Loop heat pipe heat dissipation device
By optimizing the liquid distribution and gas circulation of the loop heat pipe cooling device, the problem of insufficient heat dissipation of existing loop heat pipes is solved, realizing rapid and effective heat transfer and continuous heat exchange under high load conditions, ensuring stable equipment temperature.
Patent Information
- Application Number
- CN202422870989.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-25
- Publication Date
- 2025-10-21
- Estimated Expiration
- 2034-11-25
AI Technical Summary
Existing loop heat pipes cannot transfer heat quickly and effectively, and cannot continuously and effectively exchange heat under high load conditions, resulting in insufficient heat dissipation.
A loop heat pipe heat dissipation device was designed, including a base plate, a cover plate and an evaporation assembly. The liquid distribution is optimized by the liquid storage chamber and liquid wick inside the evaporator shell, and heat is managed by the circulation of gas and liquid, thereby enhancing structural stability and improving heat dissipation efficiency.
It achieves rapid and efficient heat transfer and continuous heat exchange under high load conditions, ensuring stable equipment temperature and improving overall heat dissipation capacity.
Smart Images
Figure CN223460892U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to loop heat pipe heat dissipation technical field especially relates to a loop heat pipe heat dissipation device. BACKGROUND
[0002] Loop heat pipe belongs to passive phase change heat transfer device, four parts of evaporator, condenser, steam pipeline and liquid pipeline are formed, the capillary force generated in the porous wick in the evaporator is the driving source, the liquid in the wick absorbs heat and evaporates, enters the condenser through the steam pipeline and carries out heat release and becomes supercooled liquid, the supercooled liquid returns to the compensation chamber through the liquid pipeline under the action of capillary force, realizes the transfer of heat, and loop heat pipe has the advantages of high reliability, long heat transfer distance and large heat transfer quantity, and has great application prospect in the field of high-power electronic equipment thermal management.
[0003] But the existing loop heat pipe can not quickly and effectively transfer heat, and can not continuously and effectively carry out heat exchange under high load conditions, resulting in insufficient heat dissipation. Therefore, a loop heat pipe heat dissipation device is provided to solve the problems in the above background art. UTILITY MODEL CONTENT
[0004] In order to make up for the above shortcomings, the utility model provides a loop heat pipe heat dissipation device, which aims at improving the problem that the prior art cannot quickly and effectively transfer heat, and cannot continuously and effectively carry out heat exchange under high load conditions, resulting in insufficient heat dissipation.
[0005] To achieve the above purpose, the utility model provides the following technical scheme: a loop heat pipe heat dissipation device, comprising a bottom plate, a cover plate one is fixedly installed on the upper part of the bottom plate, a cavity is formed in the inside of the bottom plate, a convex part is fixedly connected to the right side of the inside of the bottom plate, a cover plate two is fixedly installed on the inner bottom of the bottom plate, an annular groove is formed in the inside of the cover plate two, a liquid hole is formed in the front of the bottom plate, a gas hole is formed in the lower side of the front of the bottom plate, a liquid tube is fixedly communicated with the front of the bottom plate, a gas tube is fixedly communicated with the lower side of the front of the bottom plate, the gas hole is communicated with the gas tube, the liquid tube is communicated with the liquid hole, and an evaporation assembly is arranged on the inner side of the gas tube and the liquid tube.
[0006] Further, the evaporation assembly comprises an evaporator shell, the evaporator shell is arranged on the inner side of the gas tube and the liquid tube, a liquid storage cavity is formed in the inside of the evaporator shell, a wick is fixedly connected to the inside of the evaporator shell, a steam groove is formed in the lower part of the wick, and a gas collection chamber is formed in the lower right side of the wick.
[0007] Further, the left part of the evaporator shell is fixedly communicated with a liquid inlet, and the right side of the evaporator shell is fixedly communicated with a gas outlet.
[0008] Further, the upper part of the cover plate one is fixedly connected with an upper fin, and the lower part of the bottom plate is fixedly connected with a lower fin.
[0009] Further, the lower part of the lower fin is fixedly connected with a heat sink.
[0010] Further, the lower part of the cover plate one is fixedly connected with an annular protrusion, and the annular protrusion is slidingly connected in the inside of the annular groove.
[0011] Further, the right side of the liquid pipe is fixedly communicated with a liquid inlet pipe.
[0012] The utility model has the advantages of the following:
[0013] 1. In the utility model, a closed system is formed by the bottom plate, the cover plate one and the cover plate two, the cavity and the protruding part are arranged in the inside of the bottom plate to enhance the structural stability, when the heat source generates heat, the internal evaporation assembly absorbs the heat, the working fluid is evaporated into gas, the gas enters the gas pipe through the air hole in the front part of the bottom plate, and flows to the heat dissipation area, at the same time, the liquid enters the liquid pipe through the liquid hole, the continuous supply of the liquid in the evaporation process is ensured, the gas is condensed into liquid after being cooled in the heat dissipation area, and finally returns through the liquid pipe, so that the heat is effectively managed and the equipment temperature is stable.
