High-redundancy liquid-cooling cold plate system

Abstract

A high-redundancy liquid-cooling cold plate system comprises a vapor chamber, cold plate sets, a gas pipeline, a double-acting valve, a gas return main collecting pipe, a condenser, a pump, a liquid pipeline, a liquid separation main collecting pipe and heat exchange fluid, and further comprises at least one cold plate set, and each cold plate set is composed of at least two cold plates which are independently arranged in a crossed mode. And online maintenance of the high-heat-flow computing power chip cold plate system can be realized. In combination with the requirements of operation safety and energy conservation of the computing power chip, the device is high in safety and has the advantages of being high in heat dissipation capacity, compact in structure, high in temperature control precision, high in applicability, wide in application range and the like.

Description

Technical Field

[0001] The present invention belongs to the field of data center heat dissipation, and more specifically relates to a high-redundancy liquid-cooled cold plate system. Background Art

[0002] With the development of computing power, the number of computing chips and computing servers has gradually increased, and the corresponding power consumption of single cabinets has also increased rapidly. With the gradual evolution of high-power chips, high-density servers, and high-power single cabinets, traditional data center air cooling technology is prone to local hot spots that affect heat transfer performance, and the need to continuously reduce the supply air temperature and increase the supply air volume, affecting cooling energy consumption. As a result, traditional air cooling has gradually limited its heat transfer performance and energy efficiency.

[0003] Liquid cooling uses a liquid coolant to remove heat from heat-generating components, replacing the air-based heat exchange model used in air-cooled heat exchange. Liquid cooling technology can better dissipate heat in high-power chips, keeping them running at low temperatures and extending their lifespan. It can also fully utilize outdoor natural cooling sources to reduce data center power usage effectiveness (PUE). It can also improve the heat exchange efficiency of key components, reduce server heat dissipation hotspots, and support higher cabinet densities. It can also reduce data center noise and improve data center environmental adaptability. Liquid cooling technology is a key technical direction for future computing data center construction.

[0004] Currently, single-phase cold plate liquid cooling technology using water as the working fluid is relatively mature, takes up little space, and has a certain single-point heat dissipation capability. To prevent ice blockage in system pipes during winter, the cooling fluid is typically deionized water or an ethylene glycol / propylene glycol aqueous solution. If the cooling fluid and cold plate materials are improperly selected or poorly maintained, corrosion may occur after long-term operation, leading to cooling fluid leakage and the risk of burning the board or causing downtime. Therefore, with the further development of computing power chips and the need to ensure the high economic value of computing power chips, higher technical requirements are being placed on the heat dissipation technology and redundant safety design of liquid-cooled cold plate systems. Summary of the Invention

[0005] The present invention aims to overcome the aforementioned problems in the prior art by providing a highly redundant liquid-cooled cold plate system suitable for data center heat dissipation. This system effectively safeguards the safe and efficient operation of computing facilities and data while servicing high-heat-flux electronic devices. This system not only offers a high safety margin but also boasts strong heat dissipation capabilities, a compact structure, high temperature control accuracy, strong applicability, and a wide range of applications.

[0006] The technical solutions of the present invention are as follows:

[0007] A high-redundancy liquid cooling cold plate system, characterized in that: the system comprises a heat plate, a cold plate group, a gas pipeline, a double-acting valve, a gas return header, a condenser, a pump, a liquid pipeline, a liquid distribution header and a heat exchange fluid; it comprises at least one set of gas return header and liquid distribution header; it comprises at least one cold plate group; the cold plate group is composed of at least two independently arranged cold plates, and the cold plate can be individually installed and maintained; the cold plate is an integrated structure composed of a liquid inlet, a heat exchange branch, a gas return branch and a gas return header; the heat exchange fluid enters from the liquid inlet of the cold plate, uniformly flows into each heat exchange branch to absorb heat and phase change, and after being converted into a gaseous fluid, enters the gas return header through each gas return branch, enters the gas return header through the gas pipeline, the double-acting valve one, the gas soft connection pipeline, the double-acting valve two, and then enters the condenser through the gas pipeline to be condensed into a liquid heat exchange fluid, which is pushed into the liquid distribution header by the pump, and then is uniformly distributed through the double-acting valve four, the liquid soft connection pipeline, the double-acting valve three and the liquid pipeline to the cold plate.

