COB packaging structure of vehicle-mounted camera module
Patent Information
- Application Number
- CN202422846673.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-21
- Publication Date
- 2025-10-14
- Estimated Expiration
- 2034-11-21
AI Technical Summary
The existing COB packaging structure of vehicle-mounted camera modules is complex, resulting in cumbersome packaging process steps and an excessively large overall volume after packaging.
The bare chip COB packaging process is adopted. The center of the PCB is hollowed out and two steps are sunken. The bottom step is provided with a chip fixing groove. The first step has a gold ball for gold wire welding. The gold wire is led out from the chip PAD and connected to the PCB. A full circle of glue is drawn between the PAD point and the imaging area on the chip to form a dam, which is filled with gold wire protection glue. The glass bracket is provided with an escape hole and fixed to the PCB with thermosetting glue.
The packaging process is simplified, the overall volume is reduced, the production efficiency is improved and the reliability is enhanced.
Smart Images

Figure CN223437319U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to vehicle-mounted camera module technical field, especially a kind of vehicle-mounted camera module COB packaging structure. BACKGROUND
[0002] With the prevalence of new four automotives and intelligent driving concept, vehicle-mounted perception sensor market is developing rapidly, and vehicle-mounted camera, compared with automatic driving eye, will become the new blue ocean industry of industry.Vehicle-mounted camera, as the core sensing equipment in the field of automatic driving of automobile, its imaging quality is related to the direct experience of intelligent driving;
[0003] The existing vehicle-mounted camera module COB packaging structure and process flow, packaging structure is complex, resulting in packaging process step is complicated, and the overall volume is too large after packaging, therefore a kind of vehicle-mounted camera module COB packaging structure is proposed. UTILITY MODEL CONTENT
[0004] To solve the above at least one technical defect, the utility model provides a kind of vehicle-mounted camera module COB packaging structure, including: chip, PCB, glass support and glass, chip is bare chip, PCB center hollow sinks two steps, bottom step is equipped with the fixed groove for fixing chip, first step is equipped with gold ball for gold wire welding, gold wire is led out on the PAD of chip and is communicated with PCB, PAD point on chip and imaging area middle draw whole circle glue and form dam.
[0005] Further, the first step of PCB is filled with gold wire protection glue.
[0006] Further, glass support is located at the top periphery of chip and is fixed on PCB, the top of glass support is equipped with glass, and glass support is equipped with escape hole.
[0007] Further, the inside of escape hole is equipped with sealing glue. ADVANTAGEOUS EFFECT
[0008] Chip uses bare chip, adopts COB packaging process;PCB center hollow sinks two steps, bottom step is equipped with chip fixed groove, and first step has gold ball for gold wire welding;Gold wire is led out on the PAD of chip and is communicated with PCB;Chip bottom fills glue and fixes chip and radiating;PAD point on chip and imaging area middle draw whole circle glue and form dam, after completing packaging, make overall sinking, make overall volume reduce, and overall structure is more simple, so that packaging process is simplified, to improve production efficiency;
[0009] PCB first step is filled with gold wire protection glue, and reliability is strengthened;
[0010] Glass support is equipped with escape hole, so as to escape, and glass support is fixed on PCB with thermosetting glue.
[0011] The purposes, functional features and advantages of the utility model will be further explained in combination with embodiments and with reference to the drawings. BRIEF DESCRIPTION OF DRAWINGS
[0012] Fig. 1 It is an isometric view of the utility model as a whole.
[0013] Fig. 2 It is a sectional view of the utility model as a whole.
[0014] In Figs. 1-2 , the correspondence between the component names or lines and the drawing numbers is as follows: PCB1, glass support 2, glass 3, escape hole 4, gold wire 5, dam 6, protective glue 7. DETAILED DESCRIPTION
[0015] Please refer to Figs. 1-2 ;
[0016] The embodiment provides a vehicle-mounted camera module COB packaging structure, which comprises a chip, a PCB1, a glass support 2 and a glass 3, the chip is a bare chip, the PCB1 is provided with two steps in the center, a fixing groove for fixing the chip is arranged on the bottom step, and a gold ball is arranged on the first step for gold wire welding; the gold wire 5 is led out from the PAD of the chip and is in conduction with the PCB1, and the PAD point on the chip and the middle of the imaging area are painted with a whole circle of glue to form a dam 6.
[0017] In the specific implementation, the chip uses a bare chip, and a COB packaging process is adopted.
[0018] The PCB1 is provided with two steps in the center, a fixing groove for fixing the chip is arranged on the bottom step, and a gold ball is arranged on the first step for gold wire 5 welding; the gold wire is led out from the PAD of the chip and is in conduction with the PCB1.
[0019] Glue is filled at the bottom of the chip to fix the chip and dissipate heat.
[0020] The PAD point on the chip and the middle of the imaging area are painted with a whole circle of glue to form a dam.
[0021] After the packaging is completed, the whole body is sunken, the volume of the whole body is reduced, the overall structure is simpler, the packaging process is simplified, and therefore the production efficiency is improved.
[0022] Further, the first step of the PCB1 is filled with gold wire protective glue 7.
[0023] In the specific implementation, the first step of the PCB is filled with gold wire protective glue, and the reliability is strengthened.
[0024] Further, the glass support 2 fixed on the PCB1 is arranged at the top periphery of the chip, the glass 3 is arranged at the top of the glass support 2, and the glass support 2 is provided with the escape hole 4.
[0025] In a specific implementation, the glass holder 2 is provided with an escape hole 4 for escaping air, and the glass holder 2 is fixed on the PCB 1 by using a heat-resistant glue.
[0026] Further, the inside of the escape hole 4 is provided with a sealing glue;
[0027] In a specific implementation, after the overall packaging is completed, the escape hole 4 is finally sealed by using the sealing glue to prevent the entry of water vapor and dust.
Claims
1. A COB packaging structure for a vehicle-mounted camera module, comprising: A chip, a PCB (1), a glass support (2) and a glass (3), characterized in that: the chip is a bare chip, the center of the PCB (1) is hollowed out and two steps are sunken, the bottom step is provided with a fixing groove for fixing the chip, the first step is provided with a gold ball for gold wire welding, a gold wire (5) is led out from the PAD of the chip and is connected to the PCB (1), and a whole circle of glue is drawn between the PAD point on the chip and the imaging area to form a dam (6).
2. The COB packaging structure of a vehicle-mounted camera module according to claim 1, characterized in that: The first step of the PCB (1) is filled with a gold wire protection glue (7).
3. The COB packaging structure of a vehicle-mounted camera module according to claim 2, characterized in that: A glass support (2) fixed on the PCB (1) is provided on the top periphery of the chip, a glass (3) is provided on the top of the glass support (2), and an air escape hole (4) is provided on the glass support (2).
4. The COB packaging structure of a vehicle-mounted camera module according to claim 3, characterized in that: The inside of the air escape hole (4) is provided with sealing glue.