Pre-assembly apparatus for semiconductor device and apparatus for surface mounting
Through the design of the fixture and patch mechanism, the position of the semiconductor device in two directions is restricted, which solves the shortcomings of traditional SMT equipment in high packaging accuracy and high alignment accuracy, and realizes high-precision device positioning and integration.
Patent Information
- Application Number
- CN202422755207.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-12
- Publication Date
- 2025-10-14
- Estimated Expiration
- 2034-11-12
AI Technical Summary
Traditional SMT equipment is difficult to adapt to the high packaging precision and high alignment accuracy requirements of semiconductor devices, especially during the high-temperature reflow soldering process, where positional offsets between components lead to mismatch problems.
By setting the first and second components and the spacer of the fixture, the position of the semiconductor device in at least two directions is limited, the device is accurately positioned and fixed using the patch mechanism, and combined with the use of image acquisition and controller, high-precision pre-assembly is achieved.
It improves the position accuracy between semiconductor devices, reduces device offset during high-temperature reflow soldering, meets the needs of high-density component integration, and improves the placement accuracy of the SMT process.
Smart Images
Figure CN223436495U_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to the field of semiconductor manufacturing, and in particular to a pre-assembly device for semiconductor devices and a device for surface mounting. Background Art
[0002] Surface Mount Technology (SMT) is a technology and process widely used in the electronics assembly industry. It involves mounting leadless or short-lead surface mount components on the surface of a printed circuit board (PCB) or other substrate, and then soldering and assembling them using methods such as reflow soldering.
[0003] With the rapid development of electronic technology, especially the continuous advancement of semiconductor device technology, traditional SMT equipment is facing new challenges, especially the difficulty in adapting to the high packaging precision requirements or high alignment precision requirements of semiconductor devices.
[0004] The approaches described in this section are not necessarily approaches that have been previously conceived or employed. Unless otherwise indicated, it should not be assumed that any approach described in this section is prior art simply by virtue of its inclusion in this section. Similarly, unless otherwise indicated, the issues raised in this section should not be considered as having been recognized in any prior art. Utility Model Content
[0005] The present disclosure aims to solve at least one of the technical problems existing in the background art. To this end, the present disclosure aims to provide a preassembly device for semiconductor devices, which can alleviate or improve the problems in the related art by preassembling semiconductor devices.
[0006] According to a first aspect of an embodiment of the present disclosure, a preassembly device for semiconductor devices is provided. The preassembly device includes a fixture and a patch mechanism. The fixture includes at least one first member and a second member, wherein the at least one first member is used to limit the position of at least one semiconductor device in at least a first direction, and the second member has a first predetermined area for positioning a spacer. The patch mechanism is used to move the spacer to the first predetermined area. At least one side of the spacer is used to limit the position of at least one semiconductor device in at least a second direction, the second direction being different from the first direction and being in the same plane as the first direction.
[0007] According to a second aspect of an embodiment of the present disclosure, there is provided an apparatus for surface mounting, comprising the pre-assembly apparatus for semiconductor devices according to the first aspect.
[0008] By providing the spacer and the first and second members of the fixture, the position of the semiconductor device can be restricted in at least two directions. The pre-assembly equipment for semiconductor devices according to the embodiments of the present disclosure can improve the positioning accuracy between semiconductor devices at a low cost and with a simple process, thereby improving the placement accuracy during the SMT process and accommodating high-density component integration. BRIEF DESCRIPTION OF THE DRAWINGS
[0009] The accompanying drawings illustrate exemplary embodiments and constitute a part of the specification. Together with the description of the specification, they serve to illustrate exemplary implementations of the embodiments. The illustrated embodiments are for illustrative purposes only and do not limit the scope of the claims. Throughout the drawings, the same reference numerals designate the same elements or similar, but not necessarily identical, elements.
[0010] Figure 1 A schematic diagram illustrating a jig used in a pre-assembly device for semiconductor devices according to an embodiment of the present disclosure is shown;
[0011] Figure 2 A schematic diagram showing a jig used in a pre-assembly apparatus for semiconductor devices according to an embodiment of the present disclosure; and
[0012] Figure 3 A schematic diagram showing the mounting of a semiconductor device assembly on a PCB board according to an embodiment of the present disclosure is shown.
