp grooves correspond to the light source parts one to one, and the lamp grooves are used for containing the corresponding light source parts. According to the LED lamp panel, the circuit substrate and the light mixing structure plate are arranged to be matched with each other, when the light source part emits light, the dark area, provided with the reflecting part, of the circuit substrate can also generate light, and therefore the light emitting uniformity of the LED lamp panel is improved.
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Description

Technical Field

[0001] The present application belongs to the technical field of display devices, and more specifically, relates to an LED light board. Background Art

[0002] LED (Light Emitting Diode) light panels are widely used in the field of display devices. LED lamp beads with a diameter of less than 100 microns can be used to produce LED light panels with dense pixels to improve brightness and contrast, thereby enabling display devices equipped with LED light panels to have higher screen resolution and higher image quality.

[0003] When the existing LED light board emits light, the front of each LED is brighter, and the gaps between adjacent LEDs will produce dark areas, resulting in uneven LED light mixing. Therefore, there is a problem of poor light uniformity of the LED light board. Utility Model Content

[0004] One of the purposes of the embodiments of the present application is to provide an LED light board to solve the technical problem in the prior art that the LED light board has poor light uniformity due to dark areas generated by gaps between adjacent LEDs.

[0005] In order to solve the above technical problems, in the first aspect, an embodiment of the present application provides an LED light board, which includes a stacked circuit substrate and a mixed light structure board, and the side of the mixed light structure board facing away from the circuit substrate is provided with a semi-transparent and semi-reflective film; the side of the circuit substrate facing the mixed light structure board is provided with a plurality of reflective parts and a plurality of light source parts, and the plurality of reflective parts and the plurality of light source parts are arranged in an array, and four light source parts are arranged around the outer periphery of each reflective part; the side of the mixed light structure board facing the circuit substrate is provided with a plurality of lamp grooves, and the plurality of lamp grooves correspond one-to-one to the plurality of light source parts, and the lamp grooves are used to place the corresponding light source parts.

[0006] The beneficial effect of the LED light board provided by the present application is that: by setting a circuit substrate and a mixed light structure board to cooperate with each other, the circuit substrate is provided for the installation of the light source component, and the lamp trough of the mixed light structure board can physically protect the light source component; compared with the LED light board in the prior art, the circuit substrate of the present application is provided with multiple reflectors, and the multiple reflectors and the multiple light sources are arranged in an array, and four light sources are arranged around the outer periphery of each reflector, so that the dark area formed on the circuit substrate when the light source component emits light is provided with a reflector, and the semi-transparent and semi-reflective film can transmit a part of the light emitted by the light source component, so that the area of ​​the circuit substrate where the light source component is provided generates light, and the semi-transparent and semi-reflective film can also reflect another part of the light emitted by the light source component to the reflector, so that the dark area of ​​the circuit substrate where the reflector component is provided also generates light, thereby improving the light output uniformity of the LED light board.

[0007] In a feasible technical solution, the reflective element includes a plurality of reflective points distributed in a grid pattern, and the density of the plurality of reflective points gradually decreases from the center of the reflective element to the edge of the reflective element.

[0008] By adopting such a design, the density of the multiple reflection points is differentiated at different positions of the reflector, so that the reflection points at the edge of the reflector closer to the light source can reflect less light, and the reflection points at the center of the reflector farther from the light source can reflect more light, so that the center position of the reflector can be brighter than the edge position of the reflector, so as to reduce the brightness difference between the light source and its surroundings and the reflector on the circuit substrate, thereby improving the light output uniformity of the LED light board.

[0009] In a feasible technical solution, the plurality of reflection points are arranged in a centrally symmetrical or axially symmetrical manner.

[0010] By adopting such a design, the arrangement of the multiple reflection points constituting the reflective element can be made simpler and more orderly, and the reflective element can better reflect light.

[0011] In a feasible technical solution, the surface of the lamp groove facing the light source is arc-shaped.

[0012] By adopting such a design, the lamp trough can physically protect the light source component, thereby saving the materials and processes required for setting up support columns between the circuit substrate and the light mixing structure plate, thereby improving production efficiency.

[0013] In a feasible technical solution, the plurality of reflective elements and the circuit substrate are integrally injection molded.

[0014] By adopting such a design, the production efficiency of installing the reflector on the circuit substrate can be improved, and the stability of the reflector installed on the circuit substrate can be ensured, thereby preventing the reflector from falling off the circuit substrate.

[0015] In a feasible technical solution, the semi-transparent and semi-reflective film includes a plurality of film units arranged in an array, the plurality of film units correspond one-to-one to the plurality of lamp troughs, and the film units cover a portion of the surface of the light mixing structure plate where the lamp troughs are provided.

