Laser topping system, laser topping device and unmanned vehicle

Abstract

The utility model provides a laser topping system, a laser topping device and an unmanned vehicle. The laser topping system comprises a power supply, a microprocessor module, an upper computer, a plurality of driving modules and a plurality of lasers, the upper computer is connected with the single-chip microcomputer through the serial port circuit, the single-chip microcomputer is connected with the second DAC chip through the first DAC chip, the first DAC chip is connected with the first laser, and the second DAC chip is connected with the second laser; the power supply is connected with the single chip microcomputer through the MCU power supply circuit, the power supply is connected with the first DAC chip through the first DAC power supply circuit, and the power supply is connected with the second DAC chip through the second DAC power supply circuit. In the embodiment of the utility model, the microprocessor module can be connected with a plurality of driving modules and further can be correspondingly connected with a plurality of lasers; a plurality of lasers are driven by one microprocessor module, so that the area of the device is reduced, and the structural complexity is reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to a top -notching operation technical field especially a kind of laser top -notching system, laser top -notching device and unmanned vehicle. BACKGROUND

[0002] Cotton laser top -notching technology is an innovative modern agricultural technology, it is accurately ablated the top of cotton plant by laser, effectively controls the growth height of plant, and then significantly improves the yield and quality of cotton.In related technology, cotton top -notching operation usually needs multiple lasers to operate simultaneously, and each laser needs to be configured with a laser controller.This makes the operation system bulky, high in cost, and the structure of the system is complex.

[0003] Therefore, the problems in the related art need to be solved. UTILITY MODEL CONTENT

[0004] The utility model aims at solving one of the technical problems in the related art at least to some extent.

[0005] Therefore, an object of the embodiments of the utility model is to provide a convenient laser top -notching system, laser top -notching device and unmanned vehicle, comprising:

[0006] The utility model embodiment provides a kind of laser top -notching system, comprising: power supply, microprocessor module, host computer, several drive modules, several lasers;The microprocessor module includes serial port circuit, single-chip microcontroller, MCU power supply circuit;First drive module includes first DAC power supply circuit, first DAC chip;Second drive module includes second DAC power supply circuit, second DAC chip;The host computer is connected by the serial port circuit described single-chip microcontroller, and the single-chip microcontroller is connected by the first DAC chip described second DAC chip, and the first DAC chip connects first laser, and the second DAC chip connects second laser;The power supply is connected by the MCU power supply circuit described single-chip microcontroller, and the power supply is connected by the first DAC power supply circuit described first DAC chip, and the power supply is connected by the second DAC power supply circuit described second DAC chip.The utility model embodiment is driven by multiple drive modules to multiple lasers, which is conducive to reducing the area of device and reducing structural complexity.

[0007] In addition, the laser top -notching system according to the above embodiments of the utility model can also have the following additional technical features:

[0008] Further, in an embodiment of the utility model, the serial port circuit includes USB to serial chip, the host computer is connected the singlechip through the serial port circuit, including: the USB port of host computer's difference signal positive terminal connects the USB signal positive terminal of USB to serial chip, the USB port of host computer's difference signal negative terminal connects the USB signal negative terminal of USB to serial chip, the TXD port of USB to serial chip is connected with the first general port of singlechip, the RXD port of USB to serial chip is connected with the second general port of singlechip.

[0009] Further, in an embodiment of the utility model, the singlechip is connected the second DAC chip through the first DAC chip, including: the third general port of singlechip connects the SCLK port of first DAC chip, the fourth general port of singlechip connects the SDIN port of first DAC chip, the fifth general port of singlechip connects the LDAC port of first DAC chip, the sixth general port of singlechip connects the SYNC port of first DAC chip, the SCLK port of first DAC chip connects the SCLK port of second DAC chip, the SDO port of first DAC chip connects the SDIN port of second DAC chip, the LDAC port of first DAC chip connects the LDAC port of second DAC chip, the SYNC port of first DAC chip connects the SYNC port of second DAC chip.

