Assembly fixture for electrical components

Abstract

The utility model discloses an assembly fixture for electrical components, which belongs to the technical field of electrical components and comprises a circuit board clamping mechanism, a patch electronic component positioning mechanism and the like. The circuit board clamping mechanism comprises an assembling plate, a mounting side plate, an upper clamping plate and a lower clamping plate, the mounting side plate is vertically mounted at the top of the assembling plate, an air cylinder is mounted in the center of the side part of the mounting side plate, the output end of the air cylinder is connected with the upper clamping plate, the upper clamping plate is in contact with the upper surface of the assembling plate, and the lower clamping plate is vertically mounted at the bottom of the assembling plate; the SMD electronic component positioning mechanism comprises a height adjusting sliding block, a telescopic assembly and a positioning block. The height adjusting sliding block is movably connected into the height adjusting rectangular sliding groove of the lower clamping plate, and a horizontal distance adjusting sliding groove is formed in the side portion, close to the top end, of the height adjusting sliding block. One end of the telescopic assembly is horizontally and slidably connected in the horizontal distance adjusting chute, and the other end is connected with the positioning block; the design can assist accurate welding and positioning of the SMD electronic component.

Description

TECHNICAL FIELD

[0001] The utility model belongs to electric component technical field, especially relate to a kind of assembly fixture for electric component. BACKGROUND

[0002] With the rapid development of electronic technology, electronic products become more and more precise and miniaturization, which puts forward higher requirements for the assembly and welding technology of circuit board.

[0003] The design of circuit board clamping tool needs to consider the stability and processing accuracy of circuit board in the processing process; traditional clamping tool may extrude circuit board from the side, and if extrusion is excessive, it may cause the circuit board to bend, affecting the processing quality; and because the volume of surface mount electronic components is small, positioning is difficult, and during the welding process, the operator usually needs to hold solder wire with one hand and hold electric soldering iron with the other hand, which may cause insufficient hand stability and affect the accuracy of positioning; however, inaccurate welding may cause virtual welding, insecure welding points or solder bridges, affecting the electrical performance and reliability of the circuit board, and errors in the welding process may affect other electronic components on the welding pad, causing short circuit or other functional failure.

[0004] In view of the deficiencies of the prior art, the utility model provides an assembly fixture for electric component, aiming at solving the above problems. UTILITY MODEL CONTENTS

[0005] The utility model aims at overcoming the deficiencies in the prior art, and provides an assembly fixture for electric component, which can accurately position the surface mount electronic components.

[0006] To achieve the above-mentioned purpose, the utility model is implemented by adopting the following technical scheme:

[0007] An assembly fixture for electric component, comprising a circuit board clamping mechanism, a surface mount electronic component positioning mechanism and an angle adjusting mechanism;

[0008] The circuit board clamping mechanism comprises an assembly plate, a mounting side plate, an upper clamping plate and a lower clamping plate, the mounting side plate is vertically mounted on the top of the assembly plate, and a gas cylinder is mounted on the side center of the mounting side plate, the output end of the gas cylinder is connected with the upper clamping plate, the upper clamping plate is in contact with the upper surface of the assembly plate, and the lower clamping plate is vertically mounted on the bottom of the assembly plate;

[0009] The surface mount electronic component positioning mechanism comprises a height adjusting slider, a telescopic assembly and a positioning block; the height adjusting slider is movably connected in the height adjusting rectangular slot of the lower clamping plate, and a horizontal distance adjusting slot is formed in the side of the height adjusting slider close to the top end; one end of the telescopic assembly is horizontally slidably connected in the horizontal distance adjusting slot, and the other end is connected with the positioning block;

[0010] The angle adjustment mechanism is connected to the circuit board clamping mechanism and is used to adjust the assembly angle of the assembly plate.

[0011] Preferably, the telescopic assembly includes telescopic rod one, telescopic rod two, telescopic rod three and telescopic rod four which are sequentially connected, and the telescopic connections of the telescopic assembly are provided with telescopic limiters to prevent disengagement due to excessive extension, the non-telescopic end of the telescopic rod one is slidably connected to the horizontal distance adjustment slot, and the non-telescopic end of the telescopic rod four is connected to the positioning block.

