Wafer edge finder

Abstract

The utility model relates to the technical field of semiconductors, in particular to a wafer edge finder, which comprises an edge finding platform, a three-axis moving mechanism, an adsorption turntable connected to the output end of the three-axis moving mechanism and acquisition equipment, and is characterized in that the adsorption turntable is used for adsorbing a wafer to be detected; when a to-be-detected wafer is adsorbed on the adsorption turntable, the acquisition equipment acquires the outline of the to-be-detected wafer and obtains the central position of the to-be-detected wafer, and the three-axis moving mechanism drives the adsorption turntable to move, so that the center of the to-be-detected wafer is aligned with a target position; according to the utility model, when the sizes of the to-be-measured wafers are different, the centers of the to-be-measured wafers can be ensured to be aligned with the target position, the edge searching precision of the to-be-measured wafers is improved, the edge searching of the to-be-measured wafers with multiple sizes can be satisfied, the positioning is accurate, the compatibility is strong, and the use cost is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to a wafer edge finder. Background Art

[0002] Wafers need to go through hundreds of processes on the semiconductor production line. In order to ensure the quality of the wafers in each process, the wafers need to be continuously processed to find edges, origins, and positioning.

[0003] With the improvement of semiconductor process technology, the requirements for edge finders' positioning accuracy and efficiency have been greatly increased. The wafer edge finders on the market are difficult to achieve high-precision and high-efficiency wafer positioning and edge finding, and have poor compatibility, which increases the cost of use. Utility Model Content

[0004] In response to the deficiencies in the prior art, the utility model provides a wafer edge finder, which can ensure that its own center is aligned with the target position when the sizes of the wafers to be measured are different, thereby improving the edge finding accuracy of the wafers to be measured, meeting the edge finding requirements of wafers to be measured of multiple sizes, with accurate positioning, strong compatibility, and reduced usage costs.

[0005] In order to solve the above technical problems, the present invention adopts the following technical solutions:

[0006] The utility model provides a wafer edge finder, comprising an edge finding platform, a three-axis moving mechanism, an adsorption turntable connected to the output end of the three-axis moving mechanism, and a collection device, wherein the adsorption turntable is used to adsorb the wafer to be tested;

[0007] When the wafer to be tested is adsorbed on the adsorption turntable, the acquisition device collects the outline of the wafer to be tested and obtains the center position of the wafer to be tested, and the three-axis moving mechanism drives the adsorption turntable to move so that the center of the wafer to be tested is aligned with the target position.

[0008] The adsorption turntable is rotatably connected to the output end of the three-axis moving mechanism, and the wafer edge finder further includes a rotating mechanism, which is driven by the adsorption turntable and drives the adsorption turntable to rotate. The edge finding platform is connected to a plurality of support columns, which are distributed outside the adsorption turntable.

[0009] When performing wafer edge finding, the wafer to be tested is first supported by the support column, and the three-axis moving mechanism drives the adsorption turntable close to the wafer to be tested. After the adsorption turntable adsorbs the wafer to be tested, the acquisition device collects the outline of the wafer to be tested and obtains the center position of the wafer to be tested. The three-axis moving mechanism drives the wafer to be tested to move so that the center of the wafer to be tested is aligned with the target position. The rotation mechanism drives the adsorption turntable to rotate so that the wafer to be tested rotates to the required angle, and then the three-axis moving mechanism drives the adsorption turntable to descend. When the wafer to be tested is supported by the support column, the adsorption force on the wafer to be tested is released.

[0010] Among them, the three-axis moving mechanism includes an X-axis module, a Y-axis module and a Z-axis module. The X-axis module is installed on the edge-finding platform. The X-axis module drives the Y-axis module to move along the X-axis. The Y-axis module drives the Z-axis module to move along the Y-axis. The Z-axis module is connected to the adsorption turntable. The Z-axis module drives the adsorption turntable to move along the Z-axis. The Z-axis module is driven and connected to the rotating mechanism. The Z-axis module drives the rotating mechanism and the adsorption turntable to rise and fall synchronously.

