Heat dissipation device of power equipment and photovoltaic inverter

Abstract

The utility model discloses a heat radiation device of power equipment and a photovoltaic inverter, the heat radiation device comprises a main heat radiator, and is characterized in that the heat radiation device also comprises a refrigerator and a fan; the refrigerator is arranged between the main radiator and the fan so that cold air generated when the refrigerator works can be blown to the main radiator through the fan. The heat dissipation device provided by the utility model has a good heat dissipation effect.

Description

Technical Field

[0001] The utility model belongs to the field of electric power equipment, and in particular relates to a heat dissipation device for power equipment and a photovoltaic inverter. Background Art

[0002] Power equipment generates heat during operation, which needs to be dissipated promptly to prevent it from affecting its lifespan and efficiency. Currently, power equipment typically dissipates heat through natural convection or forced convection via fans. Both methods are significantly affected by ambient temperature. Using fans to direct ambient air into the radiator for cooling is limited in effectiveness and is less effective when the external ambient temperature is high. Furthermore, natural heat dissipation is slow, impacting heat dissipation. Utility Model Content

[0003] In order to solve the above technical problems, the utility model provides a heat dissipation device for power equipment and a photovoltaic inverter, which can effectively dissipate heat for the power equipment.

[0004] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0005] A heat dissipation device for a power device includes a main radiator, a cooler and a fan. The cooler is arranged between the main radiator and the fan so that the cool air generated by the cooler when working is blown toward the main radiator through the fan.

[0006] In a preferred embodiment, the refrigerator includes a semiconductor refrigeration plate, a side where a cold end of the semiconductor refrigeration plate is located forms a refrigeration area, and the fan is arranged facing the refrigeration area.

[0007] In a preferred embodiment, the heat dissipation device further includes an auxiliary heat sink, and the auxiliary heat sink is arranged in the area where the hot end of the semiconductor refrigeration plate is located.

[0008] In a preferred embodiment, the auxiliary heat sink includes an auxiliary heat sink connected to the hot end of the semiconductor refrigeration chip, and the auxiliary heat sink is used to dissipate heat generated by the semiconductor refrigeration chip during operation.

[0009] In a preferred embodiment, the refrigerator includes two groups of semiconductor refrigeration plates, the two groups of semiconductor refrigeration plates are arranged opposite to each other and at intervals, and the cooling area is the area between the two groups of semiconductor refrigeration plates.

[0010] In a preferred embodiment, the refrigerator includes a cold-temperature conductive member disposed in the refrigeration area, and the cold-temperature conductive member is connected to the cold end of the semiconductor refrigeration plate.

[0011] In a more preferred embodiment, there are multiple cold-temperature conduction parts, and the multiple cold-temperature conduction parts are arranged at intervals, and cold air channels for air circulation are formed between adjacent cold-temperature conduction parts, and the cold air channels are opposite to the fan or connected to the air outlet of the fan.

[0012] In a more preferred embodiment, the cold-temperature conducting member includes a first substrate and a first heat dissipating fin arranged on the first substrate, the first substrate is provided with a groove for accommodating the semiconductor refrigeration plate, and the cold end of the semiconductor refrigeration plate faces the first substrate.

[0013] In a preferred embodiment, the heat dissipation device also includes a controller and a temperature sensor for detecting the temperature of the area where the main radiator is located. The temperature sensor is electrically connected to the input end of the controller, and the control end of the controller is connected to the semiconductor refrigeration plate to power the semiconductor refrigeration plate or to connect the semiconductor refrigeration plate and the power supply.

[0014] The utility model also adopts the following technical solutions:

[0015] A photovoltaic inverter comprises the above-mentioned heat dissipation device.

[0016] The present invention adopts the above solution, which has the following advantages compared with the prior art:

[0017] In the heat dissipation device of the present invention, the cooler is arranged between the fan and the main radiator. When the temperature of the power equipment reaches a certain value, the cooler starts to work. When the cooler works, cold air is generated. The fan blows the cold air to the cold air between the coolers and cools the main radiator. The temperature of the main radiator can be reduced quickly to dissipate heat for the components under the main radiator, and the heat dissipation effect of the power equipment is better. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solution of the present invention, the following is a brief introduction to the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0019] Figure 1 is a schematic diagram of a photovoltaic inverter according to an embodiment of the present utility model;

[0020] Figure 2 is a schematic diagram of a refrigerator according to an embodiment of the present invention;

[0021] Figure 3 is another schematic diagram of a refrigerator according to an embodiment of the present utility model;

[0022] Figure 4 2 is another schematic diagram of a refrigerator according to an embodiment of the present invention.

