Laser and light source device

Abstract

The utility model discloses a laser and a light source device, and belongs to the technical field of photoelectricity. The laser comprises a substrate, a light-emitting chip and a phase change part. In the working process of the laser, heat generated by the light-emitting chip due to light emitting can be conducted to the phase change parts in the multiple hollow channels located in the substrate through the substrate, when the temperature of the phase change parts reaches the phase change temperature point of the phase change parts, the phase change parts can generate phase change, and in the phase change process of the phase change parts, the phase change parts can generate phase change. The phase change part can quickly absorb a large amount of heat to realize quick cooling of the light-emitting chip, so that the heat dissipation effect of the laser is improved. The plurality of hollow channels in the substrate can be distributed in the whole area of the substrate, and at least part of the hollow channels in the plurality of hollow channels are communicated, so that after the phase change of the phase change part occurs, the phase change part can conduct heat generated by the light-emitting chip to each area of the substrate so as to dissipate the heat through the whole substrate; therefore, the heat dissipation effect of the laser is further improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of optoelectronics, in particular to a laser and a light source device. BACKGROUND

[0002] With the development of optoelectronic technology, the application of lasers is becoming more and more widespread, for example, lasers can be applied in welding processes, cutting processes and laser displays.

[0003] The laser can generally include a packaging structure and a light-emitting chip, and the light-emitting chip can be mounted on a substrate in the packaging structure so that the packaging structure can seal the light-emitting chip. At present, in order to realize the miniaturization design of the laser, multiple light-emitting chips in the laser are usually mounted on the substrate in a centralized manner.

[0004] However, the centralized mounting of multiple light-emitting chips causes the heat generated by the light-emitting chips to be unable to be dissipated in time, thereby causing the laser to have poor heat dissipation effect. UTILITY MODEL CONTENT

[0005] The present application provides a laser and a light source device. The technical solution can solve the problem of poor heat dissipation effect of the laser in the prior art, and is as follows:

[0006] In one aspect, a laser is provided, comprising: a substrate, a light-emitting chip and a phase change part.

[0007] The substrate has a support surface, and the interior of the substrate has a plurality of hollow channels, and at least part of the hollow channels in the plurality of hollow channels are connected in communication.

[0008] The light-emitting chip is fixedly connected with the support surface.

[0009] The phase change part is located in the hollow channel.

[0010] Optionally, the substrate comprises a substrate body and a plate body, the substrate body has the support surface and a receiving cavity, the plate body is located in the receiving cavity and is fixedly connected with the inner wall of the receiving cavity, and the plate body has the plurality of hollow channels.

[0011] Optionally, the plate body comprises at least two sub-plate bodies which are stacked in a direction perpendicular to the support surface.

[0012] Among them, for any two adjacent sub-plate bodies, at least part of the hollow channels in one of the sub-plate bodies are connected in communication with at least part of the hollow channels in the other sub-plate body.

[0013] Optionally, the plurality of hollow channels of each sub-plate body extend in a first direction or extend in a second direction, and the first direction and the second direction intersect.

[0014] Wherein, for any two adjacent sub-plate bodies, one hollow channel in one sub-plate body is in communication with one hollow channel in another sub-plate body.

[0015] Optionally, the plurality of hollow channels in each sub-plate body are divided into a plurality of first sub-channels extending in a first direction and a plurality of second sub-channels extending in a second direction, the first direction intersects the second direction, and the first sub-channels and the second sub-channels are in communication.

[0016] Wherein, the first sub-channels of any two adjacent sub-plate bodies are in communication, and the second sub-channels of any two adjacent sub-plate bodies are in communication.

[0017] Optionally, the substrate further has a boss located on the support surface and protruding from the support surface, and the light emitting chip is fixedly connected to a side of the boss away from the support surface; the laser further comprises a frame body, the frame body is distributed around the boss, and the frame body is fixedly connected to a region of the support surface where the boss is not distributed.

[0018] In another aspect, a light source device is also provided, comprising a laser and a heat sink connected to the laser, the laser being any of the above-described lasers.

