Integrated mobile semiconductor refrigeration device

Abstract

The utility model belongs to the technical field of equipment, and particularly relates to an integrated mobile semiconductor refrigeration device which comprises a cold dissipation bin, a semiconductor is fixedly connected to the upper end of the cold dissipation bin, a bottom plate is fixedly connected to the upper end of the semiconductor, power source bins are fixedly installed on the two sides of the bottom plate, and clamping plates are movably installed on the two sides of the interior of each power source bin. Power supply bins are installed on the two sides of the upper end of the semiconductor refrigeration device, clamping plates are movably installed on the two sides of the interior of each power supply bin, movable rods are fixedly installed at the lower ends of the clamping plates, and clamping blocks and push rods for pushing side plates of the clamping plates are movably installed at the top ends of the movable rods. When the power supply is taken down, the power supply is pressed downwards, the movable block at the lower end moves downwards, the clamping blocks are separated from the fixed blocks, and the clamping plates move towards the two sides under the action of springs, so that the use effect of the semiconductor refrigeration device is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to semiconductor refrigeration equipment technical field, concretely is a kind of integrated mobile semiconductor refrigeration device. BACKGROUND

[0002] Semiconductor refrigeration is also called electronic refrigeration or thermoelectric refrigeration, which is a discipline developed in the 50s between refrigeration technology and semiconductor technology. It uses P-N junction of special semiconductor materials to form thermocouple pairs and generate Peltier effect, that is, a new refrigeration method by direct current refrigeration. It is called as the world's three major refrigeration methods together with compression refrigeration and absorption refrigeration.

[0003] Most of the existing semiconductor refrigeration devices need to be connected through power lines, which cannot be moved and used when power connection is not convenient, reducing the effect of semiconductor in use. UTILITY MODEL CONTENT

[0004] In view of the deficiencies of the prior art, the utility model provides an integrated mobile semiconductor refrigeration device, which solves the problem that the existing semiconductor heat conduction device does not have a carrying power supply.

[0005] To achieve the above purpose, the utility model provides the following technical scheme: an integrated mobile semiconductor refrigeration device, comprising a heat dissipation bin, the upper end of the heat dissipation bin is fixedly connected with a semiconductor, the upper end of the semiconductor is fixedly connected with a bottom plate, the two sides of the bottom plate are fixedly installed with a power supply bin, the two sides of the inside of the power supply bin are movably installed with a clamping plate, the lower end of the clamping plate is fixedly installed with a movable rod, the top end of the movable rod is movably installed with a clamping block, the middle position of the power supply bin is movably installed with a movable column, the two sides of the movable column are fixedly installed with a fixed block, the top end of the movable rod is fixedly installed with a first spring, and the lower end of the movable column is fixedly installed with a second spring.

[0006] As a preferred technical scheme of the utility model, the lower end of the heat dissipation bin is fixedly connected with a first fan, the four corners of the first fan are movably installed with a connecting rod, and the outer part of the connecting rod is movably installed with a fastening bolt.

[0007] As a preferred technical scheme of the utility model, a plurality of fins are fixedly installed in the inside of the heat dissipation bin, and a heat dissipation groove is formed in the inside of the fin.

[0008] As a preferred technical scheme of the utility model, a plurality of rhombic rods are fixedly installed on the upper end of the bottom plate, a second fan is fixedly installed on the upper end of the rhombic rod, a protective plate is fixedly installed on the upper end of the second fan, and connecting bolts are fixedly installed on the two sides of the second fan.

[0009] As a preferred technical scheme of the utility model, the upper end of the power source bin is movably provided with a cover plate, and both sides of the upper end of the power source bin are fixedly provided with a sliding groove.

[0010] As a preferred technical scheme of the utility model, the side of the clamping plate is connected with a push rod, the push rod penetrates the inside of the power source bin, the inside of the power source bin is fixedly provided with a lower fixed plate, and the side of the power source bin is fixedly provided with a through groove.

[0011] As a preferred technical scheme of the utility model, the inside of the power source bin is fixedly provided with a stabilizing block, one end of the first spring is fixedly connected with the stabilizing block, the bottom end of the power source bin is fixedly provided with a movable groove, and the inside of the movable groove is fixedly provided with a second spring.

[0012] Compared with the prior art, the utility model provides a kind of integrated mobile semiconductor refrigeration device, with the following beneficial effects:

[0013] The utility model discloses a semiconductor refrigeration device with power supply, the upper end of semiconductor refrigeration device is provided with power source bin, and the inside is stored with power supply, the side of power source bin is provided with through groove, and the heat is dissipated when power supply is used, and the other side of power source bin is connected with fin, and the inside both sides of power source bin are movably provided with clamping plate, the lower end of clamping plate is fixedly provided with movable rod, the top of movable rod is movably provided with clamping block, push rod of clamping plate side plate is pushed, and clamping block and the fixed block of both sides of intermediate position movable block are clamped and embedded, so that clamping plate is clamped to power supply, when power supply is taken down, the movable block of lower end is moved downward, clamping block and fixed block are separated, clamping plate is moved to both sides under the action of spring, so that power supply is loosened, semiconductor refrigeration device is provided with power supply, and it is convenient to move and use, even if there is no external power supply connection, the effect that semiconductor refrigeration device is used is increased. ACCURACY

