Chip test socket

Abstract

The utility model provides a chip testing socket, and relates to the technical field of chip testing. The chip test socket comprises a base assembly, an upper cover buckled on the base assembly and a pressing assembly, one side, facing the upper cover, of the base assembly is provided with an accommodating groove, the accommodating groove is used for placing a to-be-tested chip, the pressing assembly comprises a knob, a stud and a pressing block, the pressing block is used for pressing the to-be-tested chip, the pressing block is movably arranged on the upper cover, and the knob is arranged in the accommodating groove. The moving direction of the lower pressing block relative to the upper cover is perpendicular to the chip bearing face of the containing groove, the side, away from the containing groove, of the lower pressing block is connected with the stud, the axis direction of the stud is parallel to the moving direction, the knob is rotationally arranged on the side, away from the base assembly, of the upper cover, and the stud is in threaded connection with the knob. According to the chip test socket, the pressing assembly with the adjustable pressing height is arranged on the upper cover, so that to-be-tested chips with different thicknesses can be tested.

Description

Technical Field

[0001] The present application relates to the field of chip testing technology, and in particular to a chip testing socket. Background Art

[0002] Chip burn-in testing is used to assess chip lifespan and long-term power-on reliability, making it a key fundamental test for measuring chip reliability. During chip burn-in testing, the chip is secured in a test socket and connected to the PCB via the socket's probes, monitoring the chip's operating status and data.

[0003] To ensure stable contact between the contacts on the chip and the probes on the test socket, the test socket is equipped with a press-down assembly. When the test socket cover is closed, the press-down assembly presses the chip. However, the press-down height of existing press-down assemblies cannot be adjusted, making them incompatible with chips of varying thicknesses. Utility Model Content

[0004] The purpose of this application is to address the deficiencies in the above-mentioned prior art and provide a chip test socket that can test chips of different thicknesses.

[0005] To achieve the above objectives, the technical solutions adopted in the embodiments of the present application are as follows:

[0006] An embodiment of the present application provides a chip test socket, comprising: a base assembly, an upper cover snapped onto the base assembly, and a lower pressing assembly, wherein the base assembly is provided with a receiving groove on a side facing the upper cover, the receiving groove is used to place the chip to be tested, the lower pressing assembly comprises a knob, a stud and a lower pressing block, the lower pressing block is used to press the chip to be tested, the lower pressing block is movably arranged on the upper cover, the moving direction of the lower pressing block relative to the upper cover is perpendicular to the chip bearing surface of the receiving groove, the side of the lower pressing block facing away from the receiving groove is connected to the stud, the axial direction of the stud is parallel to the moving direction, the knob is rotatably arranged on the side of the upper cover facing away from the base assembly, and the stud is threadedly connected to the knob.

[0007] Optionally, a first through hole is provided on the upper cover, and the downward pressure assembly further includes a connecting member and a spring, the connecting member includes a connecting head and a connecting rod connected to the connecting head, the connecting head is located on the side of the upper cover away from the downward pressure assembly, the connecting rod is located in the first through hole and extends out of the first through hole, the spring is sleeved on the connecting rod, one end of the spring abuts against the upper cover, and the other end abuts against the downward pressure block.

[0008] Optionally, the chip test socket also includes a temperature control component, which includes a controller, a temperature sensor electrically connected to the controller, a heater and a radiator. The temperature sensor is used to monitor the surface temperature of the chip to be tested, the heater is used to heat the chip to be tested, and the radiator is used to cool the chip to be tested.

[0009] Optionally, the lower pressing block includes a heat conducting block, which is used to press the chip to be tested, and the heater and the heat sink are both arranged on the heat conducting block.

[0010] Optionally, a first mounting hole is provided in the heat conducting block, the heater is fixed in the first mounting hole, and a heat conducting material is filled between the heater and the hole wall of the first mounting hole.

[0011] Optionally, the radiator is located on a side of the upper cover facing away from the base assembly, and the heat conducting block is exposed from the upper cover and connected to the radiator.

[0012] Optionally, the lower pressing block further includes a pressing block, the pressing block is connected to the stud, and the heat conducting block is fixed on the pressing block.

[0013] Optionally, the pressing block, the stud and the knob are all provided with a third through hole, and the heat conducting block passes through the third through holes on the pressing block, the stud and the knob.