[0023] in,

[0024] 1. Photovoltaic inverter;

[0025] 11. Box; 12. Inductor box; 131. Fan; 132. Main radiator; 133. Refrigerator;

[0026] 2. First heat dissipation fin; 21. Cold air channel; 3. Auxiliary heat sink; 31. Auxiliary heat sink; 4. Third heat dissipation fin; 41. First heat dissipation channel; 5. Semiconductor cooling plate; 51. Hot end; 6. First substrate; 61. Groove; 62. Wire duct; 7. Second substrate; 8. Temperature sensor. DETAILED DESCRIPTION

[0027] The following describes in detail preferred embodiments of the present invention in conjunction with the accompanying drawings to make the advantages and features of the present invention more easily understood by those skilled in the art. It should be noted that the description of these embodiments is intended to facilitate understanding of the present invention and does not constitute a limitation of the present invention. In addition, the technical features involved in the various embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.

[0028] Reference Figures 1 to 4 As shown, this embodiment provides a heat dissipation device for a power device, specifically a photovoltaic inverter 1. The photovoltaic inverter 1 includes a housing 11, power components located within the housing 11, a main heat sink 132, and an inductor box 12 located on the housing 11. The main heat sink 132 primarily dissipates heat from the power components, while the inductor box 12 itself is provided with heat dissipation fins to dissipate heat from the inductor within the inductor box 12.

[0029] Further, refer to Figure 1 As shown, the heat dissipation device also includes a fan 131 and a cooler 133. The cooler 133 is located between the fan 131 and the main radiator 132 so that the cold air generated when the cooler 133 is working is blown to the main radiator 132 through the fan 131. Specifically, the air outlet of the fan 1311 is facing the cooler 133 or the main radiator 132. When the fan 1311 is turned on, the fan 1311 blows the cold air from the outside to the cooler 133 or the main radiator 132 to promote air flow and improve the heat dissipation efficiency.

[0030] Combine Figures 2 to 4As shown, the refrigerator 133 includes a heat transfer element, an auxiliary heat sink 3, and a semiconductor cooling plate 5 disposed between the heat transfer element and the auxiliary heat sink 3. The cold end of the semiconductor cooling plate 5 forms a cooling area, and the fan 131 is positioned directly opposite the cooling area. The heat transfer element is connected to the cold end of the semiconductor cooling plate 5, and the auxiliary heat sink 3 is disposed in the area where the hot end of the semiconductor cooling plate 5 is located. The auxiliary heat sink 3 is used to dissipate heat generated by the operation of the semiconductor cooling plate 5.

[0031] Furthermore, the refrigerator 133 includes two sets of semiconductor cooling fins 5, which are arranged opposite each other and spaced apart. The cooling area is the area between the two sets of semiconductor cooling fins 5. There are multiple cold-temperature conductive members, which are spaced apart. A cold air channel 21 for air circulation is formed between adjacent cold-temperature conductive members. The cold air channel 21 is directly opposite the fan 131 or is connected to the air outlet of the fan 131.

[0032] The heat transfer element includes a first substrate 6 and first heat sink fins 2 disposed on the first substrate 6. The first substrate 6 is provided with a groove 61 for accommodating a semiconductor cooling fin 5, with the cold end of the semiconductor cooling fin 5 facing the first substrate 6. The auxiliary heat sink 3 includes a second substrate 7 and auxiliary heat sink fins 31 disposed on the second substrate 7. The cold end of the semiconductor cooling fin 133 faces the first heat sink fin 2, and the hot end 51 of the semiconductor cooling fin 133 faces the second substrate 7 of the auxiliary heat sink 3.

