Radar board

Abstract

The utility model discloses a radar board, which comprises a substrate and an electroplating antenna layer formed on one surface of the substrate. The substrate is provided with a working block, an antenna block surrounding the outer side of the working block, and a surrounding block surrounding the outer side of the antenna block. The electroplated antenna layer comprises a plurality of first circuit patterns located in the working block and a plurality of second circuit patterns located in the antenna block, and the plurality of second circuit patterns are generated by extending from the plurality of first circuit patterns respectively. The plurality of first circuit patterns have a first thickness relative to the surface of the substrate, and the plurality of second circuit patterns have a second thickness relative to the surface of the substrate. The plurality of second line patterns can be used to generate an antenna line. The plurality of second line patterns have the second thickness, so that the antenna line generated by the plurality of second line patterns has a good signal receiving and transmitting function.

Description

TECHNICAL FIELD

[0001] The utility model relates to a radar board, especially a radar board for generating antenna lines. BACKGROUND

[0002] The existing radar board is usually difficult to control the thickness of the plating layer (such as copper layer) of the generated position of the antenna line position in the manufacturing process, so that the thickness of the plating layer of the generated position of the antenna line is thicker, thereby leading to poor transceiver signal function of the antenna line.

[0003] Therefore, the utility model person thinks that the above-mentioned defects can be improved, and finally puts forward the utility model of practical and reasonable and effective improvement of the above-mentioned defects by dint of the application of scientific principles. UTILITY MODEL CONTENT

[0004] The utility model solves the technical problem in view of the prior art to provide a radar board.

[0005] The utility model discloses a radar board, it includes: a substrate has a work block, surrounds the antenna block of work block outside, and surrounds the surrounding block of antenna block outside, and the plating antenna layer is generated in the surface of the substrate, and the plating antenna layer includes: a plurality of first line patterns are located in the work block, and a plurality of the first line pattern has a first thickness relative to the surface of the substrate, and a plurality of second line patterns are located in the antenna block, and a plurality of the second line pattern has a second thickness relative to the surface of the substrate, wherein a plurality of the second line pattern is generated from a plurality of the first line pattern respectively, wherein a plurality of the second line pattern can be used to generate antenna lines.

[0006] Preferably, the plating antenna layer is a copper layer.

[0007] Preferably, the ratio range between the first thickness and the second thickness is between 1:0.32 to 1:0.53.

[0008] Preferably, the first thickness of a plurality of the first line patterns is between 2010 microinch to 2310 microinch, and the second thickness of a plurality of the second line patterns is between 750 microinch to 1050 microinch.

[0009] Preferably, the surrounding block has the first thickness, and the first thickness is between 2010 microinch to 2310 microinch.

[0010] Preferably, the first thickness and the second thickness have a difference value between 960 microinch to 1560 microinch.

[0011] Preferably, the plurality of first line patterns can be applied to a ball grid array package.

[0012] In summary, the radar board disclosed in the embodiments of the present application can have the second thickness through the plurality of second line patterns, so that the plurality of second line patterns can have good signal receiving and transmitting functions after generating the antenna lines.

[0013] For further understanding of the features and technical contents of the present application, please refer to the following detailed description and drawings of the present application, but such description and drawings are only used to illustrate the present application, and do not limit the protection scope of the present application. BRIEF DESCRIPTION OF DRAWINGS

[0014] Figure 1 The method flow chart of the manufacturing method of the radar board in the embodiments of the present application.

[0015] Figure 2 And Figure 3 The schematic diagram of step S100 in the embodiments of the present application.

[0016] Figure 4 The schematic diagram of step S110 in the embodiments of the present application.

[0017] Figure 5 The schematic diagram of step S120 in the embodiments of the present application.

[0018] Figure 6 For Figure 5 The cross-sectional schematic diagram along the section line VI-VI.

[0019] Figures 7 to 9 The schematic diagram of step S130 in the embodiments of the present application.

[0020] Figure 10 The schematic diagram of the radar board in the embodiments of the present application. DETAILED DESCRIPTION

[0021] The following is to illustrate the embodiments of the radar board disclosed in the present application through specific embodiments, and the advantages and effects of the present application can be understood by the contents disclosed in the present specification. The present application can be implemented or applied through other different embodiments, and each detail in the present specification can be modified and changed based on different viewpoints and applications without departing from the concept of the present application. In addition, the drawings of the present application are only simple schematic illustrations, and are not the depiction of actual size, which is declared in advance. The following embodiments will further illustrate the related technical contents of the present application, but the disclosed contents are not used to limit the protection scope of the present application.