[0014] Optionally, the heat conductive block includes a pressing portion and a platform portion, one end of the pressing portion is used to press the chip to be tested, and the other end is connected to the platform portion, the platform portion is located on the side of the upper cover away from the lower pressure assembly, and the radiator is fixed on the platform portion.

[0015] Optionally, the radiator includes a fan and heat dissipation teeth, the heat dissipation teeth are attached to the heat conductive block, the fan is electrically connected to the controller, and the fan is used to blow air toward the heat dissipation teeth.

[0016] Optionally, a second mounting hole is provided in the heat conducting block, the temperature sensor is fixed in the second mounting hole, and the test end of the temperature sensor is flush with the surface of the heat conducting block facing the base assembly.

[0017] Optionally, the base assembly includes a base and a needle plate arranged on the base, the accommodating groove is located on the needle plate, and a probe is provided at the bottom of the accommodating groove, one end of the probe is used to abut against the chip to be tested, and the other end is used to abut against the PCB board to electrically connect the chip to be tested with the PCB board.

[0018] Optionally, a handle is provided on the side wall of the knob, and the handle is used to drive the knob to rotate.

[0019] Optionally, the edge of the upper cover is rotatably connected to the edge of the base assembly, the upper cover is provided with a buckle, and the base assembly is provided with a slot that cooperates with the buckle, and the buckle is snapped into the slot to lock the upper cover and the base assembly.

[0020] The beneficial effects of this application include:

[0021] The present application provides a chip test socket, comprising: a base assembly, an upper cover that is fastened to the base assembly, and a lower pressure assembly. The base assembly is provided with a receiving groove on the side facing the upper cover, the receiving groove being used to place the chip to be tested. The lower pressure assembly includes a knob, a stud, and a lower pressure block. The lower pressure block is used to press the chip to be tested. The lower pressure block is movably arranged on the upper cover. The movement direction of the lower pressure block relative to the upper cover is perpendicular to the chip-bearing surface of the receiving groove. The side of the lower pressure block facing away from the receiving groove is connected to the stud. The axial direction of the stud is parallel to the movement direction. The knob is rotatably arranged on the side of the upper cover facing away from the base assembly. The stud is threadedly connected to the knob. When the user rotates the knob, the stud can be driven to move in a direction perpendicular to the surface of the chip to be tested through threaded engagement. The stud drives the lower pressure block to move synchronously, thereby causing the lower pressure block to press the chip to be tested or separate from the chip to be tested. Since the movement distance of the lower pressure block can be adjusted by the cooperation of the knob and the stud, the above-mentioned chip test socket can adapt to chips to be tested of different thicknesses and test chips to be tested of different thicknesses. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without creative work.

[0023] Figure 1 A schematic diagram of the structure of a chip test socket provided in an embodiment of the present application;

[0024] Figure 2 A cross-sectional view of a chip test socket provided in an embodiment of the present application;

[0025] Figure 3 This is an exploded view of the chip test socket provided in an embodiment of the present application.

[0026] Icons: 10-chip test socket; 11-base assembly; 111-accommodating groove; 1111-chip carrying surface; 112-base; 113-needle plate; 114-card slot; 12-upper cover; 121-first through hole; 122-second through hole; 123-clip; 13-pressing assembly; 131-knob; 132-stud; 133-pressing block; 1331-heat conducting block; 1331a-pressing part; 1331b-platform part; 1331c-first mounting hole; 1331d-second mounting hole; 1332-pressing block; 134-handle; 135-third through hole; 14-temperature control assembly; 141-temperature sensor; 1411-test end; 142-heater; 143-radiator; 1431-fan; 1432-heat dissipation tooth; A-movement direction. DETAILED DESCRIPTION

[0027] To make the objectives, technical solutions, and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Generally, the components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations.

[0028] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application as claimed, but merely represents selected embodiments of the present application. It should be noted that, unless there is a conflict, the various features of the embodiments of the present application may be combined with each other, and the combined embodiments are still within the scope of protection of the present application.

[0029] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0030] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," "outer," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the product of this application is typically placed when in use. These terms are intended only to facilitate the description of this application and simplify the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0031] Furthermore, terms such as "horizontal" and "vertical" do not necessarily mean that a component must be absolutely horizontal or overhanging, but rather that it can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," and does not mean that the structure must be completely horizontal, but rather that it can be slightly tilted.

