Device for testing steady-state thermal resistance of flat-plate semiconductor device
By designing an adaptive clamping mechanism and replacement components, the problem of fixing semiconductor devices of different shapes and sizes in the prior art is solved, stable clamping is achieved, and the accuracy of test results is ensured.
Patent Information
- Application Number
- CN202422491911.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-15
- Publication Date
- 2025-10-17
- Estimated Expiration
- 2034-10-15
AI Technical Summary
Existing technologies are unable to effectively clamp and fix semiconductor devices of different shapes and sizes, resulting in device deviation during testing and affecting the accuracy of test results.
A clamping mechanism and replacement components were designed, including an electric push rod, a fixing plate, a support plate, a T-shaped block, a telescopic rod and a worm gear. By adjusting the size and hardness of the clamping mechanism, it can adapt to semiconductor devices of different shapes and thicknesses, and a silicone anti-sliding block is used to enhance the fixing effect.
It can firmly clamp semiconductor devices of different shapes and thicknesses, prevent deviation, and ensure the accuracy and reliability of test results.
Smart Images
Figure CN223450087U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model belongs to semiconductor device test equipment technical field, specifically is a kind of flat plate type semiconductor device steady-state thermal resistance testing device. BACKGROUND
[0002] The thermal resistance of power semiconductor devices is an important indicator of device performance parameters, and the definition of thermal resistance is: under the condition of thermal equilibrium, the ratio of the temperature difference of two fixed points to the dissipation power generated by the two points. Thermal resistance reflects the heat dissipation capacity of the device.
[0003] For example, a kind of semiconductor device steady-state thermal resistance testing device with publication number CN214150938U, including cabinet, the top of the cabinet is bolted with fixed frame, the center of the inner chamber top of the fixed frame is bolted with first air cylinder, the piston rod of the first air cylinder is bolted with mounting plate, the bottom of the mounting plate is bolted with connecting column from left to right in turn, and the bottom of connecting column is bolted with pressing plate, the inner chamber of the cabinet is provided with clamping mechanism, the center of the bottom of the cabinet is bolted with installation box, the right side of the front of the cabinet is bolted with controller. There are still the following shortcomings in actual use:
[0004] The above-mentioned patent can only fix rectangular semiconductor devices during use by setting clamps to prevent semiconductor devices from shifting during testing, but it cannot clamp and fix semiconductor devices of different shapes, which has great limitations in actual use. INVENTION CONTENTS
[0005] To solve the problems raised in the above background art, the utility model provides a kind of flat plate type semiconductor device steady-state thermal resistance testing device, with the advantage of clamping and fixing semiconductor devices of different shapes and sizes.
[0006] To achieve the above-mentioned purpose, the utility model provides the following technical scheme: a kind of flat plate type semiconductor device steady-state thermal resistance testing device, including bottom plate and the support frame of fixed connection with bottom plate, the upper surface of the bottom plate is fixedly provided with constant-temperature heating plate, the upper surface of the bottom plate is provided with the clamping mechanism for initially fixing semiconductor device by electric push rod, and the clamping part of clamping mechanism is provided with replacement assembly for adapting semiconductor device of different thickness;
[0007] The clamping mechanism includes a fixed plate fixedly connected to the extension end of the electric push rod, one side of the fixed plate is slidably provided with two T-shaped blocks fixedly connected to two support plates, one side of the support plate is slidably provided with a plurality of telescopic rods, a worm is rotatably provided in the support plate for driving the rotation of the threaded rod, and one end of the threaded rod is provided with a limit block fixedly connected to one end of the telescopic spring.
[0008] Preferably, the support plate interior aliquot array is provided with a plurality of limiting grooves for sliding of one end of the telescopic rod, one end of the telescopic rod close to the telescopic spring is fixedly connected with one end of the telescopic spring, the limiting groove inner wall is slidably connected with the limiting block surface, and the other end of the telescopic spring is fixedly connected with the limiting block close to the telescopic rod.
