End sealing plate flat plate leveling mechanism

By designing a flat plate leveling mechanism for the end plate, the problem of slurry deviation and falling caused by inconsistent protruding height of chip capacitors was solved, the protruding height of chip capacitors was made consistent, and the slurry quality and yield rate were improved.

CN223427367UActive Publication Date: 2025-10-10GUANGDONG LIXING INTELLIGENT EQUIP CO LTD
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Patent Information

Application Number
CN202422503165.2
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-10-16
Publication Date
2025-10-10
Estimated Expiration
2034-10-16

AI Technical Summary

Technical Problem

The protruding height of chip capacitors in the terminal sealing machine is inconsistent, resulting in deviation in the amount of sizing when dipping, and it is easy to detach from the thick silicone plate, causing it to fall off or the sizing layer to be thin and without sizing.

Method used

A flat plate leveling mechanism for the end plate is designed, including an upper leveling plate and a lower leveling plate. The upper and lower levels of the thick silicone plate are leveled respectively by the upper and lower leveling plates to make the protruding height of the chip capacitor consistent, avoiding bottoming out and uneven slurry layer.

Benefits of technology

Ensure that the protruding height of the chip capacitors is consistent during the dipping process to avoid falling, thereby improving the dipping quality and yield rate.

✦ Generated by Eureka AI based on patent content.

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Abstract

The end sealing plate flat plate leveling mechanism comprises a belt conveying rack, a belt conveying motor, a synchronous belt pulley, conveying belts and a thick silica gel plate, a leveling upper plate mechanism comprises four guide rods, an upper moving plate, a fixing plate and a motor fixing plate, and a leveling upper plate is installed on the lower portion of the upper moving plate and located above the thick silica gel plate between the two conveying belts; the leveling lower plate is installed on the upper portion of the lower fixing plate and located below the thick silica gel plate between the two conveying belts. The upper surface and the lower surface of the thick silica gel plate in which the chip capacitors are pressed are leveled through the upper leveling plate and the lower leveling plate respectively, so that the protruding heights of the chip capacitors are consistent, then the chip capacitors are conveyed to the slurry dipping mechanism for slurry dipping operation, and the situation that the chip capacitors are pulled out and fall off due to the fact that the chip capacitors make contact with the bottom during slurry dipping is avoided; the thickness of a slurry layer on the top of the chip capacitor is uniform during slurry dipping, and the slurry dipping quality and the yield of the chip capacitor are improved.
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Description

TECHNICAL FIELD

[0001] The utility model relates to end sealing machine equipment technical field, concretely is a kind of end sealing plate flat leveling mechanism. BACKGROUND

[0002] The thick silica gel plate feeding of end sealing machine is by needle bed to top into thick silica gel plate hole Piece capacitor, so as to be fixed piece capacitor in the way of clamping, so after piece capacitor is successfully implanted into thick silica gel plate hole, the height of each piece capacitor protruding silica gel plate board surface is influenced by needle bed needle precision and the elasticity of thick silica gel plate silica gel and other factors, leading to the uneven height of piece capacitor, thereby affecting the subsequent piece capacitor dip slurry and the great deviation of sizing amount occurs. In order to solve the problem of sizing amount deviation in the existing process, when thick silica gel plate is clamped in dip slurry equipment, the characteristics of the bottom surface of the dip slurry equipment is used to press down thick silica gel plate, so that piece capacitor is pressed to the bottom platform of sizing layer during dip slurry process, and the piece capacitor protruding longer is pressed back into thick silica gel plate hole, thereby solving the problem of piece capacitor sizing amount deviation.

[0003] In the previous production, when piece capacitor is dipped in slurry, thick silica gel plate is pressed down to make piece capacitor contact the bottom platform of sizing to carry out piece capacitor leveling operation, piece capacitor contacts the bottom platform of sizing in slurry, which will coincide with the bottom platform, generate greater tension, leading to the problem that piece capacitor is separated from thick silica gel plate when thick silica gel plate rises during dip slurry operation, and piece capacitor falls off; secondly, since piece capacitor coincides with the bottom platform of sizing, the slurry on the top of piece capacitor is squeezed out, leading to the problem that the slurry layer on the top of piece capacitor is thin or no slurry after operation. INVENTION CONTENTS

[0004] In view of the above problems, the utility model provides a kind of end sealing plate flat leveling mechanism, after piece capacitor is pressed into thick silica gel plate, it is leveled, so that the protruding height of piece capacitor is consistent, then it is conveyed to dip slurry mechanism to carry out dip slurry operation, to solve the problem that piece capacitor is pulled out and falls off when piece capacitor is dipped in slurry and the problem that the slurry layer on the top of piece capacitor is thin or no slurry.