[0032] It should also be noted that, in the description of this application, unless otherwise expressly specified or limited, the terms "disposed," "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0033] The aging test of a chip is a key basic test for measuring the reliability of the chip. During the test, the chip needs to be fixed in a test socket, and the chip is connected with a PCB board through the probe of the test socket, so as to monitor the running status and data of the chip.

[0034] In order to ensure that the contacts on the chip can stably contact with the probe, a pressing assembly is usually arranged on the test socket to press the chip against the probe. However, the pressing height of the existing pressing assembly cannot be adjusted, so that the test socket can only test the chip with one thickness and cannot adapt to chips with different thicknesses.

[0035] In order to solve the above technical problems, please refer to Figure 1 The chip test socket 10 is used for fixing on a PCB board to perform chip aging test. Please refer to Figure 2 and Figure 3 The chip test socket 10 comprises a base assembly 11, an upper cover 12 buckled on the base assembly 11 and a pressing assembly 13. The side of the base assembly 11 facing the upper cover 12 is provided with a receiving groove 111 for placing a chip to be tested. The pressing assembly 13 comprises a knob 131, a stud 132 and a pressing block 133. The pressing block 133 is used for pressing the chip to be tested. The pressing block 133 is movably arranged on the upper cover 12. The movement direction A of the pressing block 133 relative to the upper cover 12 is perpendicular to the chip bearing surface 1111 of the receiving groove 111. The side of the pressing block 133 away from the receiving groove 111 is connected with the stud 132. The axis direction of the stud 132 is parallel to the movement direction A. The knob 131 is rotationally arranged on the side of the upper cover 12 away from the base assembly 11. The stud 132 is threadedly connected with the knob 131.

[0036] The chip test socket 10 comprises a base assembly 11, an upper cover 12 and a pressing assembly 13. The base assembly 11 is used for placing a chip to be tested. The surface of the base assembly 11 is provided with a receiving groove 111. The chip to be tested is placed in the receiving groove 111. Preferably, the shape and size of the receiving groove 111 are matched with the chip, so that the chip can be better limited and prevented from moving in the receiving groove 111.

[0037] The upper cover 12 is movably arranged on the base assembly 11, so as to enclose the chip to be tested between the base assembly 11 and the upper cover 12. The chip to be tested can be placed or taken out when the upper cover 12 is opened. The chip to be tested can be tested when the upper cover 12 is closed. The upper cover 12 can be connected with the base assembly 11 and rotationally or slidably arranged on the base assembly 11, or the upper cover 12 can be not connected with the base assembly 11 and only fixed on the base assembly 11 during the test. The embodiment is not limited in this regard.

[0038] The pressing assembly 13 is arranged on the upper cover 12. When the chip to be tested is tested, it moves relative to the upper cover 12 in the direction of the chip to be tested, thereby pressing the chip to be tested. Specifically, the pressing assembly 13 includes a knob 131, a stud 132 and a pressing block 133. Among them, the pressing block 133 is a part of the pressing assembly 13 that contacts and presses the chip to be tested. The pressing block 133 can move relative to the upper cover 12. When the chip to be tested is tested, the pressing block 133 is located between the upper cover 12 and the base assembly 11. The moving direction A of the pressing block 133 is perpendicular to the chip carrying surface 1111 of the accommodating groove 111, so that the pressing block 133 can move in a direction perpendicular to the surface of the chip to be tested to approach or move away from the chip to be tested. The side of the pressing block 133 facing away from the base assembly 11 is fixedly connected to the stud 132, and the axis of the stud 132 is parallel to the moving direction A of the pressing block 133. The stud 132 is provided with an external thread, and the knob 131 is provided with a threaded hole that can cooperate with the external thread. The stud 132 extends out of the area of ​​the upper cover 12 and is threadedly connected to the knob 131. The knob 131 is rotatably set on the side of the upper cover 12 away from the base assembly 11. The user rotates the knob 131 to drive the stud 132 to move in a direction perpendicular to the surface of the chip to be tested through threaded cooperation. The stud 132 drives the lower pressure block 133 to move synchronously, so that the lower pressure block 133 presses the chip to be tested or separates from the chip to be tested. Since the movement distance of the lower pressure block 133 can be adjusted by the cooperation of the knob 131 and the stud 132, the above-mentioned chip test socket 10 can be adapted to chips to be tested of different thicknesses.

