Semiconductor refrigerator

Abstract

The utility model discloses a semiconductor cooler, which comprises a semiconductor chilling plate, a cold accumulation block, a heat dissipation block, a heat dissipation fan, a bottom shell and an upper shell, one side of the semiconductor chilling plate is a refrigeration surface, the other side of the semiconductor chilling plate is a heat dissipation surface, and the cold accumulation block is attached to the refrigeration surface of the semiconductor chilling plate to form a refrigeration end. The heat dissipation block is attached to the heat dissipation face of the semiconductor chilling plate to form a heat dissipation end, a heat dissipation fan is arranged on the bottom shell, the upper shell covers the bottom shell, a support is installed on the bottom shell, a cold conduction inclined face and a heat dissipation inclined face are arranged on the upper side of the support, and supporting feet are arranged on the lower side of the support. The refrigeration end of the semiconductor refrigeration piece and the heat dissipation end of the semiconductor refrigeration piece are installed on the support, the inner edge of the upper portion of the refrigeration end cold storage block is attached to the lower edge of the cold conduction inclined face, and the inner edge of the upper portion of the heat dissipation end heat dissipation block is attached to the lower edge of the heat dissipation inclined face.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor refrigeration, in particular to a semiconductor refrigerator. Background Art

[0002] Semiconductor refrigeration has the characteristics of small size and portability, and is suitable for temperature regulation in small outdoor spaces. However, when the size of existing semiconductor refrigeration devices is reduced, their cooling effect is also reduced, resulting in low cooling efficiency of existing small semiconductor refrigerators. Utility Model Content

[0003] The purpose of the utility model is to provide a semiconductor refrigerator.

[0004] The utility model aims to solve the problem of low refrigeration efficiency of the existing semiconductor refrigerator.

[0005] To achieve the purpose of the present invention, the present invention adopts the following technical scheme: the semiconductor refrigerator described in the present invention includes a semiconductor refrigeration plate, a cold storage block, a heat dissipation block, a heat dissipation fan, a bottom shell, and an upper shell. One side of the semiconductor refrigeration plate is a cooling surface, and the other side is a heat dissipation surface. The cold storage block is attached to the cooling surface of the semiconductor refrigeration plate to form a cooling end, and the heat dissipation block is attached to the heat dissipation surface of the semiconductor refrigeration plate to form a heat dissipation end. A heat dissipation fan is provided on the bottom shell, and the upper shell covers the bottom shell. A bracket is installed on the bottom shell, and a cooling slope and a heat dissipation slope are provided on the upper side of the bracket, and a support leg is provided on the lower side. The cooling end of the semiconductor refrigeration plate and the heat dissipation end of the semiconductor refrigeration plate are installed on the bracket, and the upper inner edge of the cold storage block at the cooling end is attached to the lower edge of the cooling slope, and the upper inner edge of the heat dissipation block at the heat dissipation end is attached to the lower edge of the heat dissipation slope.

[0006] Preferably, a cooling channel is provided in the cold storage block, and a heat dissipation channel is provided in the heat dissipation block.

[0007] Preferably, the width L1 of the cold storage block is the same as the width L of the semiconductor refrigeration fin, and the width L2 of the heat dissipation block is wider than the width L of the semiconductor refrigeration fin.

[0008] Preferably, a heat preservation sheet is provided on the outside of the cold storage block, and a heat insulation sheet is provided on the outside of the heat dissipation block.

[0009] Preferably, an air guide channel is provided in the bottom shell, the lower portion of the cooling channel of the cooling block faces the air guide channel, and the lower portion of the heat dissipation channel of the heat dissipation block faces the air guide channel.

[0010] Preferably, the bracket is provided with a rear fitting edge and a front fitting edge, and the upper shell is provided with a heat dissipation grille hole and an air inlet channel. After the upper shell is covered on the bottom shell, the rear fitting edge of the bracket is fitted to the inner wall of the upper shell and the upper part of the rear fitting edge is located above the heat dissipation grille hole of the upper shell, so that the heat dissipation grille hole is connected to the heat dissipation channel of the heat dissipation block.

[0011] Preferably, a cooling grid hole is provided on the upper part of the bottom shell. After the bracket is installed on the bottom shell, the front fitting edge of the bracket fits against the inner wall of the bottom shell and the upper part of the front fitting edge is located above the cooling grid hole of the bottom shell, so that the cooling grid hole is connected to the cooling channel of the cold storage block.