[0019] Optionally, the heat sink has a heat dissipation plate, and a side of the substrate in the laser away from the light emitting chip is connected to the heat dissipation plate.

[0020] The light source device further comprises a flexible heat-conducting layer, the flexible heat-conducting layer being located between the substrate and the heat dissipation plate.

[0021] In yet another aspect, a light source device is also provided, comprising a heat sink body, a heat dissipation plate and a light emitting chip.

[0022] A side of the heat dissipation plate is fixedly connected to the heat sink body, and a side of the heat dissipation plate away from the heat sink body has a support surface and a boss located on the support surface and protruding from the support surface.

[0023] The light emitting chip is fixedly connected to a side of the boss away from the support surface.

[0024] Optionally, the light source device further comprises a phase change part, an inside of the heat dissipation plate has a plurality of hollow channels, at least some of the plurality of hollow channels are in communication, and the phase change part is located in the hollow channels.

[0025] The technical scheme provided by the embodiments of the present application has at least the following beneficial effects:

[0026] During the operation of the laser, the heat generated by the light-emitting chip due to light emission can be conducted through the substrate to the phase change portion located within the multiple hollow channels within the substrate. When the temperature of the phase change portion reaches the phase change temperature point of the phase change portion, the phase change portion can undergo a phase change. During the phase change process, the phase change portion can quickly absorb a large amount of heat to achieve rapid cooling of the light-emitting chip, thereby improving the heat dissipation effect of the laser. In addition, the multiple hollow channels in the substrate can be distributed throughout the entire area of ​​the substrate, and at least some of the multiple hollow channels are interconnected. Therefore, after the phase change portion undergoes a phase change, the phase change portion can conduct the heat generated by the light-emitting chip to various areas of the substrate, thereby dissipating the heat through the entire substrate, further improving the heat dissipation effect of the laser. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0028] Figure 1 is a cross-sectional view of a laser provided in an embodiment of the present application;

[0029] Figure 2 is a cross-sectional view of another laser provided in an embodiment of the present application;

[0030] Figure 3 is a top cross-sectional view of a laser provided in an embodiment of the present application;

[0031] Figure 4 yes Figure 3 A cross-sectional view of the laser shown at BB';

[0032] Figure 5 is a top cross-sectional view of another laser provided in an embodiment of the present application;

[0033] Figure 6 yes Figure 5 A cross-sectional view of the laser shown at CC';

[0034] Figure 7 yes Figure 5 Another cross-sectional view of the laser shown at CC';

[0035] Figure 8 is a cross-sectional view of another laser provided in an embodiment of the present application;

[0036] Figure 9 This is a structural diagram of a light source device provided in an embodiment of the present application;

[0037] Figure 10 is a structural schematic diagram of a heat sink provided by an embodiment of the present application;

[0038] Figure 11 is a structural schematic diagram of another light source device provided by an embodiment of the present application;

[0039] Figure 12 is a structural schematic diagram of yet another light source device provided by an embodiment of the present application;

[0040] Figure 13 is a structural schematic diagram of still another light source device provided by an embodiment of the present application;

[0041] Figure 14 is a structural schematic diagram of a light source device provided by another embodiment of the present application. DETAILED DESCRIPTION

[0042] In order to make the purpose, technical solutions and advantages of the present application clearer, the embodiments of the present application will be further described in detail below with reference to the drawings.

[0043] An embodiment of the present application provides a laser, please refer to Figure 1 , Figure 1 is a cross-sectional view of a laser provided by an embodiment of the present application, and the laser 000 can include a substrate 100, a light-emitting chip 200 and a phase change part 300.

[0044] The substrate 100 in the laser 000 can have a support surface P, and the light-emitting chip 200 in the laser 000 can be fixedly connected with the support surface P of the substrate 100. It should be noted that the substrate 100 can have a boss 100a located on the support surface P and protruding from the support surface P, and the light-emitting chip 200 can be fixedly connected with a side of the boss 100a of the substrate 100 away from the support surface P. Here, the light-emitting chip 200 fixed on the boss 100a can be used to emit laser light to realize the light emission of the laser 000. And in the light emission process of the light-emitting chip 200, the light-emitting chip 200 will generate heat. In this way, the heat generated by the light-emitting chip 200 can be conducted to other parts of the substrate 100 through the boss 100a to be dissipated through the substrate 100.