[0039] During use, the chip to be tested is first placed in the receiving groove 111 of the base assembly 11, and then the upper cover 12 is placed on the base assembly 11. After the upper cover 12 is in place, the knob 131 is rotated, and the screw 132 drives the lower pressure block 133 toward the chip to be tested until the lower pressure block 133 presses the chip to be tested. At this point, the chip to be tested can be tested. After the test is completed, the knob 131 is rotated in the opposite direction to separate the lower pressure block 133 from the chip to be tested. The upper cover 12 is then opened and the chip to be tested can be removed.

[0040] The chip test socket 10 is provided with a pressing assembly 13 with an adjustable pressing height on the upper cover 12 , thereby enabling testing of chips to be tested with different thicknesses.

[0041] Optionally, a first through hole 121 is provided on the upper cover 12, and the lower pressure assembly 13 also includes a connecting member and a spring. The connecting member includes a connecting head and a connecting rod connected to the connecting head. The connecting head is located on the side of the upper cover 12 away from the lower pressure assembly 13. The connecting rod is located in the first through hole 121 and extends out of the first through hole 121. The spring is sleeved on the connecting rod, and one end of the spring abuts against the upper cover 12 and the other end abuts against the lower pressure block 133.

[0042] The lower pressing block 133 is installed on the upper cover 12 in a floating manner through a connecting piece and a spring. Specifically, a first through hole 121 is provided on the upper cover 12, and the first through hole 121 passes through two opposite surfaces of the upper cover 12. The connecting piece includes a connecting head and a connecting rod. The length of the connecting rod is greater than the length of the first through hole 121. The connecting rod is inserted into the first through hole 121 from the side of the upper cover 12 facing away from the base assembly 11, and extends from the side of the upper cover 12 facing the base assembly 11. The connecting head is located on the side of the upper cover 12 facing away from the base assembly 11, and the size of the connecting head is greater than the size of the first through hole 121, thereby ensuring that the connecting head does not enter the first through hole 121. The portion of the connecting rod extending from the first through hole 121 is covered with a spring and fixedly connected to the lower pressing block 133. After the lower pressing block 133 is installed, one end of the spring abuts against the upper cover 12, and the other opposite end abuts against the lower pressing block 133.

[0043] When the knob 131 is rotated to drive the pressing block 133 closer to the chip under test, the connecting rod and connector follow the pressing block 133 and move toward the chip under test. When the connector moves to abut against the upper cover 12, the pressing block 133 reaches its lower limit. When the knob 131 is rotated to drive the pressing block 133 away from the chip under test, the connecting rod and connector follow the pressing block 133 and move away from the chip under test. During this process, the spring is compressed. When the spring reaches its compression limit, the pressing block 133 also reaches its upper limit.

[0044] For example, the connecting member is a bolt, the connecting head is a bolt head, the connecting rod is a bolt rod, and the bolt rod is threadedly connected to the lower pressing block 133. The bolt is a standard part, and the use of bolts to connect the lower pressing block 133 and the upper cover 12 is low in cost.

[0045] For example, there are four connectors and four springs, each of which is arranged in a one-to-one correspondence. The four connectors are evenly distributed in a rectangular or circular pattern on the upper cover 12. This arrangement can improve the reliability of the connection between the lower pressing block 133 and the upper cover 12 and make the movement of the lower pressing block 133 smoother.

[0046] Optionally, a second through hole 122 is further provided on the upper cover 12 , the center line of the second through hole 122 coincides with the center line of the upper cover 12 , and the stud 132 passes through the second through hole 122 and extends from the upper cover 12 and is connected to the knob 131 .

[0047] Disposing the second through hole 122 at the center of the upper cover 12 is beneficial to the arrangement of the lower pressing block 133 and the accommodating groove 111 on the base assembly 11 , and can more reasonably utilize the space on the upper cover 12 and the base assembly 11 .

[0048] Optionally, a handle 134 is provided on the side wall of the knob 131 , and the handle 134 is used to drive the knob 131 to rotate.

[0049] The user pushes the handle 134 clockwise or counterclockwise to drive the knob 131 to rotate clockwise or counterclockwise, thereby driving the screw rod and the lower pressing block 133 to move up and down. The handle 134 is provided on the side wall of the knob 131, which can make it more convenient for the user to drive the knob 131 to rotate.

