Rotary conveying device for wafer polishing solution

Abstract

The utility model belongs to the technical field, and discloses a wafer polishing solution rotary conveying device which comprises a supporting platform, a double-shaft motor is installed at the bottom of the supporting platform, the upper end of the double-shaft motor is connected with a fixing shaft, a small gear is fixedly connected to the outer portion of the fixing shaft, the left side of the small gear is connected with a large gear in an engaged mode, and the large gear is connected with a rotating shaft. A rotating shaft is fixedly connected to the interior of the large gear, a rotating platform is fixedly connected to the top of the rotating shaft, a liquid conveying pipe penetrates through the interior of the rotating platform, and by arranging the gear, the large gear, the rotating shaft, the rotating platform and the liquid conveying pipe, a double-shaft motor is started to drive a fixing shaft and a small gear to rotate; and a large gear meshed with the small gear can drive a rotating shaft to rotate synchronously, so that the rotating shaft can drive a rotating platform to rotate, a liquid conveying pipe penetrates through the interior of a peristaltic pump, liquid conveying is controlled through the peristaltic pump, and therefore the purpose that the polishing liquid is quantitatively and rotationally conveyed conveniently is achieved.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer polishing technical field, concretely to a kind of wafer polishing solution's rotary conveying device. BACKGROUND

[0002] Wafer polishing solution, also known as CMP (Chemical Mechanical Polishing) polishing solution, is a chemical preparation specially used for semiconductor wafer polishing. It combines the dual action of chemical corrosion and mechanical grinding, which can effectively remove the rough layer and excess material on the wafer surface while ensuring high flatness of the wafer surface.

[0003] The existing rotating conveying device for semiconductor polishing solution, with patent application number 202020914605.2 in China, includes a rotating arm, which includes a vertical pipe, a rotating head, a fixed platform, and a rotating platform. The vertical pipe is rotatably connected to the rotating head, and the slurry conveying pipe passes through the bottom of the vertical pipe and then exits from the head of the rotating head. The top of the vertical pipe is fixedly connected to the fixed platform, and the bottom of the rotating head is fixedly connected to the rotating platform, which is located above the fixed platform. The positioning mechanism includes a positioning hole, a sleeve, a positioning pin, and an elastic driving unit. The positioning hole is arranged at the tail of the rotating platform, the sleeve is fixed on the upper surface of the fixed platform, the positioning pin is movably arranged in the sleeve, and the elastic driving unit is connected to the positioning pin. The utility model can keep the reset angle of the vertical pipe and the rotating head at the initial position, reducing the difficulty and time of adjustment. The utility model also has the advantages of simple operation, small structure, easy installation, and no influence on the original machine function.

[0004] The device lacks fixing of the conveying pipe and uses a peristaltic pump for infusion, which may cause the conveying pipe to shake or shift due to the movement of the rotating arm, external environmental interference, or pressure fluctuations during slurry delivery when there is no fixation. The lack of a peristaltic pump may result in inaccurate flow control, affecting the polishing rate and polishing effect.

[0005] Therefore, we propose a rotating conveying device for wafer polishing solution to solve the problems mentioned above. UTILITY MODEL CONTENTS

[0006] The utility model aims to provide a rotating conveying device for wafer polishing solution to solve the problem of the lack of fixation of the conveying pipe and the use of a peristaltic pump for infusion in the existing device, which may cause the conveying pipe to shake or shift due to the movement of the rotating arm, external environmental interference, or pressure fluctuations during slurry delivery when there is no fixation. The lack of a peristaltic pump may result in inaccurate flow control, affecting the polishing rate and polishing effect.

[0007] In order to achieve the above object, the utility model provides the following technical scheme: a kind of rotation conveying device of wafer polishing solution, including support platform, the bottom of support platform is equipped with double-shaft motor, and the upper end of double-shaft motor is connected with fixed shaft, the outside fixed connection of fixed shaft is equipped with pinion, and the left side of pinion is engaged with spur gear, the inside fixed connection of spur gear is equipped with rotating shaft, and the top of rotating shaft is fixedly connected with rotating platform, and the inside of rotating platform is penetrated with infusion tube.

[0008] Preferably, the top of the rotating platform is fixedly connected with a fixed frame, a cavity is formed in the inside of the fixed frame, a positioning rod is slidably connected in the inside of the cavity, a tension spring is fixedly connected between the positioning rod and the cavity, and a clamping plate is fixedly connected to the bottom of the positioning rod.

[0009] By pulling the positioning rod, the clamping plate can be moved synchronously, the infusion tube is slidably connected with the fixed frame, and then the positioning rod is loosened to clamp the infusion tube.