[0045] The inside of the substrate 100 in the laser 000 can have a plurality of hollow channels K, and at least part of the plurality of hollow channels K are connected in communication. The phase change part 300 in the laser 000 can be located in the hollow channel K of the substrate 100.

[0046] It should be noted that the material of the phase change part 300 in the laser 000 can be a phase change material. When the temperature of the surrounding environment of the phase change part 300 in the laser 000 reaches the phase change temperature point, the phase change part 300 can change phase, for example, the phase change part 300 can change from solid to liquid, or the phase change part 300 can change from liquid to gas. And in the process of phase change of the phase change part 300, the phase change part 300 can quickly absorb a large amount of heat to achieve rapid cooling of the surrounding environment. After the temperature around the phase change part 300 decreases, the phase change part 300 can restore to the initial state to change phase again to achieve rapid cooling of the surrounding environment after absorbing heat again.

[0047] In this way, in the working process of the laser 000, the heat generated by the light emitting chip 200 due to light emission can be conducted to the phase change part 300 located in the plurality of hollow channels K of the substrate 100. When the temperature of the phase change part 300 reaches the phase change temperature point of the phase change part 300, the phase change part 300 can change phase, and in the process of phase change of the phase change part 300, the phase change part 300 can quickly absorb a large amount of heat to achieve rapid cooling of the light emitting chip 200. In this way, the overall heat dissipation effect of the laser 000 is improved, and the phenomenon of reduced reliability of the light emitting chip 200 due to excessive temperature of the light emitting chip 200 in the working process of the laser 000 is avoided, and the reliability of the laser 000 is improved.

[0048] It should be noted that the plurality of hollow channels K in the substrate 100 can be distributed in the entire area of the substrate 100, for example, the orthographic projection of the plurality of hollow channels K on the support surface P can be uniformly distributed in the entire support surface P. In this way, after the phase change of the phase change part 300, the phase change part 300 can conduct the heat generated by the light emitting chip 200 to each area of the substrate 100 to dissipate the heat through the whole substrate 100, further improving the heat dissipation effect of the laser 000.

[0049] And since at least part of the plurality of hollow channels K in the substrate 100 are connected, after the phase change part 300 absorbs the heat generated by the light emitting chip 200 and changes phase, the phase change part 300 can flow in the at least part of the connected hollow channels K. In this way, the flow area of the phase change part 300 is increased, and the heat absorption efficiency of the phase change part 300 is improved, further improving the heat dissipation effect of the laser 000.

[0050] In summary, the embodiment of the present application provides a laser, comprising a substrate, a light emitting chip and a phase change part. In the working process of the laser, the heat generated by the light emitting chip can be conducted to the phase change part in the plurality of hollow channels in the substrate, when the temperature of the phase change part reaches the phase change temperature point of the phase change part, the phase change part can change phase, and in the process of phase change of the phase change part, the phase change part can quickly absorb a large amount of heat to achieve rapid cooling of the light emitting chip, so as to improve the heat dissipation effect of the laser. And the plurality of hollow channels in the substrate can be distributed in the whole area of the substrate, and at least part of the plurality of hollow channels are connected, so that after the phase change of the phase change part, the phase change part can conduct the heat generated by the light emitting chip to each area of the substrate to dissipate the heat through the whole substrate, which further improves the heat dissipation effect of the laser.

[0051] Optionally, please refer to Figure 2 , Figure 2 is another cross-sectional view of the laser provided by the embodiment of the present application. The substrate 100 in the laser 000 can include a substrate body 101 and a plate body 102. The substrate body 101 in the substrate 100 can have a support surface P, that is, the boss 100a in the substrate 100 and the substrate body 101 can be an integral structure. The substrate body 101 in the substrate 100 can also have a receiving cavity A, that is, the receiving cavity A can be located inside the substrate body 101. The plate body 102 in the substrate 100 can be located in the receiving cavity A of the substrate body 100 and can be fixedly connected with the inner wall of the receiving cavity A of the substrate body 100. Here, the plate body 102 in the substrate 100 can have a plurality of hollow channels K. In this way, in the working process of the laser 100, the heat generated by the light emitting chip 200 due to light emission can be conducted to the phase change part 300 through the boss 100a, the substrate body 101 and the plate body 102 in turn.