[0005] The utility model end sealing plate flat leveling mechanism, including belt conveyor frame, belt transport motor, two rows of synchronous pulley, two parallel transport belts and the thick silica gel plate erected on the upper portion of two transport belts, the upper portion and the lower portion of two transport belts are respectively equipped with leveling upper plate mechanism and leveling lower plate mechanism, wherein,

[0006] The leveling upper plate mechanism comprises four guide rods, an upper moving plate slidably mounted in the middle of the four guide rods, a lower fixed plate fixedly mounted at the lower part of the guide rods, and a motor fixed plate fixedly mounted at the upper part of the guide rods, the lower part of the upper moving plate is provided with a leveling upper plate, a press bed servo motor is mounted on the motor fixed plate, the output end of the press bed servo motor is connected with a lead screw, the lead screw passes through the upper moving plate, and the leveling upper plate is located above the thick silica gel plate between the two conveying belts.

[0007] The leveling lower plate mechanism comprises a leveling lower plate mounted on the upper part of the lower fixed plate, and the lower fixed plate is located below the thick silica gel plate between the two conveying belts.

[0008] Further, the belt conveyor frame is provided with a height adjusting structure, the height adjusting structure comprises a conveying belt lifting cylinder mounted on the lower part of the lower fixed plate, a lifting dynamic plate mounted at the end of the piston rod of the conveying belt lifting cylinder, and lifting rods slidably passing through the lower fixed plate and mounted at the four corners of the lifting dynamic plate, the belt conveyor frame is mounted on the upper part of the lifting rods, the leveling lower plate is fixed on the upper surface of the lower fixed plate and located below the thick silica gel plate between the two conveying belts.

[0009] In order to adjust the parallelism of the leveling platform, four adjusting screws for adjusting the parallelism of the leveling platform are arranged on the upper moving plate. The adjusting screws pass through the upper moving plate and are connected to the leveling upper plate. The balance of the leveling upper plate is adjusted by adjusting the threads of the adjusting screws. By twisting the adjusting screws, the leveling upper plate can be lowered or raised, and the balance adjustment of the entire leveling upper plate can be completed.

[0010] Further, the belt conveyor frame comprises a left side frame, a right side frame, a driving long shaft connecting the left side frame and the right side frame, a left side belt driving wheel and a left side belt driven wheel mounted on the left side frame, and a right side belt driving wheel and a right side belt driven wheel mounted on the right side frame, the driving long shaft is connected with the output end of the belt conveying motor, and the left side belt driving wheel and the right side belt driving wheel are respectively mounted at the two ends of the driving long shaft.

[0011] Further, one side of the upper moving plate is provided with a thick silica gel plate reaching limiting cylinder.

[0012] Further, the front and rear sides of the upper moving plate are both provided with leveling height pads.

[0013] Further, a sensor support is mounted on the lower fixed plate, and a press table position sensor is arranged on the sensor support.

[0014] Further, the belt conveyor frame is mounted on the lower fixed plate.

[0015] Further, displacement detection sensors for detecting whether there are products or other impurities remaining on the surface of the leveling upper plate and the leveling lower plate are arranged at the four corners of the leveling upper plate and the leveling lower plate.

[0016] In order to clean the residual products and foreign matter on the board surface, a cleaning brush is provided on the belt conveyor frame.

[0017] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0018] The utility model is provided with an upper leveling plate mechanism and a lower leveling plate mechanism, and the upper and lower surfaces of the thick silicone plate after the chip capacitors are pressed in are leveled by the upper and lower leveling plates respectively, so that the protruding heights of the chip capacitors are made uniform, and then the chip capacitors are transferred to the dipping mechanism for dipping, thereby avoiding the chip capacitors from being pulled out and falling due to touching the bottom during dipping, ensuring that the thickness of the slurry layer on the top of the chip capacitors during dipping is uniform, and improving the quality and yield rate of the chip capacitor dipping. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a schematic diagram of the exploded structure of the end plate flat leveling mechanism of the utility model;

[0020] Figure 2 This is a structural diagram of the end plate flat leveling mechanism of the utility model (without the thick silicone plate installed);

[0021] Figure 3 This is a structural schematic diagram of the end plate flat leveling mechanism of the utility model from another angle.

