Optical module
By setting support columns and elastic parts in the shell of the optical module to absorb the extrusion force, the problem of bending deformation of the circuit board caused by extrusion of the heat sink is solved, the risk of chip failure is reduced, and the reliability of the optical module is improved.
Patent Information
- Application Number
- CN202421983451.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-15
- Publication Date
- 2025-10-17
- Estimated Expiration
- 2034-08-15
AI Technical Summary
When the optical module is inserted into the external electrical connector, the circuit board is squeezed by the heat sink and causes bending and deformation, increasing the risk of chip failure.
A shell structure consisting of an upper shell and a lower shell is adopted. A first support column and a second support column are provided in the shell. A first protrusion and an elastic member are provided on the support column. The Shore hardness of the elastic member is smaller than that of the protrusion and is used to absorb the extrusion force and reduce the deformation of the circuit board.
The design of support columns and elastic parts reduces the deformation of the circuit board, lowers the risk of chip failure, and improves the reliability of the optical module.
Smart Images
Figure CN223450199U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present disclosure relates to the field of communication technology, and in particular to an optical module. BACKGROUND
[0002] In cloud computing, mobile Internet, video and other new business and application mode, optical communication technology will be used. In optical communication, optical module is a tool for converting optical and electrical signals, and is one of the key devices in optical communication equipment.
[0003] With the development of optical module to high speed, integration and intelligence, its reliability is becoming more and more important. Especially mechanical reliability, under the trend of miniaturization and densification of electronic devices, it is more and more prominent. The main functional area of the optical module is packaged in the alloy shell, and the circuit board assembly plays a key role in the functional area, and the circuit board is connected with the connector outside through the gold finger end to transmit signals.
[0004] When the optical module is inserted into the external electrical connector, the circuit board is pressed by the heat sink on the upper part of the optical module shell, causing the circuit board of the optical module to interfere with the electrical connector, so that the circuit board is bent and deformed, which is easy to cause the chip on the circuit board to fail. CONTENT OF THE INVENTION
[0005] The present disclosure provides an optical module to reduce the risk of chip failure on the circuit board of the optical module.
[0006] To solve the above technical problems, the present disclosure discloses the following technical solutions:
[0007] In a first aspect, the present disclosure discloses an optical module, comprising:
[0008] The upper shell comprises a cover plate, and first and second support columns on both sides of the cover plate;
[0009] The first support column comprises:
[0010] A first column body, one end of which is connected to the cover plate;
[0011] A first protrusion, one end of which is connected to the first column body, the cross-sectional area of the first protrusion being smaller than that of the first column body, the first protrusion being protruded away from the cover plate relative to the first column body;
[0012] The lower shell is covered with the upper shell to form a shell;
[0013] A circuit board is arranged inside the shell; one end of the circuit board abuts against the electrical connector;
[0014] The upper surface of the cover plate is subjected to a downward force from the external cage;
[0015] A first elastic member is sleeved on the outside of the first protrusion, and a lower surface of the first elastic member is lower than a lower surface of the first protrusion when the cover plate is not stressed.
[0016] The Shore hardness of the first elastic member is less than the Shore hardness of the first protrusion.
[0017] In a second aspect, the disclosure provides an optical module, comprising:
[0018] The upper shell comprises a cover plate and first and second support columns on both sides of the cover plate.
[0019] The first support column comprises:
[0020] A first column is connected to one end of the cover plate.
[0021] A first protrusion is connected to one end of the first column, the cross-sectional area of the first protrusion is smaller than that of the first column, and the first protrusion protrudes away from the cover plate relative to the first column.
[0022] A lower shell is covered with the upper shell to form a shell.
[0023] A circuit board is arranged inside the shell, and one end of the circuit board abuts against the electrical connector.
[0024] An upper surface of the cover plate is subjected to a downward force from an external cage.
[0025] A first elastic member is sleeved on the outside of the first protrusion, and a lower surface of the first elastic member abuts against an upper surface of the circuit board, and a gap is formed between a lower surface of the first protrusion and the circuit board.
[0026] Compared with the prior art, the present disclosure has the following advantages:
[0027] The present disclosure discloses an optical module, comprising: a housing formed by an upper housing and a lower housing that cover each other, and a circuit board disposed within the housing. The upper housing includes a cover plate, and first and second support columns located on either side of the cover plate. The first support column includes a first column and a first protrusion, with the first column disposed between the cover plate and the first protrusion. One end of the circuit board rests within an electrical connector, which applies a force to the circuit board along its length. When the upper surface of the cover plate is subjected to compressive force from an external cage, the first support column compresses the circuit board, applying a downward force to the circuit board. A first elastic member is disposed outside the first protrusion. When the cover plate is not subjected to force, the lower surface of the first elastic member is lower than the lower surface of the first protrusion. The first elastic member is located between the first column and the circuit board, and the Shore hardness of the first elastic member is lower than that of the first protrusion. The first elastic member deforms when compressed, reducing the force applied to the circuit board, thereby minimizing deformation and reducing the risk of chip failure on the optical module circuit board. BRIEF DESCRIPTION OF THE DRAWINGS
[0028] To more clearly illustrate the technical solutions of the present disclosure, the following briefly introduces the drawings required for use in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure, and those skilled in the art can also derive other drawings based on these drawings. Furthermore, the drawings described below are schematic diagrams and are not intended to limit the actual dimensions of the products, actual processes of the methods, actual timing of signals, and the like involved in the embodiments of the present disclosure.
