Vertical micro-channel vapor chamber and radiator

Abstract

The utility model discloses a vertical micro-channel vapor chamber and radiator, including a left body, a right body and a first capillary structure, the first capillary structure is located on the inner surface of the left body, the left body and the right body form a closed cavity, and a working medium is arranged in the closed cavity; a heat source area corresponding to a heat source is arranged on the left body, a plurality of micro-channels are arranged on the left body, the micro-channels are diverged outwards to the inner surface of the left body with the gravity center of the heat source area as the center, backflow of a liquid working medium is accelerated by designing the micro-channels on the left body, and meanwhile, the flow direction of the liquid working medium is increased. The first wall body and the second wall body are built on the left body, so that the volume of the stored liquid working medium is increased, and the heat dissipation requirement of the vapor chamber is met when a heat source is located on the side edge of the vapor chamber.

Description

TECHNICAL FIELD

[0001] The utility model relates to a radiator technical field especially relates to a vertical micro -channel uniform temperature plate and radiator. BACKGROUND

[0002] The vapor chamber (VC) is a common quick heat conduction, radiator mechanism, and its working principle is that the working medium circulates in the evaporation and condensation state in a closed plate cavity, realizes quick heat conduction and heat diffusion, and reaches the characteristics of quick temperature equalization.

[0003] The existing vapor chamber is mostly horizontal vapor chamber, and the evaporation area and the condensation area in the inside generally only need to consider increasing the backflow capillary on the basis of meeting the support strength, and along with the market demand increasing, various radiators have been on the stage in succession, and the use scene and the use mode also become diversified and irregular according to different position demands, and at present, the special GPU radiator use scene such as side vertical, even upside down and so on becomes the biggest resistance to the energy efficiency of the radiator. SUMMARY

[0004] In view of the above problems, the utility model aims at providing a vertical micro -channel uniform temperature plate and radiator, a plurality of micro -channels are designed on the left body, the micro -channel accelerates the backflow of the liquid working medium, at the same time, the uniformly circumferentially distributed micro -channel makes the liquid working medium quickly backflow to the heat source area with the highest temperature, is favorable to quickly transmit the heat source heat, a plurality of first wall bodies and second wall bodies are built on the left body, increase the pressure strength of the left body, at the same time, can improve the backflow speed of the liquid working medium in the vapor chamber, increase the storage space of the liquid working medium, improve the heat dissipation performance of the vapor chamber, satisfy the heat dissipation demand of the vapor chamber when the heat source is in the side of the vapor chamber.

[0005] To achieve the above object, the utility model provides a vertical micro -channel uniform temperature plate, including left body, right body and first capillary structure, the first capillary structure is located on the inner surface of the left body, the left body and the right body form a closed cavity, and the closed cavity is equipped with working medium;

[0006] The left body is equipped with the heat source area corresponding to the heat source, a plurality of micro -channels are equipped on the left body, the micro -channel is centered on the gravity center of the heat source area, and diverges to the inner surface of the left body.

[0007] Preferably, the vapor chamber further comprises a second capillary structure, the second capillary structure is located on the inner surface of the right body, and the first capillary structure is communicated with the second capillary structure.

[0008] Preferably, the uniform temperature plate further comprises a third capillary structure, which is located on the micro flow channel and communicates with the first capillary structure.

[0009] Preferably, the plurality of micro flow channels are uniformly circumferentially distributed, and the micro flow channels are provided with one or more of triangular, trapezoidal and semicircular cross-sectional structures.

[0010] Preferably, a plurality of first walls are arranged on the left body and are parallel to each other, the first walls are vertically arranged in the working state of the uniform temperature plate, fourth capillary structures are arranged on the outer walls of the first walls, and the fourth capillary structures communicate with the first capillary structure.

[0011] Preferably, the height of the first wall is highest at the center of the heat source area, and decreases in turn as the distance from the center of the heat source area increases.