[0012] Preferably, the assembly plate is provided with a plurality of heat dissipation holes, and shaft 1 is mounted on the heat dissipation holes near both sides of the assembly plate.

[0013] Preferably, the angle adjustment mechanism includes a support plate and a pair of angle adjustment rods; a pair of connecting blocks are connected to the side of the support plate close to the lower clamping plate, and the connecting blocks are rotatably connected to the assembly plate through a rotating shaft, and one end of the angle adjustment rod is rotatably connected to the assembly plate through shaft 1, and the other end is engaged in the limiting hole of the support plate, and there are multiple limiting holes.

[0014] Preferably, a height-adjusting limiter is further provided at the bottom of the height-adjusting slider to prevent the height-adjusting slider from falling out of the slot due to excessive height adjustment.

[0015] Preferably, the circuit board clamping mechanism further includes an anti-slip gasket 1, and the anti-slip gasket 1 is provided on the side of the upper clamping plate close to the lower clamping plate.

[0016] Preferably, the chip electronic component positioning mechanism further includes a second anti-slip pad, and the second anti-slip pad is provided on the side of the positioning block close to the upper clamping plate.

[0017] Preferably, the periphery of the piston rod of the cylinder is further connected to an elliptical plate, and the elliptical plate is connected to the upper clamping plate.

[0018] Compared with the prior art, the present invention has the following beneficial effects:

[0019] 1. The utility model first designs a circuit board clamping mechanism, and the upper clamping plate driven by the cylinder can evenly clamp the circuit board, avoiding damage or instability that may be caused by manual clamping; secondly, a height adjustment slider is vertically slidably connected in the lower clamping plate, and the height adjustment slider is combined with the patch electronic component positioning mechanism, which can be applied to circuit boards of various thicknesses, and a horizontal distance adjustment slot is provided on the side of the height adjustment slider near the top; the horizontal distance adjustment slot is used for positioning in the x-direction, and one end of the telescopic component is horizontally slidably connected to the horizontal distance adjustment slot, and the telescopic component is used for positioning in the y-axis direction. The combination of the height adjustment slider and the telescopic component provides a flexible adjustment method, which can adapt to patch electronic components in different orientations; finally, a positioning block is connected through the telescopic component, and an anti-slip pad is provided on the side of the positioning block. Since the assembly plate is tilted upward, only one fulcrum is needed for the patch electronic component, and the volume and mass of the patch electronic component itself are relatively small, so the positioning of the patch electronic component during welding can be achieved.

[0020] 2. The utility model introduces an angle adjustment mechanism so that the assembly plate can adapt to assembly requirements at different angles. This design not only reduces the soreness of the waist and neck caused by long-term welding and assembly on the horizontal desktop, but also increases the flexibility of welding and assembly of SMD electronic components.

[0021] 3. The utility model provides heat dissipation holes on the assembly board, which helps to dissipate the heat generated by the circuit board during processing, thereby preventing overheating from affecting the performance of electrical components or welding quality.

[0022] 4. The utility model increases the contact area between the output end of the cylinder and the upper clamping plate by connecting an elliptical plate to the periphery of the piston rod of the cylinder, and the elliptical plate is connected to the upper clamping plate, so that the pushing force of the cylinder is more evenly transmitted to the upper clamping plate, avoiding unnecessary pressure or damage to the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a structural diagram of the present utility model.

[0024] Figure 2 It is a top view of the present utility model.

[0025] Figure 3 It is a right view of the present utility model.

[0026] Figure 4 It is a schematic cross-sectional structure diagram of the present invention from another perspective.

[0027] Figure 5 This is an enlarged cross-sectional view A of the telescopic limiter from another perspective of the present invention.

[0028] Figure 6 It is an assembly diagram of an embodiment of the present utility model.

[0029] Figure 7 FIG. 1 is an enlarged schematic diagram B of the chip capacitor during soldering according to an embodiment of the present invention.