[0010] Further, in an embodiment of the utility model, the MCU power supply circuit or the first DAC power supply circuit includes switching power supply chip, the power supply is connected the singlechip through the MCU power supply circuit, including: the power supply is connected the switching power supply chip through rectifier filter unit, the switching power supply chip exports first power supply through RLC unit, the first power supply exports second power supply through voltage reducing chip, and the second power supply is the power supply of singlechip.

[0011] Further, in an embodiment of the utility model, the first DAC power supply circuit includes TDK15 power supply chip, the power supply is connected the first DAC chip through the first DAC power supply circuit, including: the power supply is connected the TDK15 power supply chip through LC unit, and the TDK15 power supply chip is connected the first DAC chip through filter unit.

[0012] Further, in an embodiment of the utility model, the first DAC chip connects the first laser, including: the first analog output port, second analog output port, third analog output port and fourth analog output port of first DAC chip connect laser galvanometer control connector, the first analog output port connects first laser power control connector, the second analog output port connects second laser power control connector, the third analog output port connects third laser power control connector, the fourth analog output port connects fourth laser power control connector.

[0013] Further, in an embodiment of the utility model, the power supply connects the MCU power circuit through the main power input connector, and the main power input connector also connects the first power input connector of the first drive module through the main power output connector, the first power input connector connects the first DAC chip, and the first power input connector also connects the first power output connector of the first drive module.

[0014] Further, in an embodiment of the utility model, the single-chip microcomputer connects the second DAC chip through the first DAC chip, including: the single-chip microcomputer connects the first signal input connector of the first drive module through the main signal output connector, the first signal input connector connects the first DAC chip, and the first signal input connector connects the first signal output connector of the first drive module; the first signal output connector connects the second signal input connector of the second drive module, and the second signal input connector connects the second DAC chip.

[0015] On the other hand, the utility model embodiment provides a kind of laser top punching device, including above-mentioned laser top punching system.

[0016] On the other hand, the utility model embodiment provides a kind of unmanned vehicle, comprising: walking car, above-mentioned laser top punching device, and the laser top punching device is arranged on the walking car.

[0017] The advantages and beneficial effects of the utility model will be partially given in the following description, some will become obvious from the following description, or be understood by the practice of the utility model:

[0018] The utility model discloses a kind of laser top punching systems, comprising: power supply, microprocessor module, host computer, several drive modules, several lasers;The microprocessor module includes serial port circuit, single-chip microcontroller, MCU power supply circuit;First drive module includes first DAC power supply circuit, first DAC chip;Second drive module includes second DAC power supply circuit, second DAC chip;The host computer is connected the single-chip microcontroller by the serial port circuit, the single-chip microcontroller is connected the second DAC chip by the first DAC chip, the first DAC chip connects first laser, and the second DAC chip connects second laser;The power supply is connected the single-chip microcontroller by the MCU power supply circuit, and the power supply is connected the first DAC chip by the first DAC power supply circuit, and the power supply is connected the second DAC chip by the second DAC power supply circuit.The microprocessor module can be connected multiple drive modules in the utility model embodiment, and then multiple lasers can be driven correspondingly;Realize by a microprocessor module drive multiple lasers, it is favorable to reduce the area of device, reduce structural complexity. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 The structure schematic view of one embodiment of the laser top punching system provided by the utility model is provided;

[0020] Figure 2 The circuit schematic diagram of one embodiment of MCU power supply circuit provided by the utility model is provided;

[0021] Figure 3 The circuit schematic diagram of another embodiment of MCU power supply circuit provided by the utility model is provided;

[0022] Figure 4 The circuit schematic diagram of one embodiment of serial port circuit provided by the utility model is provided;

[0023] Figure 5 The circuit schematic diagram of one embodiment of single-chip microcontroller provided by the utility model is provided;

[0024] Figure 6 The circuit schematic diagram of one embodiment of first DAC power supply circuit provided by the utility model is provided;

[0025] Figure 7 The circuit schematic diagram of one embodiment of first DAC chip provided by the utility model is provided;

[0026] Figure 8 The circuit schematic diagram of one embodiment of laser control connector provided by the utility model is provided. DETAILED DESCRIPTION

[0027] The embodiments of the present application are described below in detail, examples of the embodiments are shown in the drawings, wherein the same or similar notations represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are only used to explain the present application, and cannot be understood as a limitation of the present application.