[0052] It should be noted that the boss 100a, the substrate body 101 and the plate body 102 in the substrate 100 can all be made of metal materials with good thermal conductivity, for example, the substrate body 101 and the plate body 102 can both be made of copper. In this way, in the working process of the laser 100, the heat generated by the light emitting chip 200 due to light emission can be quickly conducted to the phase change part 300 in the plurality of hollow channels K of the plate body 102 through the boss 100a, the substrate body 101 and the plate body 102 in turn, so as to further improve the heat dissipation effect of the laser 000.

[0053] Optionally, as Figure 2As shown, the plate body 102 in the substrate 100 can include at least two sub-plate bodies 1021 stacked along a direction perpendicular to the support surface P of the substrate body 101. And for any two adjacent sub-plate bodies 1021, at least part of the hollow channels K in one sub-plate body 1021 can be in communication with at least part of the hollow channels K in the other sub-plate body 1021.

[0054] In this way, during the operation of the laser 000, the sub-plate body 1021 closest to the support surface P among the at least two sub-plate bodies 1021 stacked can first receive the heat generated by the light emitting chip 200, so that the phase change part 300 located in the hollow channel K of the sub-plate body 1021 can change phase to quickly absorb the heat generated by the light emitting chip 200, and after the phase change part 300 located in the hollow channel K of the sub-plate body 1021 changes phase, the phase change part 300 can flow into the hollow channel K of the sub-plate body 1021 farthest from the support surface P among the at least two sub-plate bodies 1021 stacked through the communication of the hollow channels K.

[0055] And since the temperature of the sub-plate body 1021 farthest from the support surface P among the at least two sub-plate bodies 1021 stacked is lower, the phase change part 300 flowing into the hollow channel K of the sub-plate body 1021 can recover to the initial state to conduct the heat carried by itself to the side of the substrate body 101 away from the support surface P, and then the heat can be dissipated to the outside through the substrate body 101. In this way, the heat absorption efficiency of the phase change part 300 can be further improved through the communication of the hollow channels K, and the overall heat dissipation effect of the laser 000 can be further improved.

[0056] In this application, at least part of the hollow channels K in the at least two sub-plate bodies 1021 stacked can have the following two optional implementation manners:

[0057] In the first optional implementation manner, please refer to Figure 3 , Figure 3 is a top view sectional view of a laser provided by an embodiment of the present application. The plurality of hollow channels K of each sub-plate body 1021 can all extend along the first direction X, or all can extend along the second direction Y. Here, the first direction X can intersect the second direction Y, for example, the first direction X can perpendicularly intersect the second direction Y, and the first direction X and the second direction Y can both be parallel to the support surface P of the substrate body 101. For example, as shown in Figure 3 , the plurality of hollow channels K of each sub-plate body 1021 can all extend along the first direction X.

[0058] For any two adjacent sub-plate bodies 1021 of the at least two sub-plate bodies 1021 arranged in a stack, one hollow channel K in one sub-plate body 1021 can be in communication with one hollow channel K in another sub-plate body 1021.

[0059] It should be noted that, in the first optional implementation, the above Figure 1 and Figure 2 may be Figure 3 a cross-sectional view of the laser at A-A', as Figure 4 indicated, Figure 4 is Figure 3 a cross-sectional view of the laser at B-B', as an example, in the first optional implementation, any two adjacent sub-plate bodies 1021 of the at least two sub-plate bodies 1021 arranged in a stack can have the same number of hollow channels K, a plurality of hollow channels K in one sub-plate body 1021 can correspond to a plurality of hollow channels K in another sub-plate body 1021 one-to-one, and any one hollow channel K in one sub-plate body 1021 can be in communication with a corresponding hollow channel K in another sub-plate body 1021.

