Display module and display device

Abstract

The embodiment of the utility model provides a display module and a display device, relates to the technical field of display, and aims to solve the problem that static electricity on a flexible circuit board is easily transmitted into a driving chip, so that the driving chip is damaged. The display module comprises an array substrate, a first electrode and a second electrode, wherein the array substrate is provided with a first side and a second side which are oppositely arranged; the driving chip is located on the first side of the array substrate, and the driving chip is bound with the array substrate; the flexible circuit board is located on the second side of the array substrate, and the flexible circuit board is bound with the array substrate. The display module is used for the display device.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a display module and a display device. Background Art

[0002] Currently, in order to increase the display area of ​​small-sized display devices and improve the splicing display effect of large-sized display devices, it is necessary to reduce the width of the outer frame from the edge of the display area to the edge of the display device, forming a so-called narrow frame design.

[0003] However, as the edges of the display device are continuously compressed, various defects are likely to occur on the display panel, thereby affecting the display effect of the display device. Utility Model Content

[0004] The purpose of the embodiments of the present disclosure is to provide a display module and a display device for improving the problem that static electricity on a flexible circuit board is easily transmitted to the inside of a driver chip, thereby causing damage to the driver chip.

[0005] To achieve the above objectives, the embodiments of the present disclosure provide the following technical solutions:

[0006] In one aspect, a display module is provided, comprising: an array substrate having a first side and a second side disposed opposite to each other; a driver chip located on the first side of the array substrate, the driver chip being bonded to the array substrate; and a flexible circuit board located on the second side of the array substrate, the flexible circuit board being bonded to the array substrate.

[0007] In the above-mentioned display module, the driver chip and the flexible circuit board are respectively arranged on opposite sides of the array substrate, which effectively avoids the problem of static electricity on the flexible circuit board being transmitted to the inside of the driver chip, thereby causing damage to the driver chip, thereby protecting the driver chip from interference and damage by static electricity, thereby ensuring the display quality of the display module; moreover, the driver chip and the flexible circuit board are respectively arranged on opposite sides of the array substrate, which can also effectively reduce the area occupied by the driver chip and the flexible circuit board in the width direction of the frame, making the overall structure of the display module more compact, thereby further reducing the frame size of the display module.

[0008] In some embodiments, the driving chip and the flexible circuit board partially overlap in the thickness direction of the display module.

[0009] In some embodiments, the display module further includes: a color filter substrate located between the array substrate and the driving chip; in the thickness direction of the display module, the driving chip and the color filter substrate partially overlap; and in the thickness direction of the display module, the flexible circuit board and the color filter substrate partially overlap.

[0010] In some embodiments, a plurality of binding pins are provided on the first side of the array substrate, a first through hole is provided on the color film substrate, and the driving chip is electrically connected to the binding pins through the first through hole; a second through hole is provided on the array substrate, and the flexible circuit board is electrically connected to the binding pins on the array substrate through the second through hole.

[0011] In some embodiments, a third through hole is further provided on the color filter substrate, the second through hole and the third through hole are connected, and the driving chip is electrically connected to the flexible circuit board through the second through hole and the third through hole.

[0012] In some embodiments, an edge of the color filter substrate is flush with an edge of the array substrate.

[0013] In some embodiments, the display module further includes: a first polarizer located on the side of the color film substrate away from the array substrate, wherein the first polarizer is spaced apart from the driver chip in a thickness direction perpendicular to the display module, and there is a gap between the first polarizer and the driver chip; a fixing portion located on the side of the color film substrate away from the array substrate, wherein the fixing portion is arranged around the driver chip, and a portion of the fixing portion is located at the gap position.

[0014] In another aspect, another display module is provided. The display module includes: an array substrate; a first conductive layer and a second conductive layer located on the array substrate and spaced apart from each other; the first conductive layer and the second conductive layer being an integral film layer; a driver chip located on a side of the first conductive layer away from the array substrate, the driver chip being bonded to the array substrate via the first conductive layer; and a flexible circuit board located on a side of the second conductive layer away from the array substrate, the flexible circuit board being bonded to the array substrate via the second conductive layer.

[0015] In some embodiments, a size of the gap between the first conductive layer and the second conductive layer is less than or equal to 0.5 mm.

[0016] In another aspect, a display device is provided, comprising: a display module according to any one of the above embodiments; and a cover plate disposed on a light-emitting side of the display module.

[0017] The above display device has the same structure and beneficial technical effects as the flexible circuit board provided in some of the above embodiments, which will not be described in detail here. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] To more clearly illustrate the technical solutions of the present disclosure, the following briefly introduces the drawings required for use in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure, and those skilled in the art can also derive other drawings based on these drawings. Furthermore, the drawings described below should be considered schematic diagrams and are not intended to limit the actual dimensions, etc., of the products involved in the embodiments of the present disclosure.

[0019] Figure 1 is a structural diagram of a display device according to some embodiments;

[0020] Figure 2 is a structural diagram of another display device according to some embodiments;

[0021] Figure 3 is a structural diagram of a display module according to some embodiments;

[0022] Figure 4 is a top view of a display module according to some embodiments;

[0023] Figure 5 is a structural diagram of another display device according to some embodiments;

[0024] Figure 6 A schematic diagram illustrating an integrated arrangement of a first conductive layer and a second conductive layer according to some embodiments;

[0025] Figure 7 is a structural diagram of another display device according to some embodiments;

[0026] Figure 8 is a partial structural diagram of a display module according to some embodiments;

[0027] Figure 9 is a partial structural diagram of another display module according to some embodiments;

[0028] Figure 10 FIG. 4 is a partial structural diagram of another display module according to some embodiments. DETAILED DESCRIPTION

[0029] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in some embodiments of the present disclosure. Obviously, the embodiments described are only some embodiments of the present disclosure, not all embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of the present disclosure.

[0030] Unless the context requires otherwise, throughout the specification and claims, the term "including" is to be interpreted as having an open, inclusive meaning, that is, "including, but not limited to." In the description of the specification, the terms "one embodiment," "some embodiments," "exemplary embodiments," "examples," or "some examples" are intended to indicate that a particular feature, structure, material, or characteristic associated with the embodiment or example is included in at least one embodiment or example of the present disclosure. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the particular features, structures, materials, or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0031] In the following, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more.

[0032] “At least one of A, B and C” has the same meaning as “at least one of A, B or C” and both include the following combinations of A, B and C: A only, B only, C only, the combination of A and B, the combination of A and C, the combination of B and C, and the combination of A, B and C.

