Low-temperature in-situ reaction device

Abstract

The utility model belongs to the technical field of spectrum experiment equipment, and discloses a low-temperature in-situ reaction device which comprises a shell assembly and a heat dissipation assembly, the shell assembly comprises a shell, a containing cavity is formed in the shell, two opposite side faces of the shell are provided with a light inlet hole and a light outlet hole respectively, and the shell is further provided with an air inlet and an air outlet which are communicated with the containing cavity; the heat dissipation assembly is arranged in the containing cavity and comprises a sample loading plate and a semiconductor chilling plate, the sample loading plate faces the light inlet hole and is attached to the cold face of the semiconductor chilling plate, a groove concentric with the light inlet hole and the light outlet hole is formed in the sample loading plate, and a first light through hole concentric with the groove is formed in the semiconductor chilling plate. The reaction device disclosed by the embodiment of the utility model adopts the semiconductor chilling plate for refrigeration, quickly realizes a low-temperature environment and is simple and compact in structure.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the technical field of spectrum experiment equipment, in particular to a low temperature in situ reaction device. BACKGROUND

[0002] In the existing spectrum analysis process, the low temperature in situ reaction device uses liquid nitrogen refrigeration and compressor refrigeration to reach the required temperature of the experiment, which makes the experimental equipment structure complex, inconvenient to carry and transport, and takes a long time to reach the required low temperature environment by using liquid nitrogen refrigeration and compressor refrigeration. UTILITY MODEL CONTENTS

[0003] In view of the above problems, the utility model provides a low temperature in situ reaction device, adopts the following technical scheme:

[0004] A low temperature in situ reaction device, comprising a shell assembly and a heat dissipation assembly, wherein the shell assembly comprises an outer shell, the outer shell has a containing cavity in it, the outer shell is provided with a light inlet hole and a light outlet hole on the opposite two sides respectively, and the outer shell is further provided with an air inlet and an air outlet which are in communication with the containing cavity;

[0005] The heat dissipation assembly is arranged in the containing cavity, and the heat dissipation assembly comprises a sample mounting plate and a semiconductor refrigerating sheet, the sample mounting plate faces the light inlet hole and is attached to the cold surface of the semiconductor refrigerating sheet, the sample mounting plate is provided with a groove concentric with the light inlet hole and the light outlet hole, and the semiconductor refrigerating sheet is provided with a first light transmission hole concentric with the groove.

[0006] Further, the top of the outer shell is open, and the shell assembly further comprises an upper cover, and the upper cover is detachably connected to the top of the outer shell.

[0007] Further, the four corners of the upper cover are provided with first countersunk holes, and the top of the outer shell is provided with first threaded blind holes matched with the first countersunk holes.

[0008] Further, the shell assembly further comprises a mounting seat, and the mounting seat is in U shape, and the top of the mounting seat is fixedly connected to the bottom of the outer shell.

[0009] Further, a sealing ring is further arranged between the upper cover and the top of the outer shell.

[0010] Further, the heat dissipation assembly further comprises a heat dissipation plate, the heat dissipation plate is provided with a second light transmission hole concentric with the groove, the top of the heat dissipation plate is fixedly connected to the bottom of the upper cover, the sample mounting plate is detachably connected to the heat dissipation plate, and the semiconductor refrigerating sheet is located between the sample mounting plate and the heat dissipation plate.

[0011] The upper cover is provided with a water inlet and a water outlet, the heat dissipation plate is internally provided with a liquid flow channel, the hot surface of the semiconductor refrigeration sheet is attached to the heat dissipation plate, the water inlet is communicated with the inlet of the liquid flow channel, and the water outlet is communicated with the outlet of the liquid flow channel.

[0012] Further, the upper cover is further provided with an aviation plug, the sample mounting plate is further provided with a temperature sensor, and the aviation plug is connected with the temperature sensor and the semiconductor refrigeration sheet.

[0013] Further, the recess is provided with a pressing block on the side facing the light inlet hole, the pressing block is provided with a second through hole concentric with the light inlet hole in the middle, the pressing block is provided with external threads, the recess is provided with internal threads, and the external threads of the pressing block are threadedly connected with the internal threads of the recess.

[0014] Further, the shell is provided with a recess at the light inlet hole and the light outlet hole, the recess is internally provided with a light transmission sheet, the outer side of the light transmission sheet is provided with an O-shaped ring and a window, the window press-fits the O-shaped ring and the light transmission sheet in the recess, and the window is detachably connected with the shell.