[0022] It should be understood that although the terms "first", "second", "third" and the like can be used herein to describe various components or signals, these components or signals should not be limited by these terms. These terms are mainly used to distinguish one component from another component, or one signal from another signal. In addition, the term "or" used herein can include any one or more combinations of the associated listed items.

[0023] [Manufacturing method of radar board]

[0024] In the technical field of manufacturing radar boards, the thinner the thickness of the electroplated layer (such as a copper layer) at the antenna line generation position, the better the antenna signal receiving and transmitting function can be improved. However, the existing manufacturing method of radar boards often generates a relatively thin electroplated layer (such as a copper layer) at the antenna line generation position in advance, etches out the antenna line, and uses dry film protection, and then completes the via electroplating and etches out other transmission lines and other cumbersome steps to control the thickness of the electroplated layer (such as the thickness of the copper layer) at the antenna line generation position. However, the above-mentioned repeated electroplating and etching processes not only cause low production efficiency, but also cause low product yield.

[0025] To solve the above technical problems, please refer to Figures 1 to 10 The embodiment discloses a manufacturing method of a radar board to manufacture a radar board 100, and the radar board 100 is a 77GHz radar board, but the utility model is not limited thereto. Wherein, the manufacturing method of the radar board comprises steps S100-S140: an electroplating step S100, a first dry film laying step S110, a copper reduction step S120, a second dry film laying step S130, and an etching step S140.

[0026] It should be noted that the manufacturing method of the radar board in the embodiment is used to manufacture a single radar board 100, but the utility model is not limited thereto. For example, in other embodiments not shown in the utility model, the manufacturing method of the radar board can also be used to simultaneously manufacture a plurality of radar boards 100.

[0027] As shown in Figure 2 and Figure 3 The electroplating step S100 comprises: electroplating a metal copper on a substrate 1 to generate an electroplated layer 2 (that is, a copper layer), and the electroplated layer 2 has a first thickness H1 relative to a surface of the substrate 1. Wherein, as shown in Figure 3 The electroplated layer 2 has a first region 21, a second region 22 surrounding the outside of the first region 21, and a third region 23 surrounding the outside of the second region 22.

[0028] It is additionally noted that in other embodiments not shown in the present application, a via generation step is further included before the electroplating step S100, but the present application is not limited thereto. The via generation step includes generating a plurality of vias (not shown in the figure) on the substrate 1, but the positions of the plurality of vias can be adjusted and changed according to actual needs, which are not limited in the present application.

[0029] Further, the electroplating step S100 is to electroplate the metal copper to the substrate 1 and the plurality of vias to generate the electroplated layer 2 having the first thickness H1. In more detail, the first thickness H1 can be selected to be between 2010 microinches (µin) and 2310 microinches in the present embodiment, so that the plurality of vias can have sufficient electroplated layer thickness (i.e., copper layer thickness), but the present application is not limited thereto.

[0030] It is worth mentioning that, as shown in Figure 2 The surface of the substrate 1 defines a center point A, a longitudinal center axis R1, and a transverse center axis R2 perpendicular to the longitudinal center axis R1, and the longitudinal center axis R1 and the transverse center axis R2 intersect at the center point A. Specifically, the longitudinal center axis R1 and the transverse center axis R2 can divide the substrate 1 into four quadrants, and the position of the first area 21 can be in any one of the quadrants, which are not limited in the present application.

[0031] Next, as shown in Figure 4 The first dry film laying step S110 includes providing a first dry film 3, laying the first dry film 3 on the first area 21 and the third area 23, so that the second area 22 is not covered by the first dry film 3.

[0032] Further, after the first dry film 3 is laid on the first area 21 and the third area 23, the first dry film 3 can be pressed to the first area 21 and the third area 23 by a pressure of 4×10 5 Pa to 5×10 5 Pa and a temperature of 100 ℃ to 120 ℃, but the present application is not limited thereto.

[0033] As shown in Figure 5 and Figure 6 The copper reduction step S120 includes reducing the metal copper of the second area 22, so that the first area 21 and the third area 23 have the first thickness H1, and the second area 22 has a second thickness H2.

[0034] In order to more clearly understand the present embodiment,Figure 6 The first dry film 3 is not shown in the figure. The first thickness H1 and the second thickness H2 have a difference, and the difference can be between 960 microinches and 1560 microinches, but the utility model is not limited thereto. In more detail, the ratio between the first thickness H1 and the second thickness H2 can be between 1:0.32 and 1:0.53.

[0035] Specifically, the copper reduction step S120 is to etch the second area 22 with an etching solution to reduce the metal copper of the second area 22, and to reduce the second area 22 from the first thickness H1 to the second thickness H2, but the utility model is not limited thereto. Among them, based on the total content of the etching solution being 100 wt%, the etching solution in this embodiment contains sulfuric acid with a content range of 1.71 wt% to 1.89 wt%, and hydrogen peroxide with a content range of 1.9 wt% to 2.1 wt%.