[0009] Preferably, the limiting groove inner wall away from the limiting block side is movably inserted with one end of the threaded rod, and the threaded rod end close to the telescopic rod is screwedly connected with the limiting block middle part.
[0010] Preferably, the worm away from the fixed plate end is movably inserted into the support plate and extends to the outside, the surface of the threaded rod away from the telescopic rod end is fixedly sleeved with a worm wheel engaged with the worm, and the worm end away from the fixed plate is fixedly provided with a knob.
[0011] Preferably, the replacement assembly comprises a clamping groove provided on the telescopic rod side away from the telescopic spring, and a short anti-skid block clamped with the clamping groove inner wall.
[0012] Preferably, the bottom plate upper surface is fixedly connected with the two electric push rods bottom parts, the two electric push rod telescopic end faces are fixedly connected with the fixed plate bottom part, the fixed plate close to the support plate side is provided with T-shaped grooves for sliding of the two T-shaped blocks, and the two T-shaped blocks close to the support plate side are fixedly connected with the two support plates close to the two T-shaped blocks.
[0013] Preferably, the fixed plate inner cavity two ends are movably penetrated by bidirectional threaded rods screwedly connected with the two T-shaped blocks, and the bidirectional threaded rods are fixedly provided with rotating wheels on the fixed plate external end faces.
[0014] Preferably, the constant temperature heating plate top is fixedly provided with a second standard thermal resistance, the support frame inner side left end face is fixedly provided with a temperature sensor, the support frame inner side top is fixedly provided with a cooling plate through a constant pressure air cylinder, and the cooling plate bottom is fixedly provided with a first standard thermal resistance.
[0015] Compared with the prior art, the utility model has the advantages that:
[0016] 1、The utility model discloses a clamping mechanism can be clamped and fixed to different shape and size semiconductor devices, can prevent the semiconductor device from deviating in the test process, thereby leading to inaccurate test result, through being provided with replacement assembly, can be clamped and fixed to different thickness semiconductor devices, can make the device can be clamped and fixed to different shape and size and thickness semiconductor devices. DRAWINGS
[0017] Figure 1 It is the whole axial measurement front view structure schematic diagram of the utility model;
[0018] Figure 2 It is the whole shaft measurement rear view structure schematic diagram of the utility model;
[0019] Figure 3 It is the clamping mechanism structure schematic diagram of the utility model;
[0020] Figure 4 It is the utility model Figure 3 It is the A area amplification schematic diagram in the middle;
[0021] Figure 5 It is the fixed plate structure schematic diagram of the utility model;
[0022] Figure 6 It is the replacement assembly structure schematic diagram of the utility model;
[0023] Figure 7 It is the long anti-skid block structure schematic diagram of the utility model.
[0024] In the figure: 1, bottom plate;11, support frame;12, constant pressure cylinder;13, cooling plate;14, electric push rod;15, first standard thermal resistance;16, second standard thermal resistance;17, constant temperature heating plate;18, temperature sensor;
[0025] 2, clamping mechanism;21, fixed plate;22, runner;23, two-way threaded rod;24, T-shaped block;25, support plate;26, limit slot;27, extension spring;28, extension rod;29, threaded rod;210, worm wheel;211, worm;212, knob;213, limit block;
[0026] 3, replacement assembly;31, clamping groove;32, long anti-skid block;33, short anti-skid block;
[0027] 4, semiconductor device. DETAILED DESCRIPTION
[0028] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the utility model.
