Electronic device
The local shielding structure and through-hole pad grounding method solve the complexity and high cost problems of electromagnetic interference shielding in electronic devices, and provide a flexible and low-cost shielding solution.
Patent Information
- Application Number
- CN202422753981.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Priority Date
- 2024-09-13
- Filing Date
- 2024-11-12
- Publication Date
- 2025-10-17
- Estimated Expiration
- 2034-11-12
AI Technical Summary
In the prior art, electromagnetic interference shielding methods for electronic devices are complex and costly. In particular, the grounding method of the metal shielding cover is inconvenient, resulting in increased costs and insulation problems.
A local shielding structure is adopted, which uses a metal shielding layer to connect the ground pin of the grounding device through a through-hole pad and fix it with an adhesive to achieve local shielding and avoid the use of a full shielding cover.
The invention realizes flexible and low-cost electromagnetic interference shielding, simplifies the grounding process, improves reliability and manufacturability, and reduces costs.
Smart Images
Figure CN223452312U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of electromagnetic interference shielding, particularly relates to an electronic device. BACKGROUND
[0002] The power supply is the core component of all electronic products, and once the power supply appears power supply anomaly, the electronic product will stop working, with the continuous progress and development of science and technology, people's reliability requirement of power supply is higher and higher, but the sensitive part in the power supply product is usually brought product work abnormal problem by electromagnetic interference (lightning surge, group impulse, static electricity etc.), the method commonly used in the industry is to increase the metal shielding cover, which not only has complex process, but also brings cost up sharply, in addition, the metal shielding cover must be connected with the ground of the product to form the faraday shielding cover, but the shielding cover grounding mode is also the industry's pain point, usually needs to be connected on the ground wire of the electronic product through locking screw or through conductive adhesive, which will further bring cost up, the insulation problem of the metal shielding cover and other high-voltage devices in the product also needs to be solved by taking measures.
[0003] In addition to the power supply, the electromagnetic interference shielding of other electronic devices also has the above common problems. SUMMARY
[0004] Therefore, the utility model wants to solve the technical problem, provides an electronic device and switching power supply, at least one of the technical problems existing in the prior art is solved to a certain extent.
[0005] To solve the above technical problems, the technical scheme of the embodiment of the electronic device provided by the utility model is as follows:
[0006] An electronic device, the electronic device includes an electromagnetic interference sensitive part and a grounding device, wherein: the electronic device further includes a local shielding structure, the local shielding structure is placed above the electromagnetic interference sensitive part, the local shielding structure includes a shielding main body and a through-hole pad, a metal shielding layer is arranged in the shielding main body, the metal shielding layer is connected with the ground pin of the grounding device through the through-hole pad, so as to shield the electromagnetic interference signal for the electromagnetic interference sensitive part.
[0007] Preferably, the grounding device is a capacitor.
[0008] Further, the capacitor is a capacitor arranged around the electromagnetic interference sensitive part.
[0009] Further, the capacitor is a plug-in capacitor, and the shielding main body is fixed by inserting the ground pin of the capacitor through the through-hole pad.
[0010] Further, the through-hole pads are two, one of which is inserted into the positive pin of the capacitor, and the other is inserted into the ground pin of the capacitor, wherein the through-hole pad inserted into the positive pin of the capacitor is not electrically connected with the metal shielding layer.
[0011] Preferably, the shielding body is a PCB board, and the copper layer in the PCB board is the metal shielding layer.
[0012] Preferably, the EMI sensitive part is a master control chip, a sampling control chip, a transmission signal chip, a sampling line or a driving line.
[0013] Further, an adhesive is applied between the EMI sensitive part and the shielding body to achieve further fixation.
[0014] Preferably, the adhesive is silicone rubber or double-sided tape.
[0015] Further, the electronic device is a switching power supply.
[0016] The electronic device of the present application provides a local shielding structure and grounding mode of a PCB circuit to solve the problem of cost increase and complex process caused by the addition of a metal shielding cover in the industry, and the beneficial effects are analyzed as follows:
[0017] (1) In the embodiment of the present application, only the EMI sensitive part in the electronic device is selected for local shielding, and the shape of the local shielding structure can be flexibly changed according to the shape of the device to be locally shielded, and compared with the full shielding mode of the metal shielding cover in the prior art, the manufacturability is higher and the price is cheaper.
[0018] (2) In the embodiment of the present application, the metal shielding layer in the local shielding structure is connected to the ground pin of the grounding device through the through-hole pad, and compared with the metal shielding cover in the prior art which is connected to the ground line of the PCB through locking screws or conductive adhesive, the grounding is simpler, the cost is lower, and the reliability is higher. BRIEF DESCRIPTION OF DRAWINGS
[0019] Figure 1 The schematic diagram of the local shielding structure of the present application;
[0020] Figure 2 The schematic diagram of the electronic device without the local shielding structure of the present application;
[0021] Figure 3 Figure 2 The schematic diagram of the electronic device with the local shielding structure of the present application. Figure 1 The schematic diagram of the electronic device with the local shielding structure of the present application. DETAILED DESCRIPTION
[0022] The utility model discloses a low cost, simple process partial shielding structure and ingenious grounding mode, solve the problem of product abnormal work caused by interference of sensitive device.
[0023] The utility model will make further detailed description in combination with specific embodiment and the drawing of specification, obviously, the described embodiment is a part of embodiment of the utility model, instead of all embodiments. Based on the embodiment in the application, all other embodiments obtained by the person skilled in the art without making creative labor should belong to the range of protection of the application.
