Auxiliary device convenient for testing semiconductor chip module

Abstract

The utility model discloses an auxiliary device convenient for testing a semiconductor chip module, and belongs to the technical field of chip testing. An auxiliary device convenient for testing a semiconductor chip module comprises a device body. According to the auxiliary device convenient for testing the semiconductor chip module, a chip body is placed in a placement groove, a fixed trapezoidal block moves to extrude a second slide slope, so that a clamping block drives a movable plate to slide in a movable groove, the clamping block is reset under the action of a first spring, the clamping block locks the fixed trapezoidal block, and a test plate is continuously pressed downwards; at the moment, an upper magnet and a lower magnet attract each other, the test plate drives a fixed trapezoidal block to reset, a movable trapezoidal block moves to extrude a first slide slope, the movable trapezoidal block is blocked by a clamping block, so that the upper magnet and the lower magnet are separated, the fixed trapezoidal block is reset under the action of a second spring, and the chip body test process becomes convenient and rapid; and the test efficiency of the test board on the chip body is further improved.

Description

Technical Field

[0001] The utility model relates to the technical field of chip testing, and more particularly to an auxiliary device for facilitating the testing of semiconductor chip modules. Background Art

[0002] A chip is an integrated circuit, typically made of semiconductor materials, integrating thousands or even millions of microelectronic components onto a small silicon wafer. Chips come in a wide variety of types, ranging from processors to memory chips and sensors, depending on their function and purpose. Each chip has its own specific design and application. For example, a central processing unit (CPU) executes instructions in computer programs; a graphics processing unit (GPU) processes graphics and video data; and memory chips store programs and data. Before a chip leaves the factory, it must be tested using auxiliary equipment for semiconductor chip module testing.

[0003] When some existing test jigs are used to test chips, the chip is first placed in a test slot, and the chip is squeezed by manually flipping the cover of the test jig. When the flipping movement is completed, the test power button is pressed. When the test jig detects that the chip is qualified, a buzzer will sound. After the test is completed, the cover of the test jig needs to be opened, the chip removed, and another chip replaced for testing. When using a chip test jig to test a chip, flipping the jig cover back and forth is very inconvenient and affects the test efficiency of the test jig for the chip. Utility Model Content

[0004] The purpose of this utility model is to provide an auxiliary device for facilitating the testing of semiconductor chip modules, so as to solve the problems raised in the above background technology:

[0005] In order to achieve the above purpose, the present invention provides the following technical solutions:

[0006] The cam is adapted to move the movable member into engagement with the slide, and the movable member is adapted to move the movable member into engagement with the slide.

[0007] By adopting the above technical solution, the chip body testing process becomes convenient and quick, thereby improving the testing efficiency of the test board on the chip body.

[0008] Preferably, a first spring is elastically connected between the movable plate and the movable groove, and the clamping block is elastically connected to the movable groove by matching the movable plate and the first spring.

[0009] Preferably, one end of the first spring is fixedly connected to the surface of the movable plate, and the other end of the first spring is fixedly connected to the inner wall of the movable groove.

[0010] By adopting the above technical solution, the first spring is used to reset the clamping block and fix the trapezoidal block.

[0011] Preferably, four corners of the bottom surface of the test board are electrically connected with plugs, and the inner bottom surface of the test slot is provided with slots corresponding to the positions of the plugs.

[0012] By adopting the above technical solution, the chip body is manually placed in the placement slot, and the pins of the chip body are plugged into the grooves inside the placement slot for electrical connection. During the test, the pins of the chip body are prevented from being misaligned and deformed, thereby protecting the chip body.

[0013] Preferably, a second spring is sleeved on the surface of the plug, and two ends of the second spring are fixedly connected to the bottom surface of the test board and the inner bottom surface of the test slot respectively. The test board is elastically connected to the test slot through the second spring.

[0014] By adopting the above technical solution, the second spring is used for the reset movement of the test plate.

[0015] Preferably, a placement groove is provided on the surface of the test board, a chip body is placed inside the placement groove, and a taking groove communicating with the placement groove is provided on the surface of the test board.

[0016] By adopting the above technical solution, after the chip body test is completed, tweezers are used to take out the chip body through the taking slot. The setting of the taking slot makes it convenient to take the chip body.