[0033] Specifically, before placing the semiconductor refrigeration chip 5 on the groove 61, thermal grease is applied to both the cold end and the hot end 51, and then placed into the groove 61. The thermal grease has high thermal conductivity and excellent thermal conductivity. The first substrate 6 and the second substrate 7 are fixedly connected by fasteners, and the semiconductor refrigeration chip 5 is clamped between the first substrate 6 and the second substrate 7. The fixed connection between the first substrate 6 and the second substrate 7 prevents the semiconductor refrigeration chip 5 from falling out of the groove 61 easily, and the semiconductor refrigeration chip 5 can be in close contact with the first substrate 6 and the second substrate 7. The semiconductor refrigeration chip 5 needs to be powered when working. In this embodiment, a plurality of wire grooves 61 are also provided on the first substrate 6. The wire grooves 61 can accommodate cables used to electrically connect the semiconductor refrigeration chip 5 to the photovoltaic inverter.

[0034] Reference Figure 1 As shown, the auxiliary radiator 3 is located at the front and rear sides of the first heat dissipation fin 2 , and the cold air channel 21 and the heat dissipation channel formed by the two adjacent auxiliary heat dissipation fins 31 have the same direction.

[0035] The main heat sink 132 has third heat dissipation fins 4, two adjacent third heat dissipation fins 4 form a first heat dissipation channel 41, and the included angle between the first heat dissipation channel 41 and the cold air channel 21 is greater than 0 and less than or equal to 90 degrees. Specifically, the included angle between the first heat dissipation channel 41 and the cold air channel 21 is equal to 90 degrees. When the fan 1311 is started, cold air can flow from the cold air channel 21 into the first heat dissipation channel 41 to dissipate heat for the power components of the photovoltaic inverter 1.

[0036] The photovoltaic inverter 1 further comprises a controller and a temperature sensor 8 for detecting the temperature of the area where the main heat sink 132 is located, and the temperature sensor 8 is arranged at the first heat dissipation channel 41. Specifically, the first heat dissipation channel 41 has a head end and a tail end, and in this embodiment, the side closer to the fan 1311 is the head end, and the side farther away from the fan 1311 is the tail end. The temperature sensor 8 is arranged at the tail end of the first heat dissipation channel 41. The temperature sensor 8 and the input end of the controller are electrically connected, and the control end of the controller is connected with the semiconductor refrigeration piece 5 to supply power to the semiconductor refrigeration piece 5 or turn on the semiconductor refrigeration piece 5 and the power supply.

[0037] Further, when the temperature sensor 8 has a first temperature detection value at the tail end of the first heat dissipation channel 41, the refrigerator 133 is not started; when the temperature sensor 8 has a second temperature detection value at the tail end of the first heat dissipation channel 41, the controller controls the refrigerator 133 to start, and the first heat dissipation fin 2 is lower than the temperature of the auxiliary heat sink 31 or the third heat dissipation fin 4, wherein the second temperature detection value is greater than the first temperature detection value, that is, when the temperature sensor 8 displays the second temperature detection value, the temperature is high and the semiconductor refrigeration piece 5 is needed for cooling, when the temperature sensor 8 detects the second temperature detection value, the fan 131, the main heat sink 132 and the refrigerator 133 are all working.

[0038] In order to ensure good heat dissipation effect, the height of the fan 131 is not less than that of the refrigerator 133, which ensures that the refrigerator 133 is in the air outlet area of the fan 131, and ensures good heat dissipation effect; the height of the refrigerator 133 is not less than that of the main heat sink 132, and the length of the main heat sink 132 in the first direction is less than or equal to that of the refrigerator 133, which can ensure that the cold air from the refrigerator 133 can cover the main heat sink 132, and further dissipate heat for the main heat sink 132. Here, "height" refers to the up-down direction shown in the figure, and "first direction" refers to the front-back direction shown in the figure. Figure 1 Figure 1

