High-load through-flow circuit board

Abstract

The utility model relates to a high-load through-flow circuit board. The high-load through-flow circuit board comprises a circuit board body, a plurality of through-flow modules which are sequentially connected and mounted on the circuit board body, and a plurality of heat dissipation modules which are located on the side, away from the through-flow modules, of the circuit board body and correspond to the through-flow modules in a one-to-one mode. The circuit board body comprises a first electric connection part and a second electric connection part, and the through-flow module is communicated with the first electric connection part and the second electric connection part so as to increase the flow capacity of current between the first electric connection part and the second electric connection part; a limiting protrusion is arranged at one end of the through-flow module in the length direction, and limiting grooves allowing the limiting protrusion to be embedded therein are formed in the other end of the through-flow module and the two sides of the through-flow module in the width direction. The high-load through-flow circuit board designed by the utility model is simple in structure and relatively low in cost, can give consideration to the problems of high current carrying and heat dissipation, and can realize unified standardized management of research, development, design and use of through-flow components at the same time.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to a high-current-carrying circuit board. Background Art

[0002] With the continuous advancement of science and technology, circuit boards are experiencing a booming development and are widely used in various electrical equipment. They are the basis for connecting various electronic components. In current high-speed circuit board designs, as voltage decreases and power consumption increases, the current board often needs to carry larger currents, even exceeding 100A. However, the conductive copper foil thickness of conventional circuits is generally only 0.035mm, which is unable to carry such large currents. Conventional methods for increasing the current flow capacity of circuit boards include increasing the number of circuit board layers and external custom copper busbars. However, increasing the number of circuit board layers will lead to a significant increase in production and material costs. The method of using custom copper busbars is not only expensive, but also has limited application scenarios and cannot achieve unified and standardized management of component R&D, design, and use. Utility Model Content

[0003] In response to the above-mentioned problems, the purpose of this utility model is to design a high-current-carrying circuit board with a simple structure and low cost, which can take into account both high current-carrying and heat dissipation problems, and at the same time can achieve unified and standardized management of the research and development, design and use of current-carrying components.

[0004] The purpose of the utility model is achieved through the following technical solutions:

[0005] A high-load current-carrying circuit board is designed, comprising a circuit board body, a plurality of current-carrying modules connected in sequence and mounted on the circuit board body, and a plurality of heat dissipation modules located on a side of the circuit board body away from the current-carrying modules and corresponding one-to-one to the current-carrying modules; the circuit board body comprises a first electrical connection portion and a second electrical connection portion, the current-carrying module connects the first electrical connection portion and the second electrical connection portion to increase the current flow capacity between the two; a limiting protrusion is provided at one end of the current-carrying module along the length direction, and a limiting groove for the limiting protrusion to be embedded is provided at the other end of the current-carrying module and on both sides along the width direction.

[0006] The high-load current-carrying circuit board designed in this scheme can provide a current-carrying channel that can carry large currents to meet the needs of component use. The current-carrying channel is composed of several current-carrying modules, which can be selectively spliced ​​according to actual conditions, increasing the adaptability of the current-carrying module and the diversity of usage scenarios. In order to facilitate the mounting and alignment of the current-carrying module on the circuit board body, the current-carrying module is provided with limiting protrusions and limiting grooves. According to the direction and position of the first electrical connection part and the second electrical connection part, several current-carrying module limiting protrusions and limiting grooves are spliced ​​in multiple directions in sequence to finally form a current-carrying channel between the first electrical connection part and the second electrical connection part. Current-carrying modules that carry large currents often generate a large amount of heat. If the heat is not dissipated in time and the temperature rises, it may cause the resistance of the current-carrying module to increase and reduce the current passing capacity. Therefore, a heat dissipation module is designed to match the current-carrying module to optimize the heat dissipation capacity of the circuit board and ensure that the circuit board can operate stably and effectively.

[0007] Furthermore, the circuit board body is provided with a window between the first electrical connection portion and the second electrical connection portion to expose a conductive layer, and the current flow module is conductively connected to the conductive layer.

[0008] The ink insulating layer on the surface of the circuit board body has windows to expose the buried conductive layer. The bottom of the flow module is welded to the conductive layer to form a high-current flow channel for the first electrical connection part and the second electrical connection part.

[0009] Furthermore, the size of the window is larger than the size of the flow module, so that the flow module is in complete contact with the conductive layer.

[0010] In order to ensure the flow capacity, the conductive layer and the flow module adopt a full contact form, that is, the flow path between the first electrical connection part and the second electrical connection part is designed, and the window size is designed according to the size of the flow module after splicing, so that the conductive layer is completely exposed. After laying solder paste at the window position, the flow module is mounted to the window position through the patch device, and then reflow soldering is used to realize a high-current flow channel.