[0029] Figure 1 A partial architecture diagram of an optical communication system according to some embodiments;
[0030] Figure 2 A partial structural diagram of a host computer provided according to some embodiments;
[0031] Figure 3 A structural diagram of an optical module and a cage according to some embodiments;
[0032] Figure 4 An exploded structural diagram of an optical module and a cage according to some embodiments;
[0033] Figure 5 An exploded view of an optical module according to some embodiments;
[0034] Figure 6 A schematic cross-sectional view of a cage and a light module according to some embodiments;
[0035] Figure 7 for Figure 6 Middle partial schematic diagram;
[0036] Figure 8 is a schematic cross-sectional view of an electrical connector provided according to some embodiments;
[0037] Figure 9 A schematic diagram of an upper housing structure provided according to some embodiments;
[0038] Figure 10 A schematic diagram of the structure of a second circuit board provided according to some embodiments;
[0039] Figure 11 for Figure 9 Schematic diagram of the local structure;
[0040] Figure 12 for Figure 10 A partial schematic diagram of
[0041] Figure 13 A schematic diagram of a connection between a first elastic member and a first protrusion according to some embodiments;
[0042] Figure 14 This is a schematic diagram of a first elastic member, a first protrusion, and a second circuit board before being subjected to force according to some embodiments;
[0043] Figure 15 A schematic diagram of a first elastic member, a first protrusion, and a second circuit board after being subjected to force according to some embodiments;
[0044] Figure 16 A schematic diagram of a lower shell structure provided according to some embodiments Figure 1 ;
[0045] Figure 17 A schematic diagram of a lower shell structure provided according to some embodiments Figure 2 . DETAILED DESCRIPTION
[0046] Optical communication technology enables information transmission between information processing devices. It loads information onto light and uses the propagation of light to achieve this transmission. Light loaded with information is an optical signal. The propagation of optical signals within information transmission equipment reduces optical power loss, enabling high-speed, long-distance, and low-cost information transmission. The information processed by information processing equipment exists in the form of electrical signals. Optical network terminals / gateways, routers, switches, mobile phones, computers, servers, tablets, and televisions are common information processing devices, and optical fibers and optical waveguides are common information transmission devices.
[0047] The optical signal and the electrical signal between the information processing device and the information transmission device are converted by the optical module. For example, the optical fiber is connected to the optical signal input end and / or the optical signal output end of the optical module, and the optical network terminal is connected to the electrical signal input end and / or the electrical signal output end of the optical module. The first optical signal from the optical fiber is transmitted into the optical module, the optical module converts the first optical signal into the first electrical signal, and the optical module transmits the first electrical signal into the optical network terminal. The second electrical signal from the optical network terminal is transmitted into the optical module, the optical module converts the second electrical signal into the second optical signal, and the optical module transmits the second optical signal into the optical fiber. Since the information processing devices can be connected to each other through an electrical signal network, at least one type of information processing device needs to be directly connected to the optical module, and all types of information processing devices do not need to be directly connected to the optical module. The information processing device directly connected to the optical module is called the host computer of the optical module.
[0048] Figure 1 A partial architecture diagram of an optical communication system is provided according to some embodiments. As shown in Figure 2 the partial architecture of the optical communication system is shown as a remote information processing device 1000, a local information processing device 2000, a host computer 100, an optical module 200, an optical fiber 101, and a network cable 103.
[0049] One end of the optical fiber 101 extends to the remote information processing device 1000, and the other end is connected to the optical interface of the optical module 200. The optical signal can be totally reflected in the optical fiber 101, and the propagation of the optical signal in the total reflection direction can maintain the original optical power. The optical signal is totally reflected multiple times in the optical fiber 101, and the optical signal from the remote information processing device 1000 is transmitted into the optical module 200, or the optical signal from the optical module 200 is propagated to the remote information processing device 1000, realizing long-distance and low-power loss information transmission.
[0050] The number of optical fibers 101 can be one or more (two or more). The optical fiber 101 and the optical module 200 are connected in a plug-in manner, or they can be fixedly connected.
[0051] The host computer 100 has an optical module interface 102 configured to connect to the optical module 200, so that the host computer 100 and the optical module 200 establish a one-way / two-way electrical signal connection. The host computer 100 is configured to provide a data signal to the optical module 200, or receive a data signal from the optical module 200, or monitor and control the working state of the optical module 200.
[0052] The host computer 100 has external electrical interfaces, such as a Universal Serial Bus (USB) interface, a network interface 104, which can access an electrical signal network. For example, the network interface 104 is configured to access a network cable 103, so that the host computer 100 establishes a one-way / two-way electrical signal connection with the network cable 103.
[0053] The optical network unit (ONU), the optical line terminal (OLT), the optical network terminal (ONT), and the data center server are common host computers.
