Heat insulation film

Abstract

The utility model discloses a heat insulation film. The heat insulation film comprises a first aerogel layer, a second aerogel layer and a packaging layer, the packaging layer, the first aerogel layer, the second aerogel layer, the first aerogel layer and the packaging layer are sequentially arranged from bottom to top; the aerogel content of the first aerogel layer is lower than that of the second aerogel layer. According to the utility model, the heat insulation film is arranged to have different gradient aerogel contents, so that the heat insulation effect is ensured, the influence of powder falling on electronic equipment is prevented, the packaging layer does not contain aerogel, the packaging layer can prevent the powder falling of the aerogel layer, and the packaging layer also plays a role in adhering to an electronic product, so that the packaging effect is improved. The inner side of the packaging layer is in a form that the aerogel content is gradually increased from outside to inside, the middle aerogel layer with the high aerogel content plays a main heat insulation role, and the aerogel layers with the low aerogel content on the two sides play roles in assisting heat insulation and facilitating pasting. According to the utility model, the packaging layer which is low in aerogel content and even does not contain aerogel is used as the surface, so that good bonding is easier to realize. And the thickness of each layer and the aerogel content can be adjusted, so that the requirements of different customers and application scenes are met.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the field of electronic product heat insulation, specifically relates to a heat insulation film. BACKGROUND

[0002] With the development of electronic technology, electronic equipment is developing towards miniaturization, high integration and high heat flux density. A large amount of heat is generated in the running process of electronic equipment, if these heat cannot be effectively managed, the equipment will be overheated, and then the performance and service life will be affected. In addition, the development tendency of electronic equipment to complex function and higher computing speed also needs good heat insulation material and heat management technology to protect the reliability and stability of electronic equipment.

[0003] In order to cope with these challenges, researchers have developed a variety of new heat insulation materials and heat management technologies. For example, aerogel is a kind of ultra-light solid material with three-dimensional porous network structure, which has ultra-low thermal conductivity and can be used as a super heat insulation material. As the most widely used and mature aerogel, silica aerogel has been widely used in new energy vehicles, aerospace, pipeline insulation, building insulation and other fields.

[0004] Because silica aerogel is composed of rigid Si-O-Si bond, which is macroscopically brittle and easy to fall off, which limits its use in electronic products with strict cleanliness requirements.

[0005] In addition, because of the brittle characteristics of silica aerogel, the adhesive and aerogel bonding place is easily damaged under stress, resulting in bonding failure. It is difficult to achieve good bonding using conventional organic silicone adhesive and epoxy adhesive on the surface with high aerogel content. INVENTION CONTENTS

[0006] The utility model provides a kind of heat insulation film for solving the deficiency described in the prior art above.

[0007] The technical scheme adopted by the utility model is:

[0008] A kind of heat insulation film, including first aerogel layer, second aerogel layer and encapsulation layer;From bottom to top, it is encapsulation layer, first aerogel layer, second aerogel layer, first aerogel layer and encapsulation layer;And the aerogel content of first aerogel layer is lower than the aerogel content of second aerogel layer. Outside the aerogel layer with high aerogel content, aerogel layer with low aerogel content is arranged, and encapsulation layer is further arranged in the aerogel layer with low aerogel content.

[0009] As a preferred scheme of the utility model, the packaging layer and the first aerogel layer are connected by hot pressing; the first aerogel layer and the second aerogel layer are connected by hot pressing or a bonding layer is arranged between the first aerogel layer and the second aerogel layer.

[0010] As a preferred scheme of the utility model, the packaging layer is made of thermoplastic polymer, which can be a PTFE packaging layer, a PEEK packaging layer, a PMMA packaging layer or a PP packaging layer.

[0011] As a preferred scheme of the utility model, the packaging layer and the first aerogel layer are connected by hot pressing; the first aerogel layer and the second aerogel layer are connected by hot pressing or a bonding layer is arranged between the first aerogel layer and the second aerogel layer. The bonding layer uses a bonding agent solution, which can be inorganic silicon bonding agent, organic silicone adhesive, epoxy adhesive, acrylic adhesive, etc.

[0012] As a preferred scheme of the utility model, when the bonding layer is used, the packaging layer used can be a PET packaging layer, a PI packaging layer, a PE packaging layer, a silicone rubber packaging layer or a PTFE packaging layer.

[0013] As a preferred scheme of the utility model, the thickness of the first aerogel layer is 0.5-10.0 mm.

[0014] As a preferred scheme of the utility model, the thickness of the second aerogel layer is 0.5-10.0 mm.

[0015] As a preferred scheme of the utility model, the thickness of the packaging layer is 0.02-1.0 mm.

[0016] As a preferred scheme of the utility model, the first aerogel layer is an aerogel layer made of a mixture of thermoplastic resin and aerogel powder; the second aerogel layer is an aerogel layer made of a mixture of thermoplastic resin and aerogel powder.

