Pin shaping mechanism for SMD (Surface Mount Device) chip
By designing a chip pin shaping mechanism, and utilizing an electric push rod and a buffer, the problems of inconsistency and easy breakage of chip pins were solved, achieving pin shaping consistency and ease of operation.
Patent Information
- Application Number
- CN202422975884.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-04
- Publication Date
- 2025-10-17
- Estimated Expiration
- 2034-12-04
AI Technical Summary
In the prior art, patch chips are small in size and have many pins. Workers cannot achieve consistency in pin shaping using tweezers, which causes the pins to break easily and makes operation inconvenient.
A chip pin shaping mechanism was designed, comprising a base, shaping boss, bracket, electric push rod, shaping plate, buffer, and fixing module. The electric push rod drives the shaping plate to contact the chip, and the buffer and fixing module together achieve pin shaping consistency and prevent breakage.
It achieves consistent pin shaping for surface mount chips, avoids pin breakage, simplifies operation, and improves soldering efficiency.
Smart Images
Figure CN223440964U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to chip pin shaping technical field especially relates to a kind of SMD chip pin shaping mechanism. BACKGROUND
[0002] With the high-speed development of electronic technology, the pin pitch of integrated circuit is more small and dense, in the process of assembly test, pin is easy to deform, whether artificial welding or SMD machine automatic welding, if chip pin is deformed, it will lead to welding difficulty, even produce false soldering, missed welding etc.
[0003] At present, for small batch production circuit board, before chip welding, by welding worker using tweezers to chip pin shaping, after shaping is completed, chip is welded.
[0004] But in the above-mentioned prior art, since SMD chip size is small, and pin is more, worker using tweezers cannot achieve the consistency of pin shaping, pin is prone to break, operation is very inconvenient. UTILITY MODEL CONTENTS
[0005] The utility model aims at providing a kind of SMD chip pin shaping mechanism, to solve the technical problem that the consistency of pin shaping cannot be achieved by worker using tweezers in the prior art SMD chip size is small, and pin is more, pin is prone to break, operation is very inconvenient.
[0006] To achieve the above-mentioned purpose, a kind of SMD chip pin shaping mechanism is used in the utility model, including base, shaping boss, support, electric push rod, shaping plate, buffer and two groups of fixed module, the shaping boss is fixedly connected with the base and is located above the base, the support is fixedly connected with the base and is located above the base, the electric push rod is fixedly connected with the support, the shaping plate is fixedly connected with the output end of the electric push rod, the buffer is arranged in the shaping plate, two groups of fixed module are all arranged in the outer side wall of the shaping boss;
[0007] The fixed module includes fixed frame, bearing spring, slide bar, clamping plate and guide arc block, the fixed frame is fixedly connected with the shaping boss and is located above the shaping boss, the clamping plate is located above the shaping boss, the two ends of the bearing spring are fixedly connected with the clamping plate and the fixed frame respectively, the slide bar is fixedly connected with the clamping plate and is movably penetrated through the fixed frame, the guide arc block is fixedly connected with the clamping plate and is located above the clamping plate.
[0008] The fixed module further comprises a pulling block, which is fixedly connected with the sliding rod and located at one end of the sliding rod away from the clamping plate.
[0009] The fixed module further comprises an extruded sponge pad, which is fixedly connected with the clamping plate and located at the outer sidewall of the clamping plate.
[0010] The buffer comprises two buffer springs and a rubber block, the rubber block is movably connected with the shaping plate and located in the shaping plate, and two ends of each buffer spring are fixedly connected with the shaping plate and the rubber block.
[0011] The patch chip pin shaping mechanism further comprises two needle seats, both of which are fixedly connected with the shaping boss and located above the shaping boss.