[0054] One end of the network cable 103 is connected to the local information processing device 2000, and the other end is connected to the host computer 100. The network cable 103 establishes an electrical signal connection between the local information processing device 2000 and the host computer 100.
[0055] For example, the third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 through the network cable 103. The host computer 100 generates a second electrical signal based on the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200. The optical module 200 converts the second electrical signal into a second optical signal. The optical module 200 transmits the second optical signal to the optical fiber 101. The second optical signal propagates in the optical fiber 101 towards the remote information processing device 1000.
[0056] For example, the first optical signal from the remote information processing device 1000 propagates through the optical fiber 101. The first optical signal from the optical fiber 101 is transmitted to the optical module 200. The optical module 200 converts the first optical signal into a first electrical signal. The optical module 200 transmits the first electrical signal to the host computer 100. The host computer 100 generates a fourth electrical signal based on the first electrical signal. The host computer 100 transmits the fourth electrical signal to the local information processing device 2000.
[0057] The optical module is a tool for converting optical signals and electrical signals. In the conversion process of the optical signals and the electrical signals, the information does not change, and the encoding and decoding mode of the information can change.
[0058] Figure 2 A partial structure diagram of a host computer according to some embodiments is provided. In order to clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 3 Only the structure related to the optical module 200 and the host computer 100 is shown. For example, Figure 4As shown, the host computer 100 further comprises a PCB circuit board 105 arranged in the housing, a cage 106 arranged on the surface of the PCB circuit board 105, a heat sink 107 arranged on the cage 106, and an electrical connector (not shown in the figure) arranged inside the cage 106. The heat sink 107 has a protruding structure to increase the heat dissipation area, and the fin-shaped structure is a common protruding structure.
[0059] The optical module 200 is inserted into the cage 106 of the host computer 100, and the optical module 200 is fixed by the cage 106. The heat generated by the optical module 200 is conducted to the cage 106, and then diffused through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical interface of the optical module 200 is connected with the electrical connector inside the cage 106.
[0060] Figure 5 A structural diagram of an optical module and a cage according to some embodiments, Figure 3 An exploded structural diagram of an optical module and a cage according to some embodiments. The optical module 200 is inserted into the cage 106 of the host computer 100, and the optical module 200 is fixed by the cage 106. After the optical module 200 is inserted into the cage 106, the electrical interface of the optical module 200 is connected with the electrical connector 1061 inside the cage 106.
[0061] Figure 4 An exploded diagram of an optical module according to some embodiments. As shown in Figure 5 , Figure 3 and Figure 3 , the optical module 200 comprises a housing, a circuit board 300 arranged in the housing, a light emitting component 400, and a light receiving component 500. However, the present disclosure is not limited thereto, and in some embodiments, the optical module 200 comprises one of the light emitting component 400 and the light receiving component 500.
[0062] The housing comprises an upper housing 201 and a lower housing 202. The upper housing 201 is covered on the lower housing 202 to form the above-mentioned housing with two openings 204 and 205. The outer contour of the housing generally presents a square body.
[0063] In some embodiments, the lower housing 202 comprises a bottom plate 2021 and two lower side plates 2022 arranged on both sides of the bottom plate 2021 and perpendicular to the bottom plate 2021. The upper housing 201 comprises a cover plate 2011, which is covered on the two lower side plates 2022 of the lower housing 202 to form the above-mentioned housing.
[0064] In some embodiments, the lower shell 202 includes a base plate 2021 and a first lower side plate 2022 and a second lower side plate 2023 located on both sides of the base plate 2021 and arranged perpendicularly to the base plate 2021; the upper shell 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and arranged perpendicularly to the cover plate 2011, and the two upper side plates are combined with the two lower side plates to realize that the upper shell 201 is covered on the lower shell 202.
[0065] The direction of the line connecting the two openings 204 and 205 may be consistent with the length direction of the optical module 200, or may be inconsistent with the length direction of the optical module 200. For example, the opening 204 is located at the end of the optical module 200 ( Figure 4 The opening 205 is also located at the end of the optical module 200 ( Figure 6 Alternatively, opening 204 is located at the end of optical module 200, while opening 205 is located on the side of optical module 200. Opening 204 is an electrical interface, through which the gold fingers of circuit board 300 extend and are inserted into the electrical connector of the host computer; opening 205 is an optical port, configured to receive optical fiber 101, thereby connecting optical fiber 101 to the optical emitting component 400 and / or optical receiving component 500 in optical module 200.
[0066] The combined assembly of the upper and lower housings 201 and 202 facilitates the installation of components such as the circuit board 300, light emitting component 400, and light receiving component 500 within the housings. These components are encapsulated and protected by the upper and lower housings 201 and 202. Furthermore, during assembly of the circuit board 300, light emitting component 400, and light receiving component 500, positioning components, heat dissipation components, and electromagnetic shielding components are easily positioned, facilitating automated production.
[0067] In some embodiments, the upper shell 201 and the lower shell 202 are made of metal materials, which facilitates electromagnetic shielding and heat dissipation.
[0068] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.