[0050] For example, the handle 134 is linear and perpendicular to the axis of the knob 131 .

[0051] For example, the outer wall of the handle 134 is provided with a threaded section, and the side wall of the knob 131 is provided with a threaded hole. The threaded section of the handle 134 is screwed into the threaded hole of the knob 131, thereby achieving a fixed connection between the handle 134 and the knob 131.

[0052] Optionally, the edge of the upper cover 12 is pivotally connected to the edge of the base assembly 11, thereby enabling the chip test socket 10 to be opened and closed by rotating the upper cover 12. The upper cover 12 is provided with a latch 123, and the base assembly 11 is provided with a slot 114 that mates with the latch 123. When the upper cover 12 is placed on the base assembly 11, the latch 123 engages with the slot 114, locking the upper cover 12 and the base assembly 11. When the upper cover 12 needs to be opened, the latch 123 is driven out of the slot 114 to open the upper cover 12.

[0053] For example, the upper cover 12 is provided with a latch hole, and the latch 123 is slidably installed in the latch hole and can be retracted or extended from the latch hole. A compression spring is provided between the latch 123 and the bottom of the latch hole, and the expansion and contraction direction of the compression spring is parallel to the sliding direction of the latch 123. The latch 123 is provided with a driving part, which is always located outside the latch hole.

[0054] When the upper cover 12 is placed on the base assembly 11, the buckle 123, driven by the compression spring, extends from the locking hole and into the locking slot 114 of the base assembly 11, thereby locking the upper cover 12 to the base assembly 11. When the upper cover 12 needs to be opened, the user manually pushes the buckle 123 into the locking hole through the driving unit, thereby releasing the lock between the buckle 123 and the locking slot 114, and the upper cover 12 can be opened.

[0055] Furthermore, there are two buckles 123, and accordingly, there are two buckles 123, two buckle holes, two buckle slots 114, and two compression springs, with one buckle 123, one buckle hole, one buckle slot 114, and one compression spring corresponding to each other. The two buckles 123 are symmetrically arranged, and the two buckle slots 114 are symmetrically arranged on both sides of the two buckles 123.

[0056] When it is necessary to open the upper cover 12, the user pinches the driving parts of the two buckles 123 and drives the two driving parts closer together, so that the two buckles 123 are respectively unlocked from their corresponding locking slots 114, thereby opening the upper cover 12. The provision of two buckles 123 can make the locking between the upper cover 12 and the base assembly 11 more reliable and also facilitate opening the upper cover 12 after locking.

[0057] Optionally, the base assembly 11 includes a base 112 and a needle plate 113 arranged on the base 112, the accommodating groove 111 is located on the needle plate 113, and a probe is provided at the bottom of the accommodating groove 111, one end of the probe is used to abut against the chip to be tested, and the other end is used to abut against the PCB board to electrically connect the chip to be tested with the PCB board.

[0058] It can be understood that the position of one end of the probe on the needle plate 113 should correspond to the position of the contact on the chip to be tested, and the position of the other end should correspond to the position of the contact on the PCB board. The probe is set at the bottom of the accommodating groove 111 and exposed from the accommodating groove 111. When the chip to be tested is placed in the accommodating groove 111, the chip to be tested is in contact with the probe at the bottom of the accommodating groove 111. After the pressing component 13 presses the chip to be tested, stable contact is achieved between the chip to be tested and the probe. When the chip test socket 10 is fixed on the PCB board, the probe also comes into contact with the contact on the PCB board. At this time, the electrical connection between the chip to be tested and the PCB board can be achieved.

[0059] When performing an aging test on a chip to be tested, especially for a large-sized and high-power chip to be tested, it is necessary to ensure that the chip to be tested generates about 300W of heat while maintaining a junction temperature of 125°C to complete the test. In order to control the temperature of the chip to be tested, the chip test socket 10 optionally further includes a temperature control component 14, which includes a controller, a temperature sensor 141 electrically connected to the controller, a heater 142, and a heat sink 143. The temperature sensor 141 is used to monitor the surface temperature of the chip to be tested, the heater 142 is used to heat the chip to be tested, and the heat sink 143 is used to cool the chip to be tested.