[0028] In the description of the present application, it should be understood that the terms "length", "upper", "lower", "front", "rear", "left", "right", "top", "inner", "outer", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application. In addition, the features limited as "first" and "second" can explicitly or implicitly include one or more of the features. In the description of the present application, unless otherwise specified, the meaning of "a plurality of" is two or more.

[0029] In the description of the present application, it should be noted that, unless otherwise specified and limited, the terms "set", "mount", "connected", "connected" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium, or it can be connected inside two elements. For ordinary skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0030] Cotton laser topping technology is an innovative modern agricultural technology, which precisely ablates the top of cotton plants by laser, effectively controls the growth height of plants, and significantly improves the yield and quality of cotton. The core of the technology is the laser controller, which accurately adjusts the output power of the laser and the emission angle of the laser beam and other key parameters. In order to meet the diversified cotton planting needs and improve the efficiency of laser topping operation, multiple lasers are usually equipped on a device and are controlled cooperatively. Traditionally, this is achieved by simply combining multiple single-channel laser controllers, but this method has the disadvantages of large size, high cost and complex system.

[0031] In the current technical solution, some attempts have been made to solve the problem of multi-laser cooperative control. For example, one embodiment integrates four laser driver circuits on the basis of a conventional laser controller, which can provide stable control signals for four lasers. This multi-output design provides a feasible solution for the multi-laser cooperative operation that may be required in cotton laser topping technology.

[0032] Exemplarily, a single laser is controlled by a single controller. In the cotton laser topping operation, due to the need to cover a large area of cotton field, multiple lasers are usually needed. However, the limitation of the technology leads to the need to equip multiple laser controllers, which not only increases the cost, but also makes the whole system bulky, complex in structure, increases the difficulty of maintenance and management, and may also affect the stability and reliability of the operation. Some other embodiments can control multiple lasers through multi-output intelligent semiconductor laser driving power supply, but the number of lasers they can control and the control precision are fixed and cannot be expanded and upgraded. This limits the adaptability of the system to changes in the demand of cotton laser topping operation and cannot meet the demand of higher precision and larger scale operation.

[0033] In contrast, the modular laser controller proposed by the utility model has significant advantages. The main control module can be connected in series with multiple laser driving modules, so as to correspond to multiple lasers, and the number can be flexibly expanded according to actual needs. This design improves the flexibility of the system, so that the system can easily cope with different scale and demand operation scenarios. In addition, due to the modular design, the maintenance and upgrade of the system also become simpler and more convenient. If the laser driving module fails, the modular design allows quick replacement, optimizing the maintenance process. In addition, when higher precision laser control is required, the system can upgrade the laser driving module to meet the new precision requirements, thereby ensuring the improvement of operation standards.

[0034] In summary, the modular laser controller of the utility model has unique advantages in solving the defects of the prior art, and its high flexibility, strong expansibility, easy maintenance and upgradeability will effectively improve the efficiency and quality of the cotton laser topping operation.

[0035] Therefore, the utility model proposes a laser topping system, referring to Figure 1 The structure schematic diagram of the laser topping system is shown, and the laser topping system proposed by the utility model is introduced in detail.

[0036] The laser topping system proposed by the utility model comprises: a power supply, a microprocessor module, an upper computer, a plurality of driving modules and a plurality of lasers.

[0037] The microprocessor module comprises a serial port circuit, a single-chip microcomputer and an MCU power supply circuit; the first driving module comprises a first DAC power supply circuit and a first DAC chip; and the second driving module comprises a second DAC power supply circuit and a second DAC chip.