[0011] Wherein, the adsorption turntable is provided with an adsorption channel, and the adsorption channel pipeline is connected to a vacuum pressure gauge.

[0012] Wherein, the acquisition device is a photoelectric sensor.

[0013] Among them, the edge-finding platform includes a base plate and a protective cover connected to the base plate, the three-axis moving mechanism is installed on the base plate and located in the protective cover, a movable opening is provided at the top of the protective cover, and the adsorption turntable is passed through the movable opening.

[0014] Beneficial effects of the utility model:

[0015] In actual application, a robotic arm is used to grab the wafer to be tested and place it on the adsorption turntable. The adsorption turntable is connected to negative pressure and negatively adsorbs the wafer to be tested. The acquisition device is a photoelectric sensor. The acquisition device collects the contour of the wafer to be tested and obtains the center position of the wafer to be tested. The three-axis moving mechanism drives the adsorption turntable to move so that the center of the wafer to be tested is aligned with the target position. Specifically, the robotic arm can grab wafers to be tested of different sizes. When the sizes of the wafers to be tested are different, it can ensure that its own center is aligned with the target position, thereby improving the edge finding accuracy of the wafer to be tested, and can meet the edge finding needs of wafers to be tested of multiple sizes. It has accurate positioning, strong compatibility, and reduces the cost of use. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the three-dimensional structure of the wafer edge finder.

[0017] Figure 2 This is a schematic diagram of the partial structure of the wafer edge finder.

[0018] Figure 3 Schematic diagram of the structure of the adsorption turntable.

[0019] Figure 4 Schematic diagram of the three-dimensional structure of the edge-finding platform.

[0020] 1. Edge-finding platform; 101. Bottom plate; 102. Protective cover; 1021. Movable opening;

[0021] 2. Three-axis moving mechanism;

[0022] 21. X-axis module; 22. Y-axis module; 23. Z-axis module;

[0023] 3. Adsorption turntable; 301. Adsorption channel; 302. Vacuum pressure gauge;

[0024] 4. Collection equipment;

[0025] 5. Rotating mechanism; 6. Support column. DETAILED DESCRIPTION

[0026] To facilitate understanding by those skilled in the art, the present invention is further described below with reference to examples and drawings. Specific implementation methods of the present invention will be described below. It should be noted that in the specific description of these implementation methods, for the sake of clarity and clarity, it is impossible for this specification to provide a detailed description of all features of the actual implementation methods.

[0027] refer to Figures 1 to 4 As shown, the utility model provides a wafer edge finder, including an edge finding platform 1, a three-axis moving mechanism 2, an adsorption turntable 3 connected to the output end of the three-axis moving mechanism 2 and a collection device 4, wherein the adsorption turntable 3 is used to adsorb the wafer to be tested.

[0028] refer to Figure 1 As shown, in actual application, a robotic arm is used to grab the wafer to be tested and place it on the adsorption turntable 3. The adsorption turntable 3 is connected to negative pressure and negatively adsorbs the wafer to be tested. The acquisition device 4 is a photoelectric sensor. The acquisition device 4 collects the contour of the wafer to be tested and obtains the center position of the wafer to be tested. The three-axis moving mechanism 2 drives the adsorption turntable 3 to move so that the center of the wafer to be tested is aligned with the target position. Specifically, the robotic arm can grab wafers to be tested of different sizes. When the sizes of the wafers to be tested are different, it can ensure that its own center is aligned with the target position, thereby improving the edge finding accuracy of the wafer to be tested, and can meet the edge finding of wafers to be tested of multiple sizes. It has accurate positioning, strong compatibility, and reduces the cost of use.