[0011] Furthermore, the flow module is provided with a plurality of first through holes, the circuit board body is provided with second through holes corresponding one to one with the first through holes, and the heat dissipation module is provided with a plurality of connecting columns, which pass through the first through holes and the second through holes and are connected to the flow module.

[0012] The flow module is located on one side of the circuit board body, and the heat dissipation module is located on the other side of the circuit board body. The two are thermally connected through a connecting column, that is, a plurality of corresponding first through holes and second through holes are opened on the flow module and the circuit board body, and the heat dissipation module is provided with a connecting column. After assembly, the connecting column is inserted into the first through hole through the second through hole. Part of the heat generated by the flow module is transferred and diffused to the heat dissipation module through the connecting column, thereby realizing the heat dissipation of the flow module.

[0013] Furthermore, the connecting column includes at least one stud, which passes through the corresponding first through hole and the second through hole and is connected to the flow module through a nut.

[0014] The heat dissipation module is connected to the flow module via a screw-nut connection. At least one of the multiple connection studs is a stud, which passes through the first through-hole and is locked to the flow module via a nut. Alternatively, if the first electrical connection is a terminal block, the terminal block can be mounted on the stud and pressed together with the flow module via a nut to achieve electrical continuity.

[0015] Furthermore, the connecting column also includes a heat-conducting column, the height of the stud is greater than the height of the heat-conducting column, and after the heat dissipation module is connected to the flow module, the top of the heat-conducting column is lower than the upper surface of the flow module.

[0016] In addition to the studs used for connection, the remaining connection columns can be provided with heat-conducting columns. When the heat dissipation module is connected to the flow module, the top of the heat-conducting column is located in the first through hole to avoid exceeding the upper surface of the flow module and causing interference between components.

[0017] Furthermore, thermal conductive glue is poured between the thermally conductive column and the first through hole.

[0018] In order to enhance the thermal conductivity, after the thermal conductive column is inserted into the first through hole, thermal conductive glue can be poured to fill the gap between the thermal conductive column and the first through hole, changing the air heat conduction mode to contact heat conduction, and quickly transferring the heat of the flow module to the lower surface of the heat dissipation module through the thermal conductive column, thereby improving the heat dissipation capacity.

[0019] Furthermore, the circuit board body is provided with a groove, the heat dissipation module is embedded in the groove, and the bottom surface of the heat dissipation module facing away from the flow-through module is flush with the bottom surface of the circuit board body.

[0020] A groove is provided on the bottom surface of the circuit board body away from the flow module. After the connecting column of the heat dissipation module passes through the first through hole and the second through hole, the body of the heat dissipation module is embedded in the groove, and the bottom surface of the heat dissipation module is flush with the bottom surface of the circuit board body, ensuring the consistency of the circuit board structure.

[0021] Furthermore, the heat dissipation module is made of thermally conductive ceramics.

[0022] The heat dissipation module can be made of high thermal conductivity materials, such as thermal conductive ceramics. Thermal conductive ceramics have high thermal conductivity, high hardness, corrosion resistance and other properties. While taking into account the thermal conductivity function, they can adapt to various complex application environments without being corroded.

[0023] Furthermore, an insulating layer is attached to the non-electrical connection portion of the flow module.

[0024] The flow module can be made of materials such as copper and aluminum. When used on a high-density circuit board, it may come into contact with surrounding components and cause a short circuit. Therefore, an insulating layer, such as an insulating film or PI film, can be attached to the non-electrical contact part of the flow module to improve reliability.

[0025] Compared with the prior art, the beneficial effects of the present invention are:

[0026] The high-load current-carrying circuit board designed in this scheme can provide a current-carrying channel that can carry large currents to meet the needs of component use. The current-carrying channel is composed of several current-carrying modules, which can be selectively spliced ​​according to actual conditions, increasing the adaptability of the current-carrying module and the diversity of usage scenarios. In order to facilitate the mounting and alignment of the current-carrying module on the circuit board body, the current-carrying module is provided with limiting protrusions and limiting grooves. According to the direction and position of the first electrical connection part and the second electrical connection part, several current-carrying module limiting protrusions and limiting grooves are spliced ​​in multiple directions in sequence to finally form a current-carrying channel between the first electrical connection part and the second electrical connection part. Current-carrying modules that carry large currents often generate a large amount of heat. If the heat is not dissipated in time and the temperature rises, it may cause the resistance of the current-carrying module to increase and reduce the current passing capacity. Therefore, a heat dissipation module is designed to match the current-carrying module to optimize the heat dissipation capacity of the circuit board and ensure that the circuit board can operate stably and effectively. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 This is a structural diagram of a high-current circuit board according to an embodiment of the present invention.

[0028] Figure 2 for Figure 1 Middle top view.

[0029] Figure 3 for Figure 2 Cross-section view at the AA position.