[0022] In the figure: 11. Belt transport motor; 12. Transport belt; 13. Thick silicone plate; 14-Left frame; 15-Right frame; 21. Upper movable plate; 22. Lower fixed plate; 23. Guide rod; 24. Motor fixed plate; 25. Press servo motor; 26. Screw; 3. Leveling upper plate; 4. Leveling lower plate; 41. Transport belt lifting cylinder; 42. Lifting movable plate; 43. Lifting rod; 5. Adjusting screw; 6. Thick silicone plate reaches the limit cylinder; 7. Leveling height pad; 81. Sensor bracket; 8. Press position sensor; 9. Cleaning brush. DETAILED DESCRIPTION

[0023] The present invention will be further described below with reference to the accompanying drawings.

[0024] See also Figure 1-3The end plate flattening mechanism of this embodiment includes a belt conveyor frame 10, a belt conveyor motor 11, two rows of synchronous pulleys, two parallel conveyor belts 12, and a thick silicone plate 13 mounted on the upper parts of the two conveyor belts 12. The upper and lower parts of the two conveyor belts 12 are respectively provided with a leveling upper plate mechanism and a leveling lower plate mechanism. The leveling upper plate mechanism includes four guide rods 23, an upper movable plate 21 slidably mounted in the middle of the four guide rods 23, a lower fixed plate 22 fixedly mounted on the lower part of the guide rods 23 by screws, and a motor fixed plate 24 fixedly mounted on the upper part of the guide rods 23. The leveling upper plate 3 is mounted on the lower part of the upper movable plate 21, and a press servo motor 25 is mounted on the motor fixed plate 24. The output end of the press servo motor 25 is connected to a screw rod 26, which passes through the upper movable plate 21. The leveling upper plate 3 is located above the thick silicone plate 13 between the two transport belts 12; the leveling lower plate mechanism includes a leveling lower plate 4 mounted on the upper part of the lower fixed plate 22 by screws, and the lower fixed plate 22 is located below the thick silicone plate 13 between the two transport belts 12.

[0025] The belt conveyor frame is equipped with a height adjustment mechanism, which includes a conveyor belt lifting cylinder 41 mounted below the lower fixed plate 22, a lifting plate 42 mounted at the end of the piston rod of the conveyor belt lifting cylinder 41, and lifting rods 43 mounted at the four corners of the lifting plate 42 and slidably passing through the lower fixed plate 22. The belt conveyor frame is mounted above the lifting rods 43. The leveling lower plate 4 is fixed above the lower fixed plate 22 and located below the thick silicone plate 13 between the two conveyor belts 12. The belt conveyor frame includes a left frame 14, a right frame 15, a long drive shaft connecting the left and right frames 14, 15, and a left belt driving pulley, a left belt driven pulley, a right belt driving pulley, and a right belt driven pulley mounted on the left and right frames 14, 15, respectively. The long drive shaft is connected to the output end of the belt conveyor motor 11, and the left and right belt driving pulleys are mounted at each end of the long drive shaft 16. A cleaning brush 9 is mounted on the outside of the long drive shaft.

[0026] In this embodiment, the upper movable plate 21 is equipped with four adjustment screws 5 for adjusting the parallelism of the leveling platform. The adjustment screws 5 extend through the upper movable plate 21 and connect to the upper leveling plate 3. The balance of the upper leveling plate 3 is adjusted by twisting the adjustment screws 5. Loosening or tightening the adjustment screws lowers or raises the upper leveling plate 3, completing the overall balance of the upper leveling plate 3. A thick silicone plate is installed on one side of the upper movable plate 21 to reach the limit cylinder 6. Leveling height pads 7 are located on both the front and rear sides of the upper movable plate 21. A sensor bracket 81 is mounted on the lower fixed plate 22. This bracket houses a press plate position sensor 8, which detects the current position of the press plate formed by the upper leveling plate 3 and the upper movable plate 21. Displacement sensors are located at the four corners of the upper leveling plate 3 and the lower leveling plate 4 to detect whether there is product or other impurities remaining on the plate surfaces. A belt conveyor frame is mounted on the lower fixed plate 22 and is equipped with a cleaning brush 9.