[0039] ​​The main radiator 132 of the present invention conducts heat from the inside of the photovoltaic inverter 1. When the temperature of the wind flow at the tail of the main radiator 132 reaches the first temperature detection value, the fan 1311 is started to blow the wind flow at the ambient temperature into the main radiator 132, so that the temperature of the third heat dissipation fin 4 of the main radiator 132 is reduced, and the temperature of the photovoltaic inverter 1 is reduced; when the temperature of the wind flow at the tail of the main radiator 132 reaches the second temperature detection value, the refrigerator 133 is started, the semiconductor refrigeration plate 5 starts to work and transfers the cold temperature to the first heat dissipation fin 2, when the wind flow of the fan 1311 of the fan module 131 passes through the first heat dissipation fin 2 to form cold wind and then blows the cold wind into the main radiator 132, it is ensured that the wind flow blown into the main radiator 132 is in a low temperature state, thereby achieving the cooling of the power components inside the photovoltaic inverter 1. At the same time, the cold wind will also blow to the heat dissipation fins on the inductor box 12 and have a good heat dissipation effect on the inductor in the inductor box.

[0040] As used in this specification and claims, the terms "comprises" and "include" merely indicate the inclusion of the steps and elements specifically identified, and these steps and elements do not constitute an exclusive list; a method or apparatus may also include other steps or elements. The term "and / or" as used herein includes any combination of one or more of the associated listed items.

[0041] It should be noted that, unless otherwise specified, when a feature is referred to as being "fixed" or "connected" to another feature, it may be directly fixed or connected to the other feature or indirectly fixed or connected to the other feature. In addition, the terms "upper," "lower," "left," and "right" used in this utility model are only used with respect to the relative positions of the components of the utility model in the accompanying drawings.

[0042] The above embodiment is intended only to illustrate the technical concept and features of the present invention and is a preferred embodiment. Its purpose is to enable those familiar with the art to understand the content of the present invention and implement it accordingly. It is not intended to limit the scope of protection of the present invention. Any equivalent changes or modifications made based on the principles of the present invention shall be included in the scope of protection of the present invention.

Claims

1. A heat dissipation device for a power device, comprising a main heat sink, characterized in that: The heat dissipation device further includes a refrigerator and a fan. The refrigerator is arranged between the main radiator and the fan so that the cool air generated by the refrigerator when it is working is blown toward the main radiator through the fan.

2. The heat dissipation device according to claim 1, characterized in that: The refrigerator includes a semiconductor refrigeration plate, a side where a cold end of the semiconductor refrigeration plate is located forms a refrigeration area, and the fan is arranged facing the refrigeration area.

3. The heat dissipation device according to claim 2, characterized in that: The heat dissipation device further includes an auxiliary heat sink, which is arranged in the area where the hot end of the semiconductor refrigeration plate is located.

4. The heat dissipation device according to claim 3, characterized in that: The auxiliary heat sink includes an auxiliary heat sink connected to the hot end of the semiconductor refrigeration plate.

5. The heat dissipation device according to claim 2, characterized in that: The refrigerator comprises two groups of semiconductor refrigeration plates, which are arranged opposite to each other and spaced apart. The cooling area is the area between the two groups of semiconductor refrigeration plates.

6. The heat dissipation device according to claim 2 or 5, characterized in that: The refrigerator includes a cold-temperature conducting member arranged in the refrigeration area, and the cold-temperature conducting member is connected to the cold end of the semiconductor refrigeration plate.

7. The heat dissipation device according to claim 6, characterized in that: There are multiple cold-temperature conduction members, which are arranged at intervals. Cold air channels for air circulation are formed between adjacent cold-temperature conduction members. The cold air channels are directly opposite to the fan or connected to the air outlet of the fan.

8. The heat dissipation device according to claim 7, characterized in that: The cold-temperature conducting member includes a first substrate and a first heat dissipating fin arranged on the first substrate. The first substrate is provided with a groove for accommodating the semiconductor refrigeration plate, and the cold end of the semiconductor refrigeration plate faces the first substrate.

9. The heat dissipation device according to claim 8, characterized in that: The heat dissipation device also includes a controller and a temperature sensor for detecting the temperature of the area where the main radiator is located. The temperature sensor is electrically connected to the input end of the controller, and the control end of the controller is connected to the semiconductor refrigeration plate to power the semiconductor refrigeration plate or connect the semiconductor refrigeration plate to the power supply.

10. A photovoltaic inverter comprising the heat dissipation device according to any one of claims 1 to 9.

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