[0008] In the above technical solution, the heat plate can be one or several of carbon fiber, graphene, silver, copper and aluminum high-thermal-conductivity materials, or a heat pipe.

[0009] Preferably, the condenser can be one or a combination of air-cooled condensers and water-cooled condensers.

[0010] Preferably, the heat exchange fluid is a low-boiling-point fluid working medium, a mixture of multiple low-boiling-point fluid working media, or a mixture of a low-boiling-point fluid working medium and nanoparticles.

[0011] Preferably, the pump is a high-pressure-resistant and leakage-free mechanical pump or a piezoelectric pump.

[0012] Preferably, the double-acting valve is a high-pressure-resistant valve with a bidirectional closable function and a quick connection function without leakage after connection.

[0013] Compared with the prior art, the present application has the following advantages and outstanding technical effects: the present application closely combines the safe operation and cooling needs of high-power computing chip in a data center, realizes the redundancy design of chip-level cold plate through the ingenious design of liquid-cooled cold plate structure, constructs a new idea of liquid-cooled cooling of computing chip, solves the redundancy problem of system in the process of cabinet failure or operation and maintenance, and realizes the online maintenance of high-heat-flow computing system. BRIEF DESCRIPTION OF DRAWINGS

[0014] Figure 1 is the principle and structure schematic diagram of a high-redundancy liquid cooling cold plate system embodiment provided by the present application.

[0015] Figure 2 is the principle and structure schematic diagram of a cold plate embodiment of a high-redundancy liquid cooling cold plate system provided by the present application.

[0016] Figure 3 is Figure 1 Schematic diagram of the principle and structure of a system embodiment in which a cold plate is in direct contact with the chip.

[0017] In the figure: 1—chip; 2—heat sink; 3—cold plate group; 4—liquid distribution main header; 5—return air main header; 6—gas pipeline; 7—liquid pipeline; 8—condenser; 9—pump; 10—heat exchange fluid; 11—double-acting valve four; 12—double-acting valve three; 13—double-acting valve one; 14—double-acting valve two; 15—gas flexible connecting pipeline; 16—liquid flexible connecting pipeline; 310—cold plate one; 311—liquid inlet one; 312—heat exchange flow channel one; 313—return air branch one; 314—return air header one; 320—cold plate two; 321—liquid inlet two; 322—heat exchange flow channel two; 323—return air branch two; 324—return air header two. DETAILED DESCRIPTION

[0018] The present invention will be further described below with reference to the accompanying drawings and specific embodiments:

[0019] Figure 1 The schematic diagram of the principle and structure of a high-redundancy liquid-cooled cold plate system includes a heat sink, a cold plate group, a gas pipeline, a double-acting valve, a return air manifold, a condenser, a pump, a liquid pipeline, a liquid separation manifold, and a heat exchange fluid; includes at least one group of return air manifolds and a liquid separation manifold; includes at least one cold plate group; the cold plate group consists of at least two cold plates arranged independently and crosswise, and the cold plates can be installed and maintained separately; the cold plate is an integrated structure consisting of a liquid inlet, a heat exchange branch, a return air branch, and a return air manifold; the The heat exchange fluid enters from the liquid inlet of the cold plate and flows evenly into each heat exchange branch to absorb heat and change phase. After being converted into a gaseous fluid, it enters the return gas header through each return gas branch, and enters the return gas main header through the gas pipeline, double-acting valve 1, gas soft connecting pipeline, double-acting valve 2, and then enters the condenser through the gas pipeline to be condensed into liquid heat exchange fluid. It enters the liquid distribution main header through the liquid pipeline under the push of the pump. After the heat exchange fluid is evenly distributed, it is transported to the cold plate through double-acting valve 4, liquid soft connecting pipeline, double-acting valve 3, and liquid pipeline.

[0020] The heat spreader can be made of one or more of the highly thermally conductive materials selected from carbon fiber, graphene, silver, copper, and aluminum, or can be a heat pipe.

[0021] The condenser can be an air-cooled condenser, a water-cooled condenser, or a combination thereof.