[0038] The upper computer is connected with the single-chip microcomputer through the serial port circuit, the single-chip microcomputer is connected with the second DAC chip through the first DAC chip, the first DAC chip is connected with the first laser, and the second DAC chip is connected with the second laser.

[0039] The power supply is connected with the single-chip microcomputer through the MCU power supply circuit, the power supply is connected with the first DAC chip through the first DAC power supply circuit, and the power supply is connected with the second DAC chip through the second DAC power supply circuit.

[0040] In some possible embodiments, referring to Figure 1 The first driving module and the second driving module in the embodiment of the utility model can have multiple driving modules, corresponding to multiple lasers, and the driving modules are connected in series according to the serial connection mode of the first driving module and the second driving module, the power supply can supply power to the DAC chips in the multiple driving modules, and the single-chip microcomputer provides signals for the DAC chips in the multiple driving modules. The first driving module and the second driving module in the embodiment of the utility model do not limit the number of driving modules, and the first and the second can represent any one driving module. It can be understood that the microprocessor module in the embodiment of the utility model is the main control module in Figure 1 The first driving module can be any one of the driving module 1, the driving module 2 and the driving module N. In some embodiments, the first driving module can be the driving module 1, the second driving module can be the driving module 2, the first DAC power supply circuit can be the DAC power supply circuit 10 in the driving module 1, and the first DAC chip can be the DAC chip 13 in the driving module 1. The second DAC power supply circuit can be the DAC power supply circuit in the driving module 2, and the second DAC chip can be the DAC chip in the driving module 2. In the signal transmission process, the signal sent by the single-chip microcomputer is transmitted to the first DAC chip and the second DAC chip through the daisy chain. Each DAC chip has an LDAC pin (see Figure 7 ) and is connected with the single-chip microcomputer main control. When the single-chip microcomputer main control pulls down the LDAC pin level, each DAC chip will update the analog output synchronously, so that the N lasers are synchronized.

[0041] In some embodiments, referring to Figure 2 and Figure 3 The power supply of the MCU and the first DAC chip is realized through the MCU power supply circuit and the first DAC power supply circuit; referring to Figure 4 and Figure 5 The connection relationship of the microprocessor module is displayed through the electrical principle diagram of the serial port circuit and the single-chip microcomputer; referring to Figure 6 Another embodiment of the first DAC power supply circuit is shown, which realizes the analog power supply of the first DAC chip; referring to Figure 7And Figure 8 The electric principle view of the DAC chip shown realizes the transmission of signals.

[0042] Optionally, the laser top punching system, the serial port circuit includes a USB-to-serial chip, the upper computer is connected with the single-chip microcomputer through the serial port circuit, and the USB port of the upper computer is connected with the USB signal positive end of the USB-to-serial chip in a differential signal mode, and the USB port of the upper computer is connected with the USB signal negative end of the USB-to-serial chip in a differential signal mode.

[0043] In some possible implementation manners, referring to Figure 4 The USB-to-serial chip embodiment shown, in combination with Figure 5 The connection relationship between the USB-to-serial chip and the single-chip microcomputer is shown. The first universal port is the PA9 port in Figure 5 , and the second universal port is the PA10 port in Figure 5 . Of course, Figure 5 For exemplary display, a person skilled in the art can select a universal interface according to actual needs, and the universal interface is not limited in the specific position by the utility model.

[0044] Optionally, the laser top punching system, the single-chip microcomputer is connected with the second DAC chip through the first DAC chip, and the third universal port of the single-chip microcomputer is connected with the SCLK port of the first DAC chip, the fourth universal port of the single-chip microcomputer is connected with the SDIN port of the first DAC chip, the fifth universal port of the single-chip microcomputer is connected with the LDAC port of the first DAC chip, and the sixth universal port of the single-chip microcomputer is connected with the SYNC port of the first DAC chip.