[0069] For example, the unlocking component 600 is located outside the two lower side plates 2022 of the lower shell 202, and includes a clamping component matched with the cage 106 of the upper host. When the optical module 200 is inserted into the cage 106, the optical module 200 is fixed in the cage 106 by the clamping component of the unlocking component 600; when the unlocking component 600 is pulled, the clamping component of the unlocking component 600 moves, thereby changing the connection relationship of the clamping component with the upper host, so as to release the clamping and fixed connection of the optical module 200 with the upper host, so that the optical module 200 can be pulled out of the cage 106.
[0070] The circuit board 300 includes circuit traces, electronic components, and chips, etc. The electronic components and chips are connected together according to circuit design through the circuit traces to realize power supply, electrical signal transmission, and grounding functions. The electronic components may, for example, include capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). The chips may, for example, include microcontroller units (MCUs), laser drive chips, transimpedance amplifiers (TIAs), limiting amplifiers, clock and data recovery chips (CDRs), power management chips, and digital signal processing (DSP) chips.
[0071] The circuit board 300 is generally a hard circuit board. Due to its relatively hard material, the hard circuit board can also realize a bearing function, such as stably bearing the above-mentioned electronic components and chips. The hard circuit board is also convenient for being inserted into an electrical connector in the cage of the upper host.
[0072] The circuit board 300 also includes a gold finger formed on the surface of the end thereof. The gold finger is composed of a plurality of independent pins. The circuit board 300 is inserted into the cage 106, and the gold finger is in conduction with the electrical connector in the cage 106. The gold finger can be arranged only on the surface of one side of the circuit board 300 (for example, the upper surface shown in the figure), or can be arranged on the surfaces of both upper and lower sides of the circuit board 300 to provide more pins. The gold finger is configured to establish electrical connection with the upper host to realize power supply, grounding, I2C signal transmission, data signal transmission, etc. Figure 7
[0073] Of course, flexible circuit boards are also used in some optical modules. The flexible circuit board is generally used in cooperation with the hard circuit board to serve as a supplement to the hard circuit board.
[0074] The light emitting component 400 and / or the light receiving component 500 are located on the side of the circuit board 300 away from the golden fingers; in some embodiments, the light emitting component 400 and the light receiving component 500 are physically separated from the circuit board 300, and then are electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors; in some embodiments, the light emitting component and / or the light receiving component can be directly arranged on the circuit board 300, and can be arranged on the surface of the circuit board or on the side of the circuit board.
[0075] When the optical module 200 is in the cage 106, the cage exerts pressure on the upper shell of the optical module, and the upper shell transmits the force to the circuit board. The golden finger end of the circuit board 300 is connected to the electrical connector 1061 in the cage 106, and the electrical connector 1061 exerts a rightward pressure on the circuit board 300. The double forces make the circuit board bend towards the upper shell, and the bending moment at the connection between the circuit board and the upper shell is too large to cause high stress, which causes the chips adjacent to the connection between the upper shell and the circuit board to be abnormal.
[0076] Figure 6 A cage and an optical module cross-sectional view are provided according to some embodiments, Figure 8 A partial view is provided. Figure 6 A partial view is provided. Figure 7 A cross-sectional view of an electrical connector is provided according to some embodiments. As shown in Figure 8 , Figure 9 and Figure 10 The electrical connector 1061 can include an upper connecting portion 10611. The upper connecting portion 10611 can be in contact with the upper surface of the circuit board. In some embodiments, the upper surface of the second circuit board 320 is connected to the upper connecting portion 10611.
[0077] The electrical connector 1061 can include a lower connecting portion 10612. The lower connecting portion 10612 can be in contact with the lower surface of the circuit board. In some embodiments, the lower surface of the second circuit board 320 is connected to the lower connecting portion 10621.
[0078] The electrical connector 1061 can include a bridge portion 10613. The bridge portion 10613 is used to connect the upper connecting portion 10611 and the lower connecting portion 10612. The bridge portion 10613 is located between the upper connecting portion 10611 and the lower connecting portion 10612. A connecting slot 10614 is provided between the upper connecting portion 10611 and the lower connecting portion 10612. The end of the circuit board can be embedded in the connecting slot 10614, and the end of the circuit board abuts against the side wall of the bridge portion 10613.
[0079] In some embodiments, the circuit board 300 can include a first circuit board 310 and a second circuit board 320. The first circuit board 310 can be disposed above the second circuit board 320. The first circuit board 310 can be connected with the second circuit board 320 through a connector. An end of the second circuit board 320 abuts against a side wall of the bridging portion 10613.
[0080] During assembly, one end of the second circuit board 320 enters the electrical connector 1061 through the opening of the connecting slot 10614 to the right, and the second circuit board 320 abuts against the side wall of the bridging portion 10613. The bridging portion 10613 exerts a leftward force on the second circuit board 320.
[0081] Figure 9 A schematic diagram of an upper shell structure according to some embodiments. Figure 10 A schematic diagram of a second circuit board structure according to some embodiments. As shown in Figure 11 and Figure 9 The upper shell 201 can include a first support column 2012, one end of which is connected to the cover plate 2011, and the other end of which extends in the direction of the bottom plate 2022.
[0082] The upper shell 201 can include a second support column 2013, one end of which is connected to the cover plate 2011, and the other end of which extends in the direction of the bottom plate 2022.