[0033] “A and / or B” includes the following three combinations: A only, B only, and a combination of A and B.

[0034] As used herein, the term "if" is optionally interpreted to mean "when" or "upon" or "in response to determining" or "in response to detecting," depending on the context. Similarly, the phrases "if it is determined that" or "if [stated condition or event] is detected" are optionally interpreted to mean "upon determining" or "in response to determining" or "upon detecting [stated condition or event]" or "in response to detecting [stated condition or event]," depending on the context.

[0035] The use of "adapted to" or "configured to" herein is intended to be open and inclusive language that does not exclude devices adapted or configured to perform additional tasks or steps.

[0036] Additionally, the use of “based on” is meant to be open and inclusive, as a process, step, calculation, or other action “based on” one or more stated conditions or values ​​may, in practice, be based on additional conditions or values ​​beyond those stated.

[0037] As used herein, "about," "substantially," or "approximately" includes the stated value and an average value that is within an acceptable range of deviation from the particular value as determined by one of ordinary skill in the art taking into account the measurements in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system).

[0038] As used herein, "parallel", "perpendicular", and "equal" include the situations described and situations similar to the situations described, and the range of the similar situations is within an acceptable deviation range, wherein the acceptable deviation range is as determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the specific quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, wherein the acceptable deviation range of approximate parallelism can be, for example, a deviation within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, wherein the acceptable deviation range of approximate perpendicularity can also be, for example, a deviation within 5°. "Equal" includes absolute equality and approximate equality, wherein the acceptable deviation range of approximate equality can be, for example, that the difference between the two equals is less than or equal to 5% of either one.

[0039] It will be understood that when a layer or element is referred to as being on another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may be present therebetween.

[0040] Exemplary embodiments are described herein with reference to cross-sectional and / or plan views that are idealized exemplary drawings. In the drawings, the thickness of layers and the area of ​​regions are exaggerated for clarity. Therefore, variations in shape relative to the drawings due to, for example, manufacturing techniques and / or tolerances are contemplated. Therefore, the exemplary embodiments should not be construed as limited to the shapes of the regions shown herein, but rather include deviations in shape due to, for example, manufacturing. For example, an etched region shown as a rectangle will typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the actual shape of regions of the device and are not intended to limit the scope of the exemplary embodiments.

[0041] Some embodiments of the present disclosure provide a display device 1000, such as Figure 1As shown. The display device 1000 can be any display device that displays images, whether in motion (e.g., video) or fixed (e.g., still images), and whether text or images. More specifically, it is expected that the display device of the embodiments described may be implemented in or associated with a variety of electronic devices, such as (but not limited to) mobile phones, wireless devices, personal data assistants (PDAs), handheld or portable computers, GPS receivers / navigators, cameras, MP4 video players, camcorders, game consoles, watches, clocks, calculators, television monitors, flat-panel displays, computer monitors, automotive displays (e.g., odometer displays, etc.), navigation systems, cockpit controls and / or displays, displays of camera views (e.g., displays of rearview cameras in vehicles), electronic photographs, electronic billboards or signs, projectors, architectural structures, packaging, and aesthetic structures (e.g., displays of images of a piece of jewelry), etc.

[0042] In some embodiments, the display device 1000 may be a liquid crystal display (LCD). The display device 1000 may be a vertical alignment (VA) display mode, a twisted nematic (TN) display mode, an advanced-super dimensional switching (ADS) display mode, or an in-plane switching (IPS) display mode, although the embodiments of the present disclosure are not limited thereto.

[0043] In some embodiments, combined Figure 1 and Figure 2 As shown, the display device 1000 includes a display module 100 .

[0044] For example, Figure 1 As shown, the display module 100 has a display area AA and a border area BB between the display area AA and the border area BB.

[0045] The display area AA is used to display image information.

[0046] The border area BB is used to place structures such as a driving circuit that provides electrical signals (such as scan signals, data signals, etc.) to the sub-pixels P.

[0047] Exemplarily, the border area BB is located on one side of the display area AA and is disposed adjacent to the display area AA.

[0048] In addition, the number of the frame area BB may be one or more. In the case that the number of the frame area BB is multiple, the multiple frame areas BB are arranged around the display area AA.

[0049] It should be noted that the drawings in the specification of this disclosure (such as Figure 1 ), the display area AA marked with a dotted box and the border area BB marked with a dotted box are only for the convenience of displaying the display area AA and the border area BB, and do not further limit the display area AA and the border area BB.

[0050] In some examples, such as Figure 2 As shown, the display module 100 may include an array substrate 1 and a color filter substrate 2 disposed opposite to each other, and a liquid crystal layer 3 disposed between the array substrate 1 and the color filter substrate 2. The color filter substrate 2 may also be referred to as an opposing substrate or a packaging substrate.

[0051] In some examples, such as Figure 2 As shown, the display device 1000 further includes a backlight module 200 and a cover glass (CG) 300 .

[0052] The backlight module 200 is disposed on the backlight side of the display module 100 and is used to provide a planar light source for the display module 100. The cover plate 300 is disposed on the light-emitting side of the display module 100 and is used to protect the display module 100. The side of the display module 100 used to display images is the light-emitting side of the display module 100, and the side facing away from the light-emitting side of the display module 100 is the backlight side of the display module 100.

[0053] Exemplarily, the backlight module 200 can be an edge-entry backlight module or a direct-lit backlight module. In the embodiments of the present disclosure, the backlight module 200 is described as a direct-lit backlight module. A direct-lit backlight module includes a plurality of light-emitting devices arranged in an array and a diffuser plate. The light-emitting device is also called a point light source. Exemplarily, the light-emitting device can be an LED lamp bead or a micro-LED chip. The light emitted by the plurality of light-emitting devices is homogenized by the diffuser plate and then incident on the display module 100 for display.

[0054] As will be appreciated, light emitted by the backlight module 200 can pass through the array substrate 1 and illuminate the liquid crystal layer 3. The liquid crystal layer 3 includes liquid crystal molecules. The liquid crystal molecules in the liquid crystal layer 3 are twisted by the driving electric field formed between the pixel electrode (not shown) provided on the array substrate 1 and the common electrode provided on the array substrate 1 or the common electrode (not shown) provided on the color filter substrate 2. By controlling the deflection angle of the liquid crystal molecules, the intensity of light that passes through the liquid crystal layer 3 and illuminates the color filter substrate 2 can be controlled, thereby enabling the display module 100 to realize image display function.