[0010] Preferably, a guide slot is formed in the bottom of the rotating platform, a guide rod is slidably connected in the inside of the guide slot, and the guide rod is fixedly connected with the support platform.

[0011] By rotating the rotating platform, the guide rod on the top of the support platform can move along the guide slot in the bottom of the rotating platform, to ensure the stable movement of the rotating platform.

[0012] Preferably, a mixing tank is arranged on the right side below the support platform, and a connecting rod is fixedly connected to the bottom end of the double-shaft motor.

[0013] Preferably, a bevel gear set is fixedly connected to the bottom of the connecting rod, and a stirring rod is fixedly connected to the right side of the bevel gear set.

[0014] By rotating the double-shaft motor, the connecting rod, the bevel gear set and the stirring rod at the bottom can be rotated, so that the polishing solution in the mixing tank can be uniformly stirred.

[0015] Preferably, a peristaltic pump is installed on the top of the support platform, and the infusion tube penetrates the inside of the peristaltic pump.

[0016] By using the peristaltic pump, the delivery of liquid can be controlled.

[0017] Compared with the prior art, the rotation conveying device of wafer polishing solution has the following advantages:

[0018] 1, through the gear, gear, shaft, rotating platform and infusion tube, start dual-shaft motor, can drive the fixed shaft and pinion rotate, with pinion meshing connection gear can drive the synchronous rotation of the shaft, so that the shaft can drive the rotating platform to rotate, infusion tube through the inside of peristaltic pump, through peristaltic pump control liquid delivery, so as to reach the quantitative rotation of the polishing liquid conveying device is convenient for;

[0019] 2, through the setting of mixing tank, connecting rod, bevel gear set, stirring rod and peristaltic pump, the lower end of dual-shaft motor drives connecting rod and bevel gear set to rotate, so that the bevel gear set can drive the stirring rod to rotate in the inside of mixing tank, so as to reach the inside of mixing tank is convenient for mixing and stirring the polishing liquid, prevent the polishing liquid from producing sediment. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 It is the front view cut structure schematic diagram of the utility model;

[0021] Figure 2 It is the front view cut structure schematic diagram of the utility model;

[0022] Figure 3 It is the front view structure schematic diagram of the utility model;

[0023] Figure 4 It is the front view structure schematic diagram of the utility model; Figure 1 It is the front view structure schematic diagram of the utility model;

[0024] Figure 5 It is the front view structure schematic diagram of the utility model;

[0025] In the drawing: 1, support platform; 2, dual-shaft motor; 3, fixed shaft; 4, pinion; 5, gear; 6, shaft; 7, rotating platform; 8, infusion tube; 9, fixed frame; 10, cavity; 11, positioning rod; 12, extension spring; 13, clamping plate; 14, guide slot; 15, guide rod; 16, mixing tank; 17, connecting rod; 18, bevel gear set; 19, stirring rod; 20, peristaltic pump. DETAILED DESCRIPTION

[0026] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the utility model.

[0027] Please refer to Figures 1-5The utility model provides a technical scheme: a kind of wafer polishing solution's rotary conveying device, including support platform 1, the bottom of support platform 1 is equipped with double-shaft motor 2, and the upper end of double-shaft motor 2 is connected with fixed shaft 3, and the outside fixed connection of fixed shaft 3 is equipped with pinion 4, and the left side of pinion 4 is engaged and connected with large gear 5, and the inside fixed connection of large gear 5 is equipped with rotating shaft 6, and the top of rotating shaft 6 is fixedly connected with rotating platform 7, and the inside of rotating platform 7 is penetrated with infusion tube 8, and the bottom of rotating platform 7 is equipped with guide slot 14, and the inside sliding connection of guide slot 14 is equipped with guide rod 15, and guide rod 15 is fixedly connected with support platform 1, and double-shaft motor 2 is started, can drive fixed shaft 3 and pinion 4 to rotate, and the large gear 5 engaged with pinion 4 can drive rotating shaft 6 to rotate synchronously, so that rotating shaft 6 can drive rotating platform 7 to rotate, when rotating platform 7 rotates, guide rod 15 can move along guide slot 14, can prevent deviation, and infusion tube 8 is penetrated in the inside of peristaltic pump 20, and the conveying of liquid is controlled by peristaltic pump 20, to reach the quantitative rotary conveying device of the polishing solution of being convenient to.

[0028] The top of rotating platform 7 is fixedly connected with fixed frame 9, and the inside of fixed frame 9 is equipped with cavity 10, and the inside sliding connection of cavity 10 is equipped with positioning rod 11, and the fixed connection between positioning rod 11 and cavity 10 is equipped with tension spring 12, and the bottom of positioning rod 11 is fixedly connected with clamping plate 13, and positioning rod 11 is pulled, can drive clamping plate 13 to move, then infusion tube 8 is slidably connected with fixed frame 9, and positioning rod 11 is loosened, and positioning rod 11 can clamp infusion tube 8, to prevent infusion tube 8 from falling off.