[0083] The first support column 2012 protrudes downward in the direction of the bottom plate of the lower shell 202. When the cover plate 2011 is subjected to a downward force from the cage 106, the lower surface of the first support column 2012 can abut against the surface of the second circuit board 320.
[0084] The second support column 2013 protrudes downward in the direction of the bottom plate of the lower shell 202. When the cover plate 2011 is subjected to a downward force from the cage 106, the lower surface of the second support column 2013 can abut against the surface of the second circuit board 320.
[0085] The first support column 2012 and the second support column 2013 are symmetrically arranged.
[0086] An end of the second circuit board 320 can be provided with a gold finger 321. The width of the gold finger 321 can be smaller than the width of the body of the second circuit board. The gold finger 321 can be inserted into the interior of the electrical connector 1061.
[0087] The gold finger 321 is inserted into the electrical connector 1061 from the opening of the connecting slot 10614 until the end of the gold finger 321 abuts against the side wall of the bridging portion 10613.
[0088] The second circuit board 320 may include a first embedding portion 322 , into which the first support column 2012 may be embedded.
[0089] The second circuit board 320 may include a second fitting portion 323 . The second support column 2013 may be fitted into the second fitting portion 323 .
[0090] A first chip 340 may be provided on the upper surface of the second circuit board 320. The distance between the edge of the first chip 340 and the line connecting the first interlocking portion 322 and the second interlocking portion 323 is less than 0.5 mm. The shortest distance between the edge of the first chip and the line connecting the first and second support pillars is less than or equal to 0.5 mm. Deformation of the second circuit board 320 increases stress on the first chip 340, resulting in poor contact of the first chip 340.
[0091] Figure 12 for Figure 10 Schematic diagram of the local structure. Figure 11 for Figure 12 A partial schematic diagram of . Figure 13 and Figure 13 As shown, the first support column 2012 may include a first column 20121 and a first protrusion 20122. One end of the first column 20121 is connected to the cover plate 2011, and the other end of the first column 20121 is connected to the first protrusion 20122.
[0092] The cross-sectional area of the first protrusion 20122 is smaller than the cross-sectional area of the first column 20121. The lower surface of the first protrusion 20122 is raised relative to the lower surface of the first column 20121. The first protrusion is raised relative to the first column in a direction away from the cover plate.
[0093] In some embodiments, the first protrusion 20122 may be a columnar structure, a square structure, a triangular structure, or an irregular structure.
[0094] In some embodiments, the first protrusion 20122 may be a cylindrical boss with a diameter of 0.4-0.6 mm. In some embodiments, the first protrusion 20122 may be a cylindrical boss with a diameter of 0.5 mm.
[0095] In some embodiments, the first protrusion 20122 may have a draft angle of a preset angle to facilitate assembly. The draft angle of the preset angle may be 1° to 5°. For example, the draft angle of the preset angle may be 2°.
[0096] The second supporting column 2013 may include a second column 20131 and a second protrusion 20132 . One end of the second column 20131 is connected to the cover plate 2011 , and the other end of the second column 20131 is connected to the second protrusion 20132 .
[0097] The cross-sectional area of the second protrusion 20132 is smaller than that of the second cylinder 20131. The lower surface of the second protrusion 20132 is protruded relative to the lower surface of the second cylinder 20131.
[0098] In some embodiments, the second protrusion 20132 can be a cylindrical structure. The second protrusion 20132 can be a square structure, and the second protrusion 20132 can also be a triangular structure or an irregular structure. In some embodiments, the second protrusion 20132 can be a cylindrical boss with a diameter of 0.5 mm.
[0099] In some embodiments, the first cylinder 20121 and the second cylinder 20131 are arranged opposite to each other on both sides of the cover plate 2011. The distance between the lower surface of the first cylinder 20121 and the cover plate 2011 is equal to the distance between the lower surface of the second cylinder 20131 and the cover plate 2011.
[0100] The first protrusion 20122 and the second protrusion 20132 are arranged symmetrically on both sides of the cover plate 2011. The distance between the lower surface of the first protrusion 20122 and the cover plate 2011 is equal to the distance between the lower surface of the second protrusion 20132 and the cover plate 2011.
[0101] In some embodiments, the distance between the lower surface of the first protrusion 20122 and the lower surface of the first cylinder 20121 is equal to the distance between the lower surface of the second protrusion 20132 and the lower surface of the second cylinder 20131.
[0102] In some embodiments, the first fitting part 322 can include a first groove 3221 and a second groove 3222 in communication. The depth of the first groove 3221 is greater than that of the second groove 3222. The distance between the bottom surface of the first groove 3221 and the upper surface of the second circuit board 320 is less than the distance between the second groove 3222 and the upper surface of the second circuit board 320.
[0103] The cross-sectional area of the first groove 3221 is smaller than that of the second groove 3222, and the bottom surface of the second groove 3222 forms a stepped surface.
[0104] In some embodiments, the diameter of the first groove 3221 can be 0.8 mm.