[0055] In some examples, the color filter substrate 2 includes a red filter film, a green filter film, and a blue filter film. By controlling the intensity of light irradiating the red filter film, the green filter film, and the blue filter film, different intensities of red light, green light, and blue light can be obtained, thereby enabling the display module 100 to display color images.

[0056] Optional, such as Figure 2 As shown, the display module 100 further includes a first polarizer (POL) 4 located on the side of the color filter substrate 2 away from the array substrate 1 and a second polarizer 5 located on the side of the array substrate 1 away from the color filter substrate 2 .

[0057] In the display module 100 , the polarization direction of light is controlled by controlling the deflection angle of the liquid crystal molecules, and the transmittance of light is controlled in cooperation with the first polarizer 4 and the second polarizer 5 , thereby achieving display of different gray levels (also called grayscales).

[0058] In some examples, such as Figure 3 As shown, the display module 100 further includes a driver chip (Integrated Circuit, referred to as IC) 6 and a flexible printed circuit board (Flexible Printed Circuit Board, referred to as FPC) 7. The driver chip 6 and the flexible printed circuit board 7 are both located in the frame area BB.

[0059] Exemplarily, a pixel driving circuit is provided in the array substrate 1 , and a driving chip 6 is connected to the array substrate 1 for providing a data signal to the pixel driving circuit.

[0060] Exemplarily, a plurality of signal lines are provided on the array substrate 1 , and the flexible printed circuit board 7 is connected to the array substrate 1 to provide signals for the plurality of signal lines.

[0061] In addition, the driving chip 6 is connected to the flexible circuit board 7. The flexible circuit board 7 provides a control signal to the driving chip 6. Under the control of the control signal, the driving chip 6 provides a driving signal to the pixel driving circuit.

[0062] In some examples, such as Figure 3 As shown, the display module 100 further includes a first conductive layer 8 and a second conductive layer 9 located on the array substrate 1 and spaced apart from each other. The driver chip 6 is located on the side of the first conductive layer 8 away from the array substrate 1 and is bonded to the array substrate 1 via the first conductive layer 8. The flexible circuit board 7 is located on the side of the second conductive layer 9 away from the array substrate 1 and is bonded to the array substrate 1 via the second conductive layer 9.

[0063] For example, the materials of the first conductive layer 8 and the second conductive layer 9 may be the same or different, which is not limited in the embodiments of the present disclosure.

[0064] For example, the first conductive layer 8 and the second conductive layer 9 can be made of the same material, and both can be anisotropic conductive film (ACF). Thus, the flexible circuit board 7 and the array substrate 1 can be bonded together and electrically connected via the ACF; and the driver chip 6 and the array substrate 1 can be bonded together and electrically connected via the ACF.

[0065] In some examples, the width of the first conductive layer 8 is 1.1 mm; the width of the second conductive layer 9 is 0.5 mm or 0.6 mm, for example, the width of the second conductive layer 9 is 0.5 mm. The width of the first conductive layer 8 refers to the dimension of the first conductive layer 8 in the direction in which the display area AA and the border area BB are aligned; the width of the second conductive layer 9 refers to the dimension of the second conductive layer 9 in the direction in which the display area AA and the border area BB are aligned.

[0066] In some implementations, to achieve a narrow bezel design for the display module 100, the size of the bezel area BB of the display module 100 is continuously compressed. For example, the width of the bezel area BB of the display module 100 is compressed from an initial 4.5 mm to 2.35 mm. The width of the bezel area BB refers to the size of the bezel area BB in the direction in which the display area AA and the bezel area BB are aligned.

[0067] For example, combined Figures 3 to 5 As shown, the size of the portion of the first polarizer 4 located in the frame area BB is S1; the size of the portion of the color filter substrate 2 extending beyond the first polarizer 4 is S2; the size of the gap between the color filter substrate 2 and the driver chip 6 is S3; the size of the driver chip 6 itself is S4; the size of the gap between the driver chip 6 and the flexible circuit board 7 is S5; the size of the portion of the flexible circuit board 7 used to bind to the array substrate 1 is S6; the size of the portion of the array substrate 1 extending beyond the flexible circuit board 7 used to bind to the array substrate 1 is S7; and the total width of the frame area BB is S. Among them,

[0068] S=S1+S2+S3+S4+S5+S6+S7 Formula 1

[0069] For example, the first polarizer 4 may be a dye polarizer. Compared with iodine-based polarizers and metal polarizers, dye polarizers are more likely to meet high-temperature and high-humidity environments, ultra-low-temperature environments, etc., thereby enabling the display module 100 to be applied in more scenarios.

[0070] However, if the first polarizer 4 is a dye polarizer, there is a risk of discoloration under high temperature or high humidity conditions. To prevent discoloration of the first polarizer 4 from affecting the display quality at the edge of the display module 100, the dimension S1 of the portion of the first polarizer 4 located in the border area BB is greater than or equal to 0.5 mm. For example, the dimension S1 of the portion of the first polarizer 4 located in the border area BB is 0.5 mm.

[0071] In addition, during the binding process of the driver chip 6, the temperature of the pressure head of the binding device is relatively high. In order to prevent the first polarizer 4 from being burned and affecting the display effect of the display module 100, the size of the gap between the first polarizer 4 and the driver chip 6 is greater than or equal to 0.38 mm. For example, the size of the gap between the first polarizer 4 and the driver chip 6 can be: 0.38 mm. That is: the sum of the size S2 of the portion of the color filter substrate 2 that exceeds the first polarizer 4 and the size S3 of the gap between the color filter substrate 2 and the driver chip 6 is: 0.38 mm. Specifically, the size S2 of the portion of the color filter substrate 2 that exceeds the first polarizer 4 can be 0.135 mm; the size S3 of the gap between the color filter substrate 2 and the driver chip 6 can be 0.245 mm.

[0072] For example, the dimension S4 of the driver chip 6 itself is 0.9 mm, and the dimension S6 of the portion where the flexible circuit board 7 is bound to the array substrate 1 is 0.3 mm.

[0073] Furthermore, to prevent microcracks generated during the cutting process of the display module 100 from entering the display module 100 and affecting the binding effect between the flexible circuit board 7 and the array substrate 1, the width S7 of the portion of the array substrate 1 extending beyond the portion where the flexible circuit board 7 and the array substrate 1 are bound is greater than or equal to 0.07 mm. For example, the width S7 of the portion of the array substrate 1 extending beyond the portion where the flexible circuit board 7 and the array substrate 1 are bound is 0.07 mm.

