Optical module

Abstract

The optical module provided by the utility model comprises a lens assembly which is used for changing the transmission direction of an optical signal; the circuit board comprises a first surface which supports and is connected with the lens assembly; a main chip and an auxiliary electric device are arranged on the first surface, and a rubber isolating layer is formed on the first surface; the main chip and the auxiliary electric device are located below the lens assembly, the auxiliary electric device is located on the side edge of the main chip, and the auxiliary electric device is electrically connected with the main chip; the glue isolating layer is located below the lens assembly and is far away from the side edge of the main chip, and the glue isolating layer is used for isolating glue; a heat dissipation copper layer is formed on the second surface; the projection of the heat dissipation copper layer in the direction of the first surface covers the main chip, and the heat dissipation copper layer assists the heat dissipation of the main chip. According to the optical module provided by the invention, heat dissipation of the main chip below the lens assembly is facilitated.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the field of optical fiber communication technology, and in particular to an optical module. BACKGROUND

[0002] With the development of new business and application mode such as cloud computing, mobile Internet, video, etc., the development and progress of optical communication technology becomes increasingly important. In optical communication technology, the optical module is a tool for converting optical signals and electrical signals, and is one of the key devices in optical communication equipment. With the development of optical communication technology, the transmission rate of the optical module is continuously improved. CONTENT OF THE UTILITY MODEL

[0003] Some embodiments provide an optical module, comprising:

[0004] a lens assembly for changing the transmission direction of an optical signal;

[0005] a circuit board, comprising:

[0006] a first surface connected to the bottom of the lens assembly by glue; a main chip and an auxiliary electrical device are arranged on the first surface, and a glue isolation layer is formed on the first surface; the main chip and the auxiliary electrical device are located below the lens assembly, and the auxiliary electrical device is located at the side of the main chip, and the auxiliary electrical device is electrically connected to the main chip; the glue isolation layer is located below the lens assembly, and the glue isolation layer is away from the side of the main chip, and a micro convex structure is formed on the glue isolation layer to block the glue;

[0007] a second surface opposite to the first surface, and a heat dissipation copper layer is formed on the second surface; the projection of the heat dissipation copper layer in the direction of the first surface covers the main chip, and the edge of the heat dissipation copper layer exceeds the edge of the main chip, and the heat dissipation copper layer assists the main chip in heat dissipation.

[0008] One of the above technical solutions has the following advantages or beneficial effects: The first surface of the circuit board is provided with a main chip, the side of the main chip is provided with an auxiliary electrical device, and the auxiliary electrical device is electrically connected to the main chip. The second surface of the circuit board is formed with a heat dissipation copper layer, the projection of the heat dissipation copper layer in the direction of the first surface covers the main chip, and the edge of the heat dissipation copper layer exceeds the edge of the main chip, so as to ensure that the heat dissipation copper layer has sufficient area to ensure the heat dissipation efficiency. The auxiliary electrical device and the main chip are located on the same side of the circuit board, and the auxiliary electrical device is arranged on the side of the main chip, so as to shorten the electrical connection distance between the auxiliary electrical device and the main chip, and facilitate to ensure the noise reduction, filtering, impedance matching and other effects of the auxiliary electrical device. Moreover, the auxiliary electrical device and the main chip are located on the same side of the circuit board, so as to save the space occupied by the auxiliary electrical device on the second surface, provide more sufficient space for arranging the heat dissipation copper layer, make the area of the heat dissipation copper layer as large as possible, provide a larger heat dissipation area for the main chip, and ensure the heat dissipation effect of the heat dissipation copper layer. The first surface of the circuit board is formed with a glue isolation layer, the glue isolation layer is located on the side of the main chip and below the lens assembly, the glue isolation layer is formed with a micro-convex structure, and the roughness is large, so as to block the glue flow. When the lens assembly is bonded to the circuit board by glue, the glue isolation layer can block the glue, reduce the invasion of the glue into the electrical connection area of the main chip and the circuit board.

[0009] Some embodiments provide an optical module, the main chip includes a DSP chip, the auxiliary electrical device includes a first auxiliary electrical device and a second auxiliary electrical device, the first auxiliary electrical device is located on one side of the DSP chip, and the second auxiliary electrical device is located on the other side of the DSP chip; the projection of the heat dissipation copper layer in the direction of the first surface covers the first auxiliary electrical device and the second auxiliary electrical device.

[0010] Another of the above technical solutions has the following advantages or beneficial effects: The auxiliary electrical device of the DSP chip includes a first auxiliary electrical device and a second auxiliary electrical device, the first auxiliary electrical device is arranged on one side of the DSP chip, and the second auxiliary electrical device is arranged on the other side of the DSP chip. The edge of the heat dissipation copper layer is located below the first auxiliary electrical device and the second auxiliary electrical device, so as to ensure the heat dissipation effect of the heat dissipation copper layer. Moreover, the DSP chip, the first auxiliary electrical device and the second auxiliary electrical device are located on the same side of the circuit board, so as to save the space occupied by the first auxiliary electrical device and the second auxiliary electrical device on the second surface, provide sufficient space for arranging the heat dissipation copper layer, make the area of the heat dissipation copper layer as large as possible, provide a larger heat dissipation area for the DSP chip, and ensure the heat dissipation effect of the heat dissipation copper layer. The first auxiliary electrical device and the second auxiliary electrical device are arranged on the side of the DSP chip, so as to shorten the electrical connection distance between the first auxiliary electrical device and the DSP chip and shorten the electrical connection distance between the second auxiliary electrical device and the DSP chip, and facilitate to ensure the noise reduction, filtering, impedance matching and other effects of the first auxiliary electrical device and the second auxiliary electrical device.

[0011] Some embodiments provide an optical module, the glue layer includes a third glue layer and a fourth glue layer; the third glue layer is located on one side of the DSP chip, and the third glue layer surrounds the side of the first auxiliary electrical device; the fourth glue layer is located on the other side of the DSP chip, and the fourth glue layer surrounds the side of the second auxiliary electrical device.

[0012] Another technical solution in the above technical solution has the following advantages or beneficial effects: the third glue layer and the fourth glue layer are arranged below the lens assembly, the third glue layer is located on one side of the DSP chip, and the fourth glue layer is located on the other side of the DSP chip. The lens assembly is bonded to the circuit board by glue, and the third glue layer and the fourth glue layer can block the glue to reduce the invasion of the glue into the electrical connection area of the DSP chip and the circuit board. The third glue layer surrounds the side of the first auxiliary electrical device, and the third glue layer and the first auxiliary electrical device cooperatively block the glue to ensure the blocking effect of the glue. The fourth glue layer surrounds the side of the second auxiliary electrical device, and the fourth glue layer and the second auxiliary electrical device cooperatively block the glue to ensure the blocking effect of the glue.

[0013] Some embodiments provide an optical module, the main chip includes a driving chip and a transimpedance amplifier, and the driving chip and the transimpedance amplifier are arranged side by side.

[0014] The auxiliary electrical device includes a first auxiliary electrical device group and a second auxiliary electrical device group, the first auxiliary electrical device group is located on the side of the driving chip away from the transimpedance amplifier, and the second auxiliary electrical device group is located on the side of the transimpedance amplifier away from the driving chip.