[0105] In some embodiments, the second fitting part 323 can include a third groove and a fourth groove in communication. The depth of the third groove is greater than that of the fourth groove. The distance between the bottom surface of the third groove and the upper surface of the second circuit board 320 is less than the distance between the fourth groove and the upper surface of the second circuit board 320.
[0106] The third groove has a smaller cross-sectional area than the fourth groove, and the bottom surface of the fourth groove forms a stepped surface. In some embodiments, the third groove can have a diameter of 0.8 mm.
[0107] Figure 14 A schematic diagram of a first elastic member and a first protrusion according to some embodiments is shown. As shown, in some embodiments, the optical module can include a first elastic member 2014. The first elastic member 2014 can be sleeved on the outside of the first protrusion 20122. Figure 15
[0108] In some embodiments, the first elastic member 2014 can be in overpressure connection with the first protrusion 20122. The Shore hardness of the first elastic member 2014 is less than the Shore hardness of the first protrusion 20122.
[0109] In some embodiments, the Shore hardness of the first elastic member 2014 can be 25-45.
[0110] In some embodiments, when the first column 20121 is not assembled with the first fitting part 322, the lower surface of the first elastic member 2014 is higher than the lower surface of the first protrusion 20122. During the assembly of the first column 20121 and the first fitting part 322, the first elastic member 2014 first contacts the first fitting part 322, and the Shore hardness of the first elastic member 2014 is less than the Shore hardness of the first protrusion 20122, so that the first elastic member 2014 can absorb part of the stress, reduce the stress of the circuit board, and reduce the deformation of the circuit board.
[0111] After assembly, the cover plate is subjected to the downward force of the cage, the first elastic member 2014 contacts the first fitting part 322, and the Shore hardness of the first elastic member 2014 is less than the Shore hardness of the first protrusion 20122, so that the first elastic member 2014 can absorb part of the stress, reduce the stress of the circuit board, and reduce the deformation of the circuit board.
[0112] In some embodiments, the optical module can include a second elastic member. The second elastic member can be sleeved on the outside of the second protrusion 20132.
[0113] In some embodiments, the second elastic member can be in overpressure connection with the second protrusion 20132. The Shore hardness of the second elastic member is less than the Shore hardness of the second protrusion 20132.
[0114] In some embodiments, the Shore hardness of the second elastic member can be 25-45. For example, the Shore hardness of the second elastic member can be 30.
[0115] In some embodiments, when the second elastic member is not assembled with the second engaging portion 323, the lower surface of the second elastic member is higher than the lower surface of the second protrusion 20132. During the assembly process of the second column 20131 and the second engaging portion 323, the second elastic member first contacts the second engaging portion 323. The Shore hardness of the second elastic member is lower than that of the second protrusion 20132, allowing the second elastic member to absorb some stress, reducing the force on the circuit board and minimizing deformation of the circuit board.
[0116] In some embodiments, the distance between the lower surface of the first protrusion 20122 and the lower surface of the first column 20121 is less than the thickness of the first elastic member 2014, that is, in some embodiments, when the first elastic member 2014 is sleeved on the outside of the first protrusion 20122, the distance between the lower surface of the first elastic member 2014 and the lower surface of the first column 20121 is greater than the distance between the lower surface of the first protrusion 20122 and the lower surface of the first column 20121.
[0117] Similarly, the distance between the lower surface of the second protrusion 20132 and the lower surface of the second column 20131 is less than the thickness of the second elastic member, that is, in some embodiments, when the second elastic member is sleeved on the outside of the second protrusion 20132, the distance between the lower surface of the second elastic member and the lower surface of the second column 20131 is greater than the distance between the lower surface of the second protrusion 20132 and the lower surface of the second column 20131.
[0118] Figure 14 This is a schematic diagram of a first elastic member, a first protrusion, and a second circuit board before being subjected to force according to some embodiments. Figure 16 FIG1 is a schematic diagram of a first elastic member, a first protrusion and a second circuit board after being subjected to force according to some embodiments. Figure 1 As shown, in some embodiments, when the optical module is not subjected to the downward force of the cage, the first protrusion 20122 can be embedded in the second groove 3222. A gap exists between the lower surface of the first protrusion 20122 and the bottom surface of the second groove 3222. The distance between the lower surface of the first protrusion 20122 and the bottom surface of the second groove 3222 can be 0.08 to 0.12 mm. The lower surface of the first elastic member 2014 abuts the bottom surface of the second groove 3222.
[0119] In some embodiments, the distance between the lower surface of the first protrusion 20122 and the bottom surface of the second groove 3222 can be 0.1 mm.
[0120] The first column 20121 can be embedded in the first groove 3221. A gap exists between the lower surface of the first column 20121 and the bottom surface of the first groove 3221.
[0121] In some embodiments, the first elastic member 2014 is deformed in the up-down direction after the optical module is subjected to the downward force of the cage, and can absorb part of the stress, reduce the force of the upper shell on the second circuit board, and reduce the stress of the first chip 340.
[0122] In some embodiments, the cross-sectional area of the first protrusion 20122 is smaller than the cross-sectional area of the first groove 3221, so that the first protrusion 20122 can be embedded in the inside of the first groove 3221 after assembly. The outer cross-sectional area of the first elastic member 2014 is larger than the cross-sectional area of the first groove 3221, and the first elastic member 2014 cannot be embedded in the inside of the first groove 3221.
