Semiconductor welding jig

Abstract

The utility model provides a semiconductor welding jig, which relates to the field of semiconductor packaging and welding, comprises a carbon plate, and is characterized in that a plurality of supporting blocks protruding out of the surface of the carbon plate are arranged on the surface of the carbon plate along the transverse direction of the carbon plate, and a plurality of strip-shaped grooves are arranged on the surface of the carbon plate along the longitudinal direction of the carbon plate; a strip-shaped groove is formed in the carbon plate, a strip-shaped metal sheet is arranged in the strip-shaped groove, the length of the metal sheet is smaller than that of the strip-shaped groove, so that the metal sheet can expand and extend in the strip-shaped groove after being heated, and a plurality of groups of salient points are fixedly arranged on the surface of the metal sheet and used for being correspondingly inserted into internal gaps of a semiconductor metal frame borne by the carbon plate; a guide column is fixedly arranged in the strip-shaped groove, and the metal sheet is provided with a strip-shaped hole corresponding to the guide column, so that the guide column can longitudinally slide in the strip-shaped hole along the carbon plate; according to the utility model, the problem that the chip and the welding flux are staggered due to the fact that the metal frame with the long-strip-shaped structure in the weft direction of the carbon plate extends in the weft direction of the carbon plate after being heated can be avoided, and the welding quality of a TO263-2L two-piece type packaging product is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor packaging welding, specifically relates to a semiconductor welding fixture. BACKGROUND

[0002] In the packaging process of semiconductor devices, welding operation needs to be carried out in order to fix the chip between the frame. For example, TO263-2L product is two-piece packaging structure, and in actual production, the metal frame carrying the chip is usually placed in the welding fixture of carbon plate type, and then placed in the welding furnace for heating welding. In the heating welding process, the metal frame will expand and become longer during heating, so it is easy to cause the chip to be misaligned with the solder and the metal frame, affecting the welding quality.

[0003] Therefore, it is urgent to develop a semiconductor welding fixture suitable for TO263-2L two-piece packaging product to reduce the misalignment of the chip with the solder and the metal frame in the welding process and improve the welding quality. UTILITY MODEL CONTENT

[0004] The utility model provides a semiconductor welding fixture for the above problems existing in the prior art to ensure the welding quality of TO263-2L two-piece packaging product.

[0005] The technical scheme for solving the above technical problems is as follows: a semiconductor welding fixture, comprising a carbon plate, characterized in that a plurality of support blocks protruding above the surface of the carbon plate are arranged on the surface of the carbon plate along the transverse direction thereof, and a plurality of strip-shaped grooves are arranged on the surface of the carbon plate along the longitudinal direction thereof.

[0006] A strip-shaped metal sheet is arranged in the strip-shaped groove, the length of the metal sheet is less than the length of the strip-shaped groove, so that the metal sheet can expand and elongate in the strip-shaped groove after being heated, and a plurality of groups of protrusions are fixedly arranged on the surface of the metal sheet for corresponding insertion into the internal gap of the semiconductor metal frame carried by the carbon plate.

[0007] A guide column is fixedly arranged in the strip-shaped groove, and the metal sheet is provided with a strip-shaped hole corresponding to the guide column, so that the guide column can slide in the strip-shaped hole along the longitudinal direction of the carbon plate.

[0008] Further, the semiconductor welding fixture further comprises a cover plate matched with the carbon plate, and the lower surface of the cover plate is provided with a clearance groove corresponding to the support blocks, the protrusions and the guide columns, respectively.

[0009] Further, the carbon plate and the cover plate are both made of graphite material.

[0010] Further, the carbon plate and the cover plate are fixed through the matched positioning column and the positioning hole.

[0011] Further, the material of the metal sheet is same as the material of the semiconductor metal frame to be welded, preferably copper material.

[0012] Further, each group of convex points comprises a plurality of convex points, and the arrangement direction of the plurality of convex points is at a preset angle with the longitudinal direction of the carbon plate.

[0013] Further, the guide column protrudes from the surface of the support block.

[0014] The utility model discloses the beneficial effect is: the utility model discloses a carbon plate with support block, strip -shaped recess, metal sheet structure, the metal sheet is equipped with convex point and the strip -shaped hole of adaptation with the guide column fixed in the recess, make heating welding process can effectively drive the metal frame closely adjacent carbon plate along carbon plate meridional tension, thereby avoid the problem that the chip is staggered with the solder after the metal frame of carbon plate weft direction long strip -shaped structure is heated and is elongated along carbon plate weft direction, improve the welding quality of TO263-2L two piece type packaging product. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 It is the overhead structure schematic diagram of carbon plate of the utility model,

[0016] Figure 2 It is the main view structure schematic diagram of carbon plate of the utility model,

[0017] Figure 3 It is the main view structure schematic diagram of the cover plate of the utility model,

[0018] Figure 4 And Figure 5 It is the structure schematic diagram of semiconductor product to be welded of the utility model is loaded in the structure schematic diagram of welding fixture,

[0019] In the drawing: 1. carbon plate, 2. support block, 3. strip-shaped recess, 4. metal sheet, 5. convex point, 6. guide column, 7. cover plate, 8. let - go slot, 9. positioning column, 10. positioning hole, 11. strip -shaped hole, 12. first frame, 13. second frame. DETAILED DESCRIPTION

[0020] The principle and features of the utility model will be described below, and the examples are only used to explain the utility model, and are not used to limit the scope of the utility model.