[0015] Another technical solution in the above technical solution has the following advantages or beneficial effects: the driving chip and the transimpedance amplifier are arranged side by side below the lens assembly. The first auxiliary electrical device group and the second auxiliary electrical device group are arranged below the lens assembly, the first auxiliary electrical device group is located on the side of the driving chip away from the transimpedance amplifier, and the second auxiliary electrical device is located on the side of the transimpedance amplifier away from the driving chip. The first auxiliary electrical device and the second auxiliary electrical device save the space occupied on the second surface, provide sufficient space for arranging the heat dissipation copper layer, and make the area of the heat dissipation copper layer as large as possible to provide a larger heat dissipation area for the driving chip and the transimpedance amplifier, thereby ensuring the heat dissipation effect of the heat dissipation copper layer. The first auxiliary electrical device group is located on the side of the driving chip, which can shorten the electrical connection distance between the first auxiliary electrical device group and the driving chip, and facilitate to ensure the noise reduction, filtering, impedance matching and other effects of the first auxiliary electrical device group. The second auxiliary electrical device group is located on the side of the transimpedance amplifier, which can shorten the electrical connection distance between the second auxiliary electrical device group and the transimpedance amplifier, and facilitate to ensure the noise reduction, filtering, impedance matching and other effects of the second auxiliary electrical device group.

[0016] Some embodiments provide an optical module, the heat dissipation copper layer includes a first heat dissipation copper layer and a second heat dissipation copper layer, and the second heat dissipation copper layer and the second heat dissipation copper layer have a spacing therebetween; a projection of the first heat dissipation copper layer in the first surface direction covers the driving chip, and a projection of the second heat dissipation copper layer in the first surface direction covers the transimpedance amplifier.

[0017] An edge of the first heat dissipation copper layer is located below the first auxiliary electrical device group, and an edge of the second heat dissipation copper layer is located below the second auxiliary electrical device group.

[0018] Another technical solution in the above technical solution has the following advantages or beneficial effects: the second surface of the circuit board forms the first heat dissipation copper layer and the second heat dissipation copper layer, the projection of the first heat dissipation copper layer in the first surface direction covers the driving chip and the edge thereof is located below the first auxiliary electrical device group, and the projection of the second heat dissipation copper layer in the first surface direction covers the transimpedance amplifier and the edge thereof is located below the second auxiliary electrical device group. The first heat dissipation copper layer assists the driving chip in heat dissipation, provides more sufficient heat dissipation area for the first heat dissipation copper layer, and is more convenient for the driving chip to dissipate heat; the second heat dissipation copper layer assists the transimpedance amplifier in heat dissipation, provides more sufficient heat dissipation area for the second heat dissipation copper layer, and is more convenient for the transimpedance amplifier to dissipate heat. The second heat dissipation copper layer and the second heat dissipation copper layer have a spacing therebetween, which is convenient for reducing the thermal crosstalk between the driving chip and the transimpedance amplifier, and further reducing the damage caused by the thermal crosstalk between the driving chip and the transimpedance amplifier.

[0019] Some embodiments provide an optical module, the spacer layer includes a first spacer layer and a second spacer layer; the first spacer layer surrounds the side edges of the first auxiliary electrical device group, and the second spacer layer surrounds the side edges of the second auxiliary electrical device group.

[0020] Another technical solution in the above technical solution has the following advantages or beneficial effects: the spacer layer includes the first spacer layer and the second spacer layer, the first spacer layer surrounds the side edges of the first auxiliary electrical device group, and the second spacer layer surrounds the side edges of the second auxiliary electrical device group. The first spacer layer cooperates with the first auxiliary electrical device group to block glue, and reduces the invasion of glue into the electrical connection area of the driving chip and the circuit board. The second spacer layer cooperates with the second auxiliary electrical device group to block glue, and reduces the invasion of glue into the electrical connection area of the transimpedance amplifier and the circuit board.

[0021] Some embodiments provide an optical module, the main chip includes a light receiving chip; the lens assembly includes a reflecting surface, and the light receiving chip is located below the reflecting surface;

[0022] The optical module further includes a pad block; a top of the pad block is formed with an inclined surface, the inclined surface is connected to the light receiving chip; and a bottom of the pad block is connected to the circuit board.

[0023] Another technical solution in the above technical solution has the following advantages or beneficial effects: the lens assembly is provided below the cushion block and the light receiving chip, the top of the cushion block is formed with an inclined surface, the bottom of the cushion block is connected to the circuit board, and the light receiving chip is arranged on the top of the cushion block. The cushion block makes the light receiving chip inclined and arranged below the lens assembly. A reflecting surface is arranged on the lens assembly, and the light receiving chip is located below the reflecting surface. The light receiving signal input into the optical module is reflected by the reflecting surface and transmitted to the light receiving chip. Since the light receiving chip is inclined and arranged below the lens assembly, the light receiving signal reflected by the light receiving chip deviates from the light receiving signal input link, reducing the transmission of the reflected light receiving signal into the light receiving signal input link, and further reducing the transmission of the reflected light receiving signal along the light receiving signal input link to the light emitting chip of the optical module at the opposite end.

[0024] Some embodiments provide an optical module, comprising: the inclination angle of the inclined surface is 5-15°.

[0025] Another technical solution in the above technical solution has the following advantages or beneficial effects: the inclined surface with an inclination angle of 5-15° makes the light receiving chip inclined by 5-15°, which facilitates the high-coupling-efficiency transmission of the light receiving signal to the light receiving chip. In this way, the coupling efficiency of the light receiving signal to the light receiving chip can be ensured, and the transmission of the reflected light receiving signal into the light receiving signal input link can be reduced.

[0026] Some embodiments provide an optical module, comprising:

[0027] A lens assembly for changing the transmission direction of the optical signal;

[0028] A circuit board, comprising:

[0029] A first surface connected to the bottom of the lens assembly by glue; the first surface is provided with a DSP chip and a first auxiliary electrical device, the first surface is formed with a third glue isolation layer and a fourth glue isolation layer, the DSP chip, the third glue isolation layer and the fourth glue isolation layer are located below the lens assembly, the third glue isolation layer and the fourth glue isolation layer are formed with micro-convex structures to block the glue; the third glue isolation layer is located on one side of the DSP chip, and the fourth glue isolation layer is located on the other side of the DSP chip; the third glue isolation layer surrounds the side edge of the first auxiliary electrical device, and the first auxiliary electrical device is electrically connected to the DSP chip;

[0030] A second surface opposite to the first surface, the second surface is formed with a heat dissipation copper layer; the projection of the heat dissipation copper layer in the direction of the first surface covers the DSP chip, and the edge of the heat dissipation copper layer exceeds the edge of the DSP chip.