[0036] It should be additionally pointed out that the copper reduction step S120 in this embodiment is to reduce the metal copper of the second area 22 by the etching solution through multiple (such as four) etching procedures, and each etching procedure can reduce a thickness of 240 microinches to 390 microinches, but the utility model is not limited thereto.

[0037] Specifically, the second area 22 is the generation position of the antenna circuit, and the second thickness H2 can be between 750 microinches and 1050 microinches. Thus, the antenna circuit generated in the second area 22 can have good signal receiving and transmitting functions, but the utility model is not limited thereto.

[0038] Through the cooperation of the above-mentioned electroplating step S100, the first dry film laying step S110, and the copper reduction step S120, the manufacturing method of the radar board provided by the utility model embodiment can effectively simplify the cumbersome process in the prior art, while ensuring that the plurality of guide holes have sufficient electroplated layer thickness, and the generation position of the antenna circuit (that is, the second area 22) can also have a relatively thin electroplated layer thickness (that is, the second thickness H2).

[0039] As shown in Figures 7 to 9 The second dry film laying step S130 includes removing the first dry film 3, laying a second dry film 4 on the first area 21, the second area 22, and the third area 23, and exposing the second dry film 4 located in the first area 21 and the second area 22 to generate an antenna pattern 41.

[0040] It is to be noted that the second dry film laying step S130 further comprises: after the second dry film 4 is laid on the first area 21, the second area 22 and the third area 23, vacuum suction is performed between the second dry film 4 and the first area 21, the second area 22 and the third area 23 within a predetermined time, and the predetermined time can be selected to be between 20 seconds and 40 seconds, so that the second dry film 4 is attached to the first area 21, the second area 22 and the third area 23 without gaps, and then the second dry film 4 is pressed to the first area 21, the second area 22 and the third area 23, but the utility model is not limited thereto.

[0041] For example, in other embodiments of the application, the second dry film 4 can also be used to wet the first area 21, the second area 22 and the third area 23 with water (such as deionized water) so that the second dry film 4 can be attached to the first area 21, the second area 22 and the third area 23 without gaps, and then the second dry film 4 is pressed to the first area 21, the second area 22 and the third area 23.

[0042] Further, the second dry film 4 in this embodiment is pressed to the first area 21, the second area 22 and the third area 23 within a predetermined time by a pressure of 4x10 5 Pa to 5x10 5 Pa and a temperature of 50°C to 60°C, and the predetermined time can be selected to be between 35 seconds and 45 seconds, but the utility model is not limited thereto.

[0043] It is worth mentioning that the second dry film 4 is attached to the first area 21, the second area 22 and the third area 23 by vacuum or wet attachment, which can make the second dry film 4 fill the difference between the first thickness H1 and the second thickness H2.

[0044] Therefore, after the second dry film 4 is pressed to the electroplated layer 2 (i.e. the first area 21, the second area 22 and the third area 23), gaps or bubbles can be avoided between the second dry film 4 and the electroplated layer 2, so that subsequent etching of the antenna pattern 41 on the second dry film 4 can be accurately performed.

[0045] Next, the etching step S140 comprises: etching the first area 21 and the second area 22 according to the antenna pattern 41 to generate an electroplated antenna layer 2a (such as Figure 10Specifically, the electroplated antenna layer 2a located in the second area 22 can be used to generate the antenna circuit.

[0046] Furthermore, in the etching step S140 , the first region 21 and the second region 22 are etched with an etching solution, and the etching solution in this embodiment may optionally include sodium chlorate (NaClO 3 ), hydrogen chloride (HCl), and copper chloride (CuCl 2 ), but the present invention is not limited thereto.

[0047] More specifically, the hydrogen chloride in this embodiment has an acidity value optionally ranging from 1.5 N (normality) to 2.5 N, and the copper ion content of the copper chloride in this embodiment may optionally range from 120 g / l to 160 g / l, but the present invention is not limited thereto.

[0048] Specifically, the electroplated antenna layer 2a includes a plurality of first circuit patterns 21a and a plurality of second circuit patterns 22a extending from the plurality of first circuit patterns 21a. The plurality of second circuit patterns 22a can be used to form the antenna circuits. Furthermore, the plurality of first circuit patterns 21a are located in the first region 21 and have the first thickness H1 relative to the surface of the substrate 1. Furthermore, the plurality of first circuit patterns 21a can be implemented in a ball grid array (BGA) package, but the present invention is not limited thereto.

[0049] Furthermore, the plurality of second line patterns 22a are located in the second region 22 and have the second thickness H2 relative to the surface of the substrate 1. Thus, after the antenna line is formed on the second line pattern 22a, it can have the optional signal transmission and reception function.