[0012] Preferably, a second wall is further arranged on the left body, and the second wall is not parallel to the first wall.

[0013] Preferably, the uniform temperature plate further comprises a support column, both ends of the support column are fixedly connected to the left body and the right body respectively, and a fifth capillary structure is further arranged on the outer surface of the support column, and the fifth capillary structure communicates with the first capillary structure.

[0014] Meanwhile, the utility model provides a vertical radiator, including uniform temperature plate.

[0015] The utility model discloses beneficial effect is: through the design of multiple micro flow channels on the left body, micro flow channel accelerates liquid working medium backflow, and after gaseous working medium phase change into liquid working medium, under the water absorption of gravity and capillary structure, through micro flow channel fast backflow, compared with not having micro flow channel, backflow speed is faster, therefore, heat dissipation efficiency is higher, simultaneously, the micro flow channel of uniform circumferential distribution makes liquid working medium fast backflow to the heat source area of highest temperature, is favorable to fast heat source heat transfer, through the construction of first wall and second wall on the left body, increase the volume of liquid working medium storage, make the liquid working medium of uniform temperature plate storage more, and the heat dissipation effect is better, improve the heat dissipation performance of uniform temperature plate, satisfy the heat dissipation demand of uniform temperature plate when heat source is in the side of uniform temperature plate. BRIEF DESCRIPTION OF DRAWINGS

[0016] The accompanying drawings illustrate exemplary embodiments of the present application and together with the general description given above, and explained below, serve to explain the principles of the application.

[0017] Fig. 1 It is an external structure schematic view of the vertical radiator in the embodiment.

[0018] Fig. 2 Fig. 2 is a schematic view of the internal structure of the left body in the embodiment of the vertical micro-channel heat spreader;

[0019] Fig. 3 Fig. 3 is a schematic view of the internal structure of the left body in the embodiment of the vertical micro-channel heat spreader. DETAILED DESCRIPTION

[0020] The utility model will be further explained in detail below by combining with the drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the related content, and not to limit the utility model. In addition, it needs to be explained that, in order to facilitate the description, only the part related to the utility model is shown in the drawings.

[0021] It needs to be explained that, in the case of no conflict, the embodiments in the utility model and the features in the embodiments can be combined with each other. The utility model will be explained in detail below by combining with the drawings and embodiments.

[0022] Embodiment: please refer to Figs. 1 to 3 ,

[0023] A vertical micro-channel heat spreader, comprising a left body 1, a right body 2 and a first capillary structure 31, the first capillary structure 31 is located on the inner surface of the left body 1, the left body 1 and the right body 2 form a closed cavity 4, and the closed cavity 4 is provided with a working medium (not shown);

[0024] The left body 1 is provided with a heat source area 11 corresponding to the heat source, and the left body 1 is provided with a plurality of micro-channels 5, and the micro-channels 5 are centered on the gravity center of the heat source area 11 and diverge outward to the inner surface of the left body 1, as shown in the figure, the corresponding surface of the heat source area 11 is in contact with the heat source, and the heat source in the embodiment is a heating chip 6.