[0031] Another technical solution among the above-mentioned technical solutions has the following advantages or beneficial effects: a DSP chip is disposed on the first surface of the circuit board, and a first auxiliary electrical component is disposed beside the DSP chip, electrically connected to the DSP chip. A heat dissipation copper layer is formed on the second surface of the circuit board. The projection of the heat dissipation copper layer in the direction of the first surface covers the DSP chip and extends beyond the DSP chip, thereby ensuring sufficient heat dissipation copper layer area to ensure heat dissipation efficiency. The placement of the first auxiliary electrical component beside the DSP chip shortens the electrical connection distance between the first auxiliary electrical component and the DSP chip, thereby ensuring the noise reduction, filtering, impedance matching, and other effects of the first auxiliary electrical component. Furthermore, the first auxiliary electrical component and the DSP chip are located on the same side of the circuit board, which reduces the space occupied by the first auxiliary electrical component on the second surface, providing ample space for the heat dissipation copper layer. This allows the heat dissipation copper layer to be as large as possible, providing a larger heat dissipation area for the DSP chip and ensuring the heat dissipation efficiency of the heat dissipation copper layer. A third and fourth adhesive barrier layer are formed on the first surface of the circuit board. The third adhesive layer is located on one side of the DSP chip, and the fourth adhesive layer is located on the other side. These three and fourth adhesive layers feature a micro-convex structure with a high degree of roughness, which acts as a barrier to the flow of glue. When the lens assembly is bonded to the circuit board using glue, the third and fourth adhesive layers block the glue, preventing it from invading and contaminating the electrical connection area between the DSP chip and the circuit board. The third adhesive barrier layer surrounds the sides of the first auxiliary electrical component, and the third and fourth adhesive layers work together to effectively block the glue.

[0032] Some embodiments provide an optical module, further comprising a light receiving chip and a spacer; the lens assembly comprises a reflective surface, and the light receiving chip is located below the reflective surface;

[0033] An inclined surface is formed on the top of the pad, and the inclined surface is connected to the light receiving chip; and a bottom of the pad is connected to the circuit board.

[0034] Another technical solution among the above technical solutions has the following advantages or beneficial effects: a gasket and a light receiving chip are arranged below the lens assembly, the top of the gasket is formed with an inclined surface, the bottom of the gasket is connected to the circuit board, the light receiving chip is arranged on the top of the gasket, and the gasket causes the light receiving chip to be arranged obliquely below the lens assembly. A reflecting surface is provided on the lens assembly, and the light receiving chip is located below the reflecting surface. The light receiving signal input to the optical module is reflected by the reflecting surface and transmitted to the light receiving chip. Since the light receiving chip is arranged obliquely below the lens assembly, the light receiving signal reflected by the light receiving chip deviates from the light receiving signal input link, reducing the reflected light receiving signal from being transmitted to the light receiving signal input link, thereby reducing the reflected light receiving signal from being transmitted along the light receiving signal input link to the light transmitting chip of the optical module at the opposite end. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the technical solutions in the present disclosure, the following will briefly introduce the drawings needed to be used in some embodiments of the present disclosure. Obviously, the drawings in the following description are only some of the drawings of some embodiments of the present disclosure, and other drawings can also be obtained by those skilled in the art according to these drawings. In addition, the drawings in the following description can be regarded as schematic diagrams, and are not limited to the actual size, actual process, actual timing of signals, etc. of the products involved in the embodiments of the present disclosure.

[0036] Figure 1 A partial architecture diagram of an optical communication system according to some embodiments;

[0037] Figure 2 A partial structure diagram of a host computer according to some embodiments;

[0038] Figure 3 A structure diagram of an optical module according to some embodiments;

[0039] Figure 4 An exploded view of an optical module according to some embodiments;

[0040] Figure 5 An exploded view of a lens assembly and a circuit board according to some embodiments;

[0041] Figure 6 A partial structure diagram of a circuit board according to some embodiments;

[0042] Figure 7 A partial diagram of another circuit board according to some embodiments;

[0043] Figure 8 A partial diagram of another circuit board according to some embodiments;

[0044] Figure 9 A cross section of a circuit board according to some embodiments Figure 1 ;

[0045] Figure 10 A cross section of a circuit board according to some embodiments Figure 2 ;

[0046] Figure 11A A structure of a circuit board according to some embodiments Figure 1 ;

[0047] Figure 11B A use state of a circuit board according to some embodiments Figure 1 ;

[0048] Figure 12A A structure of a circuit board according to some embodimentsFigure 2 ;

[0049] Figure 12B A use state of a circuit board according to some embodiments Figure 2 ;

[0050] Figure 13A A partial structure of a light receiving chip and lens assembly according to some embodiments Figure 1 ;

[0051] Figure 13B A partial structure of a light receiving chip and lens assembly according to some embodiments Figure 2 . DETAILED DESCRIPTION

[0052] Some embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings. However, the described embodiments are only some embodiments of the present disclosure, not all embodiments. Based on the embodiments provided in the present disclosure, all other embodiments obtained by those of ordinary skill in the art belong to the scope of protection of the present disclosure.

[0053] Unless otherwise required by the context, throughout the specification and claims, the term "comprising" is interpreted to mean "including, but not limited to"; the terms "first", "second", etc. are not used to denote or imply relative importance or to indicate a quantity of limitations; the term "multiple" means two or more; the term "connected" is to be interpreted broadly, for example, "connected" can be fixedly connected, or detachably connected, or integrated, can be directly connected, or indirectly connected through an intermediate medium; the use of the terms "adapted to" or "configured to" means open and inclusive language, which does not exclude devices adapted or configured to perform additional tasks or steps; the terms "parallel", "perpendicular", "same", "consistent", "flush", etc. are not limited to absolute mathematical relationships, but also include acceptable error ranges generated in practice, and differences formed based on the same design concept but due to manufacturing reasons.

[0054] In optical communication technology, in order to establish information transmission between information processing devices, information is loaded onto light, and the transmission of information is carried out by using the propagation speed of light. Such information-loaded light is an optical signal. The optical signal can reduce the loss of optical power when transmitted in an optical information transmission device, and realize long-distance transmission of the optical signal. At the same time, the cost of optical information transmission devices such as optical fibers is lower than that of electrical information transmission devices such as copper wires. Therefore, optical communication technology can realize high-speed, long-distance, and low-cost information transmission.

[0055] An information processing device generally includes an optical network unit (ONU), a gateway, a router, a switch, a mobile phone, a computer, a server, a tablet computer, a television, etc., and an optical information transmission device generally includes an optical fiber and an optical waveguide, etc. The signal capable of being recognized and processed by the information processing device is an electrical signal, and the optical communication technology adopts an optical signal for transmission, which requires an optical module to convert the optical signal and the electrical signal.

[0056] The optical module can realize the mutual conversion between the optical signal and the electrical signal between the information processing device and the optical information transmission device. In some embodiments, at least one of the optical signal input end or the optical signal output end of the optical module is connected with an optical fiber, and at least one of the electrical signal input end or the electrical signal output end of the optical module is connected with an optical network unit; a first optical signal from the optical fiber is transmitted to the optical module, the optical module converts the first optical signal into a first electrical signal, and transmits the first electrical signal to the optical network unit; a second electrical signal from the optical network unit is transmitted to the optical module, the optical module converts the second electrical signal into a second optical signal, and transmits the second optical signal to the optical fiber.

[0057] Since the information transmission between multiple information processing devices can be performed through the electrical signal, at least one of the multiple information processing devices needs to be directly connected with the optical module, without the need of directly connecting all the information processing devices with the optical module. Here, the information processing device directly connected with the optical module is also referred to as the host computer of the optical module. In addition, the optical signal input end or the optical signal output end of the optical module is referred to as an optical port, and the electrical signal input end or the electrical signal output end of the optical module is referred to as an electrical port.

