Flexible and bendable computer circuit board

Abstract

The utility model discloses a flexible and bendable computer circuit board, which comprises a circuit board mounting seat, a flexible circuit board, a flexible circuit board, a flexible circuit board, a flexible circuit board, a flexible circuit board, a flexible circuit board, a flexible circuit board and a flexible circuit board, the bendable circuit board main body is arranged on the circuit board mounting seat and is attached to the two surfaces of the circuit board mounting seat, so that the mounting space is saved; and the heat dissipation module is arranged in the circuit board mounting seat, and heat dissipation is carried out on the bendable circuit board main body through the heat dissipation module. The bendable circuit board main body clings to the two surfaces of the circuit board mounting seat, so that the mounting space is effectively saved, and the circuit board is more compact in the computer main body.

Description

TECHNICAL FIELD

[0001] The utility model relates to a computer circuit board, in particular to a flexible and bendable computer circuit board. BACKGROUND

[0002] In the design and application of computer circuit board, the traditional rigid circuit board has problems of large installation space, poor heat dissipation effect and poor flexibility.

[0003] Because the rigid circuit board occupies large space in the installation process, it is difficult to adapt to the complex internal structure of the computer, which limits the flexibility of the overall layout. In addition, the traditional circuit board is mostly cooled by air, and the heat dissipation speed is slow, which can easily cause the circuit board to overheat, thereby affecting its performance and service life. SUMMARY

[0004] The technical problem to be solved by the utility model is to provide a flexible and bendable computer circuit board to solve the problems in the background art.

[0005] The flexible and bendable computer circuit board of the utility model is realized by the following technical scheme, which comprises:

[0006] A circuit board mounting seat is provided in a tubular shape and fixed in the case of the computer main body;

[0007] A bendable circuit board body is provided on the circuit board mounting seat and adheres to both sides of the circuit board mounting seat, thereby saving the installation space;

[0008] A heat dissipation module is provided in the circuit board mounting seat to dissipate heat from the bendable circuit board body.

[0009] As a preferred technical scheme, the bendable circuit board body is provided with a connecting hole around it, and a locking screw is inserted into the connecting hole;

[0010] The circuit board mounting seat is provided with a locking hole corresponding to the locking screw, and the bendable circuit board body is fixed on the circuit board mounting seat by the locking screw.

[0011] As a preferred technical scheme, the heat dissipation module comprises a semiconductor refrigeration sheet and a heat dissipation fin;

[0012] The circuit board mounting seat is provided with a fixing position, and the semiconductor refrigeration sheet is fixed on the fixing position; the cooling end of the semiconductor refrigeration sheet is in contact with the bendable circuit board body;

[0013] The heat dissipation fin is provided on the inner side of the circuit board mounting seat, and the heat dissipation fin passes through the circuit board mounting seat and is in contact with the heating end of the semiconductor refrigeration sheet.

[0014] As a preferred technical solution, a wind channel is formed inside the circuit board mounting seat to dissipate heat through the wind channel.

[0015] As a preferred technical solution, an air inlet fan and an air outlet fan are arranged on the two sides of the wind channel.

[0016] The air outlet end of the air inlet fan and the air outlet end of the air outlet fan correspond to the heat dissipation end of the heat dissipation fin.

[0017] As a preferred technical solution, the circuit board mounting seat is made of a heat insulation material to prevent heat diffusion of the circuit board body.

[0018] As a preferred technical solution, a temperature sensor is arranged on the flexible circuit board body to detect the temperature of the flexible circuit board body, and the semiconductor refrigeration sheet and the heat dissipation fan are controlled to work through the flexible circuit board body.

[0019] The beneficial effects of the utility model are:

[0020] The flexible circuit board body of the utility model is closely attached to the two surfaces of the circuit board mounting seat, effectively saving installation space, and making the circuit board more compact in the computer body.

[0021] The utility model discloses a heat dissipation module to ensure the efficient heat dissipation of the circuit board, the cooling end of the semiconductor refrigeration sheet directly contacts the circuit board body to quickly reduce the temperature of the circuit board, a wind channel is formed inside the circuit board mounting seat, and the air inlet fan and the air outlet fan work cooperatively to accelerate air flow and enhance the heat dissipation effect. DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the utility model or the prior art, the drawings needed to be used in the embodiment or the prior art description will be briefly introduced as follows, and obviously, the drawings in the following description are only some embodiments of the utility model, and for those skilled in the art, other drawings can also be obtained according to these drawings without paying creative labor.

[0023] Fig. 1 It is a three-dimensional structure schematic diagram of the utility model;

[0024] Fig. 2 It is an explosion structure schematic diagram of the utility model;

[0025] Fig. 3 It is a circuit board mounting seat structure schematic diagram of the utility model.

[0026] Mark explanation:

[0027] 1, circuit board mounting seat; 2, flexible circuit board body; 3, connecting hole; 4, locking screw; 5, locking hole; 6, semiconductor refrigeration piece; 7, heat dissipation fin; 8, fixed position; 9, air duct; 10, air inlet fan; 11, air outlet fan; 12, temperature sensor. DETAILED DESCRIPTION

[0028] All features disclosed in this specification, and / or all steps of any methods or processes disclosed in this specification, can be combined in any combination, except combinations where at least some of the features and / or steps are mutually exclusive.