[0045] In some possible implementation manners, the third universal port is the PA1 port, the fourth universal port is the PA2 port, the fifth universal port is the PA3 port, and the sixth universal port is the PA4 port. The first DAC chip, the second DAC chip and the Nth DAC chip are connected through the above connection mode.

[0046] Optionally, the laser top-punching system, the MCU power supply circuit or the first DAC power supply circuit comprises a switching power supply chip, the power supply is connected with the single-chip microcomputer through the MCU power supply circuit, and the power supply is connected with the switching power supply chip through a rectifying and filtering unit, the switching power supply chip outputs a first power supply through an RLC unit, the first power supply outputs a second power supply through a voltage reduction chip, and the second power supply supplies power to the single-chip microcomputer.

[0047] In some possible implementation manners, it can be understood that the MCU power supply circuit, the first DAC power supply circuit and the second DAC power supply circuit all supply power to the related modules through the above connection relationship.

[0048] Optionally, the laser top-punching system, the first DAC power supply circuit comprises a TDK15 power supply chip, the power supply is connected with the first DAC chip through the first DAC power supply circuit, and the power supply is connected with the TDK15 power supply chip through an LC unit, and the TDK15 power supply chip is connected with the first DAC chip through a filtering unit.

[0049] In some possible implementation manners, the first DAC power supply circuit and the second DAC power supply circuit both supply power to the corresponding DAC chips through the TDK15 power supply chip.

[0050] Optionally, the laser top-punching system, the first DAC chip is connected with the first laser, and the first DAC chip comprises a first analog output port, a second analog output port, a third analog output port and a fourth analog output port, the first analog output port is connected with a laser galvanometer control connector, the second analog output port is connected with a first laser power control connector, the third analog output port is connected with a second laser power control connector, the fourth analog output port is connected with a third laser power control connector, and the fourth analog output port is connected with a fourth laser power control connector.

[0051] In some possible implementation manners, the first analog output port of the first DAC chip is a VOUTA port, the second analog output port is a VOUTB port, the third analog output port is a VOUTC port, and the fourth analog output port is a VOUTD port. Figure 7 The laser galvanometer control connector is a U7 connector, the first laser power control connector is a CN5 connector, the second laser power control connector is a CN6 connector, the third laser power control connector is a CN7 connector, and the fourth laser power control connector is a CN8 connector.

[0052] Optionally, the laser top-punching system, the power supply is connected with the MCU power circuit through a main power input connector, the main power input connector is also connected with the first power input connector of the first driving module through a main power output connector, the first power input connector is connected with the first DAC chip, and the first power input connector is also connected with the first power output connector of the first driving module.

[0053] In some possible implementation manners, the main power input connector is a power input connector 3 of a master control module in the MCU, and the main power output connector is a power output connector 6 of the master control module. Figure 1 Figure 1 The first power input connector is a power input connector 9 of the driving module 1, and the first power output connector is a power output connector of the driving module 1.

[0054] Optionally, the laser top-punching system, the single-chip microcomputer is connected with the second DAC chip through the first DAC chip, and the single-chip microcomputer is connected with the first driving module through a main signal output connector, the first signal input connector is connected with the first DAC chip, and the first signal input connector is connected with the first signal output connector of the first driving module.

[0055] In some possible implementation manners, the main signal output connector is an SPI signal output connector 8 of the master control module in the MCU, that is, H1 in the MCU. Figure 1 Figure 5 The first signal input connector is an SPI signal input connector 11 of the driving module 1, that is, H2 in the driving module 1. Figure 7 Figure 7 The first signal output connector is an SPI signal output connector of the driving module 1, that is, H3 in the driving module 1. Figure 1 The second signal input connector is an SPI signal input connector of the driving module 2 in the MCU.

