Annealing temperature control device

Abstract

The utility model discloses an annealing temperature control device, which relates to the technical field of temperature control, and comprises a heat conducting disc, a support plate, a shell and support legs, a heat conducting ring is fixedly connected inside the shell, a fan is fixedly connected at the center of the heat conducting ring, the fan is perpendicular to the top of the heat conducting disc, and a heat conducting box is fixedly connected at one side of the shell. The interior of the heat conduction box is communicated with the interior of the shell, the middles of the supporting legs and the middle of the supporting plate are each of an arc-shaped structure, the ends, away from the shell, of the supporting legs are fixedly connected with fixing plates, the heat conduction ring comprises annular and evenly-distributed vertical heat conduction plates, and the two ends of each vertical heat conduction plate are fixedly connected with fixed heat conduction plates; according to the design of the computer case, heat of the heating element is led out through the shell, the heat conduction ring and the fan, the heat is discharged out of the computer case through the heat conduction box, the partition plate and the cover plate, diffusion of the heat in the computer case is reduced, and the cooling efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of temperature control, and more specifically to an annealing temperature control device. Background Art

[0002] Annealing temperature control device is a device used to control the temperature of multiple samples during the annealing process. The device usually consists of a heater and temperature sensor, which can control the temperature of the samples at different temperatures.

[0003] During the annealing process, samples need to be kept within a specific temperature range to achieve specific physical or chemical changes. Therefore, the annealing temperature control device can ensure that all samples are within the required temperature range, and each sample can be independently adjusted when needed.

[0004] The device is typically computer-controlled and uses a feedback control algorithm to adjust the power to the heater and the temperature of the sample. It is commonly used in laboratories in fields such as materials science, chemistry, and physics to perform annealing experiments and control the temperature of samples.

[0005] In view of the above, the inventor believes that the current air-cooled radiator will dissipate the heat from the components, but the heat diffuses into the inside of the chassis, causing the overall temperature inside the chassis to rise, thereby intermittently reducing the heat dissipation efficiency of the air-cooled radiator, causing inconvenience in use. Utility Model Content

[0006] The purpose of the present invention is to provide an annealing temperature control device, which aims to effectively solve the problems mentioned in the above-mentioned prior art.

[0007] In order to solve the above problems, the present invention adopts the following technical solutions:

[0008] A device for controlling annealing temperature, comprising a heat conducting plate, support plates fixedly welded around the heat conducting plate, an end of the support plate away from the heat conducting plate being bolted to a shell, legs being arranged around the bottom of the shell, a heat conducting ring fixedly connected to the interior of the shell, a fan fixedly connected to the center of the heat conducting ring, the fan being perpendicular to the top of the heat conducting plate, a heat conducting box fixedly connected to one side of the shell, the interior of the heat conducting box and the interior of the shell being interconnected, heat from a heating element being drawn out through the shell, the shell, the heat conducting ring and the fan, and heat being discharged to the outside of the chassis through the heat conducting box, the partition and the cover, thereby reducing the diffusion of heat inside the chassis and improving the cooling efficiency.

[0009] As a preferred solution of the present invention, the middle portion of the support leg and the support plate are both arc-shaped structures, and one end of the support leg away from the housing is fixedly connected to a fixing plate.

[0010] As a preferred solution of the present invention, the heat conducting ring includes vertical heat conducting plates evenly distributed in an annular shape, both ends of the vertical heat conducting plates are fixedly connected to fixed heat conducting plates, and the inner wall of the fixed heat conducting plate is bolted to the fan.

[0011] As a preferred solution of the present invention, a connecting block is fixedly connected to the bottom of the inner wall of the shell, and one end of the connecting block away from the shell is fixedly connected to the fixed heat conducting plate.

[0012] As a preferred solution of the present invention, a cover plate is inserted into the interior of the heat conduction box, a slide groove is provided inside the heat conduction box, and the cover plate is slidably connected to the heat conduction box through the slide groove.

[0013] As a preferred solution of the present invention, a partition is fixedly connected to the interior of the heat conduction box, and several partitions are provided, and one end of the several partitions is fixedly connected to the inner wall of the shell.

[0014] As a preferred solution of the present invention, an arc-shaped plate is provided on one side of the cover plate, and the diameter of the arc-shaped plate is consistent with the inner diameter of the shell.