[0015] Further, the window is circular, the center of the window is provided with a third light transmission hole, the outer side of the third light transmission hole is circumferentially provided with a plurality of second countersunk holes, and the outer side of each recess of the shell is provided with a second threaded blind hole matched with the second countersunk hole.

[0016] The present application has the following beneficial effects:

[0017] 1. The reaction device uses a semiconductor refrigeration sheet to refrigerate, quickly realizes a low-temperature environment, and has a simple and compact structure.

[0018] 2. The sample can be quickly press-fitted and fixed through the threaded connection between the pressing block and the sample mounting plate, the window allows detection light to irradiate on the sample, and the window light transmission can be visible light or invisible light.

[0019] Other features and advantages of the present application will be described in the following description, and some will become apparent from the description, or will be understood from the practice of the present application. The purposes and other advantages of the present application can be achieved and obtained through the structures indicated in the description and the drawings. BRIEF DESCRIPTION OF DRAWINGS

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description, obviously, the drawings in the following description are some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained without creative labor on the basis of these drawings.

[0021] Figure 1 The structure of the low-temperature in-situ reaction device according to the embodiment of the present application is shown.

[0022] In the figure: 1, shell assembly; 2, heat dissipation assembly; 3, shell; 4, containing cavity; 5, light inlet hole; 6, air inlet; 7, air outlet; 8, sample plate; 9, semiconductor refrigeration piece; 10, groove; 11, upper cover; 111, heat dissipation plate; 12, mounting seat; 13, first countersunk hole; 14, first threaded blind hole; 15, first through hole; 16, sealing ring; 17, water inlet; 18, water outlet; 19, aviation plug; 20, temperature sensor; 21, pressing block; 22, recess; 23, light transmission sheet; 24, O-ring; 25, window; 26, third light transmission hole; 27, second countersunk hole; 28, second threaded blind hole. DETAILED DESCRIPTION

[0023] In order to make the purpose, technical scheme and advantages of the embodiments of the present application more clear, the following will combine the drawings in the embodiments of the present application to clearly and completely describe the technical scheme in the embodiments of the present application, obviously, the described embodiments are some embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor belong to the scope of protection of the present application.

[0024] It should be noted that the terms "first", "second", etc. in the present application are used to distinguish similar objects, and do not necessarily describe a specific order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances, so that the embodiments of the present application described herein. In the present application, the terms "up", "down", "left", "right", "front", "back", "top", "bottom", "in", "out", "middle", "vertical", "horizontal", "lateral", "longitudinal" and the like indicate the orientation or positional relationship shown in the drawings.

[0025] The embodiment of the present application provides a low-temperature in-situ reaction device, which uses a semiconductor refrigeration piece refrigeration mode to quickly realize a low-temperature environment, and compared with liquid nitrogen refrigeration and compressor refrigeration, the structure is simple and compact.

[0026] As Figure 1As shown, a low-temperature in-situ reaction device includes a shell assembly 1 and a heat dissipation assembly 2, wherein the shell assembly 1 includes an outer shell 3, the outer shell 3 has a containing cavity 4 inside, the outer shell 3 is provided with a light inlet hole 5 and a light outlet hole on the opposite two sides respectively, and the outer shell 3 is also provided with an air inlet 6 and an air outlet 7 which communicate with the containing cavity 4, for example, the side where the air inlet 6 and the air outlet 7 are arranged is adjacent to the side where the light inlet hole 5 is arranged, and the positions of the air inlet 6 and the air outlet 7 can be interchanged, and the gas environment used for experiments is provided into the containing cavity 4 through the air inlet 6 and the air outlet 7.

[0027] The heat dissipation assembly 2 is arranged in the containing cavity 4, and the heat dissipation assembly 2 includes a sample mounting plate 8 and a semiconductor refrigeration sheet 9, the sample mounting plate 8 faces the light inlet hole 5 and is attached to the cold surface of the semiconductor refrigeration sheet 9, the sample mounting plate 8 is provided with a groove 10 concentric with the light inlet hole 5 and the light outlet hole, the groove 10 is used for placing a sample, and the semiconductor refrigeration sheet 9 is arranged to face the light outlet hole, and the semiconductor refrigeration sheet 9 is provided with a first light hole concentric with the groove 10.

[0028] The semiconductor refrigeration sheet 9 can quickly provide a low-temperature environment for the containing cavity 4, the gas environment used for experiments is provided into the containing cavity 4 through the air inlet 6, so that the sample in the sample mounting plate 8 can be used for experiments under the set conditions, and the structure is simple and compact.