[0013] Description of reference numerals:
[0014] 100 clamping fixture, 110, 110a, 110b first component, 120 second component;
[0015] 200 pad, 300, 300a, 300b semiconductor devices;
[0016] X is the first direction, Y is the second direction;
[0017] 10 semiconductor device assemblies, 400 vacuum chambers, 500 PCB boards. DETAILED DESCRIPTION
[0018] The present disclosure is further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are intended only to illustrate the relevant invention and are not intended to limit the invention. Furthermore, it should be noted that for ease of description, only portions relevant to the relevant invention are shown in the accompanying drawings.
[0019] It should be noted that, unless there is a conflict, the embodiments of the present disclosure and the features therein may be combined with each other. Unless the context clearly indicates otherwise, if the number of elements is not specifically limited, the element may be one or more. In addition, the numbering of steps or functional modules used in the present disclosure is only used to identify each step or functional module, and is not used to limit the execution order of each step or the connection relationship between each functional module.
[0020] In this disclosure, unless otherwise specified, the use of terms such as "first," "second," etc. to describe various elements is not intended to limit the positional relationship, temporal relationship, or importance relationship of these elements. Such terms are simply used to distinguish one element from another. In some examples, the first element and the second element may refer to the same instance of the element, while in some cases, based on the context of the description, they may also refer to different instances.
[0021] In this disclosure, the terms used in describing the various examples are for the purpose of describing the specific examples only and are not intended to be limiting. Unless the context clearly indicates otherwise, if the number of elements is not specifically limited, the element may be one or more. In addition, the term "and / or" used in this disclosure encompasses any and all possible combinations of the listed items.
[0022] The basic SMT process consists of silk screen printing, curing (patch), reflow soldering, testing, and packaging. In related technologies, an automatic placement machine is typically used to place the components to be mounted onto PCB pads printed with solder paste. The PCB with mounted components is then passed through a reflow oven, where the solder paste melts and reflows at high temperatures. After cooling, it forms stable solder joints, securing the components to the PCB. However, high-temperature reflow often causes component displacement. Components that were previously positioned in their intended locations may mismatch due to their different offsets, which can affect their functionality.
[0023] For semiconductor devices with high packaging or alignment requirements, the impact of mismatch between devices can be even greater. For example, in the field of LiDAR, optoelectronic devices with micron-level packaging accuracy, such as silicon photomultipliers (SiPMs), are often used in transceiver modules to meet the high-precision coupling and matching requirements between the receiver (Rx) and transmitter (Tx). The alignment reference between these optoelectronic devices is a relatively small aperture or photosensitive surface, so the positional offset caused by high-temperature reflow may cause more severe mismatch for such optoelectronic devices.
[0024] In light of this, the present disclosure proposes a pre-assembly device for semiconductor devices. By providing a spacer and first and second components of a fixture, the position of the semiconductor device can be restricted in at least two directions. The pre-assembly device for semiconductor devices according to embodiments of the present disclosure can improve the positioning accuracy between semiconductor devices at a low cost and using a simple manufacturing process, thereby enhancing placement accuracy during the SMT process and accommodating high-density component integration.
[0025] Figure 1 A schematic diagram of a jig used in a pre-assembly apparatus for semiconductor devices according to an embodiment of the present disclosure is shown.
[0026] The pre-assembly equipment for semiconductor devices disclosed in the present invention includes a fixture 100 and a patch mechanism (not shown in the figure). The fixture 100 includes at least one first member 110 and a second member 120. At least one first member 110 is used to limit the position of at least one semiconductor device 300 in at least a first direction X, and the second member 120 has a first predetermined area for setting a spacer 200. The patch mechanism is used to move the spacer 200 to the first predetermined area. Among them, at least one side of the spacer 200 is used to limit the position of at least one semiconductor device in at least a second direction Y. The second direction Y is different from the first direction X and is in the same plane as the first direction X.
[0027] In an embodiment of the present disclosure, a jig is provided to accurately position a semiconductor device. Figure 1 An example of a jig according to the present disclosure positioning a 2×1 array of semiconductor devices is shown.
[0028] exist Figure 1 In the example shown, the fixture 100 includes two first members 110a and 110b for respectively limiting the positions of semiconductor devices 300a and 300b in the X-direction. In some embodiments, a side surface (e.g., a first side) of each of the semiconductor devices 300a and 300b extending in the Y-direction can be placed against a corresponding side surface of the first members 110a and 110b, thereby limiting the relative position of the semiconductor devices 300a and 300b in the X-direction.