[0016] By adopting such a design, the semi-transparent and semi-reflective film is designed to be a plurality of film units distributed in an array, which can save the raw materials consumed in the process of setting the semi-transparent and semi-reflective film on the light mixing structure plate, thereby further reducing production costs.

[0017] In a feasible technical solution, the orthographic projection area of ​​the membrane unit is not less than the area of ​​the light source component.

[0018] By adopting such a design, each of the film units can cover the top of the corresponding light source component, so that more light emitted by the light source component passes through the film unit, thereby ensuring the uniform light effect of the film unit.

[0019] In a feasible technical solution, the center of the film unit, the center of the lamp trough and the center of the reflector are collinear.

[0020] By adopting such a design, the light emitted by the light source can be propagated in a more orderly manner, thereby ensuring the uniformity of the light output of the entire LED light panel.

[0021] In a feasible technical solution, the membrane unit is circular, elliptical or polygonal.

[0022] By adopting such a design, the membrane unit can be selected into different shapes to adapt to different production requirements.

[0023] In a feasible technical solution, the semi-transparent and semi-reflective film is a single film structure, and the semi-transparent and semi-reflective film covers the entire surface of the light-mixing structure plate.

[0024] By adopting such a design, the semi-transparent and semi-reflective film is designed as a single film structure, which can save the time and manpower required for the process of setting the semi-transparent and semi-reflective film on the light mixing structure plate, thereby further improving production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0026] Figure 1 A top view of the LED light board provided in an embodiment of the present application;

[0027] Figure 2 This is a side view of an LED light board in one embodiment of the present application;

[0028] Figure 3 This is a side view of an LED light board in another embodiment of the present application.

[0029] Among them, the reference numerals in the figures are:

[0030] 10. Circuit substrate;

[0031] 20. Mixed light structure board; 201. Light trough;

[0032] 30. Semi-transparent and semi-reflective membrane; 31. Membrane unit;

[0033] 40. Reflective parts;

[0034] 50. Light source components. DETAILED DESCRIPTION

[0035] In order to make the technical problems, technical solutions and beneficial effects to be solved by this application more clearly understood, this application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.

[0036] It should be noted that when an element is referred to as being “fixed on” or “disposed on” another element, it may be directly on the other element or indirectly on the other element. When an element is referred to as being “connected to” another element, it may be directly connected to the other element or indirectly connected to the other element.

[0037] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0038] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. Throughout the description of this application, "plurality" means two or more, unless otherwise specifically defined.

[0039] The following is a detailed description with reference to the accompanying drawings and embodiments:

[0040] Please also refer to Figures 1 to 2The embodiment of the present application provides an LED light board, which includes a stacked circuit substrate 10 and a light-mixing structure board 20. A semi-transparent and semi-reflective film 30 is provided on the side of the light-mixing structure board 20 facing away from the circuit substrate 10. A plurality of reflective elements 40 and a plurality of light source elements 50 are provided on the side of the circuit substrate 10 facing the light-mixing structure board 20. The plurality of reflective elements 40 and the plurality of light source elements 50 are arranged in an array, and four light source elements 50 are arranged around the outer periphery of each reflective element 40. A plurality of lamp grooves 201 are provided on the side of the light-mixing structure board 20 facing the circuit substrate 10. The plurality of lamp grooves 201 correspond one-to-one to the plurality of light source elements 50, and the lamp grooves 201 are used to place the corresponding light source elements 50.

[0041] By setting the circuit substrate 10 and the mixed light structure plate 20 to cooperate with each other, the circuit substrate 10 is provided for the installation of the light source component 50, and the lamp trough 201 of the mixed light structure plate 20 can physically protect the light source component 50. The circuit substrate 10 is provided with a plurality of reflectors 40, and the plurality of reflectors 40 and the plurality of light source components 50 are arranged in an array. Four light source components 50 are arranged around the outer periphery of each reflector 40, so that when the light source component 50 emits light, the dark area formed on the circuit substrate 10 is provided with a reflector 40. The semi-transparent and semi-reflective film 30 can transmit a part of the light emitted by the light source component 50, so that the area of ​​the circuit substrate 10 where the light source component 50 is provided generates light. The semi-transparent and semi-reflective film 30 can also reflect another part of the light emitted by the light source component 50 to the reflector 40, so that the dark area of ​​the circuit substrate 10 where the reflector 40 is provided also generates light, thereby improving the light output uniformity of the LED lamp board.