[0024] It needs to be explained that the terms "include" and "have" and their any change described in the specification and claims of the application, the intention is to cover the non-exclusive inclusion, for example, includes a series of components, unit circuit or control timing does not have to be limited to the clearly listed those components, unit circuit or control timing, but can include the components, unit circuit or control timing that is not clearly listed or inherent to these circuits.
[0025] In addition, the embodiments in the application and the features in the embodiments can be combined with each other without conflict.
[0026] It should be understood that in the specification and claims, when describing an element "connected" to another element, the element can be "directly connected" to the other element, or "connected" to the other element through a third element.
[0027] Figure 1 The schematic diagram of the partial shielding structure of the utility model; Figure 2 The schematic diagram of the electronic device without the partial shielding structure of the utility model; Figure 3 Figure 2 The schematic diagram of the electronic device with the partial shielding structure of the utility model; Figure 1 The schematic diagram of the electronic device with the partial shielding structure of the utility model, please see Figures 1 to 3 The electronic device includes an electromagnetic interference sensitive part and a grounding device, wherein: the electronic device further includes a partial shielding structure, the partial shielding structure is arranged above the electromagnetic interference sensitive part, the partial shielding structure includes a shielding main body ③ and a through-hole pad ① and a through-hole pad ②, a metal shielding layer ④ is arranged in the shielding main body ③, the metal shielding layer ④ is connected to the ground pin of the grounding device through the through-hole pad ① and the through-hole pad ②, so as to form a Faraday shield, and the electromagnetic interference sensitive part is shielded from electromagnetic interference signals.
[0028] Please see Figure 2 The electronic device is a switching power supply, the electromagnetic interference sensitive part is a main control chip, and the grounding device is a plug-in capacitor arranged near the chip. Since the chip is arranged below the partial shielding structure, it is covered in the top view from top to bottom after assembly, so that the electromagnetic interference sensitive part is shielded from electromagnetic interference signals.Figure 2 Also represented by ③, likewise, the positive terminal pin of the plug-in capacitor as a grounding device is represented by ①, and the ground pin is represented by ②.
[0029] Please refer to Figure 3 The shielding structure adopts a PCB cover plate, and the shape of the PCB cover plate can be flexibly adjusted according to the actual PCB layout of the electronic device product. For electronic products, there are VCC power supply capacitors around the chip. By skillfully utilizing this feature, the copper shielding layer in the PCB cover plate is connected to the ground of the power supply capacitor through a via pad. Specifically, one of the two via pads is inserted into the positive terminal pin ① of the capacitor, and the other is inserted into the ground pin ② of the capacitor. The via pad inserted into the positive terminal pin of the capacitor is not electrically connected to the metal shielding layer, thereby greatly reducing the area of the PCB cover plate, achieving good anti-interference shielding effect for the chip, and the PCB cover plate can be fixed by welding the two pins of the VCC power supply capacitor, thereby realizing the problem of abnormal work of the electronic device caused by EMS interference at extremely low cost and simple process.
[0030] Further, if the electronic product is used in a place with higher anti-vibration requirements, Figure 2 The positive terminal of the chip ③ can be evenly coated with silicone rubber or further fixed by adding double-sided adhesive tape.
[0031] As another specific embodiment of the local shielding structure, it can include a flexible circuit, or it can include a polyimide with high temperature resistance and good insulation performance.
[0032] In addition, the shielding object of the local shielding structure of the utility model can be Figure 3 In addition to the main control chip ③, the transmission signal chip ⑤ (such as an optical coupler) and the sampling control chip ⑥ (such as TL431 and an operational amplifier) in the above-mentioned local shielding structure can also be some sensitive lines (such as driving lines and sampling lines).
[0033] The above is only an embodiment of the utility model, and it should be particularly pointed out that the above-mentioned embodiment should not be regarded as a limitation of the utility model. For ordinary skilled persons in the technical field, some improvements and refinements can be made without departing from the spirit and scope of the utility model, and these improvements and refinements should also be regarded as the protection scope of the utility model.
Claims
1. An electronic device comprising an electromagnetic interference sensitive portion and a grounding device, characterized in that: The electronic device also includes a local shielding structure, which is placed above the electromagnetic interference sensitive part. The local shielding structure includes a shielding body and a through-hole pad. A metal shielding layer is provided in the shielding body. The metal shielding layer is connected to the ground pin of the grounding device through the through-hole pad, thereby shielding the electromagnetic interference sensitive part from electromagnetic interference signals.
2. The electronic device according to claim 1, wherein: The grounding device is a capacitor.
3. The electronic device according to claim 2, wherein: The capacitor is a capacitor arranged around the electromagnetic interference sensitive part.
4. The electronic device according to claim 2, wherein: The capacitor is a plug-in capacitor, and the shielding body is inserted into the ground pin of the capacitor through the through-hole pad to achieve fixation.
5. The electronic device according to claim 4, wherein: There are two through-hole pads, one of which is inserted into the positive terminal pin of the capacitor and the other is inserted into the ground pin of the capacitor. The through-hole pad inserted into the positive terminal pin of the capacitor has no electrical connection with the metal shielding layer.
6. The electronic device according to claim 1, wherein: The shielding body includes a PCB board, and the copper clad layer in the PCB board is the metal shielding layer; or the shielding body includes a flexible circuit; or the shielding body includes polyimide.
7. The electronic device according to claim 1, wherein: The electromagnetic interference sensitive part is a main control chip, a sampling control chip, a transmission signal chip, a sampling line or a driving line.
8. The electronic device according to claim 1, wherein: An adhesive is applied between the electromagnetic interference sensitive portion and the shielding body to achieve further fixation.
9. The electronic device according to claim 8, wherein: The adhesive is silicone rubber or double-sided tape.
10. The electronic device according to claim 1, wherein: The electronic device is a switching power supply.