[0012] Preferably, a power connector is installed inside the bottom shell, and a wire lead-out hole is provided on the bracket.

[0013] Preferably, the heat dissipation block is formed by repeatedly folding a metal plate, and the material of the metal plate is copper or aluminum; the cold storage block is formed by repeatedly folding a conductive metal, including folding into a wavy shape, and the material of the metal plate is copper or aluminum.

[0014] Preferably, the fan is a centrifugal fan or an axial flow fan.

[0015] The beneficial effects of the present invention are as follows: The design of the cooling and heat dissipation slopes of the present invention's bracket facilitates efficient output of cold air and faster heat dissipation, thereby improving cooling efficiency. The design of the heat dissipation block being wider than the width of the semiconductor cooling plate facilitates faster heat dissipation and more efficient cooling. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is an exploded view of the present utility model.

[0017] Figure 2 It is a structural schematic diagram of the utility model after the upper shell is opened.

[0018] Figure 3 It is a structural schematic diagram of the cold storage block of the utility model.

[0019] Figure 4 It is a structural schematic diagram of the semiconductor refrigeration plate of the utility model.

[0020] Figure 5 It is a structural schematic diagram of the heat dissipation block of the utility model.

[0021] Figure 6 It is a structural schematic diagram of the bracket of the utility model.

[0022] Figure 7 It is a structural schematic diagram of the utility model in which a bracket is installed with a cold storage block.

[0023] Figure 8It is the structure schematic view of bottom shell of the utility model. DETAILED DESCRIPTION

[0024] The utility model makes further explanation in combination with additional drawing and specific embodiment.

[0025] The utility model provides a kind of semiconductor refrigerator, including semiconductor refrigerating sheet 1, cold storage block 2, heat dissipation block 3, heat dissipation fan 8, bottom shell 10, upper shell 9, the one side of the semiconductor refrigerating sheet is refrigeration face, the other side is heat dissipation face, the cold storage block 2 is pasted to the refrigeration face of semiconductor refrigerating sheet 1 and constitutes refrigeration end, the heat dissipation block 3 is pasted to the heat dissipation face of semiconductor refrigerating sheet 1 and constitutes heat dissipation end.The bottom shell 10 is equipped with heat dissipation fan 8, and the upper shell 9 is covered on bottom shell 10.The bracket 6 is installed on the bottom shell 10, and the bracket 6 upper side is equipped with cooling slope 61 and heat dissipation slope 62, and lower side is equipped with support leg 63 and support leg 64.

[0026] The refrigeration end of the semiconductor refrigerating sheet and the heat dissipation end of semiconductor refrigerating sheet are installed on bracket, and the upper inner edge of the refrigeration end cold storage block 2 is pasted to the lower edge of cooling slope 61, and the upper inner edge of the heat dissipation block 3 of heat dissipation end is pasted to the lower edge of heat dissipation slope 62.

[0027] The cold storage block 2 is equipped with cooling channel 21, and the heat dissipation block 3 is equipped with heat dissipation channel 31.The cold storage block width L1 is same with semiconductor refrigerating sheet width L.The heat dissipation block width L2 is wider than semiconductor refrigerating sheet width L, to increase the refrigeration effect of semiconductor refrigerating sheet 1.The outer side of the cold storage block 2 is equipped with heat preservation sheet 4, and the outer side of the heat dissipation block 3 is equipped with heat insulation sheet 5.

[0028] The bottom shell is equipped with air guide channel 101, and the lower air inlet end of the cooling channel 21 of the cold storage block 2 is opposite air guide channel 101, and the lower air inlet end of the heat dissipation channel 31 of the heat dissipation block 3 is opposite air guide channel 101.

[0029] The bracket is equipped with rear bonding edge and front bonding edge, and the rear bonding edge includes bonding edge 65, bonding edge 66 and bonding edge 68, and the front bonding edge includes bonding edge 67.

[0030] The upper shell 9 is equipped with heat dissipation grid hole 91 and air inlet channel 92.The upper shell 9 is covered on bottom shell 10, and the bonding edge 66 of bracket is bonded to the inner wall of upper shell 9, and bonding edge 66 is located the upper part of heat dissipation grid hole 91 of upper shell, so that the heat dissipation grid hole 91 is communicated with the heat dissipation channel 31 of heat dissipation block, and the heat dissipation slope 62 is conducive to the flow of airflow.The airflow blown by heat dissipation fan 8 passes through heat dissipation channel 31, heat dissipation slope 62 and heat dissipation grid hole 91, and the heat of heat dissipation block is quickly blown away, to achieve the effect of fast refrigeration.