[0042] In application, multiple reflective elements 40 are arranged on the circuit substrate 10 in a first matrix, and multiple light source elements 50 are arranged on the circuit substrate 10 in a second matrix. The number of rows of the first matrix is ​​one less than the number of rows of the second matrix, and the number of columns of the first matrix is ​​one less than the number of columns of the second matrix. Each row of reflective elements 40 and each row of light source elements 50 are parallel to each other, and each column of reflective elements 40 and each column of light source elements 50 are parallel to each other, so that four light source elements 50 are arranged around the periphery of each reflective element 40.

[0043] In practice, the mixed light structure panel 20 is made of a transparent, optical-grade material such as PMMA (Polymethyl Methacrylate), PC (Polycarbonate), or glass to transmit light emitted by the light source 50. PMMA offers excellent light transmittance, approaching the transparency of glass. It is also lightweight, impact-resistant, easy to process, chemically stable, and weather-resistant. PC boasts exceptionally high impact strength, approximately 200 times that of PMMA, while also offering excellent light transmittance, heat resistance, and dimensional stability. Glass offers the highest transparency and optical quality, resists yellowing, and exhibits excellent chemical stability and heat resistance.

[0044] In application, the light source 50 is a round or square LED lamp bead.

[0045] In application, when assembling the LED light board, multiple light source components 50 are first arranged in an array and welded to the circuit substrate 10, and then the circuit substrate 10 and the mixed light structure board 20 are bonded by double-sided tape, resin glue, UV (Ultraviolet Rays) glue, etc.

[0046] In one embodiment, please refer to Figures 1 to 2 The reflective element 40 includes a plurality of reflective points distributed in a grid pattern, and the density of the plurality of reflective points gradually decreases from the center of the reflective element 40 to the edge of the reflective element 40 .

[0047] In application, the density of multiple reflection points is designed differently at different positions of the reflector 40, so that the reflection points at the edge of the reflector 40 closer to the light source 50 can reflect less light, and the reflection points at the center of the reflector 40 farther away from the light source 50 can reflect more light, so that the center position of the reflector 40 can be brighter than the edge position of the reflector 40, so as to reduce the brightness difference between the light source 50 and its surroundings and the reflector 40 on the circuit substrate 10, thereby improving the light output uniformity of the LED light board.

[0048] In one embodiment, please refer to Figures 1 to 2 , multiple reflection points are arranged in a central symmetrical or axisymmetric manner.

[0049] In application, by adopting such a design, the arrangement of the multiple reflection points constituting the reflector 40 can be made simpler and more orderly, and the reflector 40 can better reflect light.

[0050] In one embodiment, please refer to Figures 1 to 2 The surface of the lamp groove 201 facing the light source component 50 is in an arc shape.

[0051] In application, by adopting such a design, the lamp trough 201 can physically protect the light source 50, thereby saving the materials and processes required to set the support column between the circuit substrate 10 and the mixed light structure board 20, thereby improving production efficiency.

[0052] In application, the surface of the lamp trough 201 facing the light source 50 is set to be arc-shaped, which can reduce the loss of light emitted by the light source 50 due to refraction or reflection in the process of penetrating the lamp trough 201, and has higher light transmission efficiency and is more energy-saving.

[0053] Specifically, the light mixing structure plate 20 can be processed by injection molding, etching, CNC (Computer Numerical Control), etc. to form the lamp groove 201. Injection molding is a manufacturing process that injects molten plastic into a mold cavity and cools to obtain the desired shape of the part. It is suitable for mass production, cost-effective, can quickly produce complex shaped products, and can achieve integrated molding, reducing assembly steps. Chemical etching is a process that uses chemical solutions to remove the surface of the material to form patterns; laser etching is a fine engraving on the surface of the material using a high-energy density laser beam. It can achieve very fine and complex patterns, suitable for making microstructures such as optical textures or patterns on light guide plates. CNC machining refers to using a computer numerical control machine tool to automatically process workpieces according to pre-programmed instructions, which can perform cutting, drilling, milling and other operations. It has high precision and can process complex three-dimensional shapes, suitable for prototype making and small-batch customized production; it is flexible and can quickly adjust the processing program according to needs.

[0054] In one embodiment, referring to Figures 1 to 2 , the plurality of reflecting elements 40 are integrally injection molded with the circuit substrate 10.

[0055] In application, by adopting such design, the production efficiency of the circuit substrate 10 installing the reflecting elements 40 can be improved, and the stability of the reflecting elements 40 installed on the circuit substrate 10 can be ensured, avoiding the reflecting elements 40 from falling off the circuit substrate 10.

[0056] Understandably, in other embodiments of the present application, according to different production conditions or product requirements, the reflecting elements 40 can also be formed on the circuit substrate 10 by printing ink, and the ink pattern can adopt a plurality of white dots distributed in a dot pattern.