[0027] The working principle of the end plate flat leveling mechanism of the present invention is as follows: in the previous process, the thick silicone plate 13 presses the chip capacitor into the plate hole through the needle bed. It is automatically transported to the leveling platform position by the belt conveyor motor 11, and the thick silicone plate reaches the limit cylinder 6. During the process, the belt conveyor motor 11 drives the cleaning brush 9 to move and clean the products and foreign matter remaining on the plate surface. After reaching the position, the conveyor belt lifting cylinder 41 descends to place the thick silicone plate 13 on the leveling lower plate 4. The press servo motor 25 drives the leveling mechanism to lower the leveling upper plate 3 to the surface of the thick silicone plate 13 according to the operating speed, distance and other parameters set by the system. The displacement detection sensors at the four corners of the leveling platform detect whether there are products or other impurities remaining on the plate surface. When a problem occurs, an alarm is triggered in time for manual processing. After inspection, the press servo motor 25 precisely descends the set distance to the leveling pad 7. The protruding portion of the chip capacitor is pressed back into the hole in the thick silicone plate 13 via the leveling platform, ensuring a consistent protrusion. Finally, the leveling mechanism ascends back to the set origin, completing the chip capacitor leveling process. If the parallelism between the upper and lower leveling plates 3 and 4 is abnormal, the leveling platform parallelism adjustment screws 5 can be used to adjust the alignment. Once leveling is complete, the plates are transported to the slurry dipping process via the belt conveyor motor 11.

[0028] The above description is merely an embodiment of the present invention and is not intended to limit the present invention. It will be apparent to those skilled in the art that various modifications and variations of the present invention are possible. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention are intended to be included within the scope of the claims of the present invention.

Claims

1. The end plate flattening mechanism comprises a belt conveyor frame, a belt conveyor motor (11), two rows of synchronous pulleys, two parallel conveyor belts (12) and a thick silicone plate (13) mounted on the upper part of the two conveyor belts (12), characterized in that: The upper and lower parts of the two transport belts (12) are respectively provided with a leveling upper plate mechanism and a leveling lower plate mechanism, wherein: The leveling upper plate mechanism comprises four guide rods (23), an upper movable plate (21) slidably mounted in the middle of the four guide rods (23), a lower fixed plate (22) fixedly mounted at the lower portion of the guide rods (23), and a motor fixed plate (24) fixedly mounted at the upper portion of the guide rods (23), wherein the lower portion of the upper movable plate (21) is provided with a leveling upper plate (3), a press servo motor (25) is mounted on the motor fixed plate (24), an output end of the press servo motor (25) is connected to a screw rod (26), and the screw rod (26) passes through the upper movable plate (21), and the leveling upper plate (3) is located above the thick silicone plate (13) between the two transport belts (12); The lower leveling plate mechanism comprises a lower leveling plate (4) mounted on the upper portion of a lower fixed plate (22), wherein the lower fixed plate (22) is located below a thick silicone plate (13) between two transport belts (12).

2. The end plate flattening mechanism according to claim 1, characterized in that: The belt conveyor frame is provided with a height adjustment structure, which includes a conveyor belt lifting cylinder (41) installed at the lower part of the lower fixed plate (22), a lifting movable plate (42) installed at the end of the piston rod of the conveyor belt lifting cylinder (41), and a lifting rod (43) installed at the four corners of the lifting movable plate (42) and slidably passing through the lower fixed plate (22), and the belt conveyor frame is installed on the upper part of the lifting rod (43).

3. The end plate flattening mechanism according to claim 1, characterized in that: The upper movable plate (21) is provided with four adjusting screws (5) for adjusting the parallelism of the leveling platform.

4. The end plate flattening mechanism according to claim 1 or 3, characterized in that: A thick silica gel plate is provided on one side of the upper movable plate (21) to reach the limiting cylinder (6).

5. The end plate flattening mechanism according to claim 4, characterized in that: Leveling height pads (7) are provided on both the front and rear sides of the upper movable plate (21).

6. The end plate flattening mechanism according to claim 1, characterized in that: A sensor bracket (81) is mounted on the lower fixed plate (22), and a press platform position sensor (8) is provided on the sensor bracket (81).

7. The end plate flattening mechanism according to claim 1, characterized in that: The belt transport frame is mounted on the lower fixed plate (22).

8. The end plate flattening mechanism according to claim 1, characterized in that: A cleaning brush (9) is provided on the belt transport frame.

9. The end plate flattening mechanism according to claim 1, characterized in that: The four corners of the leveling upper plate (3) and the leveling lower plate (4) are respectively provided with displacement detection sensors for detecting whether there are products or other impurities remaining on the plate surfaces.

10. The end plate flattening mechanism according to claim 1, characterized in that: The belt transport frame comprises a left frame (14), a right frame (15), a driving shaft connecting the left frame (14) and the right frame (15), a left belt driving wheel, a left belt driven wheel, a right belt driving wheel and a right belt driven wheel respectively mounted on the left frame (14) and the right frame (15), the driving shaft is connected to the output end of the belt transport motor (11), and the left belt driving wheel and the right belt driving wheel are respectively mounted on both ends of the driving shaft.