[0056] The system provided by the utility model will be described in detail through a specific embodiment as follows:

[0057] The power supply part of the laser control system:

[0058] Refer to Figure 1 ​​​The power supply 1 is connected with the power input connector 3 of the main control module to supply power for the main control module; the power input connector 3 is connected with the power output connector 6 inside the main control module, and the power output connector 6 of the main control module is connected with the power input connector 9 of the driving module 1 to supply power for the driving module 1; in this way, the power supply is continuously transmitted to the subsequent driving modules to supply power for the driving modules.

[0059] The power input connector 3 of the main control module is connected with the MCU power circuit 4, and the MCU power circuit 4 is connected with the power supply pin of the single-chip microcomputer 7 to convert the power supply into the required power supply for the single-chip microcomputer 7 to supply power for the single-chip microcomputer 7.

[0060] The power input connector 9 of each driving module is connected with the DAC power circuit 10, and the DAC power circuit 10 is connected with the power supply pin of the DAC chip 13 to convert the power supply into the required power supply for the DAC chip 13 to supply power for the DAC chip 13.

[0061] The signal part of the laser control system:

[0062] The host computer 2 is connected with the USB-to-TTL serial port circuit 5, and the USB-to-TTL serial port circuit 5 is connected with the serial communication pin of the single-chip microcomputer 7 to obtain the control information sent by the host computer 2 and feed back the control result to the host computer 2; the SPI communication pin of the single-chip microcomputer 7 is connected with the SPI signal output connector 8 of the main control module, the SPI signal output connector 8 of the main control module is connected with the SPI signal input connector 11 of the driving module 1, and the SPI signal input connector 11 of the driving module 1 is connected with the SPI communication pin of the DAC chip 13 to send the DAC control command signal of the single-chip microcomputer 7 to the DAC chip 13 of the driving module 1 to control the DAC analog signal output of the driving module 1; in this way, the DAC control command signal is continuously transmitted to the subsequent driving modules to control the DAC analog signal output of the driving modules; the analog signal output pin of the DAC chip 13 of each driving module is connected with the laser control interface connector 14, and the laser control interface connector 14 is connected with each laser 12 to control the laser output power and the beam exit angle of each laser 12.

[0063] Working principle:

[0064] In this embodiment, the power supply is a direct-current power supply, and the output voltage of the power supply is 48-60V.

[0065] Referring to Figure 2 , the power supply of the single-chip microcomputer is 3.3V, the TX4144 switching power supply chip is used to convert the power supply into 5V, and Figure 3 , the XC6206P332MR chip is used to convert 5V into 3.3V to supply power for the single-chip microcomputer.

[0066] CN1 is the power input connector of the master module, CN2 is the power output connector of the master module, and the two connectors are connected to transmit the power supply from the master module to the drive module.

[0067] The host computer sends working parameters to the single-chip microcomputer through a USB-to-TTL serial port circuit. These working parameters mainly include the XY galvanometer angle settings of the laser and the power percentage of the laser. When the single-chip microcomputer receives these parameters, it will transmit a response signal to confirm the reception of the parameters. In this process, referring to Figure 4 , the USB-to-serial chip used is CH340N.

[0068] Referring to Figure 5 , the single-chip microcomputer model is STM32G030K6T6. When the single-chip microcomputer receives the working parameters sent by the host computer, it follows the timing requirements of the SPI daisy chain communication protocol to combine the control commands of multiple laser controller DAC chips into a complete control command. Subsequently, this control command is sent to each DAC chip through the SPI signal output connector H1 connected to the SPI communication pin of the single-chip microcomputer. Daisy chain is a signal transmission method that achieves signal transmission along the bus through the series connection of devices, with the signal being transmitted from one device to the next.

[0069] Referring to Figure 6 , the power supply voltage of the DAC chip includes +12V, -12V and 3.3V. The TDK15-48D12W power module is used to convert the power supply to ±12V to power the analog part of the DAC chip, and TX4144 and XC6206P332MR are also used to power the digital part of the DAC chip.

[0070] CN3 is the power input connector of the drive module, and CN4 is the power output connector of the drive module.