[0030] Figure 4 This is a structural diagram of a flow module according to an embodiment of the present invention.

[0031] Figure 5 This is a structural diagram of a heat dissipation module according to an embodiment of the present invention.

[0032] Illustrations: 1. Circuit board body; 11. First electrical connection; 12. Second electrical connection; 13. Conductive layer; 2. Current flow module; 21. Limiting protrusion; 22. Limiting groove; 23. First through hole; 24. Insulation layer; 3. Heat dissipation module; 31. Stud; 32. Thermal conductive column; 33. Thermal conductive adhesive. DETAILED DESCRIPTION

[0033] To facilitate understanding of the present invention, the present invention will be described more fully below with reference to the accompanying drawings. The accompanying drawings illustrate preferred embodiments of the present invention. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein.

[0034] like Figures 1 to 5 As shown, this embodiment provides a high-load current-carrying circuit board, which can provide a current-carrying channel that carries large current to meet the use requirements of components, including a circuit board body 1, a plurality of current-carrying modules 2 connected in sequence and mounted on the circuit board body 1, and a plurality of heat dissipation modules 3 located on the side of the circuit board body 1 away from the current-carrying modules 2 and corresponding one-to-one with the current-carrying modules 2.

[0035] like Figure 1 and Figure 2 As shown, the circuit board body 1 includes a first electrical connection part 11 and a second electrical connection part 12. The first electrical connection part 11 can be a power supply terminal, and the second electrical connection part 12 can be a pin of a component. A window is opened in the ink insulation layer between the first electrical connection part 11 and the second electrical connection part 12 to expose the buried conductive layer 13. The size of the window is larger than that of the flow module 2. The flow module 2 connects the first electrical connection part 11 and the second electrical connection part 12 to increase the current flow capacity between the two. The number of the flow modules 2 is specifically set according to the flow path between the first electrical connection part 11 and the second electrical connection part 12. In order to ensure the flow capacity, the conductive layer 13 and the flow module 2 are in full contact. According to the flow path between the first electrical connection part 11 and the second electrical connection part 12, the window size is designed according to the size of the flow module 2 after splicing, so that the conductive layer 13 is completely exposed. After laying solder paste at the window position, the flow module 2 and the components connected to the flow module 2 are mounted to the corresponding position of the window through the patch device. After automatic inspection by the equipment, a high-current-carrying flow channel is realized through reflow soldering to provide a larger current to the components.

[0036] like Figure 1 and Figure 4 As shown, in order to facilitate the mounting and alignment of the flow module 2 on the circuit board body 1, a limiting protrusion 21 is provided at one end of the flow module 2 along the length direction, and a limiting groove 22 for the limiting protrusion 21 to be embedded is provided at the other end of the flow module 2 and on both sides along the width direction. According to the direction and position of the first electrical connection part 11 and the second electrical connection part 12, the limiting protrusions 21 and the limiting grooves 22 of several flow modules 2 are spliced ​​in multiple directions in sequence, and finally a flow channel is formed between the first electrical connection part 11 and the second electrical connection part 12. The flow channel is formed by splicing several flow modules, and can be selectively spliced ​​according to actual conditions, which increases the adaptability of the flow module 2 and the diversity of usage scenarios, and is conducive to the unified and standardized management of the research and development, design and use of the flow module 2.

[0037] like Figures 3 to 5 As shown, the flow module 2 carrying a large current tends to generate a large amount of heat. If the heat is not dissipated in time and the temperature rises, it may cause the resistance of the flow module 2 to increase, reducing the current passing capacity. Therefore, the heat dissipation module 3 is designed to match the flow module 2 to optimize the heat dissipation capacity of the circuit board and ensure that the circuit board can operate stably and effectively. Specifically, the flow module 2 is located on one side of the circuit board body 1. The flow module 2 is provided with a plurality of first through holes 23. The circuit board body 1 is provided with second through holes corresponding to the first through holes 23. The heat dissipation module 3 is located on the other side of the circuit board body 1. The heat dissipation module 3 is provided with a plurality of connecting columns. After assembly, the connecting columns pass through the first through holes 23 and the second through holes to connect with the flow module 2. The two are thermally connected by the connecting columns. The connecting columns pass through the second through holes and are inserted into the first through holes 23. Part of the heat generated by the flow module 2 is transferred and diffused to the heat dissipation module 3 through the connecting columns, thereby achieving heat dissipation of the flow module 2.