[0060] When testing the chip to be tested, the user will set a preset test temperature, hoping that the chip to be tested will always remain at the preset test temperature during the test. During the test, the temperature sensor 141 monitors the surface temperature of the chip to be tested in real time, and transmits the temperature information of the chip to be tested to the controller. After receiving the temperature information, the controller compares it with the preset test temperature. If the temperature of the chip to be tested is higher than the preset test temperature, the controller controls the radiator 143 to turn on, cool the chip to be tested, and reduce the temperature of the chip to be tested to the preset test temperature; if the temperature of the chip to be tested is lower than the preset test temperature, the controller controls the heater 142 to turn on, heat the chip to be tested, and raise the temperature of the chip to be tested to the preset test temperature. During the entire test process, the temperature control component 14 continues to work to keep the chip to be tested at the preset test temperature.

[0061] Optionally, the lower pressing block 133 includes a heat conducting block 1331 , which is used to press the chip to be tested. The heater 142 and the heat sink 143 are both disposed on the heat conducting block 1331 .

[0062] The heat conducting block 1331 is fixedly connected to the stud 132 and can be moved closer to or away from the chip to be tested by the drive of the knob 131. The heat conducting block 1331 and the stud 132 can be directly connected or indirectly connected through other structures.

[0063] The heat conducting block 1331 can absorb the heat generated by the chip under test and can also transfer heat to the chip under test. The heater 142 and the heat sink 143 are both arranged on the heat conducting block 1331, so that the temperature of the chip under test is adjusted by the heat conducting block 1331.

[0064] When the temperature sensor 141 detects that the temperature of the chip to be tested is higher than the preset test temperature, the controller controls the radiator 143 to turn on and cool the heat conductive block 1331. After the temperature of the heat conductive block 1331 is reduced, it absorbs the heat of the chip to be tested, thereby reducing the temperature of the chip to be tested to the preset test temperature; when the temperature sensor 141 detects that the temperature of the chip to be tested is lower than the preset test temperature, the controller controls the heater 142 to turn on and heat the heat conductive block 1331. After the temperature of the heat conductive block 1331 rises, it transfers the heat to the chip to be tested, thereby increasing the temperature of the chip to be tested to the preset test temperature.

[0065] By using the heat conducting block 1331 to heat or cool the chip to be tested, the temperature change of the chip to be tested can be made more stable, thereby avoiding damage to the chip to be tested.

[0066] Preferably, the area of ​​the heat conducting surface of the heat conducting block 1331 for contacting the chip to be tested is greater than or equal to the surface area of ​​the chip to be tested, so that the heat conducting block 1331 can completely cover the surface of the chip to be tested, thereby achieving better heat conduction effect.

[0067] Optionally, a first mounting hole 1331 c is defined in the heat conducting block 1331 , the heater 142 is fixed in the first mounting hole 1331 c , and a heat conducting material is filled between the heater 142 and the wall of the first mounting hole 1331 c .

[0068] The size of the first mounting hole 1331c is slightly larger than that of the heater 142 to facilitate installation of the heater 142. After the heater 142 is installed, a thermally conductive material is injected into the first mounting hole 1331c so that the thermally conductive material fills the gap between the heater 142 and the first mounting hole 1331c. This ensures effective heat transfer between the heater 142 and the heat conductive block 1331, thereby improving thermal conductivity.

[0069] Preferably, the end of the first mounting hole 1331c is located on the surface of the heat conducting block 1331 away from the base assembly 11. This arrangement can facilitate the lead-out of the wires of the heater 142 and avoid affecting the test of the chip to be tested.

[0070] For example, the heater 142 is a heating rod, and the heat-conducting material is thermal grease.

[0071] Optionally, the radiator 143 includes a fan 1431 and heat dissipation teeth 1432 , the heat dissipation teeth 1432 are in contact with the heat conductive block 1331 , the fan 1431 is electrically connected to the controller, and the fan 1431 is used to blow air toward the heat dissipation teeth 1432 .

[0072] The heat transferred from the chip to be tested to the heat conducting block 1331 is further transferred to the heat dissipation teeth 1432 . The fan 1431 blows air toward the heat dissipation teeth 1432 , thereby accelerating the heat dissipation from the heat dissipation teeth 1432 .

[0073] Optionally, the heat sink 143 is located on a side of the upper cover 12 facing away from the base assembly 11 , and the heat conducting block 1331 is exposed from the upper cover 12 and connected to the heat sink 143 .