[0014] 2. In the utility model, the liquid storage cavity in the evaporator shell makes the working fluid evaporate into gas, and the liquid absorbing core optimizes the distribution of the liquid, ensures efficient contact with the heat source, thereby accelerating the evaporation process, the evaporated gas moves upwards through the steam groove and enters the gas collecting chamber, in this process, the gas carries away a large amount of heat, and at the same time, a low pressure area is formed, further promoting the evaporation of more liquid, and improving the overall heat dissipation efficiency. BRIEF DESCRIPTION OF DRAWINGS
[0015] Figure 1 It is a perspective view of a loop heat pipe heat dissipation device provided by the utility model;
[0016] Figure 2 It is a partial structure schematic view of a loop heat pipe heat dissipation device provided by the utility model;
[0017] Figure 3 It is a bottom plate internal structure schematic view of a loop heat pipe heat dissipation device provided by the utility model;
[0018] Figure 4 It is a bottom plate structure schematic view of a loop heat pipe heat dissipation device provided by the utility model;
[0019] Figure 5 A cover plate two lower structure schematic view of the loop heat pipe heat dissipation device is provided in the utility model.
[0020] Figure 6 An evaporator shell internal structure schematic view of the loop heat pipe heat dissipation device is provided in the utility model.
[0021] Figure 7 A side view of the loop heat pipe heat dissipation device is provided in the utility model.
[0022] Legend:
[0023] 1, evaporator shell, 2, annular protrusion, 3, wick, 4, heat sink, 5, vapor channel, 6, gas collection chamber, 7, liquid inlet, 8, gas outlet, 9, gas pipe, 10, liquid pipe, 11, upper fin, 12, cover plate one, 13, bottom plate, 14, cavity, 15, lower fin, 16, protruding part, 17, air hole, 18, liquid hole, 19, annular groove, 20, cover plate two, 21, liquid storage cavity, 22, liquid inlet pipe. Specific implementation
[0024] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model.
[0025] With reference to Figure 1 , Figure 2 and Figure 3 , the utility model provides an embodiment: a loop heat pipe heat dissipation device, including bottom plate 13, the upper portion of bottom plate 13 is fixedly installed with cover plate one 12, the inside of bottom plate 13 is opened with cavity 14, the inside right side of bottom plate 13 is fixedly connected with protruding part 16, the inside of bottom plate 13 is fixedly installed with cover plate two 20, the inside of cover plate two 20 is opened with annular groove 19, the front of bottom plate 13 is opened with liquid hole 18, the lower side of the front of bottom plate 13 is opened with air hole 17, the front of bottom plate 13 is fixedly communicated with liquid pipe 10, the lower side of the front of bottom plate 13 is fixedly communicated with gas pipe 9, air hole 17 is communicated with gas pipe 9, liquid pipe 10 is communicated with liquid hole 18, the inside of gas pipe 9 and liquid pipe 10 is provided with evaporative assembly, and the evaporative assembly is used to evaporate the device;
[0026] A closed system is formed by the bottom plate 13 through the fixed cover plate one 12 and cover plate two 20, the bottom plate 13 is internally provided with a cavity 14 and a protruding part 16 to enhance structural stability, under the action of heat such as CPU heat, the internal evaporation assembly absorbs heat, causing the working fluid to evaporate therein and turn into gas, the gas enters the gas pipe 9 through the gas hole 17 located at the front of the bottom plate 13, flows to the heat dissipation area, at the same time, the liquid enters the liquid pipe 10 through the liquid hole 18, ensuring the continuous supply of liquid during the evaporation process, the gas cools down and condenses into liquid after cooling in the heat dissipation area, and then returns through the liquid pipe 10, which can effectively manage heat and keep the temperature of the device stable.
[0027] With reference to Figure 1 , Figure 5 and Figure 6 , the evaporation assembly comprises an evaporator shell 1 arranged inside the gas pipe 9 and the liquid pipe 10, the inside of the evaporator shell 1 is provided with a liquid storage cavity 21, and the inside of the evaporator shell 1 is fixedly connected with a liquid absorption core 3, the lower part of the liquid absorption core 3 is provided with a steam channel 5, and the lower right part of the liquid absorption core 3 is provided with a gas collection chamber 6.
[0028] The liquid in the liquid storage cavity 21 in the evaporator shell 1 evaporates into gas, the liquid absorption core 3 in the evaporator shell 1 optimizes the distribution of the liquid, ensures efficient contact of the liquid with the heat source, thereby accelerating the evaporation process, and the evaporated gas moves upward through the steam channel 5 and enters the gas collection chamber 6, in this process, the gas carries away a large amount of heat, at the same time, a low pressure area is formed, promoting more liquid to evaporate.