[0031] The bottom shell 10 is provided with a cooling grid hole 102 on its upper portion. After the bracket 6 is mounted on the bottom shell, the contact edge 67 of the bracket 6 contacts the inner wall of the bottom shell 10 and is located above the cooling grid hole 101 of the bottom shell, connecting the cooling grid hole 102 with the cooling channel 21 of the cold storage block 2. The cooling slope 61 facilitates airflow. The airflow from the cooling fan 8 passes through the cooling channel 21, the cooling slope 61, and the cooling grid hole 102 and is blown outward to produce cool air.

[0032] A power connector 7 is also installed inside the bottom shell 10. A wire lead-out hole 69 is provided on the bracket 6.

[0033] The heat dissipation block 3 is formed by repeatedly folding a metal plate, and the material of the metal plate is copper or aluminum. The cold storage block 2 is formed by repeatedly folding a conductive metal, including folding into a wave shape, and the material of the metal plate is copper or aluminum.

[0034] The fan 8 is a centrifugal fan or an axial flow fan.

Claims

1. A semiconductor refrigerator, comprising a semiconductor refrigeration sheet, a cold storage block, a heat sink block, a cooling fan, a bottom shell, and an upper shell, wherein one side of the semiconductor refrigeration sheet is a cooling surface and the other side is a heat sink, the cold storage block is attached to the cooling surface of the semiconductor refrigeration sheet to form a cooling end, the heat sink block is attached to the heat sink surface of the semiconductor refrigeration sheet to form a heat sink, the bottom shell is provided with a cooling fan, and the upper shell covers the bottom shell, characterized in that: A bracket is installed on the bottom shell, and a cooling slope and a heat dissipation slope are provided on the upper side of the bracket, and a support leg is provided on the lower side. The cooling end and the heat dissipation end of the semiconductor refrigeration plate are installed on the bracket, and the upper inner edge of the cooling end cold storage block is attached to the lower edge of the cooling slope, and the upper inner edge of the heat dissipation block at the heat dissipation end is attached to the lower edge of the heat dissipation slope.

2. A semiconductor refrigerator according to claim 1, characterized in that: A cooling channel is provided in the cold storage block, and a heat dissipation channel is provided in the heat dissipation block.

3. A semiconductor refrigerator according to claim 1, characterized in that: The width L1 of the cold storage block is the same as the width L of the semiconductor refrigeration plate, and the width L2 of the heat dissipation block is wider than the width L of the semiconductor refrigeration plate.

4. A semiconductor refrigerator according to claim 1, characterized in that: A heat preservation sheet is provided on the outside of the cold storage block, and a heat insulation sheet is provided on the outside of the heat dissipation block.

5. The semiconductor refrigerator according to claim 1, characterized in that: An air guide channel is provided in the bottom shell, the lower portion of the cooling channel of the cooling block faces the air guide channel, and the lower portion of the heat dissipation channel of the heat dissipation block faces the air guide channel.

6. The semiconductor refrigerator according to claim 1, characterized in that: The bracket is provided with a front fitting edge and a rear fitting edge, and the upper shell is provided with a heat dissipation grille hole and an air inlet channel. After the upper shell is covered on the bottom shell, the rear fitting edge of the bracket is fitted to the inner wall of the upper shell and the upper part of the rear fitting edge is located above the heat dissipation grille hole of the upper shell, so that the heat dissipation grille hole is connected to the heat dissipation channel of the heat dissipation block.

7. A semiconductor refrigerator according to claim 6, characterized in that: A cooling grid hole is provided on the upper part of the bottom shell. After the bracket is installed on the bottom shell, the front fitting edge of the bracket fits against the inner wall of the bottom shell and the upper part of the front fitting edge is located above the cooling grid hole of the bottom shell, so that the cooling grid hole is connected to the cooling channel of the cold storage block.

8. The semiconductor refrigerator according to claim 1, characterized in that: A power connector is also installed inside the bottom shell, and a wire lead-out hole is provided on the bracket.

9. The semiconductor refrigerator according to claim 1, characterized in that: The heat dissipation block is formed by repeatedly folding a metal plate, and the material of the metal plate is copper or aluminum; the cold storage block is formed by repeatedly folding a conductive metal, including folding into a wave shape, and the material of the metal plate is copper or aluminum.

10. The semiconductor refrigerator according to claim 1, characterized in that: The fan is a centrifugal fan or an axial flow fan.

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