[0074] When the width S of the border area BB of the display module 100 is 2.35 mm, it can be calculated that the size S5 of the gap between the driving chip 6 and the flexible circuit board 7 is 0.2 mm.

[0075] Furthermore, to achieve effective electrical connection between the driver chip 6 and the array substrate 1, the edge of the first conductive layer 8 needs to extend beyond the edge of the driver chip 6, and a dimension S51 of the portion of the edge of the first conductive layer 8 extending beyond the edge of the driver chip 6 is greater than or equal to 0.1 mm. For example, the dimension S51 of the portion of the edge of the driver chip 6 extending beyond the edge of the driver chip 6 is 0.1 mm.

[0076] For example, the size S52 of the portion of the second conductive layer 9 near the edge of the display area AA and beyond the portion of the flexible circuit board 7 near the edge of the display area AA, the size a of the second conductive layer 9, the size a1 of the portion of the second conductive layer 9 overlapping the flexible circuit board 7, and the size a2 of the portion of the second conductive layer 9 away from the edge of the display area AA and beyond the edge of the flexible circuit board 7 satisfy the following relationship:

[0077] S52 = a - a1 - a2.

[0078] In some examples, the edge of the second conductive layer 9 away from the edge of the display area AA is recessed relative to the edge of the array substrate 1 or is flush with the edge of the array substrate 1. For example, the edge of the second conductive layer 9 away from the edge of the display area AA is flush with the edge of the array substrate 1. At this time, the size a2 of the portion of the second conductive layer 9 away from the edge of the display area AA and beyond the edge of the flexible circuit board 7 is equal to the size S7 of the portion of the array substrate 1 beyond the portion of the flexible circuit board 7 bonded to the array substrate 1. That is, the size a2 of the portion of the second conductive layer 9 away from the edge of the display area AA and beyond the edge of the flexible circuit board 7 is 0.07 mm.

[0079] In the case where the size of the second conductive layer 9 is 0.5 mm, the size a1 of the portion of the second conductive layer 9 overlapping the flexible circuit board 7 is equal to the size S6 of the portion of the flexible circuit board 7 for bonding to the array substrate 1, that is, a1 is 0.3 mm, and the size a2 of the portion of the second conductive layer 9 away from the edge of the display area AA and beyond the edge of the flexible circuit board 7 is 0.07 mm, it is calculated that the size S52 of the portion of the second conductive layer 9 near the edge of the display area AA and beyond the portion of the flexible circuit board 7 near the edge of the display area AA is 0.13 mm.

[0080] In the gap between the driving chip 6 and the flexible circuit board 7, the size S51 of the portion of the first conductive layer 8 beyond the edge of the driving chip 6 is 0.1 mm, and the size S52 of the portion of the second conductive layer 9 beyond the flexible circuit board 7 is 0.13 mm. Obviously, in the case where the width of the gap between the driving chip 6 and the flexible circuit board 7 is 0.2 mm, there is a risk of overlap between the first conductive layer 8 and the second conductive layer 9. Thus, static electricity can be transmitted from the flexible circuit board 7, and in turn, from the second conductive layer 9, the first conductive layer 8 to the inside of the driving chip 6, which can easily damage the driving chip 6 (for example, static electricity transmitted to the inside of the driving chip 6 can cause electrical breakdown and thus cause the driving chip 6 to fail), thereby causing the display module 100 to have a display defect.

[0081] Based on this, in the display module 100 provided in the embodiments of the present disclosure, the first conductive layer 8 and the second conductive layer 9 are spaced apart, and the first conductive layer 8 and the second conductive layer 9 are a film layer integrally arranged.

[0082] It should be noted that, in the embodiment of the present disclosure, the first conductive layer 8 and the second conductive layer 9 are integrated film layers, which means that the first conductive layer 8 and the second conductive layer 9 are attached to the same release film.

[0083] During the assembly process of the display module 100, the first conductive layer 8 is bonded to the driver chip 6, and the second conductive layer 9 is bonded to the flexible circuit board 7 through a single bonding process; then, the driver chip 6 bonded with the first conductive layer 8 and the flexible circuit board 7 bonded with the second conductive layer 9 are pressed onto the array substrate 1.

[0084] For example, in the process of forming the integrated first conductive layer 8 and the second conductive layer 9, the release films corresponding to the first conductive layer 8 and the second conductive layer 9 can be torn off first, and then a second coating is performed through roller alignment, so that the first conductive layer 8 and the second conductive layer 9 are attached to the same release film.

[0085] Specifically, such as Figure 6 As shown, the first conductive layer 8 and the second conductive layer 9 are pre-aligned to achieve the interval setting, and then the release film corresponding to the first conductive layer 8 and the release film corresponding to the second conductive layer 9 are torn off by the roller 01; the roller 02 is wound with a new release film 04, and under the rotation of the rollers 02 and 03, the first conductive layer 8 and the second conductive layer 9 are driven and attached to the new release film 04, thereby realizing the integrated setting of the first conductive layer 8 and the second conductive layer 9.

[0086] In this embodiment, the first conductive layer 8 and the second conductive layer 9 are integrally formed film layers. This allows the first conductive layer 8 and the second conductive layer 9 to be bound to the driver chip 6 and the second conductive layer 9 to the flexible circuit board 7 by only one binding operation. Separate binding operations are not required, which reduces the number of binding operations and improves the assembly efficiency of the display module 100. Furthermore, the first conductive layer 8 and the second conductive layer 9 are spaced apart on the same release film. This pre-cutting process allows the first conductive layer 8 and the second conductive layer 9 to be spaced apart. This prevents overlap between the first conductive layer 8 and the second conductive layer 9 during the bonding process between the driver chip 6 and the flexible circuit board 7. This mitigates the risk of static electricity on the flexible circuit board 7 being transferred to the driver chip 6 via the second conductive layer 9 and the first conductive layer 8 due to overlap, potentially damaging the driver chip 6. This protects the driver chip 6 from static electricity interference and damage, thereby ensuring the display quality of the display module 100.

[0087] In some implementations, the first conductive layer 8 and the second conductive layer 9 are separate film layers and are attached to different release films.