[0058] Figure 1 FIG. 1 is a partial structure diagram of an optical communication system according to some embodiments. As shown in FIG. 1, the optical communication system mainly includes a remote information processing device 1000, a local information processing device 2000, a host computer 100 of an optical module, the optical module 200, an optical fiber 101, and a network cable 103, wherein the optical fiber 101 belongs to an optical information transmission device, and the network cable 103 belongs to an electrical information transmission device. Figure 1

[0059] In some embodiments, one end of the optical fiber 101 extends to the direction of the remote information processing device 1000, and the other end of the optical fiber 101 is connected with the optical module 200 through the optical port of the optical module 200. The optical signal can be totally reflected in the optical fiber 101, and the propagation of the optical signal in the totally reflected direction can almost maintain the original optical power. The optical signal is totally reflected in the optical fiber 101 for multiple times, so as to transmit the optical signal from the remote information processing device 1000 to the optical module 200, or transmit the optical signal from the optical module 200 to the remote information processing device 1000, thereby realizing the information transmission at a long distance based on low power loss. ​

[0060] The optical communication system includes one or more optical fibers 101. In some embodiments, the optical fiber 101 is detachably connected with the optical module 200; in some embodiments, the optical fiber 101 is non-detachably connected with the optical module 200.

[0061] The host computer 100 is configured to provide a data signal to the optical module 200, or receive a data signal from the optical module 200, or monitor or control the working state of the optical module 200.

[0062] The host computer 100 includes a housing accommodating the optical module 200, and an optical module interface 102 disposed on the housing. The optical module 200 is inserted into the housing through the optical module interface 102, so that the host computer 100 and the optical module 200 establish a unidirectional or bidirectional electrical signal connection.

[0063] The host computer 100 further includes an external electrical interface that can access an electrical signal network. In some embodiments, the external electrical interface includes a universal serial bus (USB) or a network cable interface 104. The network cable interface 104 is configured to access a network cable 103, so that the host computer 100 and the network cable 103 establish a unidirectional or bidirectional electrical signal connection.

[0064] One end of the network cable 103 is connected to a local information processing device 2000, and the other end of the network cable 103 is connected to the host computer 100, so that an electrical signal connection is established between the local information processing device 2000 and the host computer 100 through the network cable 103. In some embodiments, a third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 through the network cable 103, the host computer 100 generates a second electrical signal according to the third electrical signal, the second electrical signal from the host computer 100 is transmitted to the optical module 200, the optical module 200 converts the second electrical signal into a second optical signal, and transmits the second optical signal to the optical fiber 101, the second optical signal is transmitted to a remote information processing device 1000 in the optical fiber 101.

[0065] In some embodiments, a first optical signal from the remote information processing device 1000 propagates through the optical fiber 101, the first optical signal from the optical fiber 101 is transmitted to the optical module 200, the optical module 200 converts the first optical signal into a first electrical signal, the optical module 200 transmits the first electrical signal to the host computer 100, the host computer 100 generates a fourth electrical signal according to the first electrical signal, and transmits the fourth electrical signal to the local information processing device 2000.

[0066] In some embodiments, the optical module is a tool for converting optical signals and electrical signals, in which the information does not change, and the encoding or decoding mode of the information changes.

[0067] The host computer 100 includes an optical line terminal (OLT), an optical network terminal (ONT), or a data center server, in addition to the optical network terminal.

[0068] Figure 2 A partial structure diagram of a host computer according to some embodiments. In order to clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 2 Only the structure of the host computer 100 related to the optical module 200 is shown. As Figure 2 shown, in some embodiments, the host computer 100 further includes a PCB circuit board 105 arranged in the accommodation cavity, and a cage 106 arranged on the surface of the PCB circuit board 105; the optical module 200 is inserted into the cage 106 and fixed by the cage 106.

[0069] In some embodiments, the cage 106 is provided with a heat sink 107, which can dissipate heat for the optical module; in some embodiments, the heat sink 107 has a fin or other protruding structure to increase the heat dissipation area.

[0070] In some embodiments, the cage 106 is internally provided with an electrical connector configured to access the electrical port of the optical module 200.

[0071] In some embodiments, the optical module 200 is inserted into the cage 106 of the host computer 100, and the optical module 200 is fixed by the cage 106. The heat generated by the optical module 200 is conducted to the cage 106, and then diffused through the heat sink 107.

[0072] In some embodiments, the optical module 200 is inserted into the cage 106 of the host computer 100, and the electrical port of the optical module 200 is connected with the electrical connector inside the cage 106, so that the optical module 200 and the host computer 100 establish electrical signal connection.

[0073] In some embodiments, the optical port of the optical module 200 is connected with the optical fiber 101, so that the optical module 200 and the optical fiber 101 establish optical signal connection.

[0074] Figure 3 A structure diagram of an optical module according to some embodiments, Figure 4 An exploded view of an optical module according to some embodiments. As Figure 3 and Figure 4As shown, in some embodiments, the optical module 200 comprises a shell, which comprises an upper shell 201 and a lower shell 202. The upper shell 201 covers the lower shell 202, forming two openings 203 and 204, one of which is an electrical opening, and the other of which is an optical opening. In some embodiments, the shell forms one opening, which is both an electrical opening and an optical opening.

[0075] In some embodiments, the upper shell 201 and the lower shell 202 are made of metal materials, which are conducive to electromagnetic shielding and heat dissipation.

[0076] The assembly method of the upper shell 201 and the lower shell 202 facilitates the installation of the circuit board 300, the lens assembly 400, and the like into the shell, and the shell can encapsulate and protect the above-mentioned devices.

[0077] The direction of the connection line of the two openings 203 and 204 can be consistent with the length direction of the optical module 200, or can be inconsistent with the length direction of the optical module 200. For example, the opening 203 is located at the end of the optical module 200 (the left end of the optical module 200), and the opening 204 is also located at the end of the optical module 200 (the right end of the optical module 200). Alternatively, the opening 203 is located at the end of the optical module 200, and the opening 204 is located at the side of the optical module 200. Figure 3 Figure 3

[0078] In some embodiments, the lower shell 202 comprises a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and arranged perpendicularly to the bottom plate 2021; the upper shell 201 comprises a cover plate 2011, which covers the two lower side plates 2022 of the lower shell 202 to form the shell.

[0079] In some embodiments, the lower shell 202 comprises a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and arranged perpendicularly to the bottom plate 2021; the upper shell 201 comprises a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and arranged perpendicularly to the cover plate 2011, and the two upper side plates and the two lower side plates 2022 are combined to cover the lower shell 202 by the upper shell 201.

[0080] As shown in FIG. 1, the optical module 200 comprises a shell, which comprises an upper shell 201 and a lower shell 202. The upper shell 201 covers the lower shell 202, forming two openings 203 and 204, one of which is an electrical opening, and the other of which is an optical opening. In some embodiments, the shell forms one opening, which is both an electrical opening and an optical opening. Figure 3 and Figure 4 ​​As shown, in some embodiments, the optical module includes a circuit board 300 disposed in a housing. The circuit board 300 includes circuit traces, electronic components, and chips. The electronic components and chips are connected according to the circuit design through the circuit traces to achieve functions such as power supply, electrical signal transmission, and grounding. The electronic components may include capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). The chips may include a microcontroller unit (MCU), a laser driver chip, a transimpedance amplifier (TIA), a limiting amplifier (LA), a clock and data recovery chip (CDR), a power management chip, and a digital signal processing (DSP) chip.