[0015] Compared with the prior art, the advantages of the present invention are:

[0016] 1. The heat conducting plate is close to the heating element of the computer. The shell fixes the heat conducting plate to the surface of the heating element through the legs and the fixing plate. The shell fixes the fixed heat conducting plate and the vertical heat conducting plate to the center of the shell through the connecting block. The fan discharges the heat through the vertical heat conducting plate into the heat conducting box at one end of the shell. The heat conducting box is sealed by the cover. The heat conducting box diverts the heat to one end of the heat conducting box for discharge through the partition. This design draws out the heat from the heating element through the shell, the shell, the heat conducting ring and the fan, and discharges the heat to the outside of the chassis through the heat conducting box, the partition and the cover, thereby reducing the diffusion of heat inside the chassis and improving the cooling efficiency.

[0017] 2. A cover is inserted into the interior of the thermal conduction box, and a slide groove is provided inside the thermal conduction box. The cover is slidably connected to the thermal conduction box through the slide groove. The sliding connection between the cover and the thermal conduction box facilitates the opening of the thermal conduction box and the cleaning of the inside of the thermal conduction box. The interior of the thermal conduction box is fixedly connected with a partition, and there are several partitions. One end of the partitions is fixedly connected to the inner wall of the outer shell. The thermal conduction box guides the heat inside the outer shell. The partition is made of a heat-conducting aluminum plate, which improves the cooling efficiency of the outer shell. An arc plate is provided on one side of the cover. The diameter of the arc plate is consistent with the inner diameter of the outer shell. After the cover slides and covers the surface of the thermal conduction box, the arc plate fits with the inner wall of the outer shell to avoid the cover from scratching the palm when taking the outer shell, thereby facilitating the taking of the outer shell. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0019] Figure 2 This is a side sectional structural diagram of the utility model;

[0020] Figure 3 This is a bottom view of the structure of the present invention;

[0021] Figure 4 It is a schematic structural diagram of the side view of the present invention.

[0022] Explanation of the numbers in the figure: 1. Housing; 11. Support leg; 111. Fixed plate; 2. Heat conducting plate; 3. Support plate; 4. Heat conducting ring; 41. Fixed heat conducting plate; 42. Vertical heat conducting plate; 43. Connecting block; 5. Fan; 6. Heat conducting box; 61. Partition; 62. Slide; 7. Cover plate; 71. Arc plate. DETAILED DESCRIPTION

[0023] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of them. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts are within the scope of protection of the present invention.

[0024] Example:

[0025] See also Figure 1-4 , an annealing temperature control device includes a heat conducting plate 2, with a support plate 3 fixedly welded around the four sides of the heat conducting plate 2, and the support plate 3 is bolted to the shell 1 at one end away from the heat conducting plate 2, and the shell 1 fixes the heat conducting plate 2 through the support plate 3, and the support plate 3 improves the structural stability between the heat conducting plate 2 and the shell 1. The interior of the shell 1 is a hollow structure, and support legs 11 are provided around the bottom of the shell 1. The middle parts of the support legs 11 and the support plate 3 are both arc-shaped structures, and the end of the support leg 11 away from the shell 1 is fixedly connected with a fixing plate 111. The structural strength of the support legs 11 and the support plate 3 is improved by the arc structure, so that the support legs 11 and the support plate 3 are more stable, and the support legs 11 are conveniently fixed by the fixing plate 111.

[0026] Improved structural stability: By fixing the support plate 3 and designing the arc-shaped structure of the legs 11, the structural stability between the heat conducting plate 2 and the housing 1 can be improved, thereby ensuring the stability and reliability of the device during operation.

[0027] Improved structural strength: The arc-shaped structural design of the support legs 11 and the support plates 3 improves their structural strength, enabling the entire device to withstand greater loads and external force disturbances.

[0028] Conveniently fix the support legs: By fixing the plates 111, the support legs 11 can be conveniently fixed, increasing the stability and operability of the entire device.

[0029] Support temperature control: The device can control the temperature of the sample, improving the efficiency and accuracy of the experiment.

[0030] The annealing temperature control device has the advantages of stable structure, high structural strength, and convenient operation, and is suitable for annealing experiments in laboratories in the fields of materials science, chemistry, physics, etc.

[0031] Please refer to Figure 1-3 , the heat-conducting ring 4 includes vertically distributed heat-conducting plates 42, both ends of which are fixedly connected to the fixed heat-conducting plates 41, the inner wall of which is bolted to the fan 5, and the vertically distributed heat-conducting plates 42 are made of heat-conducting aluminum plates and are annularly arranged around the inner wall of the fixed heat-conducting plates 41, so that the heat of the fan 5 is rapidly dispersed, improving the cooling effect of the fan 5. The inner wall of the shell 1 is fixedly connected to the connecting block 43, and the end of the connecting block 43 away from the shell 1 is fixedly connected to the fixed heat-conducting plates 41. The fixed heat-conducting plates 41 are fixedly connected between the connecting block 43 and the shell 1, and the connecting block 43 is located at the bottom of the inner wall of the shell 1, increasing the supportability of the connecting block 43 and improving the stability of the structure between the fixed heat-conducting plates 41 and the shell 1.

