Pulsating heat pipe type vapor chamber for cooling multi-chip heat source

Abstract

The utility model relates to a pulsating heat pipe type vapor chamber for cooling a multi-chip heat source, and belongs to the technical field of electronic device heat dissipation and pulsating heat pipes. Comprising a single-heat-source pulsating heat pipe type temperature-uniforming plate, and the single-heat-source pulsating heat pipe type temperature-uniforming plate comprises an alternate reducing channel and a heat source coverage area gradient channel; the alternate reducing channels are arranged on two sides of the U-shaped elbow at the evaporation section, one side is a wide channel, and the other side is a narrow channel; and the wide channels and the narrow channels are alternately arranged. According to the pulsating heat pipe type temperature equalizing plate for cooling the multi-chip heat source, temperature control cooling of a chip heat source area is effectively achieved, modular design is carried out according to the actual heat source layout, and an efficient heat dissipation temperature control solution is provided.

Description

TECHNICAL FIELD

[0001] The utility model relates to a kind of for multi-chip heat source cooling pulsating heat pipe type uniform temperature plate, belong to electronic device heat dissipation and pulsating heat pipe technical field. BACKGROUND

[0002] The rapid development of multi-chip module, AC / DC converter and other electronic devices makes the heat dissipation problem increasingly prominent. The uneven temperature caused by multi-chip heat dissipation can cause significant thermal stress deformation, thereby threatening the safe operation of the device and even the entire system.

[0003] Pulsating heat pipe, as a new type of heat transfer device, has a wide application prospect in the fields of electronics, aerospace, etc. due to its simple structure, small size, light weight, high heat transfer efficiency, etc. Compared with tubular pulsating heat pipe, plate-type pulsating heat pipe has the advantage of better thermal contact with planar heat sources such as chips. In practical applications represented by chip cooling, the plate-type pulsating heat pipe absorbs heat on one side in contact with the chip and spreads the heat to the entire surface on the other side, which is then removed by air cooling or liquid cooling. In this radial heat dissipation mode, the pulsating heat pipe transfers heat along its channel and thickness direction to achieve temperature control and cooling of the heat source area. Compared with traditional capillary wick uniform temperature plates, the pulsating heat pipe type uniform temperature plate has the advantages of high structural strength, less affected by gravity, and not limited by capillary limits.

[0004] Currently, most of the research on pulsating heat pipe type uniform temperature plates focuses on single chip heat sources, and few involve multiple chip heat sources. This is because there are many difficulties in the layout design of the channel under the condition of multiple chip heat sources: (1) The complexity of working fluid charging and packaging will be greatly improved, and it is not suitable to use multiple single heat source pulsating uniform temperature plates for simple combination to achieve heat dissipation under the heat dissipation scenario of multiple chip heat sources. Designing multiple heat source channels through a single loop closed channel can greatly reduce the charging and manufacturing costs, but how to adjust the channel layout to break the pressure stalemate under multiple heat sources and promote one-way circulation is a big challenge. (2) Due to the flexible and variable layout of actual chips, different single loop closed channel layouts need to be designed, so the design cycle is longer, the manufacturing cost is higher, and it is difficult to meet the requirements of generalization and rapid development of multi-chip temperature control systems.

[0005] Currently, there is an urgent need to develop a pulsating heat pipe type uniform temperature plate that can be flexibly designed according to the layout of multiple chip heat sources, effectively achieve temperature control and cooling of the chip heat source area, and provide an efficient heat dissipation and temperature control solution through modular design according to the actual heat source layout. SUMMARY

[0006] In order to solve the above problems, the utility model provides a kind of for the pulsating heat pipe type uniform temperature plate of multi-chip heat source cooling, effectively realize the temperature control cooling of chip heat source area, and according to actual heat source layout carries out modular design, provides efficient heat dissipation temperature control solution.

[0007] The utility model discloses the following technical means to realize the above technical purpose.

[0008] A kind of for the pulsating heat pipe type uniform temperature plate of multi-chip heat source cooling, it is characterized by including single heat source pulsating heat pipe type uniform temperature plate, the single heat source pulsating heat pipe type uniform temperature plate includes alternate variable-diameter channel and heat source coverage area gradient channel;The alternate variable-diameter channel is arranged at the U-shaped bend of evaporation section side, one side is the larger side of channel width (wide channel), the other side is the smaller side of channel width (narrow channel);The larger side of channel width (wide channel) and the smaller side of channel width (narrow channel) are alternately arranged.