[0021] As shown in the drawings, the semiconductor welding jig of the embodiment comprises a carbon plate 1 and a cover plate 7, the surface of the carbon plate 1 is provided with a plurality of support blocks 2 protruding from the surface along the transverse direction of the carbon plate 1, a first frame 12 for supporting the upper position of a product to be welded placed on the carbon plate 1, and a plurality of strip-shaped grooves 3 provided along the longitudinal direction of the carbon plate 1; a strip-shaped metal sheet 4 is arranged in the strip-shaped groove 3, the material of the metal sheet 4 is the same as that of the semiconductor metal frame to be welded, such as copper, the length of the metal sheet 4 is less than that of the strip-shaped groove 3, so that the metal sheet 4 can expand and elongate in the strip-shaped groove 3 after being heated, and a plurality of groups of protrusions 5 are fixedly arranged on the surface of the metal sheet 4 and used for corresponding insertion into the internal space of a second frame 13 of the semiconductor metal frame, such as the lower position of the product to be welded, carried by the carbon plate 1.

[0022] A guide column 6 is fixedly arranged in the strip-shaped groove 3 and protrudes from the surface of the support block 2, and the metal sheet 4 is provided with a strip-shaped hole 11 corresponding to the guide column 6, so that the guide column 6 can slide in the strip-shaped hole 11 along the longitudinal direction of the carbon plate.

[0023] The carbon plate 1 and the cover plate 7 are both made of graphite, the lower surface of the cover plate 7 is provided with a clearance groove 8 corresponding to the support block 2, the protrusion 5 and the guide column 6 and corresponding to the first frame 12, and the carbon plate 1 and the cover plate 7 are fixed through the matched positioning column 9 and the positioning hole 10.

[0024] In use, the semiconductor device to be welded, such as a TO263-2L product, after being laminated, is placed on the carbon plate 1, at this time, the protrusions 5 are inserted into the internal space of the metal frame of the semiconductor device, such as the internal space of the second frame 13 as shown in Figure 4 and Figure 5 the cover plate 7 is covered, and then sent into a welding furnace, during the high-temperature welding process, the metal sheet 4 expands and stretches along the length direction, then the protrusions 5 carry the second frame 13 to stretch along the longitudinal direction of the carbon plate, at this time, the guide column moves in the strip-shaped hole, thereby avoiding the problem that the chips are misaligned with the solder due to the fact that the second frame with a long strip-shaped structure in the latitudinal direction of the carbon plate is elongated along the latitudinal direction of the carbon plate after being heated, and the welding quality is improved.

[0025] In a preferred embodiment of the utility model, each group of protrusions 5 comprises three protrusions 5, and the arrangement direction of the three protrusions 5 of each group forms a preset angle with the longitudinal direction of the carbon plate, the purpose is to match the second frame, so as to uniformly stretch the second frame along the longitudinal direction of the carbon plate.

Claims

1. A semiconductor bonding tool comprising a carbon plate (1), characterized in that, The carbon plate (1) is provided with a plurality of support blocks (2) protruding from its surface along its lateral direction, and a plurality of strip-shaped grooves (3) along its longitudinal direction; The strip-shaped grooves (3) are provided with strip-shaped metal sheets (4) with a length less than that of the strip-shaped grooves (3), so that the metal sheets (4) can expand and elongate in the strip-shaped grooves (3) after being heated, and the metal sheets (4) are provided with a plurality of groups of protrusions (5) on their surfaces for corresponding insertion into the internal gaps of the semiconductor metal frame carried by the carbon plate (1); The strip-shaped grooves (3) are fixedly provided with guide columns (6), and the metal sheets (4) are provided with strip-shaped holes (11) corresponding to the guide columns (6), so that the guide columns (6) can slide in the strip-shaped holes (11) along the longitudinal direction of the carbon plate.

2. The semiconductor bonding tool of claim 1, wherein Further comprising a cover plate (7) adapted to the carbon plate (1), and the lower surface of the cover plate (7) is provided with a plurality of displacement grooves (8) corresponding to the support blocks (2), the protrusions (5) and the guide columns (6).

3. The semiconductor bonding tool of claim 2, wherein The carbon plate (1) and the cover plate (7) are both made of graphite.

4. The semiconductor bonding tool of claim 2, wherein The carbon plate (1) and the cover plate (7) are fixed by the matched positioning columns (9) and positioning holes (10).

5. The semiconductor bonding tool of claim 1, wherein The material of the metal sheets (4) is the same as that of the semiconductor metal frame to be welded.

6. The semiconductor bonding tool of claim 5, wherein The material of the metal sheets (4) is copper.

7. The semiconductor bonding tool of claim 1, wherein Each group of protrusions (5) contains a plurality of protrusions (5), and the arrangement direction of the plurality of protrusions (5) forms a preset angle with the longitudinal direction of the carbon plate.

8. The semiconductor bonding tool of claim 1, wherein, The guide columns (6) protrude from the surface of the support blocks (2).

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