[0014] Figure 1 It is a kind of integrated mobile semiconductor refrigeration device three-dimensional structure schematic view of the utility model;

[0015] Figure 2 It is a kind of integrated mobile semiconductor refrigeration device side view structure schematic view of the utility model;

[0016] Figure 3 It is a kind of integrated mobile semiconductor refrigeration device side view structure schematic view of the utility model;

[0017] Figure 4 It is a kind of integrated mobile semiconductor refrigeration device sectional structure schematic view of the utility model;

[0018] Figure 5 It is a kind of integrated mobile semiconductor refrigeration device sectional structure schematic view of the utility model.

[0019] In the figure: 1, the cold warehouse; 2, the first fan; 3, connecting rod; 4, fastening bolt; 5, power supply warehouse; 6, cover plate; 7, the second fan; 8, connecting bolt; 9, guard plate; 10, semiconductor; 11, the lower fixed plate; 12, through slot; 13, push rod; 14, diamond rod; 15, bottom plate; 16, fin; 17, cold sink; 18, clamping plate; 19, movable rod; 20, movable column; 21, fixed block; 22, block; 23, the first spring; 24, stabilizing block; 26, movable slot; 27, the second spring. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the utility model.

[0021] Please refer to Figures 1-5 In the embodiment, the integrated mobile semiconductor refrigeration device comprises a cold warehouse 1, which facilitates the emission of generated cold air. The upper end of the cold warehouse 1 is fixedly connected with a semiconductor 10, which generates cold air. The upper end of the semiconductor 10 is fixedly connected with a bottom plate 15. The two sides of the bottom plate 15 are fixedly installed with power supply warehouses 5, which facilitate the stable placement of batteries. The two sides of the inside of the power supply warehouse 5 are movably installed with clamping plates 18, which clamp the batteries. The lower end of the clamping plate 18 is fixedly installed with a movable rod 19. The top end of the movable rod 19 is movably installed with a block 22, which facilitates the fixed clamping effect. The middle position of the power supply warehouse 5 is movably installed with a movable column 20. The two sides of the movable column 20 are fixedly installed with fixed blocks 21, which stabilize the clamping effect. The top end of the movable rod 19 is fixedly installed with a first spring 23, which resets the movable rod 19 by using the elastic effect. The lower end of the movable column 20 is fixedly installed with a second spring 27, which resets the movable column 20 after use.

[0022] In the embodiment, the lower end of the cold warehouse 1 is fixedly connected with a first fan 2, which facilitates the emission of generated cold air. The four corners of the first fan 2 are movably installed with connecting rods 3. The outside of the connecting rod 3 is movably installed with fastening bolts 4, which facilitate the fixed installation of the device. The inside of the connecting rod 3 is movably installed with a plurality of fins 16. The inside of the fin 16 is provided with a cold sink 17, which increases the effect of emitting cold air. The upper end of the bottom plate 15 is fixedly installed with a plurality of diamond rods 14, which increase the heat dissipation effect. The upper end of the diamond rod 14 is fixedly installed with a second fan 7, which rapidly emits the generated heat. The upper end of the second fan 7 is fixedly installed with a guard plate 9. The two sides of the second fan 7 are fixedly installed with connecting bolts 8, which increase the stability in installation.

[0023] In the embodiment, the upper end of the power bin 5 is movably provided with a cover plate 6, and the upper end of the power bin 5 is fixedly provided with a sliding groove on both sides, so that the power bin 5 is movably installed, the side of the clamping plate 18 is connected with a push rod 13, the push rod 13 penetrates through the inside of the power bin 5, the inside of the power bin 5 is fixedly provided with a lower fixed plate 11, the side of the power bin 5 is fixedly provided with a through groove 12, so that the heat of the battery during use is dissipated, the inside of the power bin 5 is fixedly provided with a stabilizing block 24, one end of the first spring 23 is fixedly connected with the stabilizing block 24, the bottom end of the power bin 5 is fixedly provided with a movable groove 26, and the inside of the movable groove 26 is fixedly provided with a second spring 27, so that the stability of the second spring 27 during use is increased.