[0025] In the working state of the uniform temperature plate, the uniform temperature plate is vertically placed, the heat source chip 6 is located on the left side of the left body 1 corresponding to the heat source area 11, the working medium is arranged in the closed cavity 4, the working medium is in a liquid state in the non-working state, and the left side of the left body 1 is in contact with the heat source in the working state. Due to the negative pressure in the closed cavity 4, the extremely low temperature causes the liquid working medium in the closed cavity 4 to be gasified into a gaseous state, the gaseous working medium drives heat to flow upwards in the closed cavity 4, the gaseous working medium with a higher temperature is condensed into liquid working medium when meeting the upper end inner wall of the closed cavity 4 with a lower temperature, and then flows back to the left body 1 along the micro flow channel 5 to realize reciprocating circulation, so that the heat of the chip 6 is continuously transmitted out, and the heat of the chip 6 is finally transmitted out by the heat dissipation fin 7 connected to the uniform temperature plate, so that the heat dissipation and cooling effect is achieved. The micro flow channel 5 is centered on the gravity center of the heat source area 11 and diverges to the inner surface of the left body 1 outward. This arrangement can more quickly return the liquid working medium to the heat source area 11, and the heat source area 11 has the highest temperature due to contact with the chip 6. The design of the micro flow channel 5 can accelerate the return speed of the liquid working medium and improve the heat dissipation power of the uniform temperature plate. The diverging design of the micro flow channel 5 enables the liquid working medium to quickly return to the area with the highest temperature, so that the heat dissipation effect of the uniform temperature plate is better, that is, the micro flow channel 5 not only enables the liquid working medium to quickly return, but also enables the liquid working medium to return to the heat source area 11, so that the heat dissipation power is higher.

[0026] The uniform temperature plate further comprises a second capillary structure 32 located on the inner surface of the right body 2. The first capillary structure 31 is in communication with the second capillary structure 32. The communication between the first capillary structure 31 and the second capillary structure 32 enables the liquid working medium to flow more smoothly in the capillary structure, and the heat dissipation power is better.

[0027] The uniform temperature plate further comprises a third capillary structure 33 located on the micro flow channel 5. The third capillary structure 33 is in communication with the first capillary structure 31, so that the liquid working medium flows more smoothly in the capillary structure, and the heat dissipation power is better.

[0028] A plurality of micro flow channels 5 are uniformly circumferentially distributed. The micro flow channel 5 is provided with one or more of a triangular, trapezoidal, and semicircular cross-sectional structure. In this embodiment, the micro flow channel 5 is provided with a triangular shape. The micro flow channel 5 accelerates the return of the liquid working medium, which is conducive to the heat dissipation of the uniform temperature plate.

[0029] The left body 1 is provided with a plurality of first walls 81 which are parallel to each other, and in the working state of the uniform temperature plate, the first walls 81 are vertically arranged, and the outer wall of the first walls 81 is provided with fourth capillary structures 34 which are communicated with the first capillary structures 31, and in the working state of the uniform temperature plate, the uniform temperature plate is vertically placed, the first walls 81 are parallel to the direction of the heat source, and the liquid working medium can flow back to the left body 1 along the first walls 81, and the heat of the chip 6 is continuously transmitted, and the heat of the chip 6 is finally transmitted to the heat dissipation fins 7 connected to the uniform temperature plate, so that the effect of heat dissipation and cooling is achieved.

[0030] The height of the first walls 81 is the highest at the center of the heat source area 11, and decreases in turn as the distance from the center of the heat source area 11 increases, that is, the corresponding wall of the first walls 81 is higher at a position closer to the center of the heat source area 11, the outer surface of the first walls 81 is provided with sixth capillary structures, the first walls 81 are arranged parallel to the direction of use, and decrease from high to low or have the same height from the center to the edge, and the design of the walls of different heights helps the sixth capillary structures to pull back the liquid working medium to the maximum extent, and the resistance of the flow of the liquid working medium after being converted into gas is reduced.

[0031] The left body 1 is also provided with second walls 82 which are not parallel to the first walls 81, and in the embodiment, the second walls 82 are perpendicular to the first walls 81, and the second walls 82 have the same effect as the first walls 81, increase the pressure bearing strength of the left body 1, can store more liquid working medium, and accelerate the backflow of the liquid working medium and improve the heat dissipation power of the uniform temperature plate.

[0032] The uniform temperature plate also comprises support columns 9 which are fixedly connected to the left body 1 and the right body 2 at both ends, and the outer surface of the support columns 9 is also provided with fifth capillary structures which are communicated with the first capillary structures 31 and the second capillary structures 32, in the process of rising of the gaseous working medium, the pressure in the closed cavity 4 increases, the support columns 9 can increase the pressure bearing strength of the left body 1 and the right body 2, prevent the left body 1 and the right body 2 from being damaged or cracked under pressure, the fifth capillary structures can store more liquid working medium and also accelerate the backflow of the liquid medium, and improve the heat dissipation efficiency of the whole uniform temperature plate.