[0012] The patch chip pin shaping mechanism of the utility model, when shaping the pin of the patch chip, first, the patch chip is located above the shaping boss, and is inserted into two guide arc blocks, the guide arc blocks are extruded, the guide arc blocks drive the clamping plate to move horizontally, the clamping plate drives the sliding rod to slide on the fixed frame, the resisting spring is compressed, then the bottom of the patch chip is continuously pushed to contact the shaping boss, and is located between the two clamping plates, at this time, the force of the resisting spring fixes the patch chip above the shaping boss, then the electric push rod on the support is started, the output end of the electric push rod is stretched out, and drives the shaping plate to move close to the shaping boss until the shaping plate contacts the patch chip, the pins on both sides of the patch chip are pressed down to be shaped, after completion, the electric push rod drives the shaping plate to move up to reset, then the sliding rod is pulled on the fixed frame to drive the clamping plate to move, the restriction on the patch chip is released, and finally the patch chip is taken out, wherein the buffer is arranged in the shaping plate, the patch chip can be prevented from being damaged by the buffer, by the above-mentioned mode, the pins of the patch chip can be shaped uniformly, the pins can be prevented from being broken, and the operation is simple and convenient. BRIEF DESCRIPTION OF DRAWINGS
[0013] In order to more clearly illustrate the technical scheme in the embodiments of the utility model or the prior art, the drawings needed to be used in the following embodiment or prior art description will be briefly introduced, and obviously, the drawings in the following description are only some embodiments of the utility model, and those skilled in the art can also obtain other drawings according to these drawings without creating creative labor.
[0014] Fig. 1 It is the structure schematic diagram of the patch chip pin shaping mechanism of the utility model.
[0015] Fig. 2 is the structure front view of the patch chip pin shaping mechanism.
[0016] Fig. 3 is the internal structure section view of the patch chip pin shaping mechanism.
[0017] Fig. 4 is the internal structure section view of the patch chip pin shaping mechanism in use.
[0018] 101-base, 102-shaping boss, 103-bracket, 104-electric push rod, 105-shaping plate, 106-fixing frame, 107-resisting spring, 108-sliding rod, 109-clamp plate, 110-guiding arc block, 111-pull block, 112-extrusion sponge pad, 113-buffer spring, 114-rubber block, 115-needle seat. DETAILED DESCRIPTION
[0019] The embodiments of the present application are described below in detail, examples of which are shown in the drawings, wherein the same or similar notations represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by reference to the drawings are exemplary and are intended to explain the present application, and cannot be understood as limiting the present application.
[0020] Please refer to Figs. 1-4 The present application provides a kind of patch chip pin shaping mechanism, including base 101, shaping boss 102, bracket 103, electric push rod 104, shaping plate 105, buffer and two groups of fixed module, the shaping boss 102 with the base 101 fixed connection, and located the top of the base 101, the bracket 103 with the base 101 fixed connection, and located the top of the base 101, the electric push rod 104 with the bracket 103 fixed connection, the shaping plate 105 with the output end fixed connection of the electric push rod 104, the buffer is arranged in the shaping plate 105, two groups of fixed module are all arranged in the outer side wall of the shaping boss 102;
[0021] The fixed module includes fixing frame 106, resisting spring 107, sliding rod 108, clamp plate 109 and guiding arc block 110, the fixing frame 106 with the shaping boss 102 fixed connection, and located the top of the shaping boss 102, the clamp plate 109 is located the top of the shaping boss 102, the both ends of the resisting spring 107 are respectively with the clamp plate 109 and the fixing frame 106 fixed connection, the sliding rod 108 with the clamp plate 109 fixed connection, and movably penetrates the fixing frame 106, the guiding arc block 110 with the clamp plate 109 fixed connection, and located the top of the clamp plate 109.
[0022] In the embodiment, when shaping the pins of the patch chip, the patch chip is first located above the shaping boss 102, and is inserted into the two guide arc blocks 110, the guide arc blocks 110 are extruded, the guide arc blocks 110 are driven to move horizontally, the clamping plates 109 are driven to slide on the fixed frame 106, the abutting spring 107 is compressed, then the bottom of the patch chip is continuously pushed to contact the shaping boss 102 and is located between the two clamping plates 109, at this time, the force of the abutting spring 107 fixes the patch chip above the shaping boss 102, then the electric push rod 104 on the support 103 is started, the output end of the electric push rod 104 is stretched out and drives the shaping plate 105 to move close to the shaping boss 102 until the shaping plate 105 contacts the patch chip, the pins on both sides of the patch chip are pressed down to be shaped, after completion, the electric push rod 104 drives the shaping plate 105 to move upward to reset, then the slide rod 108 on the fixed frame 106 is pulled to drive the clamping plate 109 to move, the restriction on the patch chip is released, and finally the patch chip is taken out, wherein the buffer is arranged in the shaping plate 105, the patch chip can be prevented from being damaged by the buffer, and by the above-mentioned mode, the pins of the patch chip can be uniformly shaped, the pins can be prevented from being broken, and the operation is simple and convenient.