[0029] The lower right side of support platform 1 is provided with mixing tank 16, and the bottom of double-shaft motor 2 is fixedly connected with connecting rod 17, the bottom of connecting rod 17 is fixedly connected with bevel gear set 18, the right side of bevel gear set 18 is fixedly connected with stirring rod 19, the top of support platform 1 is equipped with peristaltic pump 20, and infusion tube 8 is penetrated in the inside of peristaltic pump 20, and double-shaft motor 2 is started, and the lower end of double-shaft motor 2 drives connecting rod 17 and bevel gear set 18 to rotate, so that bevel gear set 18 can drive stirring rod 19 to rotate in the inside of mixing tank 16, to reach the polishing solution in the inside of mixing tank 16 is mixed and stirred conveniently, to prevent the precipitation of polishing solution.

[0030] Working principle: when using the rotating conveying device of the wafer polishing liquid, first, the infusion tube 8 is penetrated in the inside of the peristaltic pump 20, the positioning rod 11 is pulled, the clamping plate 13 is driven to move, then the infusion tube 8 is slidably connected with the fixed frame 9, the positioning rod 11 is loosened, the positioning rod 11 can clamp the infusion tube 8, the double-shaft motor 2 is started, the fixed shaft 3 and the pinion 4 are driven to rotate, the large gear 5 engaged with the pinion 4 can drive the rotating shaft 6 to rotate synchronously, so that the rotating shaft 6 can drive the rotating platform 7 to rotate, the liquid conveying is controlled through the peristaltic pump 20, so that the quantitative rotating conveying device of the polishing liquid is convenient, then the lower end of the double-shaft motor 2 drives the connecting rod 17 and the bevel gear set 18 to rotate, so that the bevel gear set 18 can drive the stirring rod 19 to rotate in the inside of the mixing tank 16, so that the polishing liquid in the inside of the mixing tank 16 is conveniently mixed and stirred, and the deposition of the polishing liquid is prevented.

[0031] Therefore, a series of work is completed, and the content not described in detail in the specification belongs to the prior art known by the person skilled in the art.

[0032] Although the utility model has been described in detail with reference to the foregoing embodiments, for the person skilled in the art, the technical scheme recorded in the foregoing embodiments can be modified, or part of the technical features can be replaced equivalently, any modification, equivalent replacement, improvement, etc. within the spirit and principle of the utility model should be included in the protection scope of the utility model.

Claims

1. A rotating delivery device for wafer polishing liquid, comprising a support platform (1), characterized in that: The bottom of the support platform (1) is provided with a double-shaft motor (2), and the upper end of the double-shaft motor (2) is connected with a fixed shaft (3); The outer part of the fixed shaft (3) is fixedly connected with a pinion (4), the left side of the pinion (4) is engagedly connected with a gear wheel (5), the inner part of the gear wheel (5) is fixedly connected with a rotating shaft (6), the top of the rotating shaft (6) is fixedly connected with a rotating platform (7), the inner part of the rotating platform (7) penetrates an infusion tube (8); the top of the rotating platform (7) is fixedly connected with a fixed frame (9), the inner part of the fixed frame (9) is provided with a cavity (10), the inner part of the cavity (10) is slidably connected with a positioning rod (11), the positioning rod (11) and the cavity (10) are fixedly connected with a tension spring (12), the bottom of the positioning rod (11) is fixedly connected with a clamping plate (13).

2. The rotating delivery device for wafer polishing solution according to claim 1, wherein: The bottom of the rotating platform (7) is provided with a guide groove (14), the inner part of the guide groove (14) is slidably connected with a guide rod (15), and the guide rod (15) is fixedly connected with the support platform (1).

3. The rotating delivery device for wafer polishing fluid of claim 1, wherein: The lower right side of the support platform (1) is provided with a mixing tank (16), and the bottom end of the double-shaft motor (2) is fixedly connected with a connecting rod (17).

4. The rotating delivery device for wafer polishing fluid of claim 3, wherein: The bottom of the connecting rod (17) is fixedly connected with a bevel gear set (18), and the right side of the bevel gear set (18) is fixedly connected with a stirring rod (19).

5. The rotating delivery device for wafer polishing fluid of claim 1, wherein: The top of the support platform (1) is provided with a peristaltic pump (20), and the infusion tube (8) penetrates the inner part of the peristaltic pump (20).

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