[0057] In one embodiment, referring to Figures 1 to 2 , the semi-transparent and semi-reflective film 30 includes a plurality of film units 31 arranged in an array, the plurality of film units 31 correspond one-to-one to the plurality of lamp grooves 201, and the film unit 31 covers part of the surface of the light mixing structure plate 20 at the position where the lamp groove 201 is provided.

[0058] In application, by adopting such design, the semi-transparent and semi-reflective film 30 is designed as a plurality of film units 31 arranged in an array, which can save the raw materials consumed by the process of setting the semi-transparent and semi-reflective film 30 on the light mixing structure plate 20, so as to further reduce the production cost.

[0059] Specifically, the film unit 31 can be set on the light mixing structure plate 20 by attaching, metal evaporation, printing, etc.

[0060] In one embodiment, referring to Figures 1 to 2The projection area of the film unit 31 is not less than the area of the light source 50.

[0061] In application, by adopting such design, each film unit 31 can cover the directly above corresponding light source 50, so that more light emitted by the light source 50 can pass through the film unit 31, to ensure the light uniformity of the film unit 31.

[0062] In one embodiment, please refer to Figures 1 to 2 The center of the film unit 31, the center of the lamp groove 201 and the center of the reflector 40 are collinear.

[0063] In application, by adopting such design, the light emitted by the light source 50 can be more orderly propagated, to ensure the light uniformity of the whole LED lamp panel.

[0064] In one embodiment, please refer to Figures 1 to 2 The film unit 31 is circular, elliptical or polygonal.

[0065] In application, by adopting such design, the film unit 31 can be selected in different shapes to adapt to different production needs.

[0066] In one embodiment, please refer to Figure 3 The semi-transparent and semi-reflective film 30 is a single film structure, and the semi-transparent and semi-reflective film 30 covers the whole surface of the light mixing structure plate 20.

[0067] In application, by adopting such design, the semi-transparent and semi-reflective film 30 is designed as a single film structure, which can save the time and manpower consumed by the process of setting the semi-transparent and semi-reflective film 30 on the light mixing structure plate 20, to further improve the production efficiency.

[0068] The above are only the preferred embodiments of the present application, and are not used to limit the present application, any modification, equivalent replacement and improvement made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. An LED light board, characterized in that: It comprises a circuit substrate (10) and a light-mixing structure plate (20) which are stacked, wherein a semi-transparent and semi-reflective film (30) is provided on a side of the light-mixing structure plate (20) facing away from the circuit substrate (10); A plurality of reflective elements (40) and a plurality of light source elements (50) are provided on a side of the circuit substrate (10) facing the light mixing structure plate (20), the plurality of reflective elements (40) and the plurality of light source elements (50) are arranged in an array, and four light source elements (50) are provided around the periphery of each reflective element (40); A plurality of light troughs (201) are provided on a side of the light mixing structure plate (20) facing the circuit substrate (10), the plurality of light troughs (201) correspond one-to-one to the plurality of light source components (50), and the light troughs (201) are used to accommodate the corresponding light source components (50).

2. The LED light board according to claim 1, characterized in that: The reflective element (40) comprises a plurality of reflective points distributed in a grid pattern, and the density of the plurality of reflective points gradually decreases from the center of the reflective element (40) to the edge of the reflective element (40).

3. The LED light board according to claim 2, characterized in that: The plurality of reflection points are arranged in a centrally symmetrical or axisymmetric manner.

4. The LED light board according to claim 1, characterized in that: The surface of the lamp trough (201) facing the light source component (50) is in an arc shape.

5. The LED light board according to claim 1, characterized in that: The plurality of reflective elements (40) and the circuit substrate (10) are integrally injection-molded.

6. The LED light board according to claim 1, characterized in that: The semi-transmissive and semi-reflective film (30) comprises a plurality of film units (31) arranged in an array, the plurality of film units (31) corresponding one-to-one to the plurality of light troughs (201), and the film units (31) covering a portion of the surface of the light mixing structure plate (20) where the light troughs (201) are provided.

7. The LED light board according to claim 6, characterized in that: The orthographic projection area of ​​the film unit (31) is not less than the area of ​​the light source component (50).

8. The LED light board according to claim 6, characterized in that: The center of the film unit (31), the center of the lamp trough (201), and the center of the reflector (40) are collinear.

9. The LED light board according to claim 6, characterized in that: The membrane unit (31) is circular, elliptical or polygonal.

10. The LED light board according to claim 1, wherein: The semi-transparent and semi-reflective film (30) is a single film structure, and the semi-transparent and semi-reflective film (30) covers the entire surface of the light-mixing structure plate (20).