Drying tank for silicon wafers
By designing a silicon wafer drying tank with moving tracks and drive parts, the interference problem between the robotic arm and the drying tank door was solved, achieving efficient silicon wafer production, reducing energy consumption and increasing production capacity.
Patent Information
- Application Number
- CN202422845489.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-21
- Publication Date
- 2025-10-14
- Estimated Expiration
- 2034-11-21
AI Technical Summary
The existing silicon wafer drying tank door interferes with the movement direction of the robotic arm, causing the door to be open for too long, resulting in internal temperature drop problems and unable to meet the needs of efficient production.
A silicon wafer drying tank with a movable track and drive parts is designed. The sealed door is driven to move and open horizontally by a bidirectional screw, realizing the synchronous operation of the robotic arm and the sealed door to avoid interference. The hot air pipe and the fixed frame cooperate to reduce heat loss.
The simultaneous operation of the robotic arm and the sealing door is achieved, which reduces the risk of temperature drop in the drying tank, shortens the door opening and closing time, reduces energy consumption, and improves production efficiency.
Smart Images
Figure CN223435435U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of silicon wafer production, especially to the drying groove for silicon wafer. BACKGROUND
[0002] The silicon wafer needs to be dried by the drying groove after being washed by the cleaning machine in the production process, and the mechanical arm moves between the cleaning machine and the drying groove to take and place the material, but the door of the existing drying groove is perpendicular to the running direction of the mechanical arm, so it will interfere with the moving mechanical arm, and in order to avoid collision, the door of the drying groove needs to be completely opened before the mechanical arm moves, which will cause the door to be opened for too long and cause the internal temperature to drop, thus failing to meet the use requirement. Figure 1 UTILITY MODEL CONTENT
[0003] The utility model provides the following technical scheme in view of the deficiency of prior art.
[0004] The drying groove for silicon wafer, including the groove body, the hot air pipe is arranged in the groove body, the opening for the silicon wafer to go in or out is set up at the top of the groove body, the moving rail no.
[0005] As the improvement of the above technical scheme, the air outlet piece includes a fixed frame embedded in the moving rail no.
[0006] As the improvement of the above technical scheme, the driving part includes a bidirectional screw rod rotatably arranged on the moving rail no.
[0007] As the improvement of the above technical scheme, the length of the fixed frame is equal to the length of the opening.
[0008] As the improvement of the above technical scheme, the sealing door is provided with a sealing rubber strip.
[0009] The utility model has the advantages of the following:
[0010] The two groups of sealing doors are driven by the driving member to move in the direction away from each other, so that the sealing doors are opened in translation, the opening on the groove body is exposed, the horizontal movement of the mechanical arm and the opening movement of the sealing door on the drying groove can be simultaneously performed, and mutual interference does not occur, so that the mechanical arm is horizontally moved to the position and the sealing door is opened to the position at the same time, the mechanical arm directly takes and places the material, the problem of internal temperature drop caused by too long opening time of the drying groove door is avoided, so that the energy consumption of the drying groove heating can be reduced, the opening and closing door mechanical action time of the drying groove is reduced, the process time can be effectively reduced, and the production capacity of the silicon wafer production is improved. BRIEF DESCRIPTION OF DRAWINGS
[0011] Figure 1 It is a structural schematic diagram of the prior art
[0012] Figure 2 It is a whole structure top view of the utility model.
[0013] Figure 3 It is an internal structure schematic diagram of the moving rail one.
[0014] Figure 4 It is an internal structure schematic diagram of the moving rail two.
[0015] The drawings show that: 10, groove; 11, opening; 12, hot air pipe; 20, moving rail one; 21, air outlet hole; 22, fixed frame; 23, connecting pipe; 30, moving rail two; 31, bidirectional screw; 32, threaded sleeve; 33, motor; 40, sealing door. DETAILED DESCRIPTION
[0016] In order to make the purpose, technical scheme and advantages of the utility model more clear and obvious, the utility model is further described in detail below by combining with the drawings and examples. It should be understood that the specific examples described herein are only used to explain the utility model, and are not used to limit the utility model.
[0017] The drying groove for silicon wafer comprises a groove body 10, a hot air pipe 12 arranged in the groove body 10, an opening 11 arranged on the top of the groove body 10 for the silicon wafer to go in and out, a moving rail one 20 and a moving rail two 30 arranged on the top of the groove body 10 and on both sides of the opening 11, two groups of sealing doors 40 arranged between the moving rail one 20 and the moving rail two 30 and moving towards opposite directions or moving towards opposite directions, an air outlet arranged on the moving rail one 20 and communicated with the hot air pipe 12, a driving part arranged on the moving rail two 30 and moving the two groups of sealing doors 40 to seal or open the opening 11, the driving part comprising a bidirectional screw rod 31 rotatably arranged on the moving rail two 30, a threaded sleeve 32 threadedly sleeved on both ends of the bidirectional screw rod 31, the two groups of threaded sleeves 32 being connected with the two groups of sealing doors 40 one by one, and an electric motor 33 arranged on one end of the bidirectional screw rod 31 penetrating through the moving rail two 30 and electrically connected with an ultrasonic sensor 50.