[0029] Embodiment 1
[0030] As Figures 1-2As shown, the utility model provides a flat-plate semiconductor device steady-state thermal resistance test device, including a base plate 1 and a support frame 11 fixedly connected to the base plate 1, the upper surface of the base plate 1 is fixedly connected to the bottom surface of a constant temperature heating plate 17, the top surface of the constant temperature heating plate 17 is fixedly connected to the bottom surface of a second standard thermal resistor 16, the second standard thermal resistor 16 can be heated by the constant temperature heating plate 17, and the heat is transferred to the semiconductor device 4 through heat transfer, the bottom surface of the semiconductor device 4 is in contact with the top surface of the second standard thermal resistor 16, the inner top surface of the support frame 11 is fixedly connected to the top surface of a constant pressure cylinder 12, and the constant pressure cylinder 12 outputs The end surface is fixedly connected to the top surface of the cooling plate 13, and the bottom surface of the cooling plate 13 is fixedly connected to the top surface of the first standard thermal resistor 15. The first standard thermal resistor 15 and the cooling plate 13 absorb the heat of the semiconductor device 4 through heat transfer. The side of the support frame 11 close to the rotating wheel 22 is fixedly connected to the left side of the temperature sensor 18. A display screen is provided on the surface of the temperature sensor 18. The constant pressure cylinder 12 has a built-in pressure sensor. The built-in pressure sensor and the temperature sensor 18 are both connected to the display screen. The current pressure and temperature changes of the semiconductor device 4 can be displayed in real time and accurately through the display screen.
[0031] The direct connection between the display screen and the pressure sensor and the temperature sensor 18 is a prior art and will not be described in detail here.
[0032] like Figures 3-7 As shown, the clamping mechanism 2 includes a fixing plate 21 fixedly connected to the output ends of the two electric push rods 14, and the two electric push rods 14 are fixedly connected to the upper surface of the base plate 1. The height of the fixing plate 21 and the support plate 25 can be adjusted by the two electric push rods 14, so that the surface of the support plate 25 is close to the upper surface of the second standard thermal resistor 16 with a certain gap, which will not affect the movement of the support plate 25. A T-shaped groove is provided on one side of the fixing plate 21 close to the support plate 25, and two T-shaped blocks 24 are slidingly provided on the inner walls of the T-shaped groove. A bidirectional threaded rod 23 is movably passed through the inner cavity of the fixing plate 21, and the bidirectional threaded rod 23 is respectively threadedly connected to the middle parts of the two T-shaped blocks 24. The distance between the two T-shaped blocks 24 can be controlled by rotating the rotating wheel 22, and the size of the semiconductor device 4 that can be clamped by the clamping mechanism 2 can be further adjusted.
[0033] Two T-shaped blocks 24 are fixedly connected with two support plates 25 near the fixed plate 21, respectively, and the support plates 25 are equally divided to form a plurality of limiting grooves 26, the limiting grooves 26 are slidably provided with telescopic rods 28, the limiting blocks 213 are slidably connected with the inner walls of the limiting grooves 26, the limiting blocks 213 are fixedly connected with one end of the telescopic springs 27, the telescopic rods 28 are fixedly connected with the other end of the telescopic springs 27, the telescopic springs 27 are movably sleeved on the outside of the threaded rods 29, the inner side surfaces of the limiting blocks 213 are threadedly connected with the surfaces of the threaded rods 29, when the limiting blocks 213 move towards the position of the worm wheel 210, the threaded rods 29 will enter the middle part of the telescopic springs 27 and will not directly contact the telescopic springs 27, the surfaces of the threaded rods 29 near the one end of the worm gear 211 are fixedly sleeved with the worm wheel 210, the worm wheel 210 is engaged with the worm gear 211, the front end of the worm gear 211 is fixedly connected with the back surface of the knob 212, the knob 212 can drive the worm wheel 210 and the threaded rod 29 to rotate through the worm gear 211, further moves the limiting blocks 213, thereby simultaneously adjusting the tightness of the telescopic springs 27 in the limiting grooves 26, and the hardness of the telescopic rods 28 can be adjusted, the replacement assembly 3 comprises the clamping groove 31 formed in the end of the telescopic rod 28 and the short anti-skid block 33 clamped with the clamping groove 31, the bottom of the short anti-skid block 33 is spaced apart from the second standard thermal resistance 16, and the movement of the telescopic rod 28 is not hindered, the middle cylindrical part of the clamping end of the short anti-skid block 33 is made of silica gel material, the friction can be increased, the insertion into the clamping groove 31 is more stable, and the short anti-skid block 33 is not easily moved, the anti-skid surface of the short anti-skid block 33 is made of high-temperature-resistant silica gel material, so that the semiconductor device 4 is prevented from sliding and the excessive heat is prevented from being absorbed to affect the test.