[0023] Further, the fixing module further comprises a pulling block 111, the pulling block 111 is fixedly connected with the slide rod 108 and is located at one end of the slide rod 108 away from the clamping plate 109.
[0024] In the embodiment, the pulling block 111 is arranged outside the slide rod 108, and the slide rod 108 is conveniently pulled by the pulling block 111.
[0025] Further, the fixing module further comprises an extrusion sponge pad 112, the extrusion sponge pad 112 is fixedly connected with the clamping plate 109 and is located outside the clamping plate 109.
[0026] In the embodiment, the extrusion sponge pad 112 is arranged outside the clamping plate 109, the extrusion sponge pad 112 can increase the friction between the clamping plate 109 and the outside of the patch chip, can fix the patch chip on the shaping boss 102, and in addition, the extrusion sponge pad 112 can prevent the patch chip from being damaged by excessive clamping.
[0027] Further, the buffer member comprises two buffer springs 113 and a rubber block 114, the rubber block 114 is movably connected with the shaping plate 105 and is located in the shaping plate 105, and two ends of each buffer spring 113 are fixedly connected with the shaping plate 105 and the rubber block 114 respectively.
[0028] In the embodiment, by arranging the buffer spring 113 and the rubber block 114 in the shaping plate 105, when the shaping plate 105 is pressed down, the rubber block 114 can contact the patch chip, and the buffer spring 113 can be compressed, so that the patch chip can be prevented from being excessively pressed and damaged.
[0029] Further, the patch chip pin shaping mechanism further comprises two needle seats 115, and the two needle seats 115 are fixedly connected with the shaping boss 102 and are located above the shaping boss 102.
[0030] In the embodiment, by arranging the needle seat 115 above the shaping boss 102, after the patch chip is pressed down by the shaping plate 105, the pin of the patch chip can enter the needle seat 115, and the needle seat 115 can support the pin.
[0031] The above only discloses a preferred embodiment of the utility model, and of course cannot limit the scope of the utility model, and those skilled in the art can understand that all or part of the above-mentioned embodiments can be implemented, and equivalent changes made according to the utility model claims still belong to the scope of the utility model.
Claims
1. A chip pin shaping mechanism, characterized in that: It includes a base, a shaping boss, a bracket, an electric push rod, a shaping plate, a buffer and two groups of fixing modules, the shaping boss is fixedly connected to the base and is located above the base, the bracket is fixedly connected to the base and is located above the base, the electric push rod is fixedly connected to the bracket, the shaping plate is fixedly connected to the output end of the electric push rod, the buffer is arranged in the shaping plate, and the two groups of fixing modules are both arranged on the outer side wall of the shaping boss; The fixing module includes a fixing frame, a supporting spring, a sliding rod, a clamping plate and a guide arc block. The fixing frame is fixedly connected to the shaping boss and is located above the shaping boss. The clamping plate is located above the shaping boss. The two ends of the supporting spring are fixedly connected to the clamping plate and the fixing frame respectively. The sliding rod is fixedly connected to the clamping plate and movably passes through the fixing frame. The guide arc block is fixedly connected to the clamping plate and is located above the clamping plate.
2. The chip pin shaping mechanism according to claim 1, wherein: The fixing module further comprises a pulling block, which is fixedly connected to the sliding rod and is located at an end of the sliding rod away from the clamping plate.
3. The chip pin shaping mechanism according to claim 2, wherein: The fixing module further includes an extruded sponge pad, which is fixedly connected to the clamping plate and is located on the outer side wall of the clamping plate.
4. The chip pin shaping mechanism according to claim 1, wherein: The buffer member includes two buffer springs and a rubber block. The rubber block is movably connected to the shaping plate and is located inside the shaping plate. The two ends of each buffer spring are fixedly connected to the shaping plate and the rubber block respectively.
5. The chip pin shaping mechanism according to claim 1, wherein: The patch chip pin shaping mechanism further includes two needle seats, both of which are fixedly connected to the shaping boss and are located above the shaping boss.