[0081] In some embodiments, the circuit board includes a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also achieve a load-bearing function. For example, the rigid circuit board can stably support the above-mentioned electronic components and chips; the rigid circuit board can also be inserted into the electrical connector in the cage 106 of the host computer 100.

[0082] In some embodiments, the circuit board further includes a flexible circuit board, which can be used independently or in conjunction with a rigid circuit board.

[0083] In some embodiments, the circuit board further includes a gold finger formed on an end surface thereof, wherein the gold finger is composed of a plurality of independent pins.

[0084] In some implementations, the gold finger 301 is disposed on a surface of one side of the circuit board 300 (eg Figure 4 In some implementations, the gold fingers 301 are provided on the upper and lower surfaces of the circuit board 300 to provide a greater number of pins, thereby adapting to occasions where a large number of pins are required.

[0085] In some implementations, the circuit board's gold fingers extend from the electrical port and plug into an electrical connector on the host computer 100. The circuit board is inserted into the cage 106, with the gold fingers 301 electrically connected to the electrical connector within the cage 106. The gold fingers 301 are configured to establish an electrical connection with the host computer, enabling electrical connection functions such as power supply, grounding, two-wire synchronous serial (I2C) signal transmission, and data signal transmission.

[0086] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0087] For example, the unlocking component 600 is located on the outside of the two lower side panels 2022 of the lower housing 202 and includes a snap-fit ​​component that mates with the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the snap-fit ​​component of the unlocking component 600 secures the optical module 200 in the cage 106. When the unlocking component 600 is pulled, the snap-fit ​​component of the unlocking component 600 moves accordingly, thereby changing the connection between the snap-fit ​​component and the host computer, thereby releasing the optical module 200 from the cage 106 and allowing the optical module 200 to be removed from the cage 106.

[0088] In some embodiments, the lens assembly 400 is connected to the circuit board 300 and is positioned above components such as the optical transmitter chip and / or optical receiver chip. The lens assembly 400 includes a transmissive surface and a reflective surface. The transmissive and reflective surfaces are combined to adjust the transmission direction of the transmitted and / or received optical signals, allowing the transmitted optical signal generated by the optical transmitter chip to be output from the optical module and the optical signal input to the optical module to be transmitted to the optical receiver chip. The optical transmitter chip may be a laser, and the optical receiver chip may be a photodetector.

[0089] In some embodiments, main chips such as a light emitting chip, a light receiving chip, an optoelectronic monitoring component, a driver chip, a transimpedance amplifier, or a DSP chip may be positioned below the lens assembly 400. These chips are the primary heat-generating components in the optical module. Of course, auxiliary electrical components such as resistors, capacitors, and inductors may also be positioned below the lens assembly 400. These auxiliary electrical components are electrically connected to the main chips and serve functions such as power supply noise reduction, filtering, and impedance matching.

[0090] In some embodiments, the optical module 200 may include a lens assembly 400. Of course, in some embodiments, the number of lens assemblies 400 in the optical module 200 is not limited to one, and may also include two lens assemblies 400, with a light emitting chip and / or a light receiving chip disposed below each lens assembly 400.

[0091] Figure 5 FIG1 is an exploded view of a lens assembly and a circuit board according to some embodiments. Figure 5As shown, in some embodiments, the first surface 301 of the circuit board 300 can be provided with a light emitting chip 310, the bottom of the lens assembly 400 is connected to the first surface, and the lens assembly 400 is arranged above the light emitting chip 310. The lens assembly 400 and the first surface 301 of the circuit board 300 form a containing cavity, and the light emitting chip 310 is located in the containing cavity. The lens assembly 400 can not only adjust the transmission direction of the light signal emitted by the light emitting chip 310, but also protect the light emitting chip 310.

[0092] In some embodiments, the first surface 301 of the circuit board 300 can be provided with a light receiving chip 320. The lens assembly 400 is arranged above the light receiving chip 320, and the light receiving chip 320 is located in the containing cavity. The lens assembly 400 can not only adjust the transmission direction of the light signal received by the light receiving chip 320, but also protect the light receiving chip 320. Exemplarily, the light receiving chip 320 can be arranged side by side with the light emitting chip 310 below the lens assembly 400.

[0093] In some embodiments, the first surface 301 of the circuit board 300 can be provided with a DSP chip 330. The lens assembly 400 is arranged above the DSP chip 330, and the DSP chip 330 is located in the containing cavity. The DSP chip 330 can be located on the side of the light emitting chip 310 or the light receiving chip 320, so that the DSP chip 330 is close to the light emitting chip 310 or the light receiving chip 320, etc.

[0094] In some embodiments, the first surface 301 of the circuit board 300 can be provided with a first auxiliary electrical device 340. The first auxiliary electrical device 340 is located on one side of the DSP chip 330, and the first auxiliary electrical device 340 is electrically connected to the DSP chip 330. The first auxiliary electrical device 340 can be a capacitor, a resistor, or an inductor, etc. The DSP chip 330 is used to process high-frequency signals, which is more sensitive to power supply noise ripple, and the first auxiliary electrical device 340 can be used for noise reduction.

[0095] In some embodiments, the first surface 301 of the circuit board 300 can be provided with a second auxiliary electrical device 350. The second auxiliary electrical device 350 is located on the other side of the DSP chip 330, and the second auxiliary electrical device 350 can be a capacitor, a resistor, or an inductor, etc. The second auxiliary electrical device 350 can also be used for noise reduction.

[0096] Figure 6 It is a partial structure diagram of a circuit board according to some embodiments. As shown in Figure 6 In some embodiments, the side of the light emitting chip 310 can be provided with a driving chip 360. The driving chip 360 can be wire-connected to the circuit board 300, and the driving chip 360 is electrically connected to the light emitting chip 310. The lens assembly 400 is arranged above the driving chip 360.

[0097] In some embodiments, a first auxiliary electrical component group 370 is disposed at the side of the driving chip 360, the first auxiliary electrical component group 370 is soldered to the circuit board 300, and the first auxiliary electrical component group 370 is electrically connected to the driving chip 360 through circuit traces on the circuit board 300. The first auxiliary electrical component group 370 includes capacitors, resistors, inductors, etc. The lens assembly 400 is disposed above the first auxiliary electrical component group 370, and the first auxiliary electrical component group 370 can be used for power supply noise reduction, filtering, impedance matching, etc. of the driving chip 360.

[0098] In some embodiments, a transimpedance amplifier 380 can be disposed at the side of the light-receiving chip 320. The transimpedance amplifier 380 can be wire-bonded to the circuit board 300, and the transimpedance amplifier 380 is electrically connected to the light-receiving chip 320. The lens assembly 400 is disposed above the transimpedance amplifier 380. Exemplarily, the transimpedance amplifier 380 can be disposed side by side with the driving chip 360 below the lens assembly 400.