[0029] With reference to Figure 1 , Figure 4 and Figure 7 , the left part of the evaporator shell 1 is fixedly connected with a liquid inlet 7, the right side of the evaporator shell 1 is fixedly connected with a gas outlet 8, the liquid inlet 7 is fixedly connected with the liquid pipe 10, the gas outlet 8 is fixedly connected with the gas pipe 9, the upper part of the cover plate one 12 is fixedly connected with an upper fin 11, the lower part of the bottom plate 13 is fixedly connected with a lower fin 15, the lower part of the lower fin 15 is fixedly connected with a heat sink 4, the lower part of the cover plate one 12 is fixedly connected with an annular protrusion 2, the annular protrusion 2 is slidingly connected inside the annular groove 19, and the right side of the liquid pipe 10 is fixedly connected with a liquid inlet pipe 22.
[0030] The fixed connection of the liquid inlet 7 with the liquid pipe 10 and the fixed connection of the gas outlet 8 with the gas pipe 9 can keep the heat dissipation in circulation, the upper fin 11 and the lower fin 15 can increase the heat dissipation area and improve the heat exchange efficiency, effectively reducing the gas temperature, the heat sink 4 can enhance the heat dissipation capacity and further help the heat dissipation fins to dissipate excess heat, the annular protrusion 2 slidingly connected inside the annular groove 19 can seal the bottom plate 13, and the liquid inlet pipe 22 provides an additional channel for liquid supplement, ensuring stable operation of the system
[0031] Working principle: when using the device, first, the heat generated by the heat source CPU is quickly absorbed by the bottom plate 13, which serves as a basic support structure to ensure the stability of the internal components. With the conduction of heat, the working fluid water in the liquid tube 10 begins to heat up and evaporate into gas through the liquid storage cavity 21 in the evaporator shell 1. The wick 3 in the evaporator shell 1 optimizes the distribution of the liquid, ensuring efficient contact between the liquid and the heat source, thereby accelerating the evaporation process. The evaporated gas moves upward through the steam channel 5 and enters the gas collection chamber 6. In this process, the gas carries away a large amount of heat, forming a low-pressure area that promotes more liquid evaporation. When the gas reaches the gas tube 9, it enters the cooling area, where it quickly releases heat and condenses into liquid due to the large surface area of the upper and lower fins 11 and 15. At this point, the condensed liquid returns to the liquid tube 10 through the liquid inlet 7 and reenters the evaporator shell 1, forming a complete cycle.
[0032] Finally, it should be noted that the above description is only a preferred embodiment of the present application and is not intended to limit the present application. Although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some technical features. Any modification, equivalent substitution, improvement, etc. made within the spirit and principles of the present application shall be included within the scope of protection of the present application.
Claims
1. A loop heat pipe heat sink device comprising a base plate (13), characterized in that: A cover plate 1 (12) is fixedly mounted on the upper portion of the base plate (13), a cavity (14) is provided inside the base plate (13), a raised portion (16) is fixedly connected to the right side of the inside of the base plate (13), a cover plate 2 (20) is fixedly mounted on the inner bottom of the base plate (13), an annular groove (19) is provided inside the cover plate 2 (20), a liquid hole (18) is provided at the front of the base plate (13), an air hole (17) is provided at the lower side of the front of the base plate (13), a liquid pipe (10) is fixedly connected to the front of the base plate (13), a gas pipe (9) is fixedly connected to the lower side of the front of the base plate (13), the air hole (17) is connected to the gas pipe (9), and the liquid pipe (10) is connected to the liquid hole (18), an evaporation component is provided on the inner side of the gas pipe (9) and the liquid pipe (10), and the evaporation component is used to evaporate the device.
2. The loop heat pipe thermal device of claim 1, wherein: The evaporation assembly comprises an evaporator housing (1), the evaporator housing (1) being arranged on the inner side of a gas pipe (9) and a liquid pipe (10), a liquid storage cavity (21) being provided inside the evaporator housing (1), a liquid wick (3) being fixedly connected to the inside of the evaporator housing (1), a steam channel (5) being provided at the lower portion of the liquid wick (3), and a gas collecting chamber (6) being provided at the right side of the lower portion of the liquid wick (3).
3. The loop heat pipe thermal device of claim 2, wherein: The left side of the evaporator housing (1) is fixedly connected to a liquid inlet (7), and the right side of the evaporator housing (1) is fixedly connected to an air outlet (8). The liquid inlet (7) is fixedly connected to a liquid pipe (10), and the air outlet (8) is fixedly connected to a gas pipe (9).
4. The loop heat pipe thermal device of claim 1, wherein: The upper portion of the cover plate 1 (12) is fixedly connected to the upper fin (11), and the lower portion of the bottom plate (13) is fixedly connected to the lower fin (15).
5. The loop heat pipe thermal device of claim 4, wherein: The lower portion of the lower fin (15) is fixedly connected to a heat sink (4).
6. The loop heat pipe thermal device of claim 1, wherein: The lower part of the cover plate 1 (12) is fixedly connected with an annular protrusion (2), and the annular protrusion (2) is slidably connected to the inside of the annular groove (19).
7. The loop heat pipe heat dissipating device of claim 1, wherein: The right side of the liquid pipe (10) is fixedly connected to a liquid inlet pipe (22).