[0022] The heat exchange fluid is a low-boiling-point fluid, or a mixture of multiple low-boiling-point fluids, or a mixture of a low-boiling-point fluid and nanoparticles.

[0023] The pump is a high-pressure resistant and leakage-free mechanical pump or a piezoelectric pump.

[0024] The double-acting valve is a high-pressure resistant valve with a two-way closable function and a quick connection function without leakage after connection.

[0025] Figure 2 is the principle and structure diagram of a cold plate embodiment of a high-redundancy liquid cooling cold plate system provided by the application. The cold plate group is composed of at least two independently arranged cold plates. Liquid heat exchange fluid enters each heat exchange channel in the cold plate from the liquid inlet of the cold plate, absorbs the heat of the chip in the heat exchange channel, changes into gaseous heat exchange fluid by phase change and gasification, and is collected into the gas return header through the gas return branch connected to the end of the heat exchange channel. This embodiment is a cold plate group composed of two cold plates. The cold plate one and the cold plate two are independent of each other and can be closely staggered to form a complete cold plate. The pipeline does not exist in space. When the cold plate one fails, only the cold plate one needs to be disassembled for maintenance. The cold plate two provides the heat dissipation needs of the entire chip through the uniform heat transmission of the heat conduction plate. When the cold plate two fails, only the cold plate two needs to be maintained. The cold plate one still provides the heat dissipation needs of the entire chip through the uniform heat transmission of the heat conduction plate.

[0026] Figure 3 is the principle and structure diagram of a system embodiment in which the cold plate directly contacts the chip on the basis of Figure 1 . The cold plate group is directly and closely installed with the chip. The cold plate group directly absorbs the heat of the chip to provide a suitable temperature environment for the stable operation of the chip. The heat exchange fluid operating principle and structure are the same as those of Figure 1 .

Claims

1. A highly redundant liquid-cooled cold plate system, characterized by: The system includes a soaking plate, a cold plate group, a gas pipeline, a double-acting valve, a return gas main pipe, a condenser, a pump, a liquid pipeline, a liquid separation main pipe and a heat exchange fluid; includes at least one group of return gas main pipes and a liquid separation main pipe; includes at least one cold plate group; the cold plate group is composed of at least two cold plates arranged independently and crosswise, and the cold plates can be installed and maintained separately; the cold plate is an integrated structure consisting of a liquid inlet, a heat exchange branch, a return gas branch and a return gas manifold; the heat exchange fluid is transferred from the liquid inlet of the cold plate to the heat exchanger; The air enters the heat exchanger from the outlet and flows evenly into each heat exchange branch to absorb heat and change phase. After being transformed into a gaseous fluid, it enters the return air header through each return air branch, passes through the gas pipeline, double-acting valve 1, gas soft connecting pipeline, double-acting valve 2, and enters the return air main header. Then, it enters the condenser through the gas pipeline to be condensed into a liquid heat exchange fluid. Driven by the pump, it enters the liquid distribution main header through the liquid pipeline. After the heat exchange fluid is evenly distributed, it is transported to the cold plate through double-acting valve 4, liquid soft connecting pipeline, double-acting valve 3, and liquid pipeline.

2. A high-redundancy liquid-cooled cold plate system according to claim 1, characterized in that: The heat spreader can be made of one or more of the highly thermally conductive materials selected from carbon fiber, graphene, silver, copper, and aluminum, or can be a heat pipe.

3. The high-redundancy liquid-cooled cold plate system according to claim 1, characterized in that: The condenser can be an air-cooled condenser, a water-cooled condenser, or a combination thereof.

4. The high-redundancy liquid-cooled cold plate system according to claim 1, wherein: The heat exchange fluid is a low-boiling-point fluid, or a mixture of multiple low-boiling-point fluids, or a mixture of a low-boiling-point fluid and nanoparticles.

5. The high-redundancy liquid-cooled cold plate system according to claim 1, characterized in that: The pump is a mechanical pump or a piezoelectric pump that is resistant to high pressure and leak-free.

6. The high-redundancy liquid-cooled cold plate system according to claim 1, characterized in that: The double-acting valve is high-pressure-resistant and has a quick-connect function with a bidirectional closing function, and there is no leakage after connection.

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