[0029] As shown in Figs. 1-3 A flexible computer circuit board, comprising:

[0030] The circuit board mounting seat 1 is tubular and fixed in the computer main body case.

[0031] The flexible circuit board body 2 is arranged on the circuit board mounting seat 1 and adheres to both sides of the circuit board mounting seat 1, thereby saving installation space.

[0032] The heat dissipation module is arranged in the circuit board mounting seat 1 and dissipates heat from the flexible circuit board body 2.

[0033] The flexible circuit board body 2 is provided with connecting holes 3 around it, and locking screws 4 are inserted into the connecting holes 3.

[0034] The circuit board mounting seat 1 is provided with locking holes 5 corresponding to the locking screws 4, and the flexible circuit board body 2 is fixed to the circuit board mounting seat 1 by the locking screws 4.

[0035] The heat dissipation module includes a semiconductor refrigeration piece 6 and a heat dissipation fin 7.

[0036] The circuit board mounting seat 1 is provided with a fixed position 8, and the semiconductor refrigeration piece 6 is fixed to the fixed position; the cooling end of the semiconductor refrigeration piece 6 is in contact with the flexible circuit board body 2.

[0037] The heat dissipation fin 7 is arranged on the inner side of the circuit board mounting seat 1, and the heat dissipation fin 7 passes through the circuit board mounting seat 1 and is in contact with the heating end of the semiconductor refrigeration piece 6.

[0038] The circuit board mounting seat 1 forms an air duct 9 inside, which dissipates heat from the heat dissipation fin 7.

[0039] The air duct 9 is provided with an air inlet fan 10 and an air outlet fan 11 on both sides.

[0040] The air outlet end of the air inlet fan 10 and the air outlet end of the air outlet fan 11 are both in correspondence with the heat dissipation end position of the heat dissipation fin 7, thereby taking away the heat on the heat dissipation fin.

[0041] In addition, the circuit board mounting seat 1 is made of heat insulation material, preventing heat diffusion and thereby affecting the heat dissipation effect of the heat dissipation module.

[0042] In addition, the temperature sensor 12 is arranged on the bendable circuit board body 2, the temperature of the bendable circuit board body 2 is detected through the temperature sensor 12, and the semiconductor refrigeration piece 6 and the heat dissipation fan are controlled to work through the bendable circuit board body 2.

[0043] The bendable circuit board body is close to the two surfaces of the circuit board mounting seat, effectively saving the installation space, making the circuit board more compact in the computer main body; the heat dissipation module ensures the efficient heat dissipation of the circuit board; the cooling end of the semiconductor refrigeration piece is directly contacted with the circuit board body, quickly reducing the temperature of the circuit board; the air duct is formed in the circuit board mounting seat, the air flow is accelerated through the cooperative work of the air inlet fan and the air outlet fan, and the heat dissipation effect is enhanced.

[0044] The above is only a specific implementation manner of the utility model, but the protection scope of the utility model is not limited to this, any change or replacement without creative labor should be covered in the protection scope of the utility model. Therefore, the protection scope of the utility model should be limited by the protection scope defined in the claims.

Claims

1. A flexible and bendable computer circuit board, characterized in that: include: A circuit board mounting seat (1), the circuit board mounting seat (1) is arranged in a tubular shape and is fixed in a chassis of a computer body; A flexible circuit board body (2), the flexible circuit board body (2) being arranged on the circuit board mounting seat (1) and being fitted to two sides of the circuit board mounting seat (1), thereby saving installation space; A heat dissipation module is provided in the circuit board mounting seat (1), and the heat dissipation module is used to dissipate heat from the flexible circuit board main body (2).

2. The flexible and bendable computer circuit board according to claim 1, wherein: The flexible circuit board body (2) is provided with connection holes (3) on all four sides, and locking screws (4) are inserted into the connection holes (3); The circuit board mounting seat (1) is provided with a locking hole (5) corresponding to the locking screw (4), and the flexible circuit board body (2) is fixed to the circuit board mounting seat (1) via the locking screw (4).

3. The flexible and bendable computer circuit board according to claim 1, wherein: The heat dissipation module includes a semiconductor refrigeration plate (6) and heat dissipation fins (7); A fixing position (8) is provided on the circuit board mounting seat (1), and a semiconductor cooling plate (6) is fixed on the fixing position; a cooling end of the semiconductor cooling plate (6) is in contact with the flexible circuit board body (2); The heat dissipation fin (7) is arranged on the inner side of the circuit board mounting seat (1), and the heat dissipation fin (7) passes through the circuit board mounting seat (1) and contacts the heating end of the semiconductor cooling plate (6).

4. The flexible and bendable computer circuit board according to claim 1, wherein: An air duct (9) is formed inside the circuit board mounting seat (1).

5. The flexible and bendable computer circuit board according to claim 4, wherein: An air inlet fan (10) and an air outlet fan (11) are respectively provided on both sides of the air duct (9); The air outlet end of the air inlet fan (10) and the air outlet end of the air outlet fan (11) both correspond to the heat dissipation end positions of the heat dissipation fins (7).

6. The flexible and bendable computer circuit board according to claim 1, wherein: The circuit board mounting seat (1) is made of heat-insulating material.

7. The flexible and bendable computer circuit board according to claim 1, wherein: A temperature sensor (12) is provided on the flexible circuit board main body (2), and the temperature of the flexible circuit board main body (2) is detected by the temperature sensor (12).

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