[0099] In some embodiments, a second auxiliary electrical component group 390 is disposed at the side of the transimpedance amplifier 380, the second auxiliary electrical component group 390 is soldered to the circuit board 300, and the second auxiliary electrical component group 390 is electrically connected to the transimpedance amplifier 380 through circuit traces on the circuit board 300. The second auxiliary electrical component group 390 includes capacitors, resistors, inductors, etc. The lens assembly 400 is disposed above the second auxiliary electrical component group 390, and the second auxiliary electrical component group 390 can be used for power supply noise reduction, filtering, impedance matching, etc. of the transimpedance amplifier 380.

[0100] In some embodiments, auxiliary electrical components can be disposed between the driving chip 360 and the transimpedance amplifier 380, and the auxiliary electrical components can be electrically connected to the driving chip 360 or the transimpedance amplifier 380. Exemplarily, a plurality of auxiliary electrical components can be disposed between the driving chip 360 and the transimpedance amplifier 380, part of the auxiliary electrical components can be electrically connected to the driving chip 360, and part of the auxiliary electrical components can be electrically connected to the transimpedance amplifier 380.

[0101] Figure 7 A partial view of yet another circuit board according to some embodiments. As shown in FIG. 4B, the circuit board 300 includes a driving chip 360, a light-receiving chip 320, a transimpedance amplifier 380, a first auxiliary electrical component group 370, and a second auxiliary electrical component group 390. The driving chip 360 is disposed at the side of the light-receiving chip 320, and the driving chip 360 is electrically connected to the light-receiving chip 320 through circuit traces on the circuit board 300. The transimpedance amplifier 380 is disposed at the side of the driving chip 360, and the transimpedance amplifier 380 is electrically connected to the driving chip 360 through circuit traces on the circuit board 300. The first auxiliary electrical component group 370 is disposed at the side of the driving chip 360, and the first auxiliary electrical component group 370 is electrically connected to the driving chip 360 through circuit traces on the circuit board 300. The second auxiliary electrical component group 390 is disposed at the side of the transimpedance amplifier 380, and the second auxiliary electrical component group 390 is electrically connected to the transimpedance amplifier 380 through circuit traces on the circuit board 300. Figure 7As shown, in some embodiments, a heat dissipation copper layer 303 is formed on the second surface 302 of the circuit board 300. The projection of the heat dissipation copper layer 303 in the direction of the first surface 301 may cover the optical transmitter chip 310, the optical receiver chip 320, the DSP chip 330, the driver chip 360, or the transimpedance amplifier 380. The heat dissipation copper layer 303 is used to assist in dissipating heat from the main chips, such as the optical transmitter chip 310, the optical receiver chip 320, the DSP chip 330, the driver chip 360, or the transimpedance amplifier 380. Exemplarily, the heat dissipation copper layer 303 contacts and connects to a protrusion on the inner side of the lower housing 202. The heat dissipation copper layer 303 transfers heat generated by the main chips, such as the optical transmitter chip 310, the optical receiver chip 320, the DSP chip 330, the driver chip 360, or the transimpedance amplifier 380, to the lower housing 202 via the protrusion on the inner side of the lower housing 202. The heat dissipation copper layer 303 may contact and connect to the protrusion on the inner side of the lower housing 202 via a thermally conductive layer or thermally conductive pad.

[0102] In some embodiments, the edge of the heat dissipation copper layer 303 extends beyond the edge of the main chip to ensure sufficient heat dissipation copper layer area to ensure heat dissipation efficiency. Exemplarily, the edge of the heat dissipation copper layer 303 extends to below the auxiliary electrical components on the side of the main chip.

[0103] Figure 8 FIG. 1 is a partial diagram of another circuit board according to some embodiments. Figure 8 As shown, in some embodiments, a first heat dissipation copper layer 3031 and a second heat dissipation copper layer 3032 are formed on the second surface 302 of the circuit board 300, with a gap between the first heat dissipation copper layer 3031 and the second heat dissipation copper layer 3032. The projection of the first heat dissipation copper layer 3031 in the direction of the first surface 301 can cover the light emitting chip 310 and the driver chip 360, and the first heat dissipation copper layer 3031 assists in heat dissipation of the light emitting chip 310 and the driver chip 360; the projection of the second heat dissipation copper layer 3032 in the direction of the first surface 301 can cover the light receiving chip 320 and the transimpedance amplifier 380, and the second heat dissipation copper layer 3032 assists in heat dissipation of the light emitting chip 310 and the driver chip 360. The first and second heat-dissipating copper layers 3031, 3032 are in contact with the protrusions on the inner side of the lower housing 202. The first and second heat-dissipating copper layers 3031, 3032 transfer heat generated by the main chips, such as the optical transmitter chip 310, the optical receiver chip 320, the driver chip 360, or the transimpedance amplifier 380, to the lower housing 202 via the protrusions on the inner side of the lower housing 202. The first and second heat-dissipating copper layers 3031, 3032 can be in contact with the protrusions on the inner side of the lower housing 202 via a thermally conductive layer or a thermally conductive gasket.

[0104] In some embodiments, the edge of the first heat dissipation copper layer 3031 extends beyond the edge of the driver chip 360, and the edge of the second heat dissipation copper layer 3032 extends beyond the edge of the transimpedance amplifier 380. For example, the edge of the first heat dissipation copper layer 3031 extends below or beyond the edge of the first auxiliary electrical component group 370; the edge of the second heat dissipation copper layer 3032 extends below or beyond the edge of the second auxiliary electrical component group 380.

[0105] Since a gap is set between the first heat dissipation copper layer 3031 and the second heat dissipation copper layer 3032, the heat generated by the optical transmitter chip 310 and the like is transferred through the first heat dissipation copper layer 3031, and the heat generated by the optical receiver chip 320 and the like is transferred through the second heat dissipation copper layer 3032, thereby reducing the thermal crosstalk between the driver chip and the transimpedance amplifier.

[0106] Figure 9 A cross section of a circuit board according to some embodiments Figure 1 .like Figure 9 As shown, in some embodiments, a driver chip 360 and a transimpedance amplifier 380 are disposed on the first surface 301 of the circuit board 300. The driver chip 360 is connected to the circuit board 300 by wire bonding, and the transimpedance amplifier 380 is connected to the circuit board 300 by wire bonding. A first auxiliary electrical component group 370 is located on a side of the driver chip 360 away from the transimpedance amplifier 380, and a second auxiliary electrical component group 390 is located on a side of the transimpedance amplifier 380 away from the driver chip 360.

[0107] In some embodiments, a heat dissipation copper layer 303a is provided on the second surface 302 of the circuit board 300. The heat dissipation copper layer 303a is located below the driver chip 360 and the transimpedance amplifier 380. The projection of the heat dissipation copper layer 303a in the direction of the first surface 301 covers the driver chip 360 and the transimpedance amplifier 380. The first auxiliary electrical component group 370 is located on the side of the driver chip 360, and the second auxiliary electrical component group 390 is located on the side of the transimpedance amplifier 380. This reduces the space occupied by the first and second auxiliary electrical component groups 370 and 390 on the second surface 302, thereby providing space for the heat dissipation copper layer 303a. This maximizes the area of ​​the heat dissipation copper layer 303a, provides a larger heat dissipation area for the driver chip 360 and the transimpedance amplifier 380, and ensures the heat dissipation effect of the heat dissipation copper layer 303a. In addition, the first auxiliary electrical component group 370 is located on the side of the driving chip 360, and the second auxiliary electrical component group 390 is located on the side of the transimpedance amplifier 380. This also facilitates shortening the electrical connection distance between the first auxiliary electrical component group 370 and the driving chip 360, as well as shortening the electrical connection distance between the second auxiliary electrical component group 390 and the transimpedance amplifier 380, thereby ensuring the noise reduction, filtering, impedance matching and other effects of the first auxiliary electrical component group 370 and the second auxiliary electrical component group 390.