[0017] Compared with the prior art, the beneficial effects of the present invention are:

[0018] 1) The utility model discloses a convenient semiconductor chip module test's auxiliary device places the chip body to the placing groove when using, and manually presses the test board to move to the test groove with the fixed trapezoidal block downward movement, and the fixed trapezoidal block movement extrudes the second landslide, and makes the card block with the movable plate slide in the moving groove, and the first spring is compressed at this time, and the test board movement with the plug movement inserts into the socket and carries out electric connection, and the card block resets under the action of the first spring at this time, and makes the card block lock the fixed trapezoidal block, and the test board tests the chip body, and after the chip body test is completed, continues to press the test board downward, and the fixed trapezoidal block continues to move and matches the movable trapezoidal block at this time, and the upper magnet and the lower magnet attract each other, and under the action of the second spring, the test board with the fixed trapezoidal block resets, and the movable trapezoidal block moves to extrude the first landslide at this time, and when the fixed trapezoidal block moves to the card block above, the movable trapezoidal block is blocked by the card block at this time, and makes the upper magnet and the lower magnet separate, and then makes the movable trapezoidal block reset to the sliding slot, and the fixed trapezoidal block resets under the action of the second spring, and the chip body test process becomes convenient and fast, and then improves the test efficiency of the test board to the chip body.

[0019] 2) The utility model discloses a convenient semiconductor chip module test's auxiliary device when using, and the test personnel wears dustproof insulating gloves, and manually places the chip body to the placing groove, and the pin of chip body is inserted with the slot inside the placing groove and carries out electric connection, and prevents the pin of chip body from being misaligned and deforming during the test, and further protects the chip body.

[0020] 3) The utility model discloses a convenient semiconductor chip module test's auxiliary device when using, and after the chip body test is completed, uses the tweezers to take out the chip body through the taking groove, and the setting of taking groove is convenient to take the chip body. DRAWINGS

[0021] Figure 1 It is the whole structure schematic diagram of the utility model;

[0022] Figure 2 It is the device body cross section structure schematic diagram of the utility model;

[0023] Figure 3 It is the movable trapezoidal block structure schematic diagram of the utility model;

[0024] Figure 4 It is the card block structure schematic diagram of the utility model.

[0025] Brief description of the drawings: 1, device body; 2, test slot; 3, sliding slot; 4, movable trapezoidal block; 5, moving slot; 6, movable plate; 7, clamping block; 8, first sliding slope; 9, second sliding slope; 10, test plate; 11, fixed trapezoidal block; 12, upper magnet; 13, lower magnet; 14, first spring; 15, second spring; 16, plug; 17, plug slot; 18, placing slot; 19, chip body; 20, taking slot. DETAILED DESCRIPTION

[0026] Example 1

[0027] Please refer to Figures 1 to 4, an auxiliary device for facilitating semiconductor chip module testing, including a device body 1, the device body 1 is a fixture for testing chip bodies 19 in the prior art, a test slot 2 is provided on the surface of the device body 1, a slide groove 3 is provided on the inner bottom surface of the test slot 2, a movable trapezoidal block 4 matching therewith is slidably connected to the inner surface of the slide groove 3, a movable slot 5 is correspondingly provided on the inner walls of both sides of the slide groove 3, a movable plate 6 matching therewith is slidably connected to the inner surface of the movable plate 6, a clamping block 7 is fixedly connected to the surface of one end of the movable plate 6, a first slide slope 8 is provided on the bottom surface of the clamping block 7, and a second slide slope 8 is provided on the top surface of the clamping block 7 Slope 9, the internal sliding connection of the test slot 2 is provided with a test board 10 that matches it, the bottom surface of the test board 10 is fixedly connected with a fixed trapezoidal block 11 that matches the movable trapezoidal block 4, and the bottom surface of the fixed trapezoidal block 11 is fixedly installed with an upper magnet 12, and the upper magnet 12 matches the lower magnet 13, so that the movable trapezoidal block 4 moves to squeeze the first slope 8, thereby resetting the fixed trapezoidal block 11, and the inner bottom surface of the movable trapezoidal block 4 is fixedly provided with a lower magnet 13 that matches the upper magnet 12, and the chip body 19 is placed in the placement slot 18, and the test board 10 is manually pressed to move toward the test slot 2. As the fixed trapezoidal block 11 moves downward, the fixed trapezoidal block 11 moves and squeezes the second slide 9, so that the card block 7 slides with the movable plate 6 in the movable groove 5. At this time, the first spring 14 is compressed, and the test board 10 moves with the plug 16 and then inserts it into the slot 17 for electrical connection. At this time, the card block 7 is reset under the action of the first spring 14, so that the card block 7 locks the fixed trapezoidal block 11, and the test board 10 tests the chip body 19. After the chip body 19 test is completed, the test board 10 continues to be pressed downward. At this time, the fixed trapezoidal block 11 continues to move to match the movable trapezoidal block 4, and the upper The magnet 12 and the lower magnet 13 attract each other, and under the action of the second spring 15, the test board 10 is reset with the fixed trapezoidal block 11. At this time, the movable trapezoidal block 4 moves to squeeze the first slide 8. When the fixed trapezoidal block 11 moves above the block 7, the movable trapezoidal block 4 is blocked by the block 7, so that the upper magnet 12 and the lower magnet 13 are separated, and then the movable trapezoidal block 4 is reset to the slide groove 3. The fixed trapezoidal block 11 is reset under the action of the second spring 15, and the test process of the chip body 19 becomes convenient and quick, thereby improving the test efficiency of the test board 10 on the chip body 19.

