Test probe station of semiconductor device

Abstract

The utility model discloses a test probe station of a semiconductor device, which comprises a base, a test loading disc arranged on the base and a probe head positioned above the test loading disc, and an annular groove is arranged on the upper surface of the base and positioned on the outer side of the test loading disc. An annular plate capable of rotating around the center of the annular groove is installed in the annular groove in an embedded mode, a plurality of containing grooves which are formed in the circumferential direction at equal intervals are formed in the lower surface of the annular plate, a gear is rotatably installed in each containing groove, an installation groove extending in the whole circumferential direction is formed in the bottom face of the annular groove, and the gear is installed in the installation groove. A gear ring meshed with the gears is fixedly mounted in the mounting groove, and at least one gear is in transmission connection with a driving assembly. According to the utility model, the probe head can be rotated and adjusted so as to meet the multi-point test of the to-be-tested product on the test loading disc, and the position of the to-be-tested product does not need to be repeatedly adjusted.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of semiconductor device package, concretely to a test probe station of semiconductor device. BACKGROUND

[0002] The probe station is one of important detection equipment in semiconductor industry, is widely used in the precision electrical measurement of complex, high speed device, aims at ensuring device quality and reliability, and reduces the cost of research and development time and device manufacturing process. With the development of industry, the types of measured device are more and more, and the requirement is more and more complex, the function of probe station must have corresponding promotion, on this basis, test efficiency is also an important factor that can not be ignored. The existing test probe assembly carries out probe test to the different directions of device through multiple fixed position probe heads, but the position of existing probe head is fixed, so the direction of measured device needs to be adjusted, and the device needs to be rotated in the process of adjusting device direction, which is easy to produce position deviation, so repositioning calibration is needed, which affects the efficiency of test. SUMMARY

[0003] The utility model discloses a kind of test probe stations of semiconductor device, which can test multiple point positions of the product to be tested on test carrier disc and does not need to repeatedly adjust the position of the product to be tested, improve the efficiency and precision of test.

[0004] To achieve the above object, the utility model adopts the technical scheme of: a kind of test probe station of semiconductor device, comprising: base, test carrier disc being set on base and probe head being located above test carrier disc, the upper surface of base and located the outside of test carrier disc is provided with a annular groove, the annular groove is embedded and is installed with the annular plate that can rotate around the center of annular groove, the lower surface of annular plate is provided with a plurality of accommodation grooves being set at equidistant along circumference, each accommodation groove is rotatably mounted with a gear, the bottom of annular groove is provided with an installation slot extending along full circumference, the installation slot is fixedly installed with a gear ring being meshed with a plurality of gears respectively, at least one gear is drivingly connected with a driving assembly, the probe head is installed on annular plate by a mounting seat.

[0005] The further improved scheme in the above technical scheme is as follows:

[0006] 1. In the above scheme, a limiting slot is formed on each of the two opposite side walls of the annular groove, and the two side walls of the annular plate each have a limiting protrusion matched with the limiting slot.

[0007] 2. In the above scheme, the limiting protrusion is embedded in the corresponding limiting slot and is in sliding fit with the limiting slot.

[0008] 3. In the above solution, the driving component is a motor.

[0009] 4. In the above solution, the test carrier is a vacuum adsorption carrier.

[0010] Due to the application of the above technical solution, the utility model has the following advantages compared with the prior art:

[0011] The utility model provides a test probe station for semiconductor devices, wherein an annular groove is provided on the upper surface of the base and located on the outer side of the test carrier, an annular plate which can rotate around the center of the annular groove is embedded in the annular groove, a plurality of accommodating grooves which are arranged at equal intervals along the circumferential direction are provided on the lower surface of the annular plate, a gear is rotatably installed in each of the accommodating grooves, a mounting groove extending along the entire circumference is provided on the bottom surface of the annular groove, a gear ring which is respectively meshed with the plurality of the gears is fixedly installed in the mounting groove, at least one of the gears is connected to a drive assembly in a transmission manner, the probe head is mounted on the annular plate through a mounting seat, the probe head can be rotated and adjusted to meet the multi-point test of the product to be tested on the test carrier without repeatedly adjusting the position of the product to be tested, thereby improving the efficiency and accuracy of the test. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Attachment Figure 1 This is a schematic diagram of the overall structure of a test probe station for semiconductor devices of the present invention;

[0013] Attachment Figure 2 This is a cross-sectional schematic diagram of a test probe station for a semiconductor device of the present invention;

[0014] Attachment Figure 3 For attachment Figure 2 Enlarged view of point A in the middle.

[0015] In the above figures: 1. Base; 2. Test carrier; 301. Annular groove; 302. Annular plate; 303. Gear; 304. Drive assembly; 305. Mounting groove; 306. Gear ring; 307. Limiting groove; 308. Limiting protrusion; 309. Accommodating groove; 4. Probe head; 41. Mounting seat. DETAILED DESCRIPTION

[0016] The present invention can be further understood through the specific embodiments given below, but they are not intended to limit the present invention.