[0088] During the assembly process of the display module 100, the first conductive layer 8 is first bonded to the driver chip 6. Then, the release film corresponding to the first conductive layer 8 is peeled off, and the driver chip 6 bonded with the first conductive layer 8 is pressed onto the array substrate 1. The second conductive layer 9 is then bonded to the flexible circuit board 7. Then, the release film corresponding to the second conductive layer 9 is peeled off, and the flexible circuit board 7 bonded with the second conductive layer 9 is pressed onto the array substrate 1. In other words, if the first conductive layer 8 and the second conductive layer 9 are separate film layers, two bonding steps are required to respectively bond the first conductive layer 8 to the driver chip 6 and the second conductive layer 9 to the flexible circuit board 7.

[0089] It is understandable that certain errors will occur in the process of binding the first conductive layer 8 to the driver chip 6, binding the second conductive layer 9 to the flexible circuit board 7, pressing the driver chip 6 bound with the first conductive layer 8 onto the array substrate 1, and pressing the flexible circuit board 7 bound with the second conductive layer 9 onto the array substrate 1.

[0090] In the case where the first conductive layer 8 and the second conductive layer 9 are integrally arranged film layers, it is only necessary to bind the integrally arranged first conductive layer 8 and the second conductive layer 9 once to achieve the binding between the first conductive layer 8 and the driver chip 6, and the binding between the second conductive layer 9 and the flexible circuit board 7. Compared with achieving the binding between the first conductive layer 8 and the driver chip 6, and the binding between the second conductive layer 9 and the flexible circuit board 7 through two bindings respectively, the error is smaller, which is beneficial to further reduce the size S51 of the part where the edge of the first conductive layer 8 exceeds the edge of the driver chip 6, and the size S52 of the part where the second conductive layer 9 exceeds the flexible circuit board 7, which is beneficial to further reduce the width of the border area BB of the display module 100.

[0091] For example, at the gap between the driver chip 6 and the flexible circuit board 7, the dimension S51 of the portion of the edge of the first conductive layer 8 extending beyond the edge of the driver chip 6, and the dimension S52 of the portion of the second conductive layer 9 extending beyond the flexible circuit board 7, respectively, satisfy the following: 0.05 mm ≤ S51 ≤ 0.1 mm; 0.05 mm ≤ S52 < 0.1 mm. For example, the dimension S51 of the portion of the edge of the first conductive layer 8 extending beyond the edge of the driver chip 6 can be 0.05 mm, 0.06 mm, 0.07 mm, 0.08 mm, 0.1 mm, etc.; the dimension S52 of the portion of the second conductive layer 9 extending beyond the flexible circuit board 7 can be 0.05 mm, 0.06 mm, 0.07 mm, 0.08 mm, 0.09 mm, etc.

[0092] In some embodiments, the size of the gap between the first conductive layer 8 and the second conductive layer 9 is less than or equal to 0.05 mm. For example, the size of the gap between the first conductive layer 8 and the second conductive layer 9 is 0.01 mm, 0.02 mm, 0.03 mm, 0.04 mm, 0.05 mm, etc. The embodiments of the present disclosure are not limited to this.

[0093] By adopting the above-mentioned setting, on the basis of ensuring that the width of the border area BB of the display module 100 is small, the first conductive layer 8 and the second conductive layer 9 are spaced apart. In the process of binding the driver chip 6 and the flexible circuit board 7, there will be no overlap between the first conductive layer 8 and the second conductive layer 9. This improves the problem that static electricity on the flexible circuit board 7 is transmitted to the inside of the driver chip 6 through the second conductive layer 9 and the first conductive layer 8 due to the overlap between the first conductive layer 8 and the second conductive layer 9, which easily causes damage to the driver chip 6. This protects the driver chip 6 from being interfered with and damaged by static electricity, thereby ensuring the display quality of the display module 100.

[0094] In some examples, such as Figure 5 The display module 100 further includes an insulating layer 10 disposed on a side of the driving chip 6 away from the array substrate 1 .

[0095] Exemplarily, the insulating layer 10 covers the side of the driver chip 6 away from the array substrate 1. Exemplarily, the insulating layer 10 also covers the flexible circuit board 7. Because the insulating layer 10 has insulating properties, the insulating layer 10 can provide electrostatic protection for the driver chip 6 and the flexible circuit board 7 it covers, preventing the driver chip 6 and the flexible circuit board 7 from being interfered with by static electricity.

[0096] Exemplarily, the insulating layer 10 may be an insulating tape.

[0097] In some examples, the display module 100 further includes: a heat dissipation layer disposed on a side of the insulating layer 10 away from the driving chip 6 , and an electromagnetic shielding layer disposed on a side of the heat dissipation layer away from the insulating layer 10 .

[0098] For example, the heat dissipation layer may include a carbon nanolayer, which has excellent thermal conductivity and can quickly transfer heat from the driver chip 6 .

[0099] Exemplarily, the electromagnetic shielding layer may include a copper foil layer.

[0100] In the embodiment of the present disclosure, another display module 100 is provided, such as Figure 7 As shown, the array substrate 1 has a first side aa and a second side bb arranged opposite to each other. The driving chip 6 is located on the first side aa of the array substrate 1; and the flexible circuit board 7 is located on the second side bb of the array substrate 1.

[0101] In some examples, the first side aa is the side of the array substrate 1 close to the color filter substrate 40, and the second side bb is the side of the array substrate 1 away from the color filter substrate 40. In other examples, the first side aa is the side of the array substrate 1 away from the color filter substrate 40, and the second side bb is the side of the array substrate 1 close to the color filter substrate 40. The embodiments of the present disclosure are not limited to this.

[0102] In some examples, the orthographic projection of the driving chip 6 on the array substrate 1 and the orthographic projection of the flexible circuit board 7 on the array substrate 1 may be staggered or partially overlapped.

[0103] In this embodiment, the driver chip 6 and the flexible circuit board 7 are respectively arranged on opposite sides of the array substrate 1, which can effectively prevent static electricity on the flexible circuit board 7 from being transmitted to the inside of the driver chip 6, thereby causing damage to the driver chip 6. This protects the driver chip 6 and prevents it from being interfered with and damaged by static electricity, thereby ensuring the display quality of the display module 100. Moreover, the driver chip 6 and the flexible circuit board 7 are respectively arranged on opposite sides of the array substrate 1, which can also effectively reduce the area occupied by the driver chip 6 and the flexible circuit board 7 in the width direction of the border area BB, making the overall structure of the display module 100 more compact, thereby further reducing the width of the border area BB of the display module 100.

[0104] In some embodiments, as Figure 7 As shown, in the thickness direction of the display module 100 , the driving chip 6 and the flexible circuit board 7 partially overlap.