[0028] A first spring 14 is elastically connected between the movable plate 6 and the movable groove 5 , and the clamping block 7 is elastically connected to the movable groove 5 by matching the movable plate 6 and the first spring 14 .

[0029] One end of the first spring 14 is fixedly connected to the surface of the movable plate 6 , and the other end of the first spring 14 is fixedly connected to the inner wall of the movable groove 5 . The first spring 14 is used to reset the block 7 and fix the fixed trapezoidal block 11 .

[0030] The four corners of the bottom surface of the test board 10 are electrically connected with plugs 16, and the inner bottom surface of the test slot 2 is provided with a slot 17 corresponding to the position of the plug 16. The test board 10 is powered by plugging the plug 16 into the slot 17. The chip body 19 is manually placed into the placement slot 18, and the pins of the chip body 19 are plugged into the slots inside the placement slot 18 for electrical connection. During the test, the pins of the chip body 19 are prevented from being misaligned and deformed, thereby protecting the chip body 19.

[0031] A second spring 15 is sleeved on the surface of the plug 16. The two ends of the second spring 15 are fixedly connected to the bottom surface of the test board 10 and the inner bottom surface of the test slot 2 respectively. The test board 10 is elastically connected to the test slot 2 through the second spring 15. The second spring 15 is used for the reset movement of the test board 10.

[0032] A placement groove 18 is provided on the surface of the test board 10, and a chip body 19 is placed inside the placement groove 18. A picking groove 20 connected to the placement groove 18 is provided on the surface of the test board 10, and a slot hole is provided inside the placement groove 18 to be plugged into the chip body 19. After the test of the chip body 19 is completed, tweezers are used to take out the chip body 19 through the picking groove 20. The setting of the picking groove 20 makes it convenient to take the chip body 19.

[0033] The use steps of the utility model are as follows: when the auxiliary device for semiconductor chip module testing is used, when the device body 1 tests the chip body 19, the tester wears dustproof insulating gloves and manually places the chip body 19 into the placement slot 18, and the pins of the chip body 19 are plugged into the slots inside the placement slot 18, and manually presses the test board 10 to move into the test slot 2. At this time, the test board 10 moves with the fixed trapezoidal block 11 downward, and the fixed trapezoidal block 11 moves to squeeze the second slide 9, so that the card block 7 slides with the movable plate 6 in the movable slot 5. At this time, the first spring 14 is compressed, and the test board 10 moves with the plug 16 and then inserts it into the slot 17 for electrical connection. At this time, the card block 7 is reset under the action of the first spring 14. The card block 7 locks the fixed trapezoidal block 11. At this time, the second spring 15 is compressed. After the chip body 19 test is completed, the test board 10 continues to be pressed downward. At this time, the fixed trapezoidal block 11 continues to move to match the movable trapezoidal block 4, so that the upper magnet 12 and the lower magnet 13 attract each other. At this time, under the action of the second spring 15, the test board 10 is reset with the fixed trapezoidal block 11. At this time, the movable trapezoidal block 4 moves to squeeze the first slide 8 so that the card block 7 slides with the movable plate 6 in the movable groove 5. At this time, the first spring 14 is compressed. When the fixed trapezoidal block 11 moves above the card block 7, the movable trapezoidal block 4 is blocked by the card block 7, so that the upper magnet 12 and the lower magnet 13 are separated, and then the movable trapezoidal block 4 is reset. After the chip body 19 is tested, the chip body 19 is taken out through the taking slot 20 using tweezers. The chip body 19 is placed in the placement slot 18, and the test board 10 is manually pressed to move toward the test slot 2 with the fixed trapezoidal block 11 moving downward. The fixed trapezoidal block 11 moves and squeezes the second slide 9, so that the card block 7 slides with the movable plate 6 in the movable slot 5. At this time, the first spring 14 is compressed, and the test board 10 moves with the plug 16 and then inserts it into the slot 17 for electrical connection. At this time, the card block 7 is reset under the action of the first spring 14, so that the card block 7 locks the fixed trapezoidal block 11, and the test board 10 tests the chip body 19. After the chip body 19 test is completed, the test board 10 continues to be pressed downward. At this time, the fixed trapezoidal block 11 continues to move to match the movable trapezoidal block 4. The upper magnet 12 and the lower magnet 13 attract each other. Under the action of the second spring 15, the test board 10 is reset with the fixed trapezoidal block 11. At this time, the movable trapezoidal block 4 moves to squeeze the first slide 8. When the fixed trapezoidal block 11 moves above the card block 7, the movable trapezoidal block 4 is blocked by the card block 7, so that the upper magnet 12 and the lower magnet 13 are separated, and then the movable trapezoidal block 4 is reset to the slide groove 3. The fixed trapezoidal block 11 is reset under the action of the second spring 15. The test process of the chip body 19 becomes convenient and quick, thereby improving the test efficiency of the test board 10 on the chip body 19;The tester, wearing dust-proof insulating gloves, manually places the chip body 19 into the placement slot 18. The pins of the chip body 19 are plugged into the grooves inside the placement slot 18 to establish an electrical connection. During the test, the pins of the chip body 19 are prevented from being misaligned and deformed, thereby protecting the chip body 19. After the chip body 19 is tested, the chip body 19 is removed using tweezers through the removal slot 20. The provision of the removal slot 20 facilitates the removal of the chip body 19.