[0029] The second member 120 is disposed between the first members 110a and 110b along the second direction Y and has a first predetermined area for disposing the spacer 200. The first predetermined area may be predetermined according to the array arrangement of the semiconductor device. Figure 1In the example shown, the second member 120 is configured to include a raised portion, and the spacer 200 is located on the raised portion. It should be understood that other configurations are also possible. For example, the second member 120 may also include a groove for defining the first predetermined area. After the spacer 200 is moved to the first predetermined area by the patch mechanism, the position of the semiconductor devices 300a and 300b in the Y direction can be limited. Figure 1 In the example shown, two opposite sides of the spacer 200 respectively abut against corresponding sides (eg, second sides) of the semiconductor devices 300 a and 300 b extending along the X direction, thereby limiting the relative positions of the semiconductor devices 300 a and 300 b in the Y direction.
[0030] It should be understood that the number, position or arrangement of the components in the present disclosure may be adjusted depending on the design requirements of the semiconductor device array. For example, when positioning a 2×2 semiconductor device array, the number of first components in the fixture may be 4, and Figure 1 The second member 120 may be a protrusion having an extended length in the X direction. Accordingly, the spacer 200 also has an extended length in the X direction, so that another group of semiconductor devices can abut against corresponding side surfaces of the spacer along the X direction.
[0031] By providing the spacer and the first and second members of the fixture, the position of the semiconductor device can be restricted in at least two directions, thereby improving the position accuracy between the semiconductor devices.
[0032] In some embodiments, the patch mechanism may include an adsorption head for sucking and placing a pad or semiconductor device. In some embodiments, the patch mechanism also includes a robotic arm connected to the adsorption head for providing the adsorption head with different directions (e.g. Figure 1 The placement mechanism can be configured to move in the X and Y directions shown in FIG, and in the Z direction perpendicular to the plane defined by the X and Y directions. In some embodiments, the placement mechanism further includes a tray, a tape, and a feeder for accommodating and transporting spacers or semiconductor devices. It should be understood that the description of the tray, tape, and feeder is for illustrative purposes only and is not essential for the purposes of this disclosure.
[0033] In some embodiments, the pre-assembly equipment further includes an image collector (not shown in the figure) and a controller (not shown in the figure). The image collector can be, for example, a CCD camera or an automatic optical inspection (AOI) device, which is used to collect images of the pad 200, the first predetermined area, and the semiconductor device 300. The controller is communicatively connected to the image collector and the patch mechanism to analyze and identify the shape, size or position of the pad 200, the first predetermined area, and the semiconductor device 300 acquired by the image collector, and to control the movement of the pad 200 and the semiconductor device 300 based on the above information. Examples of controllers include, but are not limited to, industrial control computers, such as IPC (PC bus industrial computer), PLC (programmable control system), DCS (distributed control system), FCS (field bus system) or CNC (numerical control system).
[0034] In some embodiments, the fixture 100 may include a spacer block fixing device (not shown) for fixing the spacer block 200 in the first predetermined area. Figure 1 and Figure 2 , the second component 120 is provided with a hole in the first predetermined area, and the pad fixing device may include a vacuum machine (not shown in the figure) in fluid communication with the hole. The fixture 100 includes a vacuum chamber 400, which is in fluid communication with the hole and the vacuum machine. The controller first controls the adsorption head of the patch mechanism to absorb the pad 200 and move it to the first predetermined area. When the controller recognizes that the pad 200 is in place based on the image captured by the image collector, it controls the vacuum machine to start suction and controls the adsorption head to stop absorbing the pad 200, so that the pad 200 is accurately fixed on the fixture 100.
[0035] In some embodiments, the pre-assembly equipment may further include a glue dispenser (not shown) for dispensing glue on at least one side of the spacer 200 to fix the at least one semiconductor device 300 to the corresponding side of the spacer 200. Figure 1 and Figure 2 After the spacer 200 is secured to the fixture 100, the controller controls the glue dispenser to apply glue to the two sides of the spacer that are intended to abut against the semiconductor devices 300a and 300b. The controller then controls the suction head to respectively absorb the semiconductor devices 300a and 300b and place them against the corresponding sides of the first components 110a and 110b and the corresponding glue-applied sides of the spacer 200, thereby bonding and securing the semiconductor devices 300a and 300b to the spacer 200, thereby forming the semiconductor device assembly 10.
[0036] The semiconductor devices in the semiconductor device assembly 10 are limited by the fixture 100 and the spacer 200, and the relative positioning accuracy between them can be significantly improved (for example, to the μm level), thereby meeting the high packaging precision or high alignment precision requirements of the semiconductor devices. For example, after the SiPM chip is formed into an assembly using the pre-assembly equipment for semiconductor devices disclosed herein, the consistency of the active coupling between the Rx and Tx ends of the laser radar transceiver module is improved.