[0030] in:

[0031] 1. Circuit board clamping mechanism;

[0032] 101, assembly plate; 101a, heat dissipation hole; 101b, shaft 1; 102, mounting side plate; 103, upper clamping plate; 103a, anti-slip pad 1; 104, lower clamping plate; 104a, height-adjusting rectangular slide; 105, cylinder; 106, elliptical plate;

[0033] 2. Positioning mechanism for patch electronic components;

[0034] 201, height adjustment slider; 201a, horizontal distance adjustment chute; 201b, height adjustment limiter; 202, telescopic assembly; 202a, telescopic rod 1; 202b, telescopic rod 2; 202c, telescopic rod 3; 202d, telescopic rod 4; 203, positioning block; 204, anti-slip pad 2; 205, telescopic limiter;

[0035] 3. Angle adjustment mechanism;

[0036] 301, support plate; 301a, limiting hole; 302, connecting block; 303, rotating shaft; 304, angle adjustment rod;

[0037] 4. Circuit board; 401. Solder pad; 5. Chip capacitor; 501. Soldering part. DETAILED DESCRIPTION

[0038] The present invention will be further described below in conjunction with the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present invention and are not intended to limit the scope of protection of the present invention.

[0039] In the description of the present invention, it should be understood that the terms "center," "upper," "lower," "front," "back," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, indicating positions or relationships, are based on the positions or relationships shown in the accompanying drawings and are intended solely to facilitate the description of the present invention and simplify the description. They do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention. Furthermore, in the description of the present invention, unless otherwise specified, "plurality" means two or more.

[0040] In the description of this utility model, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections, electrical connections; direct connections, indirect connections through an intermediate medium, and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on specific circumstances.

[0041] refer to Figure 1-Figure 7 , this embodiment provides an assembly fixture for electrical components, including a circuit board clamping mechanism 1, a patch electronic component positioning mechanism 2 and an angle adjustment mechanism 3;

[0042] The circuit board clamping mechanism 1 includes an assembly plate 101, an installation side plate 102, an upper clamping plate 103 and a lower clamping plate 104. The installation side plate 102 is vertically installed on the top of the assembly plate 101, and a cylinder 105 is installed at the center of the side of the installation side plate 102. The output end of the cylinder 105 is connected to the upper clamping plate 103. The upper clamping plate 103 contacts the upper surface of the assembly plate 101. The lower clamping plate 104 is vertically installed at the bottom of the assembly plate 101.

[0043] In order to help dissipate the heat generated by the circuit board during the processing and prevent overheating from affecting component performance or welding quality, in this embodiment, the assembly board 101 is further provided with a plurality of heat dissipation holes 101a, and shaft 101b is installed on the heat dissipation holes 101a near both sides of the assembly board 101.

[0044] It should be noted that the heat dissipation holes 101 a are not regular. In this embodiment, the heat dissipation holes 101 a include a plurality of circular holes and a plurality of irregular rectangular long holes.

[0045] The patch electronic component positioning mechanism 2 includes a height adjustment slider 201, a telescopic assembly 202, and a positioning block 203. The height adjustment slider 201 is movably connected to the height adjustment rectangular slot 104a of the lower clamping plate 104, and a horizontal distance adjustment slot 201a is provided on the side of the height adjustment slider 201 near the top. One end of the telescopic assembly 202 is horizontally slidably connected to the horizontal distance adjustment slot 201a, and the other end is connected to the positioning block 203.

[0046] The angle adjustment mechanism 3 is connected to the circuit board clamping mechanism 1 and is used to adjust the assembly angle of the assembly plate 101 .

[0047] Further, the angle adjusting mechanism 3 comprises a support plate 301 and a pair of angle adjusting rods 304; a pair of connecting blocks 302 are connected to one side of the support plate 301 close to the lower clamping plate 104, the connecting blocks 302 are rotationally connected with the assembly plate 101 through a rotating shaft 303, the rotating shaft 303 is installed inside the bottom end of the assembly plate 101, one end of the angle adjusting rod 304 is rotationally connected with the assembly plate 101 through a shaft 101b, and the other end is clamped in a limiting hole 301a of the support plate 301, and the limiting hole 301a is provided with a plurality of limiting holes.

[0048] It should be noted that the limiting hole 301a has two groups, which are symmetrically arranged on both sides of the support plate 301.