[0060] In this way, as Figure 4 indicated, for any two adjacent sub-plate bodies 1021 and any two hollow channels K in communication, in the working process of the laser 000, the phase change part 300 in the hollow channel K close to the support surface P can change phase to quickly absorb the heat generated by the light emitting chip 200. After the phase change part 300 in the hollow channel K close to the support surface P changes phase, the phase change part 300 can flow into the hollow channel K away from the support surface P and with lower temperature to restore from the phase change state to the initial state to conduct the heat carried by itself to the side of the substrate body 101 away from the support surface P, and then the heat can be dissipated to the outside through the substrate body 101, so that the cooling of the light emitting chip 200 can be realized.

[0061] In the second optional implementation, as Figure 5 indicated, Figure 5 is a top view of another laser provided by the embodiments of the present application. The plurality of hollow channels K of each sub-plate body 1021 can be divided into a plurality of first sub-channels K1 extending along a first direction X and a plurality of second sub-channels K2 extending along a second direction Y, and the first sub-channels K1 and the second sub-channels K2 in each sub-plate body 1021 are in communication. Here, the first direction X and the second direction Y can be the first direction X and the second direction Y in the first optional implementation, that is, the first direction X can intersect the second direction Y, for example, the first direction X can perpendicularly intersect the second direction Y, and the first direction X and the second direction Y can both be parallel to the support surface P of the substrate body 101.

[0062] Specifically, for at least two stacked sub-plates 1021, the first sub-channels K1 of any two adjacent sub-plates 1021 are interconnected, and the second sub-channels K2 of any two adjacent sub-plates 1021 are interconnected. Thus, after the phase change portion 300 absorbs heat generated by the light-emitting chip 200 and undergoes a phase change, the phase change portion 300 can flow within the first sub-channel K1 and the second sub-channel K2. This further increases the flow area of ​​the phase change portion 300, thereby further improving the heat absorption efficiency of the phase change portion 300 and further enhancing the heat dissipation effect of the laser 000.

[0063] It should be noted that, in the second optional implementation, the first sub-channels K1 of any two adjacent sub-plate bodies 1021 are connected, and the second sub-channels K2 of any two adjacent sub-plate bodies 1021 are connected can be in the following two situations:

[0064] In the first case, if Figure 6 As shown, Figure 6 yes Figure 5 In the cross-sectional view of the laser at C-C', for any two adjacent sub-plates 1021, the first sub-channel K1 located at the outermost edge of the multiple first sub-channels K1 in one sub-plate 1021 can be connected to the first sub-channel K1 located at the outermost edge of the multiple first sub-channels K1 in the other sub-plate 1021. And / or, the second sub-channel K2 located at the outermost edge of the multiple second sub-channels K2 in one sub-plate 1021 can be connected to the second sub-channel K2 located at the outermost edge of the multiple second sub-channels K2 in the other sub-plate 1021.

[0065] In the second case, if Figure 7 As shown, Figure 7 yes Figure 5 Another cross-sectional view of the laser at CC' is shown. For any two adjacent sub-plates 1021, the intersection of the first sub-channel K1 and the second sub-channel K2 in one sub-plate 1021 can be connected to the intersection of the first sub-channel K1 and the second sub-channel K2 in the other sub-plate 1021.

[0066] Optional, such as Figure 8 As shown, Figure 8 This is a cross-sectional view of another laser provided by an embodiment of the present application. The laser 000 may further include a frame 400. The frame 400 in the laser may be distributed around the boss 100a of the substrate 100, and the frame 400 may be fixedly connected to the area of ​​the support surface P of the substrate 100 where the boss 100a1 is not distributed.