[0033] In the embodiment, a vertical heat sink is also provided, which comprises the uniform temperature plate and the heat dissipation fins 7 which are located on the right side of the uniform temperature plate, and the working principle is the same as above, and here, the repeated description is omitted.

[0034] In summary, the vertical micro-channel heat spreader and radiator provided by the utility model, through design multiple micro-channel on left body, micro-channel accelerates liquid working medium backflow, gaseous working medium phase change into liquid working medium, under the water absorption of gravity and capillary structure, through micro-channel rapid backflow, compared with no micro-channel, backflow speed is faster, therefore, heat dissipation efficiency is higher, simultaneously, uniform circumferential distribution micro-channel makes liquid working medium rapid backflow to heat source area of highest temperature, is favorable to rapid heat source heat transfer, through construction first wall and second wall on left body, increase the volume of liquid working medium storage, make heat spreader store more liquid working medium, heat dissipation effect is better, improve heat spreader heat dissipation performance, satisfy heat source at heat spreader side edge, heat spreader heat dissipation demand.

[0035] Those skilled in the art will understand that the above embodiments are merely for the purpose of clearly illustrating the utility model, and are not intended to limit the scope of the utility model. For those skilled in the art, other changes or modifications can be made on the basis of the above utility model, and these changes or modifications are still within the scope of the utility model.

Claims

1. A vertical micro-channel heat spreader, characterized by: The left body, the right body and the first capillary structure, the first capillary structure is located on the inner surface of the left body, the left body and the right body form a closed cavity, and the working medium is arranged in the closed cavity. The left body is provided with a heat source area corresponding to the heat source, and a plurality of micro flow channels are arranged on the left body, the micro flow channels are centered on the gravity center of the heat source area and diverge outward to the inner surface of the left body.

2. The vertical micro-channel uniform temperature plate according to claim 1, characterized in that: The uniform temperature plate further comprises a second capillary structure, the second capillary structure is located on the inner surface of the right body, and the first capillary structure is communicated with the second capillary structure.

3. The vertical micro-channel uniform temperature plate according to claim 1, characterized in that: The uniform temperature plate further comprises a third capillary structure, the third capillary structure is located on the micro flow channel, and the third capillary structure is communicated with the first capillary structure.

4. The vertical micro-channel uniform temperature plate of claim 1, wherein: The plurality of micro flow channels are uniformly circumferentially distributed, and the micro flow channels are provided with one or more of triangular, trapezoidal and semicircular cross-sectional structures.

5. The vertical micro-channel uniform temperature plate of claim 1, wherein: The left body is provided with a plurality of first walls parallel to each other, the first walls are vertically arranged in the working state of the uniform temperature plate, the outer wall of the first walls is provided with a fourth capillary structure, and the fourth capillary structure is communicated with the first capillary structure.

6. The vertical micro-channel uniform temperature plate of claim 5, wherein: The height of the first wall is highest at the center of the heat source area, and decreases in turn as the distance from the center of the heat source area increases.

7. The vertical micro-channel heat spreader of claim 5, wherein: The left body is further provided with a second wall, and the second wall is not parallel to the first wall.

8. The vertical micro-channel uniform temperature plate of claim 1, wherein: The uniform temperature plate further comprises a support column, two ends of the support column are fixedly connected to the left body and the right body respectively, and a fifth capillary structure is further arranged on the outer surface of the support column, and the fifth capillary structure is communicated with the first capillary structure.

9. A vertical heat sink, characterized by: The uniform temperature plate comprises the uniform temperature plate, and the uniform temperature plate is the vertical micro flow channel uniform temperature plate according to any one of claims 1-8.

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