[0074] The upper cover 12 is provided with a through hole, and the heat conducting block 1331 is installed in the through hole and exposed by the through hole, thereby connecting to the radiator 143. The radiator 143 is arranged on the side of the upper cover 12 away from the base assembly 11, which is conducive to the rapid dissipation of heat and also facilitates the installation of the radiator 143.

[0075] Optionally, the heat conductive block 1331 includes a pressing portion 1331a and a platform portion 1331b, one end of the pressing portion 1331a is used to press the chip to be tested, and the other end is connected to the platform portion 1331b, the platform portion 1331b is located on the side of the upper cover 12 away from the lower pressure assembly 13, and the heat sink 143 is fixedly set on the platform portion 1331b.

[0076] The pressing portion 1331a is disposed within the upper cover 12. The pressing portion 1331a extends from the upper cover 12 and moves closer to or further away from the chip to be tested under the drive of the knob 131. The platform portion 1331b is located on the side of the upper cover 12 away from the lower pressing assembly 13 and is fixedly connected to the pressing portion 1331a. It is understood that the size of the platform portion 1331b should be larger than the size of the pressing portion 1331a and the size of the through hole on the upper cover 12 for accommodating the pressing portion 1331a, thereby ensuring that the platform portion 1331b does not enter the upper cover 12 and providing a larger installation plane for the radiator 143, thereby facilitating the installation of the radiator 143.

[0077] In order to facilitate the fixed connection between the heat conducting block 1331 and the stud 132, optionally, the lower pressing block 133 further includes a pressing block 1332, which is connected to the stud 132, and the heat conducting block 1331 is fixed on the pressing block 1332. The heat conducting block 1331 is indirectly fixedly connected to the stud 132 through the pressing block 1332.

[0078] Optionally, the pressing block 1332 , the stud 132 and the knob 131 are all provided with a third through hole 135 , and the heat conducting block 1331 passes through the third through hole 135 on the pressing block 1332 , the stud 132 and the knob 131 .

[0079] The heat conducting block 1331 is exposed from the upper cover 12 through the third through-hole 135 on the pressing block 1332, the stud 132, and the knob 131, facilitating connection to the heat sink 143. Furthermore, the pressing block 1332, the stud 132, and the knob 131 are all configured in an annular shape, and the heat conducting block 1331 is positioned within the three. This better protects the heat conducting block 1331 and also facilitates making the pressing block 1332 larger for connection to the upper cover 12.

[0080] Optionally, a second mounting hole 1331 d is further provided in the heat conductive block 1331 , and the temperature sensor 141 is fixed in the second mounting hole 1331 d , with the test end 1411 of the temperature sensor 141 flush with the surface of the heat conductive block 1331 facing the base assembly 11 .

[0081] The surface of the thermal block 1331 facing the base assembly 11 is the heat-conducting surface of the thermal block 1331 that contacts the chip under test. The test end 1411 of the temperature sensor 141 is the end of the temperature sensor 141 that is used to sense the temperature of an object. By arranging the test end 1411 of the temperature sensor 141 flush with the surface of the thermal block 1331 facing the base assembly 11, the test end 1411 of the temperature sensor 141 can be brought into contact with the surface of the chip under test after the thermal block 1331 is pressed against the chip under test. This allows the temperature of the chip under test to be directly measured without damaging the surface of the chip under test.

[0082] The above description is merely a preferred embodiment of the present application and is not intended to limit the present application. Various modifications and variations are possible for those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present application shall be included within the scope of protection of the present application.

Claims

1. A chip test socket, characterized in that: include: A base assembly (11), an upper cover (12) fastened to the base assembly (11), and a lower pressing assembly (13); the base assembly (11) is provided with a receiving groove (111) on a side facing the upper cover (12); the receiving groove (111) is used to place a chip to be tested; the lower pressing assembly (13) includes a knob (131), a stud (132), and a lower pressing block (133); the lower pressing block (133) is used to press the chip to be tested; the lower pressing block (133) is movably arranged on the upper cover (12); The lower pressing block (133) is perpendicular to the chip carrying surface (1111) of the accommodating groove (111) relative to the movable direction (A) of the upper cover (12); the side of the lower pressing block (133) facing away from the accommodating groove (111) is connected to the stud (132); the axial direction of the stud (132) is parallel to the movable direction (A); the knob (131) is rotatably arranged on the side of the upper cover (12) facing away from the base assembly (11); the stud (132) is threadedly connected to the knob (131).