[0123] Similarly, the second protrusion 20132 can be embedded in the fourth groove when the optical module is not subjected to the downward force of the cage. There is a gap between the lower surface of the second protrusion 20132 and the bottom surface of the second groove 3222. The distance between the lower surface of the second protrusion 20132 and the bottom surface of the fourth groove can be 0.08-0.12 mm. The lower surface of the first elastic member 2014 abuts against the bottom surface of the fourth groove.
[0124] In some embodiments, the distance between the lower surface of the second protrusion 20132 and the bottom surface of the fourth groove can be 0.1 mm.
[0125] The second cylinder 20131 can be embedded in the third groove. There is a gap between the lower surface of the second cylinder 20131 and the bottom surface of the third groove.
[0126] In some embodiments, the second elastic member is deformed in the up-down direction after the optical module is subjected to the downward force of the cage, and can absorb part of the stress, reduce the force of the upper shell on the second circuit board, and reduce the stress of the first chip 340.
[0127] In some embodiments, the cross-sectional area of the second protrusion 20132 is smaller than the cross-sectional area of the third groove, so that the second protrusion 20132 can be embedded in the inside of the third groove after assembly. The outer cross-sectional area of the second elastic member is larger than the cross-sectional area of the third groove, and the second elastic member cannot be embedded in the inside of the third groove.
[0128] In some embodiments, the first elastic member and the second elastic member can be high-elasticity rubber.
[0129] In some embodiments, the thickness of the first elastic member is greater than the depth of the second groove. For example, the thickness of the first elastic member and the depth of the second groove are greater than or equal to 0.02 mm.
[0130] In some embodiments, the thickness of the second elastic member is greater than the depth of the fourth groove. For example, the thickness of the second elastic member and the depth of the fourth groove are greater than or equal to 0.02 mm.
[0131] In some embodiments, the first elastic member and the first protrusion can be connected by overpressure.
[0132] In some embodiments, to facilitate installation and positioning of the second circuit board 320 in the optical module, the second circuit board 320 is provided with a first avoidance portion 3201 , and the first avoidance portion 3201 changes the width of the second circuit board 320 .
[0133] In order to facilitate the installation and positioning of the second circuit board 320 in the optical module, the second circuit board 320 is provided with a second avoidance portion 3202 . The second avoidance portion 3202 changes the width of the second circuit board 320 .
[0134] The left end of the connecting line between the first avoidance portion 3201 and the second avoidance portion 3202 is the main body of the second circuit board 320 , and the right side of the connecting line between the first avoidance portion 3201 and the second avoidance portion 3202 is the gold finger portion of the second circuit board 320 . The width of the main body is greater than the width of the gold finger portion.
[0135] In some embodiments, the first chip 340 is located on the left side of the connection line between the first avoiding portion 3201 and the second avoiding portion 3202 .
[0136] Figure 17 A schematic diagram of a lower shell structure provided according to some embodiments Figure 2 . Figure 16 A schematic diagram of a lower shell structure provided according to some embodiments Figure 17 .like and As shown, the lower housing may include a bottom plate 2021, and a first lower side plate 2022 and a second lower side plate 2023 disposed on either side of the bottom plate 2021. The inner wall of the first lower side plate 2022 may be provided with a first stopper 20221. The lower surface of the first circuit board 310 abuts against the first stopper 20221, providing support for the first circuit board 310.
[0137] The inner wall of the first lower side plate 2022 may be provided with a second stopper 20222. The lower surface of the second circuit board 320 abuts against the second stopper 20222, providing support for the second circuit board 320. The first stopper 20221 and the second stopper 20222 have different support planes, thereby creating a gap between the first circuit board 310 and the second circuit board 320, facilitating the clearance of electrical components on the first and second circuit boards 310 and 320.
[0138] The inner wall of the second lower side plate 2023 may be provided with a third limiting portion 20231 . The lower surface of the first circuit board 310 abuts against the third limiting portion 20231 , and the third limiting portion 20231 supports the first circuit board 310 .
[0139] The inner wall of the second lower side plate 2023 can be provided with a fourth limiting portion 20232. The lower surface of the second circuit board 320 abuts against the fourth limiting portion 20232, and the fourth limiting portion 20232 has a supporting effect on the second circuit board 320. The third limiting portion 20231 and the fourth limiting portion 20232 have different supporting planes, so that the first circuit board 310 and the second circuit board 320 have a gap therebetween, facilitating the avoidance between the electrical devices of the first circuit board 310 and the second circuit board 320.