[0018] With reference to Figure 2 and Figure 4 When the mechanical arm moves from above the groove body 10, the electric motor 33 is started, the electric motor 33 drives the bidirectional screw rod 31 to rotate, the bidirectional screw rod 31 drives the two groups of sealing doors 40 to move towards the direction away from each other through the threaded sleeves 32, the two groups of sealing doors 40 are opened by translation, the opening 11 on the groove body 10 is exposed, the horizontal movement of the mechanical arm and the opening of the sealing door 40 on the drying groove can be carried out at the same time, the mechanical arm is directly taken and placed, the problem of internal temperature drop caused by the opening of the drying groove door for too long is avoided, the drying process temperature is reduced from 92℃ to 88℃, thereby the problem of energy consumption of the drying groove heating can be reduced, at the same time, the mechanical action time of the opening and closing of the drying groove door is reduced by 3s, the process time can be effectively reduced, the production capacity of the silicon wafer production is improved, and the annual production capacity contribution is: 0.0354*11*8*60*12=2243.
[0019] In one embodiment, with reference to Figure 2 and Figure 3 The air outlet comprises a fixed frame 22 embedded on the moving rail one, an air outlet hole 21 is arranged on the fixed frame 22 for the gas to flow out, and the fixed frame 22 is communicated with the hot air pipe 12 through a connecting pipe 23.
[0020] Specifically, the position of the fixed frame 22 corresponds to the position of the opening 11, and the hot air pipe 12 passes hot air into the tank body 10 to dry the silicon wafers in the tank body 10. When the two sets of sealed doors 40 move away from each other along the movable rail 1 20 and the movable rail 2 30, the number of air outlet holes 21 opened is opened one by one as the sealed door 40 moves, so that the hot air flows out through the air outlet holes 21, so that the part exposed by the opening 11 can form an air curtain, which can isolate the air flow inside and outside the tank body 10, reduce the heat loss in the tank body 10, and reduce the energy consumption of heating production capacity. When the two sets of sealed doors 40 move toward each other, the sealed door 40 seals the air outlet holes 21, so that all the hot air in the hot air pipe 12 enters the tank body 10, avoiding heat loss.
[0021] In one embodiment, reference Figure 3 The length of the fixing frame 22 is equal to the length of the opening 11 . When the opening 11 is fully opened, the gas flowing out of the air outlet 21 on the fixing frame 22 can completely block the opening 11 .
[0022] In order to improve the sealing effect, a sealing strip is provided on the sealing door 40 .
[0023] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same.
Claims
1. A drying tank for silicon wafers, characterized in that: The invention comprises a trough body (10), wherein a hot air pipe (12) is arranged in the trough body (10), an opening (11) for silicon wafers to enter and exit is opened at the top of the trough body (10), a movable rail 1 (20) and a movable rail 2 (30) are respectively arranged at the top of the trough body (10) and on both sides of the opening (11), two groups of sealing doors (40) that move in opposite directions or in reverse directions are arranged between the movable rail 1 (20) and the movable rail 2 (30), an air outlet member is arranged on the movable rail 1 (20), and the air outlet member is connected to the hot air pipe (12), and a driving member is arranged on the movable rail 2 (30), and the driving member drives the two groups of sealing doors (40) to move to seal or open the opening (11).
2. The silicon wafer drying tank according to claim 1, wherein: The air outlet member comprises a fixed frame (22) embedded in the movable rail, the fixed frame (22) is provided with an air outlet hole (21) for gas to flow out, and the fixed frame (22) is connected to the hot air pipe (12) through a connecting pipe (23).
3. The silicon wafer drying tank according to claim 1, wherein: The driving member includes a bidirectional lead screw (31) rotatably arranged on the second movable rail (30), threaded sleeves (32) are threadedly sleeved on both ends of the bidirectional lead screw (31), two groups of the threaded sleeves (32) are connected to two groups of sealing doors (40) in a one-to-one correspondence, one end of the bidirectional lead screw (31) passes through the second movable rail (30), and a motor (33) is installed on the end of the bidirectional lead screw (31) passing through the second movable rail (30), and the motor (33) is electrically connected to the ultrasonic sensor (50).
4. The silicon wafer drying tank according to claim 2, wherein: The length of the fixing frame (22) is equal to the length of the opening (11).
5. The silicon wafer drying tank according to claim 1, wherein: The sealing door (40) is provided with a sealing strip.