[0034] The above shows and describes the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are merely preferred examples of the present invention and are not intended to limit the present invention. Various changes and improvements may be made to the present invention without departing from the spirit and scope of the present invention, and such changes and improvements fall within the scope of the present invention. The scope of protection claimed in the present invention is defined by the appended claims and their equivalents.

Claims

1. An auxiliary device for facilitating semiconductor chip module testing, comprising a device body (1), characterized in that: The surface of the device body (1) is provided with a test slot (2), the inner bottom surface of the test slot (2) is provided with a slide slot (3), the inner surface of the slide slot (3) is slidably connected to a movable trapezoidal block (4) matching therewith, the inner walls of both sides of the slide slot (3) are correspondingly provided with movable slots (5), the inner surface of the movable slot (5) is slidably connected to a movable plate (6) matching therewith, one end surface of the movable plate (6) is fixedly connected to a clamping block (7), the bottom surface of the clamping block (7) is provided with a first slide slope (8), the top surface of the clamping block (7) is provided with a second slide slope (9), the inner surface of the test slot (2) is slidably connected to a test plate (10) matching therewith, the bottom surface of the test plate (10) is fixedly connected to a fixed trapezoidal block (11) matching the movable trapezoidal block (4), the bottom surface of the fixed trapezoidal block (11) is fixedly mounted with an upper magnet (12), and the inner bottom surface of the movable trapezoidal block (4) is fixedly mounted with a lower magnet (13) matching the upper magnet (12).

2. The auxiliary device for facilitating semiconductor chip module testing according to claim 1, characterized in that: A first spring (14) is elastically connected between the movable plate (6) and the movable groove (5), and the clamping block (7) is elastically connected to the movable groove (5) by matching the movable plate (6) and the first spring (14).

3. The auxiliary device for facilitating semiconductor chip module testing according to claim 2, characterized in that: One end of the first spring (14) is fixedly connected to the surface of the movable plate (6), and the other end of the first spring (14) is fixedly connected to the inner wall of the movable groove (5).

4. The auxiliary device for facilitating semiconductor chip module testing according to claim 1, characterized in that: The four corners of the bottom surface of the test board (10) are electrically connected to plugs (16), and the inner bottom surface of the test slot (2) is provided with slots (17) corresponding to the positions of the plugs (16).

5. The auxiliary device for facilitating semiconductor chip module testing according to claim 4, characterized in that: A second spring (15) is sleeved on the surface of the plug (16), and two ends of the second spring (15) are fixedly connected to the bottom surface of the test board (10) and the inner bottom surface of the test slot (2), respectively. The test board (10) is elastically connected to the test slot (2) via the second spring (15).

6. The auxiliary device for facilitating semiconductor chip module testing according to claim 1, characterized in that: The surface of the test board (10) is provided with a placement groove (18), a chip body (19) is placed inside the placement groove (18), and the surface of the test board (10) is provided with a taking groove (20) connected to the placement groove (18).

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