2. The chip test socket according to claim 1, wherein: The upper cover (12) is provided with a first through hole (121), and the pressing assembly (13) further includes a connecting piece and a spring, wherein the connecting piece includes a connecting head and a connecting rod connected to the connecting head, the connecting head is located on the side of the upper cover (12) away from the pressing assembly (13), the connecting rod is located in the first through hole (121) and extends out of the first through hole (121), and the spring is sleeved on the connecting rod, one end of the spring abuts against the upper cover (12), and the other end abuts against the pressing block (133).

3. The chip test socket according to claim 1, wherein: The chip test socket (10) further comprises a temperature control component (14), the temperature control component (14) comprising a controller, a temperature sensor (141) electrically connected to the controller, a heater (142) and a radiator (143), the temperature sensor (141) being used to monitor the surface temperature of the chip to be tested, the heater (142) being used to heat the chip to be tested, and the radiator (143) being used to cool the chip to be tested.

4. The chip test socket according to claim 3, wherein: The lower pressing block (133) comprises a heat conducting block (1331), the heat conducting block (1331) is used to press the chip to be tested, and the heater (142) and the heat sink (143) are both arranged on the heat conducting block (1331).

5. The chip test socket according to claim 4, wherein: A first mounting hole (1331c) is provided in the heat-conducting block (1331), the heater (142) is fixed in the first mounting hole (1331c), and heat-conducting material is filled between the heater (142) and the hole wall of the first mounting hole (1331c).

6. The chip test socket according to claim 4, wherein: The radiator (143) is located on a side of the upper cover (12) facing away from the base assembly (11), and the heat conducting block (1331) is exposed from the upper cover (12) and connected to the radiator (143).

7. The chip test socket according to claim 6, wherein: The lower pressing block (133) further comprises a pressing block (1332), wherein the pressing block (1332) is connected to the stud (132), and the heat conducting block (1331) is fixed on the pressing block (1332).

8. The chip test socket according to claim 7, wherein: The pressing block (1332), the stud (132) and the knob (131) are all provided with a third through hole (135), and the heat conducting block (1331) passes through the third through hole (135) on the pressing block (1332), the stud (132) and the knob (131).

9. The chip test socket according to claim 6, wherein: The heat conducting block (1331) comprises a pressing portion (1331a) and a platform portion (1331b); one end of the pressing portion (1331a) is used to press the chip to be tested, and the other end is connected to the platform portion (1331b); the platform portion (1331b) is located on a side of the upper cover (12) away from the lower pressing assembly (13); and the heat sink (143) is fixedly arranged on the platform portion (1331b).

10. The chip test socket according to claim 4, wherein: The radiator (143) comprises a fan (1431) and heat dissipation teeth (1432), the heat dissipation teeth (1432) are in contact with the heat conductive block (1331), the fan (1431) is electrically connected to the controller, and the fan (1431) is used to blow air toward the heat dissipation teeth (1432).

11. The chip test socket according to claim 4, wherein: A second mounting hole (1331d) is provided in the heat-conducting block (1331), the temperature sensor (141) is fixed in the second mounting hole (1331d), and the test end (1411) of the temperature sensor (141) is flush with the surface of the heat-conducting block (1331) facing the base assembly (11).

12. The chip test socket according to claim 1, wherein: The base assembly (11) comprises a base (112) and a needle plate (113) arranged on the base (112); the accommodating groove (111) is located on the needle plate (113); a probe is provided at the bottom of the accommodating groove (111); one end of the probe is used to abut against the chip to be tested, and the other end is used to abut against a PCB board, so that the chip to be tested is electrically connected to the PCB board.

13. The chip test socket according to claim 1, wherein: A handle (134) is provided on the side wall of the knob (131), and the handle (134) is used to drive the knob (131) to rotate.

14. The chip test socket according to claim 1, wherein: The edge of the upper cover (12) is rotatably connected to the edge of the base assembly (11); the upper cover (12) is provided with a buckle (123); the base assembly (11) is provided with a slot (114) that cooperates with the buckle (123); the buckle (123) is snapped into the slot (114) to lock the upper cover (12) and the base assembly (11).

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