[0067] It should be noted that ifFigure 8 As shown, the laser 000 can further include a light-transmitting sealing cover plate 500, which can be fixedly connected to the side of the frame 400 away from the substrate 100. Here, the light-transmitting sealing cover plate 500 can include a cover plate body 501 and a light-transmitting glass 502, the cover plate body 501 can be fixedly connected to the side of the frame 400 away from the substrate 100, and the cover plate body 501 can have a light-transmitting through hole, and the light-transmitting glass can cover the light-transmitting through hole of the cover plate body 501. In this way, the light-emitting chip 200 fixed to the side of the boss 100a can be sealed by the substrate 100, the frame 400 and the light-transmitting sealing cover plate 500 to avoid damage to the light-emitting chip 200. And the laser emitted by the light-emitting chip 200 can be emitted outward through the light-transmitting glass 502 in the light-transmitting sealing cover plate 500, so that the laser 000 emits laser.

[0068] In summary, the embodiment of the present application provides a laser, which includes a substrate, a light-emitting chip and a phase change part. In the working process of the laser, the heat generated by the light-emitting chip due to light emission can be conducted to the phase change part in the plurality of hollow channels inside the substrate, when the temperature of the phase change part reaches the phase change temperature point of the phase change part, the phase change part can change phase, and in the process of phase change of the phase change part, the phase change part can quickly absorb a large amount of heat to achieve rapid cooling of the light-emitting chip, thereby improving the heat dissipation effect of the laser. And the plurality of hollow channels in the substrate can be distributed in the entire area of the substrate, at least part of the plurality of hollow channels are connected, after the phase change of the phase change part, the phase change part can conduct the heat generated by the light-emitting chip to each area of the substrate to dissipate the heat through the whole substrate, which further improves the heat dissipation effect of the laser.

[0069] The embodiment of the present application also provides a light source device, as shown in Figure 9 As shown, Figure 9 is a structural schematic diagram of a light source device provided by the embodiment of the present application, the light source device 010 can include a laser and a heat sink 020 connected with the laser, and the laser in the light source device 010 can be the laser 000 in the above-mentioned embodiment.

[0070] Optionally, as shown in Figure 9 The heat sink 020 in the light source device 010 can have a heat dissipation plate 021, and the side of the substrate 100 in the laser 000 away from the light-emitting chip 200 can be fixedly connected with the heat dissipation plate 021 in the heat sink 020.

[0071] It should be noted that the heat sink 010 can further include a heat sink body 022, the heat sink plate 021 can be fixedly connected with the heat sink body 022, and the side of the heat sink plate 021 away from the heat sink body 022 can be fixedly connected with the substrate 100 in the laser 000. In this way, during the working process of the laser 000, after the phase change part 300 in the laser 000 conducts heat to the side of the substrate 100 away from the support surface P, the heat carried by the phase change part 300 can be conducted to the heat sink body 022 through the heat sink plate 021, and then the heat can be dissipated to the external environment through the heat sink body 022.

[0072] It should be further noted that, as shown in Figure 10 , Figure 10 is a structural schematic diagram of a heat sink provided by an embodiment of the present application. The heat sink body 022 can include a heat pipe 0221 and a fin 0222. The heat pipe 0221 in the heat sink body 022 can be in contact with the heat sink plate 021 and the fin 0222 at the same time, and the heat pipe 0222 can quickly conduct the heat received by the heat sink plate 021 to the fin 0222. Here, the fin 0222 in the heat sink body 022 has a large contact area with the external environment, so that heat can be continuously dissipated from the surface of the fin 0222 to the external environment, thereby realizing the heat dissipation function of the heat sink body 022.

[0073] As shown in Figure 10 , the side of the heat sink plate 021 away from the heat sink body 022 can have a positioning groove S, and the laser 000 fixed on the heat sink plate 021 can be located in the positioning groove S.

[0074] Optionally, as shown in Figure 9 , the light source device 010 can further include a flexible heat-conducting layer 030, which can be located between the substrate 100 in the laser 000 and the heat sink plate 021 in the heat sink 020. That is, the substrate 100 in the laser 000 can be connected with the heat sink plate 021 through the flexible heat-conducting layer 030.