[0038] like Figures 3 to 5 As shown, the connecting column can be provided with one stud 31, and the rest are provided as heat-conducting columns 32. Of course, it can also be provided according to the actual application, such as being provided with two studs 31. The stud 31 passes through the corresponding first through hole 23 and the second through hole and is connected to the flow module 2 through a nut. The height of the stud 31 is greater than the height of the heat-conducting column 32. After the heat dissipation module 3 is connected to the flow module 2, the top of the heat-conducting column 32 is lower than the upper surface of the flow module 2. The heat dissipation module 3 is connected and fixed to the flow module 2 by screwing the stud 31 and the nut together. The stud 31 passes through the first through hole 23 and is locked to the flow module 2 by the nut. In addition, if the first electrical connection part 11 is a terminal, the terminal can be sleeved on the stud 31, and the terminal and the flow module 2 are pressed together by the nut to achieve electrical conduction. In addition to the studs 31 used for connection, the remaining connection columns can be provided with heat-conducting columns 32. When the heat dissipation module 3 is connected to the flow module 2, the top of the heat-conducting column 32 is located in the first through hole 23 to avoid exceeding the upper surface of the flow module 2 and causing interference between components. In order to enhance the thermal conductivity, after the heat-conducting column 32 is inserted into the first through hole 23, a thermal adhesive 33 can be poured to fill the gap between the heat-conducting column 32 and the first through hole 23, changing the air heat conduction mode to contact heat conduction, and quickly transferring the heat of the flow module 2 to the lower surface of the heat dissipation module 3 through the heat-conducting column 32, thereby improving the heat dissipation capacity. In addition, a groove is provided on the bottom surface of the circuit board body 1 away from the flow module 2. After the connection column of the heat dissipation module 3 passes through the first through hole 23 and the second through hole, the body of the heat dissipation module 3 is embedded in the groove, and the bottom surface of the heat dissipation module 3 is flush with the bottom surface of the circuit board body 1, ensuring the consistency of the circuit board structure.

[0039] The through-flow module 2 can be made of copper, aluminum or the like, and can be attached with an insulating layer 24 such as an insulating film or a PI film at a non-electric contact position of the through-flow module 2 to improve reliability, as application on a high-density circuit board can be in contact with surrounding components to cause short circuit. The heat-dissipation module 3 can be made of a high-thermal-conductivity material such as thermal-conductivity ceramic, which has high thermal conductivity, high hardness, corrosion resistance and the like, and can be applied to various complex application environments without corrosion while taking into account the heat-dissipation function.

[0040] In the description of the present application, it should be understood that the orientation or positional relationship indicated by terms such as "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element indicated must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application.

[0041] In addition, the terms "first", "second", and the like are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with "first", "second" and the like can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise specifically limited.

[0042] Although the embodiments of the present application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to the embodiments without departing from the principles and spirit of the present application, and the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A high-current-carrying circuit board, characterized in that: It includes a circuit board body, several flow modules connected in sequence and mounted on the circuit board body, and several heat dissipation modules located on the side of the circuit board body away from the flow modules and corresponding to the flow modules one by one; the circuit board body includes a first electrical connection part and a second electrical connection part, and the flow module connects the first electrical connection part and the second electrical connection part to increase the current flow capacity between the two; a limiting protrusion is provided at one end of the flow module along the length direction, and a limiting groove for the limiting protrusion to be embedded is provided at the other end of the flow module and on both sides along the width direction.

2. The high-current-carrying circuit board according to claim 1, characterized in that: The circuit board body is provided with a window between the first electrical connection portion and the second electrical connection portion to expose a conductive layer, and the current flow module is conductively connected to the conductive layer.

3. The high-current-carrying circuit board according to claim 2, characterized in that: The size of the window is larger than that of the flow module, so that the flow module is in complete contact with the conductive layer.

4. The high current carrying circuit board according to claim 1, characterized in that: The flow module is provided with a plurality of first through holes, the circuit board body is provided with second through holes corresponding to the first through holes one by one, and the heat dissipation module is provided with a plurality of connecting columns, which pass through the first through holes and the second through holes and are connected to the flow module.

5. The high-current-carrying circuit board according to claim 4, characterized in that: The connecting column includes at least one stud, which passes through the corresponding first through hole and the second through hole and is connected to the flow module through a nut.

6. The high current carrying circuit board according to claim 5, characterized in that: The connecting column also includes a heat-conducting column. The height of the stud is greater than that of the heat-conducting column. After the heat dissipation module is connected to the flow module, the top of the heat-conducting column is lower than the upper surface of the flow module.

7. The high current carrying circuit board according to claim 6, characterized in that: Thermal conductive glue is poured between the thermal conductive column and the first through hole.

8. The high current carrying circuit board according to claim 1, characterized in that: The circuit board body is provided with a groove, the heat dissipation module is embedded in the groove, and the bottom surface of the heat dissipation module facing away from the flow-through module is flush with the bottom surface of the circuit board body.

9. The high current carrying circuit board according to claim 1, characterized in that: The heat dissipation module is made of thermally conductive ceramics.

10. The high current carrying circuit board according to claim 1, characterized in that: An insulating layer is attached to the non-electrical connection portion of the flow module.

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