[0034] Embodiment 2
[0035] The difference between the embodiment 1 and the embodiment 2 is that the short anti-skid block 33 in the replacement assembly 3 can be replaced by the long anti-skid block 32, compared with the length of the short anti-skid block 33 and the silica gel part of the anti-skid end surface, the long anti-skid block 32 is longer, and the thicker semiconductor device 4 can be better clamped and fixed.
[0036] Principle and process of the utility model:
[0037] First, turn on the two electric push rods 14, so that the fixed plate 21 and the support plate 25 move up and down, adjust the support plate 25 to fit the surface of the second standard thermal resistance 16, rotate the rotating wheel 22, so that the two-way threaded rod 23 drives the two T-shaped blocks 24 to move, further increasing the distance between the two support plates 25, so that the telescopic rod 28 clamps the semiconductor device 4 of different sizes, rotating the knob 212 can drive the worm 211 to rotate the worm gear 210, and the worm gear 210 rotates synchronously to drive the threaded rod 29 to rotate, further driving the limiting block 213 to slide in the limiting groove 26, so that the maximum distance between the limiting block 213 and the telescopic rod 28 can be adjusted. When the maximum distance increases, the length of the telescopic spring 27 is longer, so that the telescopic spring 27 is more easily compressed, further reducing the hardness of the telescopic rod 28, and vice versa. After adjusting the telescopic rod 28 to the appropriate softness, place the semiconductor device 4 to be tested on the second standard thermal resistance 16, and when the semiconductor device 4 is thin, directly insert the short anti-skid block 33 at one end of the telescopic rod 28, then rotate the rotating wheel 22, so that the two-way threaded rod 23 drives the distance between the two T-shaped blocks 24 and the support plate 25 to gradually decrease. After the short anti-skid block 33 contacts the semiconductor device 4, the support plate 25 continues to move towards the semiconductor device 4 to be tested, which will cause the telescopic rod 28 to move in the opposite direction, thereby further compressing the telescopic spring 27. The telescopic spring 27 is compressed at the same time, which will generate an opposite elastic force on the telescopic rod 28 and the short anti-skid block 33, so that the short anti-skid block 33 gradually clamps and fixes the semiconductor device 4 to be tested. When the semiconductor device 4 is thick, the short anti-skid block 33 needs to be replaced with the long anti-skid block 32 inserted into the clamping groove 31 of the telescopic rod 28, so as to better clamp it.
[0038] Then start the constant pressure cylinder 12, which pushes the cooling plate 13 and the first standard thermal resistance 15 downward, so that the pressure of the first standard thermal resistance 15 when it abuts against the surface of the semiconductor device 4 to be tested reaches the preset value. Start the constant temperature heating plate 17 to heat the second standard thermal resistance 16, which transfers heat to the semiconductor device 4 to be tested. The first standard thermal resistance 15 will absorb the heat of the semiconductor device 4 to be tested through heat transfer, and then consume the heat through the cooling plate 13. The temperature of the surface of the semiconductor device 4 to be tested can be observed through the temperature sensor 18. When the temperature no longer changes, it means that the steady state has been reached, and the steady state thermal resistance of the semiconductor device 4 can be further measured and calculated.
[0039] When detecting the semiconductor, the detection method such as heating or cooling detection can also use the existing detection method.
[0040] It is to be noted that, in the present document, relational terms such as first and second and the like can be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises", "comprising", or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus.
[0041] While the embodiments of the present application have been illustrated and described, it will be understood by those skilled in the art that various changes, modifications, substitutions, and alterations can be made therein without departing from the spirit and scope of the application, which is defined by the appended claims and their equivalents.