[0037] In some embodiments, the pre-assembly equipment further includes a curing machine (not shown) for baking and fixing the bonded spacers 200 and semiconductor devices 300a, 300b in pairs. The curing machine can cure the glue between the bonding spacers 200 and the semiconductor devices 300a, 300b by heating, thereby firmly fixing them. Figure 3 , Figure 3 The schematic diagram shows the semiconductor device assembly 10 as a whole being mounted on a PCB board 500. The cured semiconductor device assembly 10 can further reduce the possibility of different offsets between devices, thereby improving the mismatch between devices caused by high temperature reflow during the SMT process.
[0038] In some embodiments, the chip placement mechanism further includes a film placement machine (not shown) for applying a protective film to the surface of the semiconductor device. Applying a protective film to the surface of the semiconductor device can reduce physical damage or contamination to the device during welding, transportation, or storage. Furthermore, the protective film can also reduce damage to the semiconductor device caused by static electricity in the environment (particularly in a dry environment).
[0039] In some embodiments, the spacer 200 can be made of glass, and the fixture 100 can be made of stainless steel. It should be understood that the materials for the spacer and the fixture can be selected according to actual needs. For example, the spacer can be made of a material compatible with the semiconductor device, while the fixture can be made of a material with high stability.
[0040] The present disclosure also provides a surface mounting device, including the pre-assembly device for semiconductor devices according to any one of the above embodiments.
[0041] Since the surface mounting device includes the pre-assembly device for semiconductor devices according to any of the above embodiments, the surface mounting device has the technical effects of the above pre-assembly device, which will not be described in detail here.
[0042] Some exemplary aspects of the present disclosure are described below:
[0043] Solution 1: A pre-assembly device for a semiconductor device, comprising:
[0044] A clip jig comprising at least one first member for limiting a position of at least one semiconductor device in at least a first direction and a second member having a first predetermined area for disposing a spacer;
[0045] A patch mechanism for moving the spacer to the first predetermined area;
[0046] Wherein at least one side of the spacer is for limiting a position of the at least one semiconductor device in at least a second direction, the second direction being different from the first direction and in the same plane as the first direction.
[0047] Scheme 2, the pre-assembly device according to scheme 1, wherein the pre-assembly device further comprises:
[0048] An image collector configured to collect an image of the spacer and the first predetermined area; and
[0049] A controller communicatively connected with the image collector and the patch mechanism, configured to determine a position of the spacer relative to the first predetermined area based on the image of the spacer and the first predetermined area, and control the patch mechanism to move the spacer to the first predetermined area based on the position.
[0050] Scheme 3, the pre-assembly device according to scheme 2, wherein the patch mechanism is further configured to move the at least one semiconductor device to a respective predetermined position, the image collector is further configured to collect an image of the semiconductor device, and the controller is further configured to control the patch mechanism to move the at least one semiconductor device to a respective predetermined position based on the collected image of the semiconductor device.
[0051] Scheme 4, the pre-assembly device according to any one of schemes 1 to 3, wherein the patch mechanism comprises a suction head and a mechanical arm connected with the suction head.
[0052] Scheme 5, the pre-assembly device according to any one of schemes 1 to 4, wherein the pre-assembly device further comprises:
[0053] A dispensing machine for dispensing glue on the at least one side of the spacer to adhesively fix the at least one semiconductor device with a respective side of the spacer.
[0054] Scheme 6, the pre-assembly device according to scheme 5, wherein the pre-assembly device further comprises a curing machine configured to bake the adhesively fixed spacer and semiconductor device.
[0055] Option 7: The pre-assembly device according to any one of Options 1 to 6, wherein the fixture includes a spacer fixing device for fixing the spacer in the first predetermined area.
[0056] Option 8. The pre-assembly equipment according to Option 7, wherein the second component is provided with a hole in the first predetermined area, and the pad fixing device includes a vacuum machine connected to the fluid of the hole, for adsorbing and fixing the pad in the first predetermined area.
[0057] Option 9. The preassembly device according to Option 8, wherein the fixture includes a vacuum chamber, which is fluidically connected to the hole and the vacuum machine.
[0058] Option 10: The pre-assembly equipment according to any one of Options 1 to 9, wherein the patch mechanism further includes a film mounting machine for mounting a protective film on the surface of the semiconductor device.