[0029] refer to Figure 1 、 2 As shown, in this embodiment, the adsorption turntable 3 is rotatably connected to the output end of the three-axis moving mechanism 2, and the wafer edge finder also includes a rotating mechanism 5, which is driven by the adsorption turntable 3 and drives the adsorption turntable 3 to rotate. Figure 4 As shown, the edge-finding platform 1 is connected to a plurality of support columns 6 , and the support columns 6 are distributed outside the adsorption turntable 3 .

[0030] In actual application, the wafer to be tested is grabbed by the robotic arm, and the wafer to be tested is supported by the support column 6. The three-axis moving mechanism 2 drives the adsorption turntable 3 to approach the wafer to be tested. After the adsorption turntable 3 adsorbs the wafer to be tested, the acquisition device 4 collects the outline of the wafer to be tested and obtains the center position of the wafer to be tested. The three-axis moving mechanism 2 drives the wafer to be tested to move so that the center of the wafer to be tested is aligned with the target position. The rotation mechanism 5 drives the adsorption turntable 3 to rotate, so that the wafer to be tested rotates to the required angle, and then the three-axis moving mechanism 2 drives the adsorption turntable 3 to descend. When the wafer to be tested is supported by the support column 6, the adsorption force on the wafer to be tested is released, thereby realizing the positioning, edge finding and deviation correction of the wafer to be tested, meeting the edge finding accuracy of the wafer to be tested, improving the edge finding efficiency, and improving the edge finding compatibility of the wafer to be tested.

[0031] refer to Figure 2 As shown, in this embodiment, the three-axis moving mechanism 2 includes an X-axis module 21, a Y-axis module 22 and a Z-axis module 23. The X-axis module 21 is installed on the edge-finding platform 1. The X-axis module 21 drives the Y-axis module 22 to move along the X-axis. The Y-axis module 22 drives the Z-axis module 23 to move along the Y-axis. The Z-axis module 23 is connected to the adsorption turntable 3. The Z-axis module 23 drives the adsorption turntable 3 to move along the Z-axis. The Z-axis module 23 is connected to the rotating mechanism 5. The Z-axis module 23 drives the rotating mechanism 5 and the adsorption turntable 3 synchronous lifting; in actual application, the X-axis module 21, the Y-axis module 22 and the Z-axis module 23 adopt oil cylinders, electric cylinders or screw motor modules, and the X-axis module 21, the Y-axis module 22 and the Z-axis module 23 drive the adsorption turntable 3 to realize XYZ three-axis movement, which can smoothly drive the deviation between the wafer to be tested and the target position in the three-dimensional space to improve the correction accuracy of the wafer to be tested; the rotating mechanism 5 adopts a servo motor or a drive motor, and the rotating mechanism 5 drives the adsorption turntable 3 to rotate to adjust the placement angle of the wafer to be tested and accurately position the wafer to be tested.

[0032] refer to Figure 3 As shown, in this embodiment, the adsorption turntable 3 is provided with an adsorption channel 301, and the adsorption channel 301 pipeline is connected to a vacuum pressure gauge 302. When the wafer to be tested is placed on the adsorption turntable 3, the adsorption channel 301 is connected to negative pressure so that the wafer to be tested is adsorbed by the negative pressure. Figure 1 、 4 As shown, the vacuum pressure gauge 302 is set to detect the value change of the vacuum pressure value. When the vacuum pressure value is zero, there is no wafer to be tested. The presence of the wafer to be tested is detected to improve the edge finding efficiency.

[0033] refer to Figure 4As shown, in the embodiment, the edge searching platform 1 comprises a bottom plate 101 and a shield 102 connected with the bottom plate 101, the three-axis moving mechanism 2 is installed on the bottom plate 101 and located in the shield 102, the three-axis moving mechanism 2 is compactly arranged in the shield, space occupation is saved, and the three-axis moving mechanism 2 is effectively protected; a movable opening 1021 is arranged at the top end of the shield 102, the adsorption turntable 3 is arranged through the movable opening 1021, the movable space of the adsorption turntable 3 is provided through the movable opening 1021, the three-axis moving mechanism 2 can smoothly drive the adsorption turntable 3 to move, and the normal use of the adsorption turntable 3 is met.