[0071] Referring to Figure 7 , the DAC chip model is AD5724R, which receives control commands from the single-chip microcomputer through the SPI input signal connector H2 and extracts its own part from the command according to the SPI daisy chain timing. After parsing the command, it generates the corresponding laser control voltage at the analog output pins VOUTA, VOUTB, VOUTC, and VOUTD. Referring to Figure 8The analog output pin is connected to the laser control connector U7, CN5, CN6, CN7 and CN8. Among them, U7 is a laser galvanometer control connector port, and CN5-CN8 are laser power control ports, which are connected to the laser according to actual needs to control the laser beam angle or laser power. The AD5724R is a 12-bit precision DAC chip, which can be replaced by higher precision chips such as AD5734R and AD5754R to meet higher precision operation requirements, which shows the easy upgradeability of the laser control system.

[0072] In summary, the control system independently sets the main control part circuit and the driver part circuit as two sub-modules, and realizes the power supply and signal connection between one main control module and multiple driver modules through the daisy chain technology, so as to form a complete system capable of controlling multiple lasers. The modular design features of the system give it high flexibility, strong expansion capability, convenient maintainability and upgradeability.

[0073] The innovative technology is a laser control system specially designed for cotton laser topping operation. By skillfully using the daisy chain technology, the system realizes the serial connection of power supply and signals between the main control module and multiple driver modules, so that the cooperative control of multiple lasers becomes possible. This system not only has excellent expansion performance, but also is easy to maintain, has significant cost-effectiveness, and is upgradeable, bringing unprecedented convenience and efficiency to cotton laser topping operation.

[0074] As can be seen from the above description, the system provided by the embodiment of the utility model includes: a power supply, a microprocessor module, an upper computer, a plurality of driver modules, and a plurality of lasers. The microprocessor module includes a serial port circuit, a single-chip microcomputer, and an MCU power supply circuit. The first driver module includes a first DAC power supply circuit and a first DAC chip. The second driver module includes a second DAC power supply circuit and a second DAC chip. The upper computer is connected to the single-chip microcomputer through the serial port circuit. The single-chip microcomputer is connected to the second DAC chip through the first DAC chip. The first DAC chip is connected to the first laser. The second DAC chip is connected to the second laser. The power supply is connected to the single-chip microcomputer through the MCU power supply circuit. The power supply is connected to the first DAC chip through the first DAC power supply circuit. The power supply is connected to the second DAC chip through the second DAC power supply circuit. In the embodiment of the utility model, the microprocessor module can be connected to multiple driver modules, and then can be connected to multiple lasers. The microprocessor module drives multiple lasers, which is beneficial to reduce the area of the device and reduce the structural complexity.

[0075] In another aspect, the utility model embodiment further provides a laser top punching device, including the laser top punching system as described above.

[0076] In another aspect, the utility model embodiment provides an unmanned vehicle, comprising: a walking vehicle, the laser top punching device, the laser top punching device is arranged on the walking vehicle, supports realizing laser top punching operation position transfer and / or carries out laser top punching operation in the process of moving.

[0077] In the description of the present specification, the description of the terms "one embodiment", "another embodiment" or "some embodiments" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiments or examples are included in at least one embodiment or example of the utility model. In the present specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0078] Although the embodiments of the utility model have been shown and described, those skilled in the art can understand that various changes, modifications, replacements and variations can be made to these embodiments without departing from the principles and purposes of the utility model, and the scope of the utility model is defined by the claims and their equivalents.

Claims

1. A laser tipping system, characterized in that, The utility model relates to a kind of laser cutting machine, including: Power supply, microprocessor module, host computer, several drive modules, several lasers; The microprocessor module includes serial port circuit, single-chip microcontroller, MCU power supply circuit; The first drive module includes the first DAC power supply circuit, the first DAC chip;The second drive module includes the second DAC power supply circuit, the second DAC chip; The host computer is connected with the single-chip microcontroller by the serial port circuit, and the single-chip microcontroller is connected with the second DAC chip by the first DAC chip, and the first DAC chip is connected with the first laser, and the second DAC chip is connected with the second laser; The power supply is connected with the single-chip microcontroller by the MCU power supply circuit, and the power supply is connected with the first DAC chip by the first DAC power supply circuit, and the power supply is connected with the second DAC chip by the second DAC power supply circuit.