[0029] For example, the top of the outer shell 3 is open, and the shell assembly 1 further includes an upper cover 11 and a mounting seat 12, wherein the upper cover 11 is detachably connected to the top of the outer shell 3 through bolts, for example, the four corners of the upper cover 11 are provided with first countersunk holes 13, and the top of the outer shell 3 is provided with first threaded blind holes 14 matched with the first countersunk holes 13, the bolts are threadedly connected through the first countersunk holes 13 and the first threaded blind holes 14 to fixedly connect the upper cover 11 and the outer shell 3, and the upper cover 11 is arranged to facilitate the installation and dismounting of the heat dissipation assembly 2.

[0030] The mounting seat 12 is in a U shape, the top of the mounting seat 12 is fixedly connected to the bottom of the outer shell 3, and the bottom of the mounting seat 12 is provided with a plurality of first through holes 15, and the mounting seat 12 is connected to other equipment through the plurality of first through holes 15.

[0031] For example, a sealing ring 16 is further arranged between the upper cover 11 and the top of the outer shell 3, so that the upper cover 11 and the outer shell 3 form a seal, and the containing cavity 4 can withstand a certain pressure.

[0032] For example, the heat dissipation assembly 2 further comprises a heat dissipation plate 111, the top of the heat dissipation plate 111 is fixedly connected with the bottom of the upper cover 11, the heat dissipation plate 111 is provided with a second light transmission hole concentric with the groove 10, the sample plate 8 is detachably connected with the heat dissipation plate 111, and the semiconductor refrigeration piece 9 is located between the sample plate 8 and the heat dissipation plate 111. The sample plate 8 press-fits the semiconductor refrigeration piece 9 on the heat dissipation plate 111. For example, the sample plate 8 is fixed on the heat dissipation plate 111 by four screws.

[0033] The upper cover 11 is provided with a water inlet 17, a water outlet 18 and an aviation plug 19, the heat dissipation plate 111 is internally provided with a liquid flow channel, the sample plate 8 is further provided with a temperature sensor 20, the temperature sensor 20 can detect the temperature in real time, the aviation plug 19 is connected with the temperature sensor 20 and the semiconductor refrigeration piece 9, and the aviation plug 19 is further connected with a temperature controller to supply power to the semiconductor refrigeration piece 9 and the temperature sensor 20.

[0034] The hot surface of the semiconductor refrigeration piece 9 is attached to the heat dissipation plate 111, the water inlet 17 of the upper cover 11 is in communication with the inlet of the liquid flow channel in the heat dissipation plate 111, and the water outlet 18 of the upper cover 11 is in communication with the outlet of the liquid flow channel in the heat dissipation plate 111. The cooling water flows through the heat dissipation plate 111 in sequence from the water inlet 17 to form a circulating water belt to take away the heat of the hot surface of the semiconductor refrigeration piece 9.

[0035] For example, the groove 10 is provided with a pressing block 21 on the side facing the light inlet hole 5, the pressing block 21 is provided with a second through hole concentric with the light inlet hole 5 in the middle, the pressing block 21 is provided with external threads, the groove 10 is provided with internal threads, the external threads of the pressing block 21 are threadedly connected with the internal threads of the groove 10, and the pressing block 21 tightly presses the sample in the groove 10.

[0036] For example, the shell 3 is provided with a recess 22 at the light inlet hole 5 and the light outlet hole, the recess 22 is internally provided with a light transmission sheet 23, the outer side of the light transmission sheet 23 is provided with an O-ring 24 and a window 25, the window 25 press-fits the O-ring 24 and the light transmission sheet 23 in the recess 22, the O-ring 24 forms a seal between the window 25 and the light transmission sheet 23, and the window 25 is detachably connected with the shell 3.

[0037] For example, the window 25 is circular, the center of the window 25 is provided with a third light transmission hole 26, the window 25 is provided with a plurality of second countersunk holes 27 on the outer side of the third light transmission hole 26 in the circumferential direction, the shell 3 is provided with a second threaded blind hole 28 matched with the second countersunk hole 27 on the outer side of each recess 22, and a bolt is threadedly connected with the second threaded blind hole 28 through the second countersunk hole 27 to fixedly connect the window 25 with the shell 3.

[0038] The low-temperature in-situ reaction device has simple and compact structure, does not need to be equipped with liquid nitrogen refrigeration or compressor refrigeration, can realize low-temperature environment through the semiconductor refrigerating sheet 9, can quickly press and fix the sample through the briquetting piece 21, and can allow detection light to irradiate on the sample through the window 25.