[0049] Preferably, the telescopic assembly 202 comprises telescopic rod one 202a, telescopic rod two 202b, telescopic rod three 202c and telescopic rod four 202d which are sequentially sleeved, and the telescopic connecting parts of the telescopic assembly 202 are all provided with telescopic limiting pieces 205 to prevent overextension and disconnection, the non-telescopic end of the telescopic rod one 202a is slidingly connected with the horizontal distance adjusting sliding groove 201a, and the non-telescopic end of the telescopic rod four 202d is connected with the positioning block 203.

[0050] It should be noted that in this embodiment, the telescopic assembly 202 is closely sleeved inside, and the friction generated therebetween is sufficient to fix the position of the patch electronic component, so no additional telescopic locking mechanism is provided here.

[0051] Further, in order to prevent the height adjusting slider 201 from disengaging from the sliding groove due to excessive adjustment, the bottom of the height adjusting slider 201 is further provided with a height adjusting limiting piece 201b to prevent the height adjusting slider 201 from disengaging from the groove due to excessive height adjustment, which ensures the safety and stability of the height adjusting slider 201.

[0052] In order to increase the friction with the side of the circuit board and prevent the circuit board from sliding during assembly, in this embodiment, the circuit board clamping mechanism 1 further comprises an anti-skid pad one 103a, which is arranged on the side of the upper clamping plate 103 close to the lower clamping plate 104.

[0053] Similarly, in order to increase the friction with the patch electronic component and ensure the stability of the patch electronic component during assembly, in this embodiment, the patch electronic component positioning mechanism 2 further comprises an anti-skid pad two 204, which is arranged on the side of the positioning block 203 close to the upper clamping plate 103.

[0054] In order to increase the contact area between the output end of the cylinder 105 and the upper clamping plate 103 , an elliptical plate 106 is further connected to the periphery of the piston rod of the cylinder 105 , and the elliptical plate 106 is connected to the upper clamping plate 103 .

[0055] Working principle: Reference Figure 6 and Figure 7 When in use, first adjust the angle adjustment mechanism 3 to a suitable assembly angle according to needs, place the circuit board 4 to be assembled on the assembly plate 101, and one side of the circuit board 4 to be assembled abuts against the lower clamping plate 104; then, according to the size of the circuit board 4 to be assembled, use the cylinder 105 to make the anti-slip pad 103a connected to the upper clamping plate 103 abut against the other side of the circuit board 4 to be assembled; after the circuit board 4 to be assembled is clamped and fixed, first adjust the height of the height adjustment slider 201 and the telescopic component 202 (at this time the telescopic component 202 has not yet adjusted the telescopic length) according to the thickness of the circuit board 4 to be assembled, until the height adjustment slider 201 and the telescopic component 202 (at this time the telescopic component 202 has not yet adjusted the telescopic length) are in contact with the surface of the circuit board 4 to be assembled, and then find the position of the patch electronic components to be soldered and assembled, first move the telescopic component 202 horizontally (at this time the telescopic component 202 has not yet adjusted the telescopic length) to adjust the height of the height adjustment slider 201 and the telescopic component 202 The telescopic assembly 202 is adjusted to position the chip electronic component to be assembled and welded in the X direction, and then the chip electronic component to be assembled and welded is positioned in the Y direction by adjusting the length of the telescopic assembly 202. After accurate positioning, one of the welding parts 501 of the chip electronic component to be assembled and welded (such as the chip capacitor 4) is placed on the anti-slip pad 204 connected to the positioning block 203. Since the assembly board 101 is in an inclined state and the chip capacitor 5 itself is too small in size and mass, the telescopic assembly 202 will not move again at this time. After the chip electronic component to be assembled and welded is accurately positioned, the staff first connects the other exposed welding part 501 of the chip electronic component to be assembled and welded to the welding pad 401 of the circuit board 4. After welding is completed and the chip electronic component to be assembled and welded has been fixed, the telescopic assembly 202 is shortened, and then the other welding part of the chip electronic component to be assembled and welded is connected to the welding pad of the circuit board. If the chip electronic component to be soldered and assembled is located near the bottom of the circuit board 4 to be assembled (i.e., the Y value of the chip electronic component to be soldered and assembled is less than the length of the telescopic component 202, and positioning cannot be achieved), the circuit board 4 to be assembled is changed in direction so that the component near the bottom of the circuit board 4 to be assembled is at the top, and then positioning is performed.