[0108] Figure 10 A cross section of a circuit board according to some embodiments Figure 2 . As Figure 10 shown, in some embodiments, a DSP chip 330 is disposed on a first surface 301 of the circuit board 300, and the DSP chip 330 is wire-bonded to the circuit board 300. A first auxiliary electrical device 340 is disposed on one side of the DSP chip 330, and a second auxiliary electrical device 350 is disposed on another side of the DSP chip 330.

[0109] In some embodiments, a heat dissipation copper layer 303b is disposed on a second surface 302 of the circuit board 300, and the heat dissipation copper layer 303b is disposed below the DSP chip 330, and a projection of the heat dissipation copper layer 303b in the direction of the first surface 301 covers the DSP chip 330. The first auxiliary electrical device 340 and the second auxiliary electrical device 350 are disposed on the side edges of the DSP chip 330, and the DSP chip 330, the first auxiliary electrical device 340, and the second auxiliary electrical device 350 are disposed on the same side of the circuit board 300, reducing the occupation of the space on the second surface 302 by the first auxiliary electrical device 340 and the second auxiliary electrical device 350, facilitating the provision of space for the heat dissipation copper layer 303b, so that the area of the heat dissipation copper layer 303b is as large as possible, to provide a larger heat dissipation area for the DSP chip 330, and to ensure the heat dissipation effect of the heat dissipation copper layer 303b. In addition, the first auxiliary electrical device 340 and the second auxiliary electrical device 350 are disposed on the side edges of the DSP chip 330, facilitating the shortening of the electrical connection distance between the first auxiliary electrical device 340 and the DSP chip 330 and the electrical connection distance between the second auxiliary electrical device 350 and the DSP chip 330, and ensuring the noise reduction, filtering, impedance matching, and other effects of the first auxiliary electrical device 340 and the second auxiliary electrical device 350.

[0110] Figure 11A A structure of a circuit board according to some embodiments Figure 1 , Figure 11B A use state of a circuit board according to some embodiments Figure 1 . As Figure 11A and Figure 11B shown, in some embodiments, a first isolation glue layer 304 is disposed on a first surface 301 of the circuit board 300, and the first isolation glue layer 304 is disposed on the side edge of the driving chip 360. The first isolation glue layer 304 has a micro-convex structure formed thereon, which can form a glue storage structure and has a large roughness, and can block the flow of glue. Exemplarily, the first isolation glue layer 304 is disposed on the side of the driving chip 360 away from the transimpedance amplifier 380, and is disposed below the lens assembly 400. The lens assembly 400 is usually bonded to the circuit board 300 by glue, and the first isolation glue layer 304 can block the glue 01, reducing the invasion of the glue 01 into the wire-bonded connection area of the driving chip 360 and the circuit board 300.

[0111] In some embodiments, a first auxiliary electrical component assembly 370 may be disposed on the first insulating layer 304, and the first insulating layer 304 surrounds the sides of the first auxiliary electrical component assembly 370. For example, the first insulating layer 304 surrounds the sides of the solder pad assembly 370 that is soldered to the first auxiliary electrical component assembly 370. The first insulating layer 304 and the first auxiliary electrical component assembly 370 cooperate to block the glue 01, thereby enhancing the effectiveness of the glue 01.

[0112] In some embodiments, a second adhesive layer 305 is provided on the first surface 301 of the circuit board 300. The second adhesive layer 305 is located on the side of the transimpedance amplifier 380. The second adhesive layer 305 has a micro-convex structure that forms a glue reservoir and has a high degree of roughness, which can block the flow of glue. Exemplarily, the second adhesive layer 305 is located on the side of the transimpedance amplifier 380 away from the driver chip 360 and below the lens assembly 400. The second adhesive layer 305 blocks glue, reducing the risk of glue intrusion and contamination in the bonding area between the transimpedance amplifier 380 and the circuit board 300.

[0113] In some embodiments, a second auxiliary electrical component assembly 390 is disposed on the second adhesive layer 305, and the second adhesive layer 305 surrounds the sides of the second auxiliary electrical component assembly 390. For example, the second adhesive layer 305 surrounds the sides of the solder pad assembly 390 that is soldered to the second auxiliary electrical component assembly 390. The second adhesive layer 305 and the second auxiliary electrical component assembly 390 cooperate to block the glue 02, thereby enhancing the effectiveness of blocking the glue 02.

[0114] Figure 12A A circuit board structure according to some embodiments Figure 2 , Figure 12B A usage state of a circuit board according to some embodiments Figure 2 .like Figure 12A and Figure 12B As shown, in some embodiments, a third adhesive layer 306 is disposed on the first surface 301 of the circuit board 300. The third adhesive layer 306 is located on one side of the DSP chip 330 and below the lens assembly 400. The third adhesive layer 306 has a micro-convex structure that forms a glue reservoir and has a high degree of roughness, which blocks the flow of glue. The third adhesive layer 306 blocks the glue O3, preventing the glue O1 from invading and contaminating the bonding area between the DSP chip 330 and the circuit board 300.

[0115] In some embodiments, the first auxiliary electrical component 340 may be disposed on the third insulating layer 306, and the third insulating layer 306 surrounds the sides of the first auxiliary electrical component 340. For example, the third insulating layer 306 surrounds the sides of the pad group connected to the first auxiliary electrical component 340 by welding. The third insulating layer 306 and the first auxiliary electrical component 340 cooperate to block the glue 03, thereby improving the effectiveness of blocking the glue 03.

[0116] In some embodiments, a fourth adhesive layer 307 is disposed on the first surface 301 of the circuit board 300. This fourth adhesive layer 307 is located on the other side of the DSP chip 330 and below the lens assembly 400. The fourth adhesive layer 307 has a micro-convex structure that forms a glue reservoir and has a high degree of roughness, which blocks the flow of glue. This fourth adhesive layer 307 blocks glue O4, preventing it from invading and contaminating the bonding area between the DSP chip 330 and the circuit board 300.

[0117] In some embodiments, a second auxiliary electrical component 350 may be disposed on the fourth insulating layer 307, and the fourth insulating layer 307 surrounds the sides of the second auxiliary electrical component 350. For example, the fourth insulating layer 307 surrounds the sides of the pad group to which the second auxiliary electrical component 350 is soldered. The fourth insulating layer 307 and the second auxiliary electrical component 350 cooperate to block the glue 04, thereby enhancing the effectiveness of blocking the glue 04.

[0118] Figure 13A A partial structure of a light receiving chip and a lens assembly according to some embodiments Figure 1 .like Figure 13A As shown, a reflective surface 401 is formed on the lens assembly 400 , and the reflective surface 401 is located above the light receiving chip 320 . The light receiving signal input into the optical module 200 is reflected by the reflective surface 401 and transmitted to the light receiving chip 320 .