[0017] Embodiment 1: a test probe station of a semiconductor device, comprising: a base 1, a test tray 2 arranged on the base 1, and a probe head 4 located above the test tray 2, a ring-shaped groove 301 is arranged on the upper surface of the base 1 and located outside the test tray 2, a ring-shaped plate 302 capable of rotating around the center of the ring-shaped groove 301 is embedded and arranged in the ring-shaped groove 301, a plurality of accommodation grooves 309 are arranged on the lower surface of the ring-shaped plate 302 and are equidistantly arranged along the circumference, a gear 303 is rotatably arranged in each of the accommodation grooves 309, an installation groove 305 extending along the whole circumference is arranged on the bottom surface of the ring-shaped groove 301, a gear ring 306 meshing with the plurality of gears 303 is fixedly arranged in the installation groove 305, at least one of the gears 303 is in transmission connection with a driving assembly 304, and the probe head 4 is arranged on the ring-shaped plate 302 through a mounting seat 41.

[0018] The driving assembly 304 is an electric motor, and the test tray 2 is a vacuum adsorption tray.

[0019] Embodiment 2: a test probe station of a semiconductor device, comprising: a base 1, a test tray 2 arranged on the base 1, and a probe head 4 located above the test tray 2, a ring-shaped groove 301 is arranged on the upper surface of the base 1 and located outside the test tray 2, a ring-shaped plate 302 capable of rotating around the center of the ring-shaped groove 301 is embedded and arranged in the ring-shaped groove 301, a plurality of accommodation grooves 309 are arranged on the lower surface of the ring-shaped plate 302 and are equidistantly arranged along the circumference, a gear 303 is rotatably arranged in each of the accommodation grooves 309, an installation groove 305 extending along the whole circumference is arranged on the bottom surface of the ring-shaped groove 301, a gear ring 306 meshing with the plurality of gears 303 is fixedly arranged in the installation groove 305, at least one of the gears 303 is in transmission connection with a driving assembly 304, and the probe head 4 is arranged on the ring-shaped plate 302 through a mounting seat 41.

[0020] A limiting groove 307 is arranged on each of the two opposite side walls of the ring-shaped groove 301, the ring-shaped plate 302 is provided with a limiting protrusion 308 on each of the two side walls, the limiting protrusion 308 is embedded in the corresponding limiting groove 307 and is in sliding connection with the limiting groove 307.

[0021] Working principle:

[0022] During testing, the product to be tested is placed on the test tray and positioned;

[0023] When the direction of the test probe needs to be adjusted, the control driving assembly is operated to drive the gear to rotate relatively engaged on the surface of the gear ring, under the limiting of the limiting convex block embedded in the limiting groove, the annular plate is annularly movable in the annular groove, thereby driving the probe head to efficiently adjust the direction of the probe according to the product to be tested placed on the surface of the test carrier, which can rotate the probe head to meet the multi-point testing of the product to be tested on the test carrier without repeatedly adjusting the position of the product to be tested.

[0024] When the test probe station is used, the probe head can be rotated to meet the multi-point testing of the product to be tested on the test carrier without repeatedly adjusting the position of the product to be tested, thereby improving the efficiency and accuracy of the test.

[0025] The above embodiments are only for illustrating the technical concept and characteristics of the utility model, and the purpose is to enable those skilled in the art to understand the content of the utility model and implement it, and cannot limit the protection scope of the utility model. Any equivalent changes or modifications made according to the spirit and essence of the utility model shall be covered within the protection scope of the utility model.

Claims

1. A test probe station for a semiconductor device, comprising: A base (1), a test carrier (2) arranged on the base (1), and a probe head (4) located above the test carrier (2), characterized in that: an annular groove (301) is provided on the upper surface of the base (1) and located on the outer side of the test carrier (2), an annular plate (302) is embedded in the annular groove (301) and can rotate around the center of the annular groove (301), and a plurality of accommodating grooves (309) are provided on the lower surface of the annular plate (302) at equal intervals along the circumferential direction. A gear (303) is rotatably mounted in each of the receiving grooves (309), a mounting groove (305) extending along the entire circumference is provided on the bottom surface of the annular groove (301), a gear ring (306) is fixedly mounted in the mounting groove (305) and is respectively engaged with a plurality of the gears (303), at least one of the gears (303) is transmission-connected to a driving assembly (304), and the probe head (4) is mounted on the annular plate (302) via a mounting seat (41).

2. The semiconductor device test probe station according to claim 1, wherein: A limiting groove (307) is provided on each of the two opposite side walls of the annular groove (301), and a limiting protrusion (308) is provided on each of the two side walls of the annular plate (302) to cooperate with the limiting groove (307).

3. The semiconductor device test probe station according to claim 2, wherein: The limiting protrusion (308) is embedded in the corresponding limiting groove (307) and slidably engages with the limiting groove (307).

4. The semiconductor device test probe station according to claim 1, wherein: The driving component (304) is a motor.

5. The semiconductor device test probe station according to claim 1, wherein: The test carrier (2) is a vacuum adsorption carrier.

Images