[0056] It should be noted that the bottom of the positioning block 203 and the bottom of the telescopic assembly 202 should be at the same horizontal position, so that the chip electronic components to be soldered and assembled can fit perfectly with the upper surface of the circuit board to be assembled.

[0057] The above merely is the preferred implementation manner of the present application, and it should be noted that, for the ordinary skilled in the art, without departing from the technical principles of the present application, a number of improvements and deformations can be made, and these improvements and deformations should also be considered as the protection scope of the present application.

Claims

1. An assembly fixture for electrical components, characterized in that: It comprises a circuit board clamping mechanism (1), a patch electronic component positioning mechanism (2) and an angle adjustment mechanism (3); The circuit board clamping mechanism (1) comprises an assembly plate (101), an installation side plate (102), an upper clamping plate (103) and a lower clamping plate (104), wherein the installation side plate (102) is vertically installed on the top of the assembly plate (101), and a cylinder (105) is installed at the center of the side of the installation side plate (102), the output end of the cylinder (105) is connected to the upper clamping plate (103), the upper clamping plate (103) contacts the upper surface of the assembly plate (101), and the lower clamping plate (104) is vertically installed on the bottom of the assembly plate (101); The patch electronic component positioning mechanism (2) comprises a height adjustment slider (201), a telescopic assembly (202) and a positioning block (203); the height adjustment slider (201) is movably connected to the height adjustment rectangular chute (104a) of the lower clamping plate (104), and a horizontal distance adjustment chute (201a) is provided on the side of the height adjustment slider (201) near the top; one end of the telescopic assembly (202) is horizontally slidably connected to the horizontal distance adjustment chute (201a), and the other end is connected to the positioning block (203); The angle adjustment mechanism (3) is connected to the circuit board clamping mechanism (1) and is used to adjust the assembly angle of the assembly plate (101).

2. The assembly fixture for electrical components according to claim 1, characterized in that: The telescopic assembly (202) comprises a telescopic rod 1 (202a), a telescopic rod 2 (202b), a telescopic rod 3 (202c) and a telescopic rod 4 (202d) which are connected in sequence, and a telescopic limiter (205) is provided at the telescopic connection of the telescopic assembly (202) to prevent disengagement due to excessive extension. The non-telescopic end of the telescopic rod 1 (202a) is slidably connected to the horizontal distance adjustment slot (201a), and the non-telescopic end of the telescopic rod 4 (202d) is connected to the positioning block (203).

3. The assembly fixture for electrical components according to claim 1, characterized in that: The assembly plate (101) is provided with a plurality of heat dissipation holes (101a), and shaft one (101b) is installed on the heat dissipation holes (101a) close to both sides of the assembly plate (101).

4. The assembly fixture for electrical components according to claim 3, characterized in that: The angle adjustment mechanism (3) comprises a support plate (301) and a pair of angle adjustment rods (304); a pair of connecting blocks (302) are connected to one side of the support plate (301) close to the lower clamping plate (104); the connecting blocks (302) are rotatably connected to the assembly plate (101) via a rotating shaft (303); one end of the angle adjustment rod (304) is rotatably connected to the assembly plate (101) via a shaft (101b), and the other end is engaged in a limiting hole (301a) of the support plate (301); and a plurality of limiting holes (301a) are provided.

5. The assembly fixture for electrical components according to claim 1, characterized in that: The bottom of the height adjustment slider (201) is also provided with a height adjustment limiter (201b) for preventing the height adjustment slider (201) from being out of the groove due to excessive height adjustment.

6. The assembly fixture for electrical components according to claim 1, characterized in that: The circuit board clamping mechanism (1) further comprises an anti-skid pad (103a), and the anti-skid pad (103a) is arranged on the side of the upper clamping plate (103) close to the lower clamping plate (104).

7. The assembly fixture for electrical components according to claim 1, characterized in that: The chip electronic component positioning mechanism (2) further comprises a second anti-skid pad (204), and the second anti-skid pad (204) is arranged on the side of the positioning block (203) close to the upper clamping plate (103).

8. The assembly fixture for electrical components according to claim 1, characterized in that: The periphery of the piston rod of the cylinder (105) is further connected to an elliptical plate (106), and the elliptical plate (106) is connected to the upper clamping plate (103).

Images