[0105] Exemplarily, the driver chip 6 is partially overlapped on the array substrate 1 with the orthographic projection of the flexible circuit board 7 on the array substrate 1. That is, part of the orthographic projection of the driver chip 6 on the array substrate 1 is located within the orthographic projection of the flexible circuit board 7 on the array substrate 1, and part of the orthographic projection is staggered with the orthographic projection of the flexible circuit board 7 on the array substrate 1.

[0106] In this embodiment, the driver chip 6 and the flexible circuit board 7 are arranged on opposite sides of the array substrate 1, and the driver chip 6 and the flexible circuit board 7 partially overlap, thereby reducing the size occupied by the driver chip 6 and the flexible circuit board 7 in the arrangement direction of the border area BB and the display area AA, thereby further reducing the size of the border area BB and realizing a narrow border design of the display module 100.

[0107] In some embodiments, as Figure 7As shown, the color filter substrate 2 is located between the array substrate 1 and the driving chip 6. In the thickness direction of the display module 100, the driving chip 6 and the color filter substrate 2 partially overlap; and in the thickness direction of the display module 100, the flexible circuit board 7 and the color filter substrate 2 partially overlap.

[0108] In some examples, the orthographic projection of the driver chip 6 on the array substrate 1 partially overlaps with the orthographic projection of the color filter substrate 2 on the array substrate 1. In other examples, the orthographic projection of the driver chip 6 on the array substrate 1 is located within the orthographic projection of the color filter substrate 2 on the array substrate 1.

[0109] In some examples, the orthographic projection of the flexible circuit board 7 on the array substrate 1 partially overlaps with the orthographic projection of the color filter substrate 2 on the array substrate 1 .

[0110] In some implementations, Chip On Glass (COG) technology is used to bond the driver chip 6 and flexible circuit board 7 to the array substrate 1. Specifically, COG technology means that the driver chip 6 and flexible circuit board 7 are directly bonded to the array substrate 1. The portion of the array substrate 1 where the driver chip 6 and flexible circuit board 7 are bonded is offset from the color filter substrate 2. During a drop, this offset portion of the array substrate 1 and the color filter substrate 2 is susceptible to damage, which can affect the display quality of the display module 100.

[0111] In the present embodiment, the color filter substrate 2 is arranged between the array substrate 1 and the driving chip 6, and the driving chip 6 and the color filter substrate 2 and the flexible circuit board 7 are partially overlapped, thereby improving the direct binding of the driving chip 6 and the flexible circuit board 7 to the array substrate 1. As a result, at the binding position of the driving chip 6 and the flexible circuit board 7 to the array substrate 1, the array substrate 1 and the color filter substrate 2 are staggered, so that the staggered portion of the array substrate 1 and the color filter substrate 2 is prone to damage, thereby ensuring the display effect of the display module 100.

[0112] In some embodiments, as Figure 7 As shown, a plurality of binding pins (not shown in the figure) are provided on the first side aa of the array substrate 1, a first through hole 201 is provided on the color film substrate 2, and the driving chip 6 is electrically connected to the binding pins on the array substrate 1 through the first through hole 201; a second through hole 101 is provided on the array substrate 1, and the flexible circuit board 7 is electrically connected to the binding pins on the array substrate 1 through the second through hole 101.

[0113] Exemplarily, the input terminal (input PIN) of the driving chip 6 is electrically connected to the binding pin on the array substrate 1 through the first through hole 201 .

[0114] In some examples, the first through hole 201 and the second through hole 101 may be through holes formed by through glass via (TGV) interconnection technology.

[0115] Illustratively, the first through hole 201 and the second through hole 101 may be filled with a conductive material, thereby achieving electrical connection between the driving chip 6 and the array substrate 1 , and electrical connection between the flexible circuit board 7 and the array substrate 1 .

[0116] In some examples, such as Figure 8 As shown, the plurality of binding pins include an electric test pad (ET PAD) 102 .

[0117] For example, Figure 8 As shown, the electrical test pins 102 are located on both sides of the binding position between the array substrate 1 and the driver chip 6 .

[0118] The driver chip 6 is connected to the test traces on the array substrate 1 through the first through-holes 201, and is further connected to the electrical test pins through the test traces. Thus, the ET signal output by the driver chip 6 can be provided to the sub-pixels P in the display area AA via the traces on the array substrate 1 to detect whether the display module 100 is properly illuminated.

[0119] In this embodiment, the driver chip 6 and the flexible circuit board 7 are respectively arranged on opposite sides of the array substrate 1, thereby effectively preventing static electricity on the flexible circuit board 7 from being transmitted to the inside of the driver chip 6, thereby causing damage to the driver chip 6. The first through hole 201 and the second through hole 101 are used to realize the electrical connection between the driver chip 6 and the array substrate 1, and the electrical connection between the flexible circuit board 7 and the array substrate 1, thereby ensuring the normal display of the display module 100.

[0120] In some embodiments, as Figure 7 As shown, the color filter substrate 2 is further provided with a third through hole 202 , the second through hole 101 in the array substrate 1 is connected to the third through hole 202 , and the driving chip 6 is electrically connected to the flexible circuit board 7 through the second through hole 101 and the third through hole 202 .

[0121] Exemplarily, the output terminal (output PIN) of the driving chip 6 is electrically connected to the flexible circuit board 7 through the second through hole 101 and the third through hole 202 .

[0122] For example, in the thickness direction of the display module 100, the second through hole 101 and the third through hole 202 at least partially overlap. For example, the second through hole 101 and the third through hole 202 partially overlap. For another example, the second through hole 101 and the third through hole 202 completely overlap. The embodiments of the present disclosure are not limited to this.

[0123] With the above arrangement, the electrical connection between the driving chip 6 and the flexible circuit board 7 is achieved, so that the flexible circuit board 7 can provide the control signal for the driving chip 6, and the driving chip 6 provides the driving signal for the pixel driving circuit under the control of the control signal.

[0124] In some embodiments, as shown in FIG. 1, the edge of the color film substrate 2 is flush with the edge of the array substrate 1. Figure 7

[0125] It should be noted that the edge of the color film substrate 2 flush with the edge of the array substrate 1 means that the edge of the color film substrate 2 away from the display area AA is flush with the edge of the array substrate 1 away from the display area AA. In addition, the edge of the color film substrate 2 flush with the edge of the array substrate 1 includes two cases of completely flush and approximately flush.

[0126] In the above, the edge of the color film substrate 2 flush with the edge of the array substrate 1 means that the edge of the color film substrate 2 away from the display area AA is located on or approximately on the same plane as the edge of the array substrate 1 away from the display area AA.