[0034] The above is only the preferred embodiment of the present application, and does not limit the present application in any form. Although the present application is disclosed as the above preferred embodiment, it is not intended to limit the present application. Any skilled person in the art can make some changes or modifications to the above disclosed technical content without departing from the technical scheme of the present application, and any simple modification, equivalent change and modification of the above embodiment belong to the scope of the technical scheme of the present application.

Claims

1. A wafer edge finder, characterized in that: It comprises an edge-finding platform (1), a three-axis moving mechanism (2), an adsorption turntable (3) connected to the output end of the three-axis moving mechanism (2), and a collection device (4), wherein the adsorption turntable (3) is used to adsorb a wafer to be tested; When the wafer to be tested is adsorbed on the adsorption turntable (3), the acquisition device (4) acquires the outline of the wafer to be tested and obtains the center position of the wafer to be tested, and the three-axis moving mechanism (2) drives the adsorption turntable (3) to move, so that the center of the wafer to be tested is aligned with the target position.

2. The wafer edge finder according to claim 1, characterized in that: The adsorption turntable (3) is rotatably connected to the output end of the three-axis moving mechanism (2), and the wafer edge finder further includes a rotating mechanism (5), the rotating mechanism (5) is drivingly connected to the adsorption turntable (3), and the rotating mechanism (5) drives the adsorption turntable (3) to rotate. The edge finding platform (1) is connected to a plurality of support columns (6), and the support columns (6) are distributed outside the adsorption turntable (3); When performing wafer edge search, the wafer to be tested is first supported by a support column (6), the three-axis moving mechanism (2) drives the adsorption turntable (3) to approach the wafer to be tested, the adsorption turntable (3) adsorbs the wafer to be tested, and then the acquisition device (4) collects the outline of the wafer to be tested and obtains the center position of the wafer to be tested. The three-axis moving mechanism (2) drives the wafer to be tested to move so that the center of the wafer to be tested is aligned with the target position, the rotation mechanism (5) drives the adsorption turntable (3) to rotate, so that the wafer to be tested rotates to a required angle, and then the three-axis moving mechanism (2) drives the adsorption turntable (3) to descend, and the adsorption force on the wafer to be tested is released when the wafer to be tested is supported by the support column (6).

3. The wafer edge finder according to claim 2, characterized in that: The three-axis moving mechanism (2) comprises an X-axis module (21), a Y-axis module (22) and a Z-axis module (23); the X-axis module (21) is installed on the edge-finding platform (1); the X-axis module (21) drives the Y-axis module (22) to move along the X-axis; the Y-axis module (22) drives the Z-axis module (23) to move along the Y-axis; the Z-axis module (23) is connected to the adsorption turntable (3); the Z-axis module (23) drives the adsorption turntable (3) to move along the Z-axis; the Z-axis module (23) is connected to the rotating mechanism (5); the Z-axis module (23) drives the rotating mechanism (5) and the adsorption turntable (3) to rise and fall synchronously.

4. The wafer edge finder according to claim 1, wherein: The adsorption turntable (3) is provided with an adsorption channel (301), and the adsorption channel (301) pipeline is connected to a vacuum pressure gauge (302).

5. The wafer edge finder according to claim 1, characterized in that: The acquisition device (4) is a photoelectric sensor.

6. The wafer edge finder according to claim 1, characterized in that: The edge-finding platform (1) comprises a base plate (101) and a protective cover (102) connected to the base plate (101); the three-axis moving mechanism (2) is mounted on the base plate (101) and located within the protective cover (102); a movable opening (1021) is provided at the top end of the protective cover (102); and the adsorption turntable (3) is passed through the movable opening (1021).

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