Claims
1. A device for testing the steady-state thermal resistance of a flat-plate semiconductor device, comprising a base plate (1) and a support frame (11) fixedly connected to the base plate (1), characterized in that: A constant temperature heating plate (17) is fixedly provided on the upper surface of the base plate (1); a clamping mechanism (2) for preliminarily fixing the semiconductor device (4) is provided on the upper surface of the base plate (1) via an electric push rod (14); and a replacement component (3) for adapting to semiconductor devices (4) of different thicknesses is provided on the clamping portion of the clamping mechanism (2); The clamping mechanism (2) comprises a fixed plate (21) fixedly connected to the telescopic end of the electric push rod (14); two T-shaped blocks (24) fixedly connected to two support plates (25) are slidably provided on one side of the fixed plate (21); a plurality of telescopic rods (28) are slidably provided on one side of the support plate (25); a worm (211) for driving a threaded rod (29) to rotate is rotatably provided inside the support plate (25); and a limit block (213) fixedly connected to one end of a telescopic spring (27) is provided at one end of the threaded rod (29).
2. The device for testing the steady-state thermal resistance of a flat-plate semiconductor device according to claim 1, wherein: The support plate (25) is provided with a plurality of equally divided arrays of limit slots (26) for sliding one end of the telescopic rod (28), one end of the telescopic rod (28) close to the telescopic spring (27) is fixedly connected to one end of the telescopic spring (27), the inner wall of the limit slot (26) is slidably connected to the surface of the limit block (213), and the other end of the telescopic spring (27) is fixedly connected to one side of the limit block (213) close to the telescopic rod (28).
3. The device for testing the steady-state thermal resistance of a flat-plate semiconductor device according to claim 2, wherein: The inner wall of the limiting groove (26) is movably interlaced with one end of the threaded rod (29) at a side away from the limiting block (213), and the end of the threaded rod (29) close to the telescopic rod (28) is threadedly connected to the middle of the limiting block (213).
4. The device for testing steady-state thermal resistance of a flat-plate semiconductor device according to claim 1, wherein: The end of the worm (211) away from the fixed plate (21) movably penetrates the support plate (25) and extends to the outside; the surface of the threaded rod (29) away from the telescopic rod (28) is fixedly sleeved with a worm wheel (210) engaged with the worm (211); and the end of the worm (211) away from the fixed plate (21) is fixedly provided with a knob (212).
5. The device for testing steady-state thermal resistance of a flat-plate semiconductor device according to claim 1, wherein: The replacement assembly (3) comprises a slot (31) provided on a side of the telescopic rod (28) away from the telescopic spring (27), and a short anti-sliding block (33) engaged with the inner wall of the slot (31).
6. The device for testing steady-state thermal resistance of a flat-plate semiconductor device according to claim 1, wherein: The upper surface of the bottom plate (1) is fixedly connected to the bottoms of the two electric push rods (14), and the telescopic end surfaces of the two electric push rods (14) are fixedly connected to the bottom of the fixed plate (21). The two ends of the fixed plate (21) close to the support plate (25) are provided with T-shaped grooves for the two T-shaped blocks (24) to slide, and the sides of the two T-shaped blocks (24) close to the support plate (25) are respectively fixedly connected to the sides of the two support plates (25) close to the two T-shaped blocks (24).
7. The device for testing steady-state thermal resistance of a flat-plate semiconductor device according to claim 1, wherein: Two bidirectional threaded rods (23) threadedly connected to two T-shaped blocks (24) are movably passed through the two ends of the inner cavity of the fixing plate (21); a rotating wheel (22) is fixedly provided on the outer end surface of the bidirectional threaded rod (23) located on the fixing plate (21).
8. The device for testing steady-state thermal resistance of a flat-plate semiconductor device according to claim 1, wherein: A second standard thermal resistor (16) is fixedly provided on the top of the constant temperature heating plate (17), a temperature sensor (18) is fixedly provided on the left end face of the inner side of the support frame (11), a cooling plate (13) is fixedly provided on the top of the inner side of the support frame (11) via a constant pressure cylinder (12), and a first standard thermal resistor (15) is fixedly provided on the bottom of the cooling plate (13).