[0127] For example, the edge of the color film substrate 2 away from the display area AA in the orthographic projection of the color film substrate 2 on the array substrate 1 coincides with the edge of the array substrate 1.

[0128] In some implementations, the driving chip 6 and the flexible circuit board 7 are bonded to the array substrate 1 by using a chip on film (COF) technology. Specifically, the COF technology means that the driving chip 6 and the flexible circuit board 7 are bonded to a chip on film, and the chip on film is bonded to the array substrate 1, and the chip on film is folded back and around the edge of the array substrate 1 and attached to the backlight module.

[0129] The material of the chip on film is relatively hard. After the chip on film is folded back and attached to the backlight module, the chip on film has a large rebound force in the folded state, which can cause the backlight module to be pulled and deformed on the lamp port side, affecting the light emitting effect of the backlight module. In addition, the array substrate 1 has a single layer area (a part of the array substrate 1 that is arranged away from the color film substrate 2), and there is a certain gap between the single layer area of the array substrate 1 and the cover plate, so that the single layer area of the array substrate 1 cannot be effectively supported and is easily damaged during the falling process, thereby affecting the display effect of the display module 100. In addition, in order to ensure that the chip on film has good folding performance, the chip on film needs to use high-quality soft substrate circuit and packaging materials, which are very expensive, resulting in an increase in the production cost of the display module 100.

[0130] ​When COG technology is used to bond the driver chip 6 and flexible circuit board 7 to the array substrate 1, the portion of the array substrate 1 where the driver chip 6 and flexible circuit board 7 are bonded is staggered with the color filter substrate 2. In other words, when COG technology is used to bond the driver chip 6 and flexible circuit board 7 to the array substrate 1, the array substrate 1 also has a single-layer region. The portion of the array substrate 1 located in this single-layer region is susceptible to damage during a drop, thereby affecting the display quality of the display module 100.

[0131] In the embodiment of the present disclosure, the edge of the color filter substrate 2 is flush with the edge of the array substrate 1, so that there is no single-layer area in the array substrate 1, thereby effectively avoiding the problem that due to the existence of the single-layer area in the array substrate 1, the portion of the array substrate 1 located in the single-layer area is easily damaged during the falling process, thereby affecting the display effect of the display module 100.

[0132] In some embodiments, as Figure 7 As shown, the first polarizer 4 is located on the side of the color filter substrate 2 away from the array substrate 1. In the thickness direction perpendicular to the display module 100, the first polarizer 4 and the driving chip 6 are spaced apart, and there is a gap between the first polarizer 4 and the driving chip 6.

[0133] For example, the orthographic projection of the first polarizer 4 on the array substrate 1 is staggered with the orthographic projection of the driver chip 6 on the array substrate 1. This prevents interference between the first polarizer 4 and the driver chip 6. Furthermore, during the binding process of the driver chip 6, the temperature of the pressure head of the binding device is relatively high, and the gap between the first polarizer 4 and the driver chip 6 is within a certain safe distance, which can also prevent burns on the first polarizer 4.

[0134] like Figure 7 As shown, the display module 100 further includes a fixing portion 12. The fixing portion 12 is disposed around the driving chip 6, and a portion of the fixing portion 12 is located at the above-mentioned gap position.

[0135] In some examples, the fixing portion 12 is a single-layer structure. For example, the fixing portion 12 may be a protective adhesive having adhesive properties. The protective adhesive may be, for example, Tuffy adhesive or 3M fluorinated liquid. Tuffy adhesive is primarily composed of synthetic rubber, a tackifier, and a stabilizer.

[0136] In some other examples, the fixing portion 12 is a multi-layer structure. For example, the fixing portion 12 includes a protective adhesive and a silicone adhesive coated on the protective adhesive.

[0137] Exemplarily, the thickness of the fixing portion 12 is less than or equal to 50 μm. For example, the thickness of the fixing portion 12 can be 50 μm, 40 μm, 30 μm, 20 μm, 10 μm, etc.

[0138] For example, in the display device 1000 , the side of the fixing portion 12 away from the array substrate may contact the cover plate 300 . That is, the fixing portion 12 fills the gap formed by the first polarizer 4 , the driving chip 6 , and the cover plate 300 .

[0139] In this embodiment, the fixing portion 12 is arranged around the driver chip 6, which can not only protect the driver chip 6, improve the waterproof performance of the driver chip 6, and prevent the binding position between the driver chip 6 and the array substrate 1 from being corroded by water and oxygen, thereby ensuring the effectiveness of the binding between the driver chip 6 and the array substrate 1; the fixing portion 12 can also be used to fill the gap between the first polarizer 4 and the driver chip 6, thereby avoiding abnormal noise inside the display device 1000 when external vibration or shaking occurs.

[0140] For example, Figure 7 As shown, the size of the portion of the first polarizer 4 located in the border area BB is H1; the size of the gap between the first polarizer 4 and the driver chip 6 is H2; the size of the driver chip 6 itself is H3; and the size from the driver chip 6 to the edge of the array substrate 1 is H4. The total width of the border area BB is H.

[0141] H=H1+H2+H3+H4 Formula 2

[0142] To prevent the first polarizer 4 from discoloring under high temperature or high temperature and high humidity conditions, thereby affecting the display effect at the edge of the display module 100 , the size H1 of the portion of the first polarizer 4 located in the frame area BB is greater than or equal to 0.45 mm.

[0143] In addition, it has been verified that during the binding process of the driver chip 6, the temperature of the pressure head of the binding device is less than or equal to 150°C, and during the binding process of the flexible circuit board 7, the temperature of the pressure head of the binding device is less than or equal to 180°C. The size of the gap between the first polarizer and the driver chip 6 is greater than or equal to 0.4105mm, which can prevent the first polarizer 4 from being burned, thereby ensuring the display effect of the display module 100.

[0144] The size H3 of the driver chip 6 itself can be 0.945 mm or 0.96 mm.

[0145] To prevent microcracks generated during the cutting process of the display module 100 from entering the display module 100 and affecting the binding between the driver chip 6 and the array substrate 1, the dimension H4 between the driver chip 6 and the edge of the array substrate 1 is greater than or equal to 0.07 mm. For example, the dimension H4 between the driver chip 6 and the edge of the array substrate 1 is 0.07 mm.

[0146] According to the above formula 2, it can be calculated that the total width H of the border area BB ranges from 1.8305 mm to 2.3 mm. The total width H of the border area BB is smaller, thereby achieving a narrow border design of the display module 100.