[0140] In the optical module provided by the present disclosure, the lower surface of the second circuit board abuts against the second limiting portion 20222 and the fourth limiting portion 20232. The first protrusion 20122 and the second protrusion 20132 of the upper shell are pressed against the upper surface of the second circuit board 320. The cage 106 forms a downward force on the second circuit board 320 through the upper shell. The gold fingers of the second circuit board 320 are embedded in the inside of the electrical connector 1061, and the electrical connector 1061 forms a rightward extrusion force on the circuit board 300. The connection between the first protrusion 20122 and the second circuit board 320 is provided with a first elastic member. When the optical module is not subjected to the force of the cage 106, the lower surface of the first elastic member 2014 is higher than the lower surface of the first protrusion 20122. During the assembly of the first protrusion 20122 and the first embedded portion 322, the first elastic member 2014 first contacts the first embedded portion 322, and the Shore hardness of the first elastic member 2014 is less than the Shore hardness of the first protrusion 20122, so that the first elastic member 2014 can absorb part of the stress, reduce the stress of the circuit board, and reduce the deformation of the circuit board.
[0141] Other embodiments of the present disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the present disclosure. The present disclosure is intended to cover any variations, uses, or adaptations of the present disclosure following the general principles thereof and including modifications and equivalents of the present disclosure. The specification and examples are to be regarded as illustrative only, and the true scope and spirit of the present disclosure are indicated by the content of the claims.
[0142] The above-described embodiments of the present disclosure do not constitute a limitation on the protection scope of the present disclosure.
Claims
1. An optical module, characterized in that: include: The upper shell comprises: a cover plate and a first supporting column and a second supporting column located on both sides of the cover plate; Wherein, the first support column comprises: a first column, one end of which is connected to the cover plate; a first protrusion, one end of which is connected to the first column, the cross-sectional area of the first protrusion being smaller than the cross-sectional area of the first column, and the first protrusion protruding relative to the first column in a direction away from the cover plate; The first support column and the second support column are symmetrically arranged; A lower shell, covering the upper shell to form a shell; A circuit board is disposed inside the housing; one end of the circuit board abuts against the external electrical connector; a first elastic member, sleeved on the outside of the first protrusion, wherein when the cover plate is not subjected to force, the lower surface of the first elastic member is lower than the lower surface of the first protrusion; the first elastic member is located between the first column and the circuit board; The Shore hardness of the first elastic member is smaller than the Shore hardness of the first protrusion.
2. The optical module according to claim 1, wherein The circuit board is provided with a first chip, and the shortest distance between an edge of the first chip and a line connecting the first support column and the second support column is less than or equal to 0.5 mm; The first chip is located on the upper surface of the circuit board.
3. The optical module according to claim 1, wherein: include: a second elastic member; The second support column comprises: a second column, one end of which is connected to the cover plate; a second protrusion, one end of which is connected to the second column, the cross-sectional area of the second protrusion being smaller than the cross-sectional area of the second column, and the second protrusion protruding relative to the second column in a direction away from the cover plate; The first elastic member is sleeved on the outside of the second protrusion, and when not assembled, the lower surface of the second elastic member is lower than the lower surface of the second protrusion; The Shore hardness of the second elastic member is smaller than the Shore hardness of the second protrusion.
4. The optical module according to claim 1, wherein: The upper surface of the circuit board is provided with a first groove and a second groove that are connected to each other, and the depth of the first groove is greater than the depth of the second groove; The cross-sectional area of the first groove is smaller than the cross-sectional area of the second groove; The first elastic member abuts against the bottom of the second groove.
5. The optical module according to claim 1, wherein: The first protrusion has a draft angle of a preset angle.
6. An optical module, characterized in that: include: The upper shell comprises: a cover plate, and a first supporting column and a second supporting column located on both sides of the cover plate; The first support column comprises: a first column, one end of which is connected to the cover plate; a first protrusion, one end of which is connected to the first column, the cross-sectional area of the first protrusion being smaller than the cross-sectional area of the first column, and the first protrusion protruding relative to the first column in a direction away from the cover plate; The second support column is symmetrically arranged with the first support column; A lower shell, covering the upper shell to form a shell; A circuit board is disposed inside the housing; one end of the circuit board abuts against the electrical connector; The first elastic member is sleeved on the outside of the first protrusion, the lower surface of the first elastic member abuts against the upper surface of the circuit board, and a gap is formed between the lower surface of the first protrusion and the circuit board.
7. The optical module according to claim 6, wherein: The circuit board is provided with a first chip, and the shortest distance between an edge of the first chip and a line connecting the first support column and the second support column is less than or equal to 0.5 mm; The first chip is located on the upper surface of the circuit board.
8. The optical module according to claim 6, wherein: include: a second elastic member; The second support column comprises: a second column, one end of which is connected to the cover plate; a second protrusion, one end of which is connected to the second column, the cross-sectional area of the second protrusion being smaller than the cross-sectional area of the second column, and the second protrusion protruding relative to the second column in a direction away from the cover plate; The first elastic member is sleeved on the outside of the second protrusion, and when not assembled, the lower surface of the second elastic member is lower than the lower surface of the second protrusion; The Shore hardness of the second elastic member is smaller than the Shore hardness of the second protrusion.
9. The optical module according to claim 6, wherein: The upper surface of the circuit board is provided with a first groove and a second groove that are connected to each other, and the depth of the first groove is greater than the depth of the second groove; The cross-sectional area of the first groove is smaller than the cross-sectional area of the second groove; The first elastic member abuts against the bottom of the second groove.
10. The optical module according to claim 6, wherein: The first protrusion has a draft angle of a preset angle.