[0075] Here, the surfaces of the substrate 100 in the laser 000 and the heat sink plate 021 in the heat sink 020 can have unevenness, resulting in a small gap between the substrate 100 and the heat sink plate 021, and thus the heat conduction effect between the substrate 100 and the heat sink plate 021 is not good. Therefore, the flexible heat-conducting layer 030 can eliminate the small gap between the substrate 100 and the heat sink plate 021, so as to improve the adhesion between the substrate 100 and the heat sink plate 021, and thus the heat conduction effect of the substrate 100 to the heat sink plate 021 can be improved. For example, the material of the flexible heat-conducting layer 030 can be heat-conducting silicone grease or heat-conducting silicone gel.

[0076] Another light source device is further provided by an embodiment of the present application, as shown inFigure 11 and Figure 12 as shown in FIG. 4B, Figure 11 is a structural schematic diagram of another light source device provided by an embodiment of the present application, Figure 12 is a structural schematic diagram of still another light source device provided by an embodiment of the present application. The light source device 040 can include a heat sink body 022, a heat sink plate 021, and a light emitting chip 200. One side of the heat sink plate 021 in the light source device 040 can be fixedly connected with the heat sink body 022, and the side of the heat sink plate 021 facing away from the heat sink body 022 can have a support surface P and a boss 100a located on the support surface P and protruding from the support surface P. The light emitting chip 200 in the light source device 040 can be fixedly connected with the side of the boss 100a facing away from the support surface P. In this way, during the working process of the light source device 040, the heat generated by the light emitting chip 200 can be directly conducted to the heat sink body 022 through the heat sink plate 021, so as to dissipate the heat to the external environment through the heat sink body 022.

[0077] It should be noted that, in the light source device 010 in the above embodiment, in order to eliminate the tiny gap between the substrate 100 and the heat sink plate 021, the flexible heat-conducting layer 030 is needed to connect the substrate 100 and the heat sink plate 021. The material of the flexible heat-conducting layer 030 has a certain heat conductivity, and when the heat conductivity of the material of the flexible heat-conducting layer 030 is low, the speed of heat conduction from the substrate 100 to the heat sink plate 020 is small, that is, the heat dissipation effect of the light source device 010 is limited by the material of the flexible heat-conducting layer 030. Therefore, compared with the light source device 010 in the above embodiment, the light emitting chip 020 in the light source device 040 is directly fixed on the boss 100a of the heat sink plate 021, which can not only reduce the heat conduction path, but also eliminate the heat conduction limitation of the flexible heat-conducting layer 030, so that the heat dissipation effect of the light source device 040 is better.

[0078] It should be further noted that, as Figure 11 and Figure 13 as shown in FIG. 4B, Figure 13 is a structural schematic diagram of still another light source device provided by an embodiment of the present application. The light source device 040 can further include a frame 400 and a light-transmitting sealing cover plate 500. The frame 400 can be distributed around the boss 100a and can be fixedly connected with the region of the heat sink plate 021 where the boss 100a is not distributed. The light-transmitting sealing cover plate 500 can be fixedly connected with the side of the frame 400 facing away from the support surface P. In this way, the heat sink plate 021, the frame 400, and the light-transmitting sealing cover plate 500 can seal the light emitting chip 200, so as to avoid damage to the light emitting chip 200.

[0079] Optionally, as Figure 14 as shown in FIG. 4B, Figure 14is a structural schematic diagram of a light source device provided by another embodiment of the present application. The light source device 040 can further include a phase change portion 300, and the heat sink plate 021 in the light source device 040 can have a plurality of hollow channels K inside, at least some of the plurality of hollow channels K are connected, and the phase change portion 300 can be located in the hollow channels K of the heat sink plate 021.

[0080] In this way, during the operation of the light source device 040, after the phase change portion 300 located in the plurality of hollow channels K of the heat sink plate 021 absorbs the heat generated by the light emitting chip 200 to change phase, the phase-changed phase change portion 300 can conduct the heat generated by the light emitting chip 200 to the side of the heat sink plate 021 away from the light emitting chip 200. Since the heat sink plate 021 is directly fixedly connected with the heat sink body 022, the heat received by the heat sink plate 021 can be directly conducted to the heat sink body 022, and then dissipated to the external environment through the heat sink body 022, thereby further improving the heat dissipation effect of the light source device 040.