[0017] The utility model discloses a kind of aerogel powder and thermoplastic resin are mixed and hot-pressed into aerogel-thermoplastic resin composite material instead of pure aerogel material as heat insulation material, solve the problem of brittleness, easy to break and drop powder when pure aerogel material is used as heat insulation layer.

[0018] The heat insulation film provided by the utility model can be used for heat insulation of electronic equipment, the heat insulation film is set to have different gradient aerogel contents, the heat insulation effect is ensured, and the influence of powder falling on the electronic equipment is prevented, the packaging layer does not contain aerogel, the packaging layer can prevent the aerogel layer from falling powder, and also plays the role of being pasted to the electronic product, the aerogel content of the packaging layer inside structure gradually increases from outside to inside, the aerogel layer with high aerogel content in the middle bears the main heat insulation function, the aerogel layers with low aerogel content on both sides play the roles of auxiliary heat insulation and convenient pasting. The utility model sets the packaging layer with low aerogel content or even without aerogel as the surface, and good bonding effect is more easily realized. Moreover, the thickness and aerogel content of each layer can be adjusted, and the needs of different customers and application scenarios are met. BRIEF DESCRIPTION OF DRAWINGS

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the utility model or the prior art, the drawings needed to be used in the embodiment or the prior art description will be briefly introduced, and obviously, the drawings in the following description are only some embodiments of the utility model, and for those skilled in the art, other drawings can be obtained according to these drawings without creative labor.

[0020] Figure 1 It is a structural schematic diagram of the utility model. DETAILED DESCRIPTION

[0021] The technical solutions in the embodiments of the utility model will be clearly and completely described in combination with the drawings in the embodiments of the utility model, obviously, the described embodiments are only some embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor belong to the protection scope of the utility model.

[0022] Embodiment 1:

[0023] A kind of heat insulation film, such as Figure 1As shown, including the first aerogel layer 1, the second aerogel layer 2 and the packaging layer 3; from bottom to top in turn is the packaging layer 3, the first aerogel layer 1, the second aerogel layer 2, the first aerogel layer 1 and the packaging layer 3; the thickness of the first aerogel layer 1 is 0.5-10.0mm, which can be 0.5mm, 1mm, 2mm, 3mm, 4mm, 5mm, 6mm, 7mm, 8mm, 9mm, 10mm, etc.; the thickness of the second aerogel layer 2 is 0.5-10.0mm, which can be 0.5mm, 1mm, 2mm, 3mm, 4mm, 5mm, 6mm, 7mm, 8mm, 9mm, 10mm, etc., the thickness of the first aerogel layer 1 and the thickness of the second aerogel layer 2 can be the same or different, which is designed according to actual needs; the thickness of the packaging layer 3 is 0.02-1.0mm, which can be 0.03mm, 0.035mm, 0.03mm, 0.05mm, 0.06mm, 0.07mm, 0.08mm, 0.09mm, 0.1mm, 0.3mm, 0.5mm, 0.6mm, 0.8mm, 0.9mm, 1.0mm, etc.

[0024] And the aerogel content of the first aerogel layer 1 is lower than that of the second aerogel layer 2. The low-aerogel-content aerogel layer is arranged outside the high-aerogel-content aerogel layer, and the packaging layer 3 is arranged in the low-aerogel-content aerogel layer. And the packaging layer 3, the first aerogel layer 1 and the second aerogel layer 2 are connected together by hot pressing. The packaging layer 3 used is a thermoplastic polymer, such as PMMA (Polymethyl methacrylate, polymethyl methacrylate), PEEK (polyether ether ketone), PTFE (Polytetrafluoro-Ethylene, polytetrafluoroethylene), PP (Polypropylene, polypropylene), which is convenient for hot pressing.

[0025] The manufacturing process is as follows:

[0026] Mix PEEK powder and aerogel according to the volume ratio of 6 / 4, hot-press as high-aerogel-content layer, i.e. the second aerogel layer 2, with a thickness of 5mm, and mix PEEK powder and aerogel according to the volume ratio of 8 / 2, hot-press as low-aerogel-content layer, i.e. the first aerogel layer 1, with a thickness of 3mm.

[0027] Lay PEEK powder on the bottom of the mold, put the low-aerogel-content layer, the high-aerogel-content layer, the low-aerogel-content layer in the center of the mold in turn, lay PEEK powder on the top, clamp the mold, hot-press at 360℃, 1MPa for 5min. After cooling, demold and take out.

[0028] When other thermoplastic polymers are used, the manufacturing process is the same.

[0029] The encapsulation layer 3 is free of aerogel, facilitating adhesion to electronic products, and also has the effect of preventing the first aerogel layer 1 and the second aerogel layer 2 from falling off powder, and after encapsulation, the inside of the encapsulation layer 3 presents an aerogel content gradually increasing from outside to inside, and the second aerogel layer 2 undertakes the main heat insulation function, and the first aerogel layers 1 on both sides play the role of auxiliary heat insulation and facilitating adhesion. Moreover, the first aerogel layer 1 and the second aerogel layer 2 of the utility model are both mixed with aerogel powder and thermoplastic resin and hot-pressed.