[0059] Option 11. The pre-assembled device according to any one of Options 1 to 10, wherein the spacer is made of glass and the fixture is made of stainless steel.
[0060] Option 12: The preassembled device according to any one of options 1 to 11, wherein the semiconductor device is a silicon photomultiplier (SiPM).
[0061] Option 13. A preassembled device according to any one of Options 1 to 12, wherein the semiconductor device includes a first side and a second side, the first side is used to abut against one side of one of the at least one first components, and the second side is used to abut against one side of the at least one side of the spacer.
[0062] Option 14: A pre-assembled device according to any one of Options 1 to 13, characterized in that the semiconductor device includes an optoelectronic chip for a lidar.
[0063] Option 15: A surface mounting device comprising the pre-assembly device for semiconductor devices according to any one of options 1 to 14.
[0064] The above description is merely a preferred embodiment of the present disclosure and an explanation of the technical principles employed. Those skilled in the art should understand that the scope of the invention involved in the embodiments of the present disclosure is not limited to the technical solutions formed by a specific combination of the above-mentioned technical features, but should also encompass other technical solutions formed by any combination of the above-mentioned technical features or their equivalents without departing from the above-mentioned inventive concept. For example, a technical solution formed by mutually replacing the above-mentioned features with (but not limited to) technical features with similar functions disclosed in the embodiments of the present disclosure.
Claims
1. A pre-assembly device for semiconductor devices, characterized in that: include: A jig including at least one first member and a second member, wherein the at least one first member is used to restrict the position of at least one semiconductor device in at least a first direction, and the second member has a first predetermined area for arranging a spacer; a patch mechanism, configured to move the pad to the first predetermined area; At least one side of the spacer is used to limit the position of the at least one semiconductor device in at least a second direction, and the second direction is different from the first direction and is in the same plane as the first direction.
2. The pre-assembly device according to claim 1, characterized in that The pre-assembled equipment further comprises: an image collector configured to collect images of the pad and the first predetermined area; and A controller is communicatively connected to the image collector and the patch mechanism, and is configured to determine the position of the pad relative to the first predetermined area based on the image of the pad and the first predetermined area, and control the patch mechanism to move the pad to the first predetermined area based on the position.
3. The pre-assembly device according to claim 2, characterized in that The patch mechanism is further configured to move the at least one semiconductor device to its respective predetermined position, the image collector is further configured to capture an image of the semiconductor device, and the controller is further configured to control the patch mechanism to move the at least one semiconductor device to its respective predetermined position based on the captured image of the semiconductor device.
4. The pre-assembly device according to any one of claims 1 to 3, characterized in that The patch mechanism includes an adsorption head and a mechanical arm connected to the adsorption head.
5. The pre-assembly device according to any one of claims 1 to 3, characterized in that The pre-assembled equipment further comprises: A glue dispenser is used to dispense glue on at least one side of the spacer to bond and fix the at least one semiconductor device to the corresponding side of the spacer.
6. The pre-assembly device according to claim 5, characterized in that The preassembly equipment further includes a curing machine configured to bake and fix the bonded spacer and the semiconductor device.
7. The preassembly device according to any one of claims 1 to 3, characterized in that The fixture includes a pad fixing device for fixing the pad in the first predetermined area.
8. The pre-assembly device according to claim 7, characterized in that The second component is provided with a hole in the first predetermined area, and the pad fixing device includes a vacuum machine in fluid communication with the hole, for adsorbing and fixing the pad in the first predetermined area.
9. The pre-assembly device according to claim 8, characterized in that The fixture includes a vacuum chamber in fluid communication with the aperture and the vacuum machine.
10. The pre-assembly device according to any one of claims 1 to 3, characterized in that The chip mounting mechanism also includes a film mounting machine for mounting a protective film on the surface of the semiconductor device.
11. The preassembly device according to any one of claims 1 to 3, characterized in that The spacer is made of glass, and the jig is made of stainless steel.
12. The preassembly device according to any one of claims 1 to 3, characterized in that The semiconductor device is a silicon photomultiplier (SiPM).
13. The pre-assembly device according to any one of claims 1 to 3, characterized in that The semiconductor device includes a first side and a second side, the first side being configured to abut against one side of one of the at least one first member, and the second side being configured to abut against one side of the at least one side of the spacer.
14. The pre-assembly device according to any one of claims 1 to 3, characterized in that The semiconductor device includes an optoelectronic chip for a lidar.
15. An apparatus for surface mounting, comprising the pre-assembly apparatus for semiconductor devices according to any one of claims 1 to 14.