[0024] The working principle and use process of the utility model are as follows: the operator fixes and installs the semiconductor refrigeration device to a suitable position during use, the lower end of the semiconductor 10 is fixedly provided with a cold air dissipating bin 1, the cold air generated by the semiconductor 10 is dissipated, the lower end of the cold air dissipating bin 1 is fixedly connected with a first fan 2, the cold air is downwardly conveyed, the four corners of the first fan 2 are movably provided with connecting rods 3, the outside of the connecting rods 3 is provided with screw grooves, and the screw grooves are movably provided with fastening bolts 4, so that the stability of the device during installation is increased, the upper end of the semiconductor 10 is fixedly provided with a rhombic rod 14, the rhombic rod 14 is fixedly installed at the upper end of the bottom plate 15, the generated heat is dissipated, the upper end of the rhombic rod 14 is fixedly provided with a second fan 7, the heat is further dissipated, the power bin 5 is fixedly installed at both sides of the bottom plate 15, the inside of the power bin 5 is placed with a battery, the inside of the power bin 5 is movably provided with a clamping plate 18, the lower end of the clamping plate 18 is fixedly provided with a movable rod 19, the top end of the movable rod 19 is movably provided with a clamping block 22, the clamping block 22 and the movable rod 19 are fixedly provided with a torsional spring, so that the movable rod 19 is moved during use, the middle position of the power bin 5 is movably provided with a movable column 20, both sides of the movable column 20 are fixedly provided with fixed blocks 21, the clamping block 22 and the fixed blocks 21 are clamped, when the battery is installed, the push rods 13 on both sides are pressed, the clamping block 22 and the fixed blocks 21 are clamped, the clamping plate 18 clamps the battery, when the battery is disassembled, the movable column 20 is downwardly pressed, the movable column 20 is downwardly moved, the clamping block 22 and the fixed blocks 21 are separated, and the movable rod 19 is restored to the original position under the action of the first spring 23.

[0025] In the description of the utility model, it needs to be explained that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "two ends", "one end", "the other end" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the utility model and simplifying the description, and do not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the utility model. In addition, the terms "first" and "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance.

[0026] In the description of the utility model, it needs to be explained that unless otherwise explicitly specified and limited, the terms "mounting", "provided with", "connection" and the like should be broadly understood, for example, "connection" can be fixed connection, can also be detachable connection, or integrally connected; can be mechanical connection, can also be electrical connection; can be directly connected, can also be indirectly connected through an intermediate medium, can be the communication between two elements inside. For ordinary skilled persons in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.

[0027] The components used in the utility model are all general standard components or components known to those skilled in the art, and their structure and principle can be known by the technical personnel through the technical manual or through the conventional experimental method.

[0028] The above is only the preferred embodiment of the utility model, and does not limit the technical range of the utility model in any way, so any slight modification, equivalent change and modification made according to the technical essence of the utility model to the above embodiment still belongs to the protection range of the utility model.

Claims

1. An integrated mobile semiconductor refrigeration device, comprising a cooling chamber (1), characterized in that: The upper end of the cooling bin (1) is fixedly connected to a semiconductor (10), the upper end of the semiconductor (10) is fixedly connected to a base plate (15), and power bins (5) are fixedly mounted on both sides of the base plate (15); Clamps (18) are movably mounted on both sides of the interior of the power supply compartment (5), a movable rod (19) is fixedly mounted on the lower end of the clamps (18), and a clamping block (22) is movably mounted on the top end of the movable rod (19); A movable column (20) is movably installed in the middle position of the power supply compartment (5), fixed blocks (21) are fixedly installed on both sides of the movable column (20), a first spring (23) is fixedly installed on the top end of the movable rod (19), and a second spring (27) is fixedly installed on the lower end of the movable column (20).

2. The integrated mobile semiconductor refrigeration device according to claim 1, characterized in that: A first fan (2) is fixedly connected to the lower end of the cooling bin (1); Connecting rods (3) are movably mounted at the four corners of the first fan (2); A fastening bolt (4) is movably mounted on the outside of the connecting rod (3).

3. The integrated mobile semiconductor refrigeration device according to claim 1, characterized in that: A plurality of fins (16) are fixedly installed inside the cooling bin (1); A cooling groove (17) is provided inside the fin (16).

4. The integrated mobile semiconductor refrigeration device according to claim 1, characterized in that: A plurality of diamond-shaped rods (14) are fixedly mounted on the upper end of the bottom plate (15); A second fan (7) is fixedly mounted on the upper end of the diamond-shaped rod (14); A protective plate (9) is fixedly mounted on the upper end of the second fan (7); Connecting bolts (8) are fixedly mounted on both sides of the second fan (7).

5. The integrated mobile semiconductor refrigeration device according to claim 1, characterized in that: A cover plate (6) is movably mounted on the upper end of the power supply compartment (5); Slide grooves are fixedly mounted on both sides of the upper end of the power supply compartment (5).

6. The integrated mobile semiconductor refrigeration device according to claim 1, characterized in that: The side of the clamping plate (18) is connected to a push rod (13), and the push rod (13) passes through the interior of the power supply compartment (5); A lower fixing plate (11) is fixedly installed inside the power supply compartment (5); A through slot (12) is fixedly provided on the side of the power supply compartment (5).

7. The integrated mobile semiconductor refrigeration device according to claim 1, characterized in that: A stabilizing block (24) is fixedly installed inside the power supply compartment (5), and one end of the first spring (23) is fixedly connected to the stabilizing block (24); A movable groove (26) is fixedly installed at the bottom end of the power supply compartment (5), and a second spring (27) is fixedly installed inside the movable groove (26).

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