High-speed optical module heat dissipation structure

Abstract

The utility model relates to the technical field of optical modules, in particular to a heat dissipation structure of a high-speed optical module, which comprises a base, upper side sealing plates are arranged on the left side and the right side of the upper end of the base, a positioning groove part is arranged on the bottom surface of the base, the upper end and the lower end of the base are communicated through the positioning groove part, and a heat dissipation piece is assembled at the positioning groove part; the positioning slot is provided with a first opening body and a second opening body; the heat dissipation piece comprises an aluminum heat dissipation device assembled in the first opening body and a copper heat dissipation device assembled in the second opening body; the aluminum radiator is made of high-thermal-conductivity aluminum alloy, and the copper radiator is made of copper alloy. According to the technology, a multi-section combined connection mode is adopted, efficient heat dissipation is achieved, a high-power-consumption part is made of copper, a low-power-consumption part is made of aluminum, and the problem of high-power-consumption heat dissipation is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of optical modules, in particular to a heat dissipation structure of a high-speed optical module. Background Art

[0002] An optical module usually consists of a light emitting device (TOSA, including a laser), a light receiving device (ROSA, including a photodetector), functional circuits, and optical (electrical) interfaces.

[0003] As bandwidth in optical communications continues to increase, optical module bandwidth is also being upgraded. However, as optical fiber product power increases, the volumetric heat density also increases, which leads to higher operating temperatures. High temperatures can reduce product lifespan and performance, necessitating more appropriate product designs that simplify optical module design and improve heat dissipation. Utility Model Content

[0004] In order to overcome the above-mentioned shortcomings, the present invention aims to provide a technical solution that can solve the above-mentioned problems.

[0005] The heat dissipation structure of the high-speed optical module includes a base, upper sealing plates are provided on the left and right sides of the upper end of the base, and a positioning groove is provided on the bottom surface of the base. The positioning groove connects the upper and lower ends, and a heat sink is assembled at the positioning groove; the positioning groove is set as a first mouth body and a second mouth body; the heat sink includes an aluminum heat sink assembled in the first mouth body and a copper heat sink assembled in the second mouth body; the aluminum heat sink is a high thermal conductivity aluminum alloy, and the copper heat sink is a copper alloy.

[0006] Furthermore, the aluminum heat sink and the base, as well as the copper heat sink and the base, are assembled by soldering.

[0007] Furthermore, it also includes a cover plate covering the upper ends of the aluminum radiator and the copper radiator.

[0008] Furthermore, the cover plate is covered on the upper ends of the aluminum radiator and the copper radiator by soldering.

[0009] Furthermore, the cover is made of sheet metal.

[0010] The beneficial effects of the utility model are:

[0011] (1) A multi-section connection method is used to achieve efficient heat dissipation, using copper for high power consumption parts and aluminum for low power consumption parts, thus solving the problem of high power consumption heat dissipation.

[0012] Additional aspects and advantages of the present invention will be given in part in the following description and will become apparent from the following description or learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 This is a schematic diagram of the assembly structure of the utility model without a cover plate.

[0014] Figure 2 This is a schematic diagram of the disassembled structure of the utility model without a cover plate.

[0015] Figure 3 This is a schematic diagram of the disassembled structure with a cover plate of the utility model.

[0016] The accompanying drawings in the figure are marked as follows: base-1, upper side sealing plate-2, positioning groove part-3, heat sink-4, first mouth body-5, second mouth body-6, aluminum radiator-7, copper radiator-8, cover plate-9. DETAILED DESCRIPTION

[0017] The following is a clear and complete description of the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only a part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0018] See also Figures 1-2 The utility model includes a base 1, and upper side sealing plates 2 are provided on the left and right sides of the upper end of the base 1. A positioning groove portion 3 is provided on the bottom surface of the base 1, the positioning groove communicates with the upper and lower ends, and a heat sink 4 is assembled at the positioning groove; the positioning groove is set as a first mouth body 5 and a second mouth body 6; the heat sink 4 includes an aluminum radiator 7 assembled in the first mouth body 5 and a copper radiator 8 assembled in the second mouth body 6; the aluminum radiator 7 is a high thermal conductivity aluminum alloy, and the copper radiator 8 is a copper alloy.

[0019] This technical solution mainly makes technical improvements based on a solution with simple structure and excellent heat dissipation.

[0020] The first assembly method is without the cover plate 9. The heat sink 4 is directly assembled with the base 1. The heat sink 4 is installed on the base 1 through the positioning groove 3 and assembled and fixed by soldering. This technology uses a multi-segment connection. Specifically, the positioning groove is set as the first mouth body 5 and the second mouth body 6. The heat sink 4 is set as an aluminum heat sink 7 assembled in the first mouth body 5 and a copper heat sink 8 assembled in the second mouth body 6. This achieves efficient heat dissipation, uses copper for the high power consumption part and aluminum for the low power consumption part, and solves the problem of high power consumption heat dissipation. The thermal conductivity of copper parts is better than that of aluminum parts, but the processing technology of aluminum parts is simpler than that of copper parts. By disassembling the heat sink and combining different structures, it is possible to meet the heat dissipation needs of high-power chips and produce at a lower cost. At the same time, compared with the same structure, the heat dissipation effect of this design can be reduced by 5 degrees.

[0021] The second assembly method is to use soldering to cover the upper ends of the aluminum radiator 7 and the copper radiator 8 with a sheet metal cover 9. The purpose of adding the cover 9 to the surface is to meet the agreed flatness and roughness requirements.

[0022] The above description is only a preferred embodiment of the present invention and does not constitute any form of limitation to the present invention. Although the present invention is disclosed as a preferred embodiment as above, it is not intended to limit the present invention. Any technician familiar with the profession can make some changes or modifications to equivalent embodiments of the above-disclosed technical contents without departing from the scope of the technical solution of the present invention. However, any simple modifications, equivalent changes and modifications made to the above embodiments according to the technology of the present invention, which do not depart from the content of the technical solution of the present invention, are within the scope of the technical solution of the present invention.

Claims

1. A high-speed optical module heat dissipation structure, comprising a base (1), upper sealing plates (2) provided on the left and right sides of the upper end of the base (1), a positioning groove portion (3) provided on the bottom surface of the base (1), the positioning groove portion communicating with the upper and lower ends, and a heat dissipation member (4) assembled at the positioning groove portion; characterized in that: The positioning slots are set as a first mouth body (5) and a second mouth body (6); The heat sink (4) includes an aluminum heat sink (7) assembled in the first body (5) and a copper heat sink (8) assembled in the second body (6); The aluminum radiator (7) is made of a high-thermal-conductivity aluminum alloy, and the copper radiator (8) is made of a copper alloy.

2. The high-speed optical module heat dissipation structure according to claim 1, characterized in that: The aluminum radiator (7) and the base (1), as well as the copper radiator (8) and the base (1), are assembled by soldering.

3. The high-speed optical module heat dissipation structure according to claim 1, characterized in that: It also includes a cover plate (9) covering the upper ends of the aluminum radiator (7) and the copper radiator (8).

4. The high-speed optical module heat dissipation structure according to claim 3, characterized in that: The cover plate (9) is covered on the upper ends of the aluminum radiator (7) and the copper radiator (8) by soldering.

5. The high-speed optical module heat dissipation structure according to claim 1, characterized in that: The base (1) is made of aluminum alloy.

6. The high-speed optical module heat dissipation structure according to claim 3, characterized in that: The cover plate (9) is made of sheet metal.

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