[0050] It should be noted that if Figure 10 As shown, after the etching step S140, the second dry film 4 can be removed to obtain the radar board 100. In addition, the radar board 100 obtained by the radar board manufacturing method can further undergo automated optical inspection (AOI) to ensure the quality of the radar board 100.

[0051] [Radar Board]

[0052] See also Figure 10As shown, the embodiment discloses a radar board 100, which can be manufactured by steps S100-S140 in the manufacturing method of the radar board provided by the above embodiment. Wherein, the radar board 100 comprises a substrate 1, and an electroplated antenna layer 2a generated on a surface of the substrate 1. It should be additionally explained that the substrate 1 can be provided with a plurality of guide holes (not shown in the figure), but the positions of the plurality of guide holes can be adjusted and changed according to actual needs, and the utility model is not limited here.

[0053] Further, the substrate 1 has a working block 11, an antenna block 12 surrounding the outside of the working block 11, and a surrounding block 13 surrounding the outside of the antenna block 12. In the embodiment, the surrounding block 13 comprises an electroplated layer (such as a copper layer) and has a first thickness H1, and the first thickness H1 can be selected to be between 2010 micro inches (µin) and 2310 micro inches in the embodiment, but the utility model is not limited to this.

[0054] The electroplated antenna layer 2a is a copper layer, and the electroplated antenna layer 2a is generated on the working block 11 and the antenna block 12. Wherein, the electroplated antenna layer 2a comprises a plurality of first line patterns 21a and a plurality of second line patterns 22a respectively generated from the plurality of first line patterns 21a.

[0055] Further, the plurality of first line patterns 21a is located in the working block 11, and the plurality of second line patterns 22a is located in the antenna block 12. Specifically, the plurality of first line patterns 21a has the first thickness H1 relative to the surface of the substrate 1, and the plurality of second line patterns 22a has a second thickness H2 relative to the surface of the substrate 1.

[0056] More specifically, the ratio range between the first thickness H1 and the second thickness H2 can be selected to be between 1:0.32 and 1:0.53, the difference between the first thickness H1 and the second thickness H2 can be selected to be between 960 micro inches and 1560 micro inches, and the second thickness H2 is between 750 micro inches and 1050 micro inches, but the utility model is not limited to this.

[0057] As described above, the generated positions of the surrounding block 13 and the plurality of first line patterns 21a have the copper layer thickness of the first thickness H1, so that the plurality of guide holes possibly located thereon has sufficient copper layer thickness. Furthermore, the plurality of second line patterns 22a can be used to generate antenna lines. Thus, the antenna lines can have optional transceiving signal function after being generated on the second line patterns 22a.

[0058] [Technical effects of the embodiments of the utility model]

[0059] In summary, the radar board disclosed by the embodiments of the utility model can have the second thickness through the plurality of second circuit patterns, so that the plurality of second circuit patterns can have good signal receiving and transmitting functions after generating the antenna circuit.

[0060] The above disclosed content is only optional and feasible embodiments of the utility model, and does not limit the patent range of the utility model, so that equivalent technical changes made by applying the utility model specification and the attached drawings are included in the patent range of the utility model.

Claims

1. A radar board, characterized in that: The radar board includes: a substrate having a working area, an antenna area surrounding the working area, and a peripheral area surrounding the antenna area; and An electroplated antenna layer is formed on a surface of the substrate, and the electroplated antenna layer includes: a plurality of first circuit patterns located in the working area, and the plurality of first circuit patterns have a first thickness relative to the surface of the substrate; and A plurality of second line patterns are located in the antenna block, and the plurality of second line patterns have a second thickness relative to the surface of the substrate; wherein the plurality of second line patterns are respectively generated by extending from the plurality of first line patterns; wherein the plurality of second line patterns can be used to generate antenna lines.

2. The radar board according to claim 1, characterized in that The electroplated antenna layer is a copper layer.

3. The radar board according to claim 1, wherein: A ratio between the first thickness and the second thickness ranges from 1:0.32 to 1:0.

53.

4. The radar board according to claim 1, wherein: The first thickness of the plurality of first line patterns is between 2010 microinches and 2310 microinches, and the second thickness of the plurality of second line patterns is between 750 microinches and 1050 microinches.

5. The radar board according to claim 1, wherein: The peripheral block has the first thickness, and the first thickness is between 2010 microinches and 2310 microinches.

6. The radar board according to claim 1, characterized in that The first thickness and the second thickness have a difference between 960 microinches and 1560 microinches.

7. The radar board according to claim 1, characterized in that A plurality of the first line patterns can be applied to a ball grid array package.

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