[0032] Please refer to Figure 1-3 , the heat-conducting ring 4 is fixedly connected to the inside of the shell 1, and the fan 5 is fixedly connected to the center of the heat-conducting ring 4. The fan 5 is perpendicular to the top of the heat-conducting disc 2, and the fan 5 accelerates the heat-conducting effect of the heat-conducting disc 2. The heat-conducting box 6 is fixedly connected to one side of the shell 1, and the inside of the heat-conducting box 6 is in communication with the inside of the shell 1. The shell 1 can quickly discharge the heat dispersed by the heat-conducting ring 4 through the heat-conducting box 6, avoiding the accumulation of heat in the inside of the case, which can cause the temperature in the inside of the case to rise.

[0033] Please refer to Figure 2-4After the cover plate 7 slides over the surface of the heat conducting box 6, the curved plate 71 fits with the inner wall of the shell 1 to avoid scratching the cover plate 7 when the shell 1 is taken out, making it convenient to take the shell 1 out.

[0034] Working principle:

[0035] The utility model is that when in use, the heat conducting plate 2 is placed close to the heating element of the computer, the shell 1 fixes the heat conducting plate 2 to the surface of the heating element through the support legs 11 and the fixing plate 111, the shell 1 fixes the fixed heat conducting plate 41 and the vertical heat conducting plate 42 to the center of the shell 1 through the connecting block 43, the fan 5 discharges the heat into the heat conducting box 6 at one end of the shell 1 through the vertical heat conducting plate 42, the heat conducting box 6 is sealed by the cover 7, and the heat conducting box 6 diverts the heat to one end of the heat conducting box 6 for discharge through the partition 61. This design draws out the heat of the heating element through the shell 1, the shell 1, the heat conducting ring 4 and the fan 5, and discharges the heat to the outside of the chassis through the heat conducting box 6, the partition 61 and the cover 7, thereby reducing the diffusion of heat inside the chassis and improving the cooling efficiency.

[0036] The above are only preferred specific implementation methods of the present invention, but the protection scope of the present invention is not limited to this. Any technician familiar with the technical field within the technical scope disclosed by the present invention can make equivalent replacements or changes based on the technical solution and improved ideas of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. An annealing temperature control device, characterized in that: include: A heat conducting plate (2) is provided, wherein support plates (3) are fixedly welded around the heat conducting plate (2), an end of the support plate (3) away from the heat conducting plate (2) is bolted to a shell (1), legs (11) are provided around the bottom of the shell (1), a heat conducting ring (4) is fixedly connected to the inside of the shell (1), a fan (5) is fixedly connected to the center of the heat conducting ring (4), and the fan (5) is perpendicular to the top of the heat conducting plate (2), a heat conducting box (6) is fixedly connected to one side of the shell (1), and the interior of the heat conducting box (6) and the interior of the shell (1) are mutually connected.

2. The annealing temperature control device according to claim 1, characterized in that: The middle portions of the supporting leg (11) and the supporting plate (3) are both arc-shaped structures, and one end of the supporting leg (11) away from the housing (1) is fixedly connected to a fixing plate (111).

3. The annealing temperature control device according to claim 2, characterized in that: The heat-conducting ring (4) comprises vertical heat-conducting plates (42) uniformly distributed in an annular shape, both ends of the vertical heat-conducting plates (42) are fixedly connected to fixed heat-conducting plates (41), and the inner wall of the fixed heat-conducting plate (41) is bolted to the fan (5).

4. The annealing temperature control device according to claim 3, characterized in that: A connecting block (43) is fixedly connected to the bottom of the inner wall of the outer shell (1), and one end of the connecting block (43) away from the outer shell (1) is fixedly connected to the fixed heat conducting plate (41).

5. The annealing temperature control device according to claim 1, characterized in that: A cover plate (7) is inserted into the interior of the heat conduction box (6), a slide groove (62) is provided inside the heat conduction box (6), and the cover plate (7) is slidably connected to the heat conduction box (6) through the slide groove (62).

6. The annealing temperature control device according to claim 5, characterized in that: A partition (61) is fixedly connected to the interior of the heat conduction box (6), and a plurality of partitions (61) are provided, and one end of the plurality of partitions (61) is fixedly connected to the inner wall of the outer shell (1).

7. The annealing temperature control device according to claim 5, characterized in that: An arc-shaped plate (71) is provided on one side of the cover plate (7), and the diameter of the arc-shaped plate (71) is consistent with the inner diameter of the housing (1).

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