[0030] Embodiment 2:

[0031] A kind of heat insulation film, the encapsulation layer 3 and the first aerogel layer 1 are hot-pressed together, but the first aerogel layer 1 and the second aerogel layer 2 are provided with adhesive layer, the adhesive layer uses adhesive solution, can be inorganic silicon adhesive, organic silicone adhesive, epoxy adhesive, acrylic adhesive etc., that is, first aerogel layer 1 and second aerogel layer 2 are respectively mixed with aerogel powder and thermoplastic resin and hot-pressed after forming, then first aerogel layer 1 and second aerogel layer 2 are bonded together, finally the encapsulation layer 3 and corresponding first aerogel layer 1 are hot-pressed together to complete the overall encapsulation, the rest structures are same with embodiment 1.

[0032] Embodiment 3:

[0033] A kind of heat insulation film, the encapsulation layer 3 and the first aerogel layer 1 are provided with adhesive layer, the adhesive layer uses adhesive solution, can be inorganic silicon adhesive, organic silicone adhesive, epoxy adhesive, acrylic adhesive etc. Corresponding the used encapsulation layer 3 can be PET encapsulation layer, PI encapsulation layer, PE encapsulation layer, silicone rubber encapsulation layer or PTFE encapsulation layer, by coating high-temperature-resistant adhesive, the encapsulation layer 3 and the first aerogel layer 1, the first aerogel layer 1 and the second aerogel layer 2 are pasted together, the rest structures are same with embodiment 1.

[0034] Embodiment 4:

[0035] A kind of heat insulation film, adhesive layer is only arranged between the encapsulation layer 3 and the first aerogel layer 1, and no adhesive layer is arranged between the first aerogel layer 1 and the second aerogel layer 2, and it is connected together by hot-pressing, that is, after preparing the first aerogel layer 1 and the second aerogel layer 2, the first aerogel layer 1 and the second aerogel layer 2 are hot-pressed together, then the encapsulation layer 3 and corresponding first aerogel layer 1 are connected by adhesive, other same with embodiment 3.

[0036] In the description of the present specification, the description referring to the terms "one embodiment", "an example", "a specific example" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0037] The above is only a preferred specific implementation of the present application, but the protection scope of the present application is not limited to this. Any person skilled in the art, within the technical range disclosed by the present application, according to the technical scheme and the application concept of the present application, should be covered within the protection scope of the present application.

Claims

1. A thermal insulation film, characterized in that: The invention comprises a first aerogel layer (1), a second aerogel layer (2), and an encapsulation layer (3); from bottom to top, the encapsulation layer (3), the first aerogel layer (1), the second aerogel layer (2), the first aerogel layer (1), and the encapsulation layer (3); and the aerogel content of the first aerogel layer (1) is lower than the aerogel content of the second aerogel layer (2).

2. The thermal insulation film according to claim 1, characterized in that: The encapsulation layer (3) is connected to the first aerogel layer (1) by heat pressing; the first aerogel layer (1) and the second aerogel layer (2) are connected by heat pressing, or an adhesive layer is provided between the first aerogel layer (1) and the second aerogel layer (2).

3. The thermal insulation film according to claim 2, characterized in that: The encapsulation layer (3) is a PTFE encapsulation layer, a PEEK encapsulation layer, a PMMA encapsulation layer or a PP encapsulation layer.

4. The thermal insulation film according to claim 1, characterized in that: An adhesive layer is provided between the encapsulation layer (3) and the first aerogel layer (1), the first aerogel layer (1) and the second aerogel layer (2) are connected by hot pressing, or an adhesive layer is provided between the first aerogel layer (1) and the second aerogel layer (2).

5. The thermal insulation film according to claim 4, characterized in that: The encapsulation layer (3) is a PET encapsulation layer, a PI encapsulation layer, a PE encapsulation layer, a silicone rubber encapsulation layer or a PTFE encapsulation layer.

6. The thermal insulation film according to claim 1, characterized in that: The thickness of the first aerogel layer (1) is 0.5-10.0 mm.

7. The thermal insulation film according to claim 1, characterized in that: The thickness of the second aerogel layer (2) is 0.5-10.0 mm.

8. The thermal insulation film according to claim 1, characterized in that: The thickness of the packaging layer (3) is 0.02-1.0 mm.

9. The thermal insulation film according to claim 1, 6, 7 or 8, characterized in that: The first aerogel layer (1) is an aerogel layer made of a mixture of thermoplastic resin and aerogel powder; the second aerogel layer (2) is an aerogel layer made of a mixture of thermoplastic resin and aerogel powder.

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