2. A laser tipping system according to claim 1, wherein, The serial port circuit includes USB-to-serial chip, and the host computer is connected with the single-chip microcontroller by the serial port circuit, including: the differential signal positive terminal of the USB port of the host computer is connected with the USB signal positive terminal of the USB-to-serial chip, and the differential signal negative terminal of the USB port of the host computer is connected with the USB signal negative terminal of the USB-to-serial chip;The TXD port of the USB-to-serial chip is connected with the first general port of the single-chip microcontroller, and the RXD port of the USB-to-serial chip is connected with the second general port of the single-chip microcontroller.

3. A laser tipping system according to claim 2, wherein, The single-chip microcontroller is connected with the second DAC chip by the first DAC chip, including: the third general port of the single-chip microcontroller is connected with the SCLK port of the first DAC chip, the fourth general port of the single-chip microcontroller is connected with the SDIN port of the first DAC chip, the fifth general port of the single-chip microcontroller is connected with the LDAC port of the first DAC chip, and the sixth general port of the single-chip microcontroller is connected with the SYNC port of the first DAC chip;The SCLK port of the first DAC chip is connected with the SCLK port of the second DAC chip, the SDO port of the first DAC chip is connected with the SDIN port of the second DAC chip, the LDAC port of the first DAC chip is connected with the LDAC port of the second DAC chip, and the SYNC port of the first DAC chip is connected with the SYNC port of the second DAC chip.

4. The laser tipping system of claim 1, wherein, The MCU power supply circuit or the first DAC power supply circuit includes switching power supply chip, and the power supply is connected with the single-chip microcontroller by the MCU power supply circuit, including: the power supply is connected with the switching power supply chip by rectifier filter unit, and the switching power supply chip outputs first power supply by RLC unit;The first power supply outputs second power supply by step-down chip, and the second power supply supplies power to the single-chip microcontroller.

5. The laser tipping system of claim 1, wherein, The first DAC power supply circuit includes TDK15 power supply chip, and the power supply is connected with the first DAC chip by the first DAC power supply circuit, including: The power supply is connected with the TDK15 power supply chip by LC unit, and the TDK15 power supply chip is connected with the first DAC chip by filter unit.

6. The laser tipping system of claim 1, wherein, The first DAC chip is connected with the first laser, including: the first analog output port, the second analog output port, the third analog output port and the fourth analog output port of the first DAC chip are connected with the laser galvanometer control connector, the first analog output port is connected with the first laser power control connector, the second analog output port is connected with the second laser power control connector, the third analog output port is connected with the third laser power control connector, and the fourth analog output port is connected with the fourth laser power control connector.

7. The laser tipping system of claim 1, wherein, The power supply is connected with the MCU power circuit through the main power input connector, and the main power input connector is further connected with the first power input connector of the first driving module through the main power output connector, the first power input connector is connected with the first DAC chip, and the first power input connector is further connected with the first power output connector of the first driving module.

8. The laser tipping system of claim 1, wherein, The single-chip microcomputer is connected with the second DAC chip through the first DAC chip, including: the single-chip microcomputer is connected with the first signal input connector of the first driving module through the main signal output connector, the first signal input connector is connected with the first DAC chip, and the first signal input connector is connected with the first signal output connector of the first driving module; the first signal output connector is connected with the second signal input connector of the second driving module, and the second signal input connector is connected with the second DAC chip.

9. A laser tipping device, characterized by The laser top punching system comprises the laser top punching device according to any one of claims 1 to 8.

10. An unmanned vehicle, characterized in that The laser top punching device comprises: The laser top punching device is arranged on the walking vehicle.

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