[0147] In some examples, such as Figure 7 As shown, the display module 100 further includes a protective portion 13. The protective portion 13 is located on the side of the flexible circuit board 7 close to the array substrate 1 and contacts the edge of the array substrate 1, thereby preventing moisture from invading and corroding the binding position between the flexible circuit board 7 and the array substrate 1. This ensures the binding effect between the flexible circuit board 7 and the array substrate 1 and improves the yield of the display module 100.

[0148] In some examples, such as Figure 7 As shown, the display module 100 further includes an insulating portion 14 . The insulating portion 14 is disposed on a side of the flexible circuit board 7 away from the array substrate 1 .

[0149] For example, the thickness of the insulating portion 14 may range from 0.012 mm to 0.075 mm.

[0150] like Figure 7 As shown, in the display device 1000, the insulating portion 14 is located between the flexible circuit board 7 and the backlight module 200 and abuts against the backlight module 200. This can alleviate the problem of the flexible circuit board 7 shaking in the gap between the flexible circuit board 7 and the backlight module 200 during external vibration or shaking, thereby generating abnormal noise.

[0151] Furthermore, the insulating portion 14 may be a non-sticky tape, thereby facilitating the backlight module 200 to be taken out for inspection or repair.

[0152] Illustratively, in the thickness direction of the display device 1000 , the sum of the thickness of the flexible circuit board 7 and the thickness of the insulating portion 14 is less than or equal to the thickness of the second polarizer 5 .

[0153] In some examples, such as Figure 7 As shown, the display module 100 further includes an OCA layer 15. The OCA layer 15 is located between the first polarizer 4 and the cover plate 300, and is used to achieve fixation between the first polarizer 4 and the cover plate 300.

[0154] Illustratively, in the thickness direction of the display device 1000 , the sum of the gap between the driving chip 6 and the cover plate 300 and the thickness of the driving chip 6 is equal to the sum of the thickness of the first polarizer 4 and the thickness of the OCA layer 15 .

[0155] Exemplarily, the size of the gap between the driving chip 6 and the cover plate 300 is greater than or equal to 0.02 mm.

[0156] Further, the display module 100 further comprises: an insulating layer and a buffer layer which are sequentially stacked in a direction away from the array substrate 1 and arranged on the driving chip 6. When the display module 100 is applied to the display device 1000, the insulating layer and the buffer layer which are sequentially stacked are located between the driving chip 6 and the cover plate 300, and fill the gap between the driving chip 6 and the cover plate 300.

[0157] The material of the insulating layer can include polyethylene terephthalate (PET) and the like.

[0158] The buffer layer can include a foam layer. The foam layer has good compression performance. During the whole machine assembly process, the foam layer can be compressed and abut against the cover plate 300. Thus, the problem that the driving chip 6 collides back and forth between the color film substrate 2 and the cover plate 300 due to the large gap between the driving chip 6 and the cover plate 300 when the external vibration or shaking occurs, thereby generating abnormal sound, can be improved.

[0159] In some examples, in combination with Figures 8 to 10 As shown, the frame area BB of the array substrate 1 is further provided with a silver paste point D.

[0160] The color film substrate 2 close to the first polarizer 4 is provided with a silver paste point E (not shown in the figure) corresponding to the silver paste point D. The silver paste point E is coated with silver paste, which is used to realize the electrical connection between the first polarizer 4 and the color film substrate 2; the silver paste point D is coated with silver paste, which is used to realize the electrical connection between the array substrate 1 and the color film substrate 2. Thus, the static electricity on the cover plate 300 can be sequentially conducted to the flexible circuit board 7 through the first polarizer 4, the color film substrate 2, the array substrate 1, and finally conducted through the flexible circuit board 7.

[0161] The above is only a specific embodiment of the present disclosure, but the protection scope of the present disclosure is not limited thereto, and any person skilled in the art can think of changes or replacements within the technical range disclosed by the present disclosure, which should be covered within the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be subject to the protection scope of the claims.

Claims

1. A display module, characterized in that: The display module includes: an array substrate, the array substrate having a first side and a second side oppositely disposed; a driving chip located on a first side of the array substrate, wherein the driving chip is bound to the array substrate; A flexible circuit board is located on the second side of the array substrate, and the flexible circuit board is bound to the array substrate.

2. The display module according to claim 1, wherein: In the thickness direction of the display module, the driving chip and the flexible circuit board partially overlap.

3. The display module according to claim 1, wherein: Also includes: a color filter substrate located between the array substrate and the driver chip; In the thickness direction of the display module, the driving chip and the color filter substrate partially overlap; Moreover, in the thickness direction of the display module, the flexible circuit board and the color filter substrate partially overlap.

4. The display module according to claim 3, wherein: A plurality of binding pins are provided on the first side of the array substrate, a first through hole is provided on the color filter substrate, and the driving chip is electrically connected to the binding pins through the first through hole; The array substrate is provided with a second through hole, and the flexible circuit board is electrically connected to the binding pins on the array substrate through the second through hole.

5. The display module according to claim 4, wherein: The color filter substrate is further provided with a third through hole, the second through hole and the third through hole are connected, and the driving chip is electrically connected to the flexible circuit board through the second through hole and the third through hole.

6. The display module according to claim 3, wherein: The edge of the color filter substrate is flush with the edge of the array substrate.

7. The display module according to claim 3, wherein: Also includes: a first polarizer located on a side of the color filter substrate away from the array substrate, wherein the first polarizer is spaced apart from the driver chip in a thickness direction perpendicular to the display module, and a gap exists between the first polarizer and the driver chip; The fixing portion is located on a side of the color filter substrate away from the array substrate. The fixing portion is arranged around the driving chip, and a portion of the fixing portion is located at the gap position.

8. A display module, characterized in that: The display module includes: an array substrate; a first conductive layer and a second conductive layer located on the array substrate and spaced apart from each other; the first conductive layer and the second conductive layer are integrally provided film layers; a driving chip located on a side of the first conductive layer away from the array substrate, the driving chip being bound to the array substrate through the first conductive layer; A flexible circuit board is located on a side of the second conductive layer away from the array substrate, and the flexible circuit board is bound to the array substrate through the second conductive layer.

9. The display module according to claim 8, wherein: A size of a gap between the first conductive layer and the second conductive layer is less than or equal to 0.05 mm.

10. A display device, characterized in that: include: The display module according to any one of claims 1 to 7 or claims 8 to 9; A backlight module is provided on the backlight side of the display module.

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