[0081] It should be noted that the heat sink body 022 in the light source device 040 can be the heat sink body 022 in the light source device 010 in the above embodiment. The structure of the heat sink plate 021 with a plurality of hollow channels K in the light source device 040 can be the same as that of the substrate 100 with a plurality of hollow channels K in the laser 000 in the above embodiment, and will not be described here.

[0082] It should be noted that the light source device 010 and the light source device 040 in the present application can further include a housing, and the laser and the heat sink can be mounted on the housing. For example, the light source device in the present application can be used to provide laser in a laser projection device, and a plurality of optical devices can be fixed in the housing of the light source device. The optical devices fixed in the housing of the light source device can cooperate with other optical devices in the laser projection device to guide the laser emitted by the laser to a projection lens in the laser projection device, and then project the laser through the projection lens to form a picture.

[0083] In the present application, the terms "first" and "second" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance. The term "a plurality of" means two or more, unless otherwise explicitly limited.

[0084] The above description is only optional embodiments of the present application, and does not limit the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. A laser characterized by, The laser device comprises: a substrate, a light-emitting chip, and a phase change part; the substrate has a support surface, and the interior of the substrate has a plurality of hollow channels, at least some of the plurality of hollow channels being connected; the light-emitting chip is fixedly connected to the support surface; the phase change part is located in the hollow channel.

2. The laser of claim 1, wherein, The substrate comprises a substrate body and a plate body, the substrate body has the support surface and a receiving cavity, the plate body is located in the receiving cavity and is fixedly connected to the inner wall of the receiving cavity, and the plate body has the plurality of hollow channels.

3. The laser of claim 2, wherein, The plate body comprises at least two sub-plate bodies which are stacked in a direction perpendicular to the support surface; for any two adjacent sub-plate bodies, at least some of the hollow channels in one of the sub-plate bodies are connected to at least some of the hollow channels in the other sub-plate body.

4. The laser of claim 3, wherein, The plurality of hollow channels of each sub-plate body extend in a first direction or in a second direction, the first direction and the second direction intersecting; for any two adjacent sub-plate bodies, one of the hollow channels in one of the sub-plate bodies is connected to one of the hollow channels in the other sub-plate body.

5. The laser of claim 3, wherein, The plurality of hollow channels of each sub-plate body are divided into a plurality of first sub-channels extending in a first direction and a plurality of second sub-channels extending in a second direction, the first direction intersecting the second direction, the first sub-channels and the second sub-channels being connected; the first sub-channels of any two adjacent sub-plate bodies are connected, and the second sub-channels of any two adjacent sub-plate bodies are connected.

6. The laser of any one of claims 1 to 5, wherein, The substrate further has a boss located on the support surface and protruding from the support surface, the light-emitting chip is fixedly connected to the side of the boss facing away from the support surface; the laser device further comprises a frame, the frame is distributed around the boss, and the frame is fixedly connected to the region of the support surface where the boss is not distributed.

7. A light source device, characterized in that: The laser device comprises: a laser device and a heat sink connected to the laser device, the laser device being any one of the laser devices according to claims 1 to 6.

8. The light source apparatus according to claim 7, wherein The heat sink has a heat dissipation plate, and the side of the substrate in the laser device facing away from the light-emitting chip is connected to the heat dissipation plate; the light source device further comprises a flexible heat-conducting layer located between the substrate and the heat dissipation plate.

9. A light source apparatus, characterized by comprising: The laser device comprises: a heat sink body, a heat dissipation plate, and a light-emitting chip; one side of the heat dissipation plate is fixedly connected to the heat sink body, and the side of the heat dissipation plate facing away from the heat sink body has a support surface and a boss located on the support surface and protruding from the support surface; the light-emitting chip is fixedly connected to the side of the boss facing away from the support surface.

10. The light source apparatus according to claim 9, wherein The light source device further comprises a phase change part, and the interior of the heat dissipation plate has a plurality of hollow channels, at least some of the plurality of hollow channels being connected, and the phase change part is located in the hollow channel.

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