[0039] Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that the technical solutions recorded in the foregoing embodiments can still be modified, or some technical features can be replaced equivalently, and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the utility model.

Claims

1. A low-temperature in-situ reaction device, characterized in that: The invention comprises a housing assembly (1) and a heat dissipation assembly (2), wherein the housing assembly (1) comprises a shell (3), the shell (3) has a receiving cavity (4) therein, the shell (3) is provided with a light inlet (5) and a light outlet hole on two opposite sides, and the shell (3) is further provided with an air inlet (6) and an air outlet (7) communicating with the receiving cavity (4); The heat dissipation component (2) is arranged in the accommodating cavity (4), and the heat dissipation component (2) includes a sample plate (8) and a semiconductor cooling plate (9), the sample plate (8) faces the light inlet hole (5) and is in contact with the cold surface of the semiconductor cooling plate (9), the sample plate (8) is provided with a groove (10) concentric with the light inlet hole (5) and the light outlet hole, and the semiconductor cooling plate (9) is provided with a first light hole concentric with the groove (10).

2. The low-temperature in-situ reaction device according to claim 1, characterized in that: The top of the shell (3) is open, and the housing assembly (1) further comprises an upper cover (11), wherein the upper cover (11) is detachably connected to the top of the shell (3).

3. The low-temperature in-situ reaction device according to claim 2, characterized in that: The four corners of the upper cover (11) are each provided with a first countersunk hole (13), and the top of the shell (3) is provided with a first threaded blind hole (14) matching the first countersunk hole (13).

4. The low-temperature in-situ reaction device according to claim 1, characterized in that: The housing assembly (1) further comprises a mounting seat (12), the mounting seat (12) being U-shaped, and the top of the mounting seat (12) being fixedly connected to the bottom of the housing (3).

5. The low-temperature in-situ reaction device according to claim 2, characterized in that: A sealing ring (16) is also provided between the upper cover (11) and the top of the outer shell (3).

6. The low-temperature in-situ reaction device according to claim 2, 3 or 5, characterized in that: The heat dissipation assembly (2) further comprises a heat dissipation plate (111), a second light-through hole concentric with the groove (10) is provided on the heat dissipation plate (111), the top of the heat dissipation plate (111) is fixedly connected to the bottom of the upper cover (11), the sample loading plate (8) is detachably connected to the heat dissipation plate (111), and the semiconductor refrigeration plate (9) is located between the sample loading plate (8) and the heat dissipation plate (111); The upper cover (11) is provided with a water inlet (17) and a water outlet (18); a liquid flow channel is provided inside the heat sink (111); the hot surface of the semiconductor refrigeration plate (9) is in contact with the heat sink (111); the water inlet (17) is connected to the inlet of the liquid flow channel; and the water outlet (18) is connected to the outlet of the liquid flow channel.

7. The low-temperature in-situ reaction device according to claim 6, characterized in that: An aviation plug (19) is also provided on the upper cover (11), and a temperature sensor (20) is also provided on the sample loading plate (8). The aviation plug (19) is connected to the temperature sensor (20) and the semiconductor cooling plate (9).

8. The low-temperature in-situ reaction device according to claim 1, characterized in that: The groove (10) is provided with a pressing block (21) on the side facing the light inlet (5), a second through hole concentric with the light inlet (5) is provided in the middle of the pressing block (21), an external thread is provided on the pressing block (21), and the groove (10) is provided with an internal thread, and the external thread of the pressing block (21) is threadedly connected to the internal thread of the groove (10).

9. The low-temperature in-situ reaction device according to any one of claims 1 to 5, characterized in that: The housing (3) is provided with a recessed platform (22) at the light inlet (5) and the light outlet; a light-transmitting sheet (23) is provided in the recessed platform (22); an O-ring (24) and a window (25) are provided on the outside of the light-transmitting sheet (23); the window (25) presses the O-ring (24) and the light-transmitting sheet (23) into the recessed platform (22); and the window (25) is detachably connected to the housing (3).

10. The low-temperature in-situ reaction device according to claim 9, characterized in that: The window (25) is circular, a third light-through hole (26) is provided at the center of the window (25), a plurality of second countersunk holes (27) are provided on the outer side of the third light-through hole (26) along the circumferential direction, and the housing (3) is provided with a second threaded blind hole (28) matching the second countersunk hole (27) on the outer side of each recess (22).

Images