[0119] In some embodiments, a converging lens 402 is formed on the lens assembly 400 , and the converging lens 402 is located below the reflective surface 401 and above the optical receiving chip 320 . The converging lens 402 is used to converge the optical receiving signal reflected by the reflective surface 401 to the optical receiving chip 320 .

[0120] When the optical receive signal is transmitted to the optical receive chip 320, part of the optical receive signal is reflected by the optical receive chip 320. If the reflected optical receive signal is transmitted to the optical receive signal input link, it may be transmitted along the optical receive signal input link to the optical transmit chip of the optical module at the other end, affecting the normal stimulated emission of the laser and degrading the transmission performance of the optical module at the other end.

[0121] Figure 13B A partial structure of a light receiving chip and a lens assembly according to some embodimentsFigure 2 As shown in FIG. 3, in some embodiments, a light receiving chip 320 is disposed below a lens assembly 400, and a support 321 is disposed below the light receiving chip 320. The support 321 supports the light receiving chip 320, and the light receiving chip 320 is disposed obliquely below the lens assembly 400. For example, the support 321 has an inclined surface on a top thereof, and the inclined surface supports the light receiving chip 320. A bottom of the support 321 is connected to a first surface 301 of a circuit board 300. Figure 13B As shown in FIG. 3, in some embodiments, a light receiving chip 320 is disposed below a lens assembly 400, and a support 321 is disposed below the light receiving chip 320. The support 321 supports the light receiving chip 320, and the light receiving chip 320 is disposed obliquely below the lens assembly 400. For example, the support 321 has an inclined surface on a top thereof, and the inclined surface supports the light receiving chip 320. A bottom of the support 321 is connected to a first surface 301 of a circuit board 300.

[0122] In some embodiments, the inclined surface has an inclination angle of 5-20°, and the light receiving chip 320 is disposed obliquely at an angle of 5-20°. For example, the inclined surface has an inclination angle of 5-15°, and the light receiving chip 320 is disposed obliquely at an angle of 5-15°.

[0123] When a light receiving signal is transmitted to the light receiving chip 320, part of the light receiving signal is reflected by the light receiving chip 320. Due to the oblique disposition of the light receiving chip 320, the reflected light receiving signal deviates from a light receiving signal input link, and the transmission of the reflected light receiving signal to the light receiving signal input link is reduced. In turn, the transmission of the reflected light receiving signal along the light receiving signal input link to a light emitting chip of an optical module at an opposite end is reduced.

[0124] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present disclosure, rather than limit them. Although the present disclosure has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacements to some technical features therein. Such modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present disclosure.

Claims

1. An optical module, characterized in that: include: A lens assembly, used to change the transmission direction of the optical signal; Circuit board, including: A first surface is connected to the bottom of the lens assembly by glue; a main chip and auxiliary electrical components are provided on the first surface, and a rubber barrier layer is formed on the first surface; the main chip and auxiliary electrical components are located below the lens assembly, and the auxiliary electrical components are located on the side of the main chip, and the auxiliary electrical components are electrically connected to the main chip; the rubber barrier layer is located below the lens assembly and away from the side of the main chip, and a micro-convex structure is formed on the rubber barrier layer to block glue; The second surface is opposite to the first surface, and a heat dissipation copper layer is formed on the second surface; the projection of the heat dissipation copper layer in the direction of the first surface covers the main chip, and the edge of the heat dissipation copper layer exceeds the edge of the main chip, and the heat dissipation copper layer assists the main chip in dissipating heat.

2. The optical module according to claim 1, wherein The main chip includes a DSP chip, and the auxiliary electrical components include a first auxiliary electrical component and a second auxiliary electrical component, the first auxiliary electrical component is located on one side of the DSP chip, and the second auxiliary electrical component is located on the other side of the DSP chip; the projection of the heat dissipation copper layer in the direction of the first surface covers the first and second auxiliary electrical components.

3. The optical module according to claim 2, wherein: The isolation layer includes a third isolation layer and a fourth isolation layer; the third isolation layer is located on one side of the DSP chip, and the third isolation layer surrounds the side of the first auxiliary electrical component; the fourth isolation layer is located on the other side of the DSP chip, and the fourth isolation layer surrounds the side of the second auxiliary electrical component.

4. The optical module according to claim 1, wherein: The main chip includes a driver chip and a transimpedance amplifier, and the driver chip is located on the side of the transimpedance amplifier; The auxiliary electrical components include a first auxiliary electrical component group and a second auxiliary electrical component group. The first auxiliary electrical component group is located on a side of the driver chip away from the transimpedance amplifier, and the second auxiliary electrical component group is located on a side of the transimpedance amplifier away from the driver chip.

5. The optical module according to claim 4, wherein: The heat dissipation copper layer includes a first heat dissipation copper layer and a second heat dissipation copper layer, and a gap is formed between the second heat dissipation copper layer and the second heat dissipation copper layer; the projection of the first heat dissipation copper layer in the direction of the first surface covers the driver chip, and the projection of the second heat dissipation copper layer in the direction of the first surface covers the transimpedance amplifier; An edge of the first heat dissipation copper layer is located below the first auxiliary electrical component group, and an edge of the second heat dissipation copper layer is located below the second auxiliary electrical component group.

6. The optical module according to claim 4, wherein: The rubber isolation layer includes a first rubber isolation layer and a second rubber isolation layer; the first rubber isolation layer surrounds the side of the first auxiliary electrical component group, and the second rubber isolation layer surrounds the side of the second auxiliary electrical component group.

7. The optical module according to claim 1, wherein: The main chip includes a light receiving chip; the lens assembly includes a reflective surface, and the light receiving chip is located below the reflective surface; The optical module further includes a pad; a top of the pad is formed with an inclined surface, and the inclined surface is connected to the light receiving chip; and a bottom of the pad is connected to the circuit board.

8. The optical module according to claim 7, wherein: The inclination angle of the inclined surface is 5-15°.

9. An optical module, characterized in that: include: A lens assembly, used to change the transmission direction of the optical signal; Circuit board, including: A first surface is connected to the bottom of the lens assembly by glue; a DSP chip and a first auxiliary electrical component are provided on the first surface, and a third and a fourth insulating layer are formed on the first surface. The DSP chip, the third and the fourth insulating layers are located below the lens assembly, and micro-convex structures are formed on the third and the fourth insulating layers to block glue; the third insulating layer is located on one side of the DSP chip, and the fourth insulating layer is located on the other side of the DSP chip; the third insulating layer surrounds the side of the first auxiliary electrical component, and the first auxiliary electrical component is electrically connected to the DSP chip; The second surface is opposite to the first surface, and a heat dissipation copper layer is formed on the second surface; the projection of the heat dissipation copper layer in the direction of the first surface covers the DSP chip, and the edge of the heat dissipation copper layer exceeds the edge of the DSP chip.

10. The optical module according to claim 9, wherein: It also includes a light receiving chip and a spacer; the lens assembly includes a reflective surface, and the light receiving chip is located below the reflective surface; An inclined surface is formed on the top of the pad, and the inclined surface is connected to the light receiving chip; and a bottom of the pad is connected to the circuit board.

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