[0009] Preferably, the heat source coverage area gradient channel is designed as follows: the length of the channel coinciding with the heating area is 10.5 mm, 8.0 mm, 5.5 mm and 3.2 mm in turn, showing a gradient change of 10:8:6:3.

[0010] Preferably, the width ratio of the larger side of channel width (wide channel) to the smaller side of channel width (narrow channel) is 4:3-6:3.

[0011] Preferably, the local unit of a U-shaped bend and two adjacent U-shaped bend units of the pulsating heat pipe type uniform temperature plate during stable operation are taken as the analysis objects, and the stress analysis is given:

[0012] The pressure difference on both sides of a single U-shaped bend is approximately represented by the following formula (1):

[0013]

[0014] Wherein, σ is the surface tension, h is the channel depth, w1 and w2 are the widths of the narrow channel and the wide channel respectively, and θ1 and θ2 are the contact angles corresponding to the two sides of the channel.

[0015] Preferably, assuming that the contact angles in the larger side of channel width (wide channel) and the smaller side of channel width (narrow channel) remain unchanged, formula (1) can be simplified as the following formula (2):

[0016]

[0017] Wherein, σ is the surface tension, w1 and w2 are the widths of the narrow channel and the wide channel respectively, and θ is the contact angle corresponding to the two sides of the channel.

[0018] Preferably, at the evaporation section and the condensation section of a single channel, the superimposed pressure difference generated by the two U-shaped bends is the following formula (3):

[0019]

[0020] Among them, σ c and σ e Represent the surface tension at the elbow of the condensation section and the elbow of the evaporation section respectively.

[0021] Preferably, the pulsating heat pipe type temperature distribution board for cooling multi-chip heat sources includes three sub-module channel layouts: a same-direction connection module, a turning connection module and an end-closure module, and each sub-module channel layout corresponds to a chip heat source.

[0022] Preferably, the steering connection module includes a first steering connection module, a second steering connection module and a third steering connection module connected in sequence; the same-direction connection module is connected to the first steering connection module in the steering connection module, and the third steering connection module in the steering connection module is connected to the end closing module.

[0023] Preferably, the same-direction connection module is used to connect different modules on the same axis; the steering connection module is used to connect different modules on two axes perpendicular to each other; the end closing module is located at the end of the channel design, closing the entire channel layout into a single loop.

[0024] Preferably, the connection and matching between the sub-modules are flexibly adjusted according to the actual heat source layout, and the interface boundaries of the modules are overlapped to generate variant layouts, including "I" type, "L" type, "T" type, "Z" type, "cross" type, "U" type, "mouth" type and "nine-square" type.

[0025] Preferably, the variant layouts are all single-channel closed loops.

[0026] Preferably, the heat source area and the basic module are both square in design.

[0027] Beneficial effects:

[0028] The pulsating heat pipe type temperature equalizing plate of the utility model for cooling the heat sources of multiple chips effectively realizes temperature-controlled cooling of the heat source area of ​​the chip, and is modularly designed according to the actual heat source layout to provide an efficient heat dissipation solution.

[0029] The present invention will be further described below with reference to the accompanying drawings and specific implementation methods, but these are not intended to limit the scope of protection of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 This is a structural schematic diagram of a single heat source pulsating heat pipe type temperature equalizing plate (meta-module) in a pulsating heat pipe type temperature equalizing plate for multi-chip heat source cooling in Example 1 of the present invention.

[0031] Figure 2 Single heat source pulsating heat pipe type heat spreader (element module) and derived sub-module schematic diagram for the pulsating heat pipe type heat spreader of the utility model embodiment 2 for multi-chip heat source cooling.

[0032] Figure 3-1 One of the multi-chip heat source modular design cases for the pulsating heat pipe type heat spreader of the utility model embodiment 1 for multi-chip heat source cooling.

[0033] Figure 3-2 Second of the multi-chip heat source modular design cases for the pulsating heat pipe type heat spreader of the utility model embodiment 1 for multi-chip heat source cooling.

[0034] Figure 3-3 Third of the multi-chip heat source modular design cases for the pulsating heat pipe type heat spreader of the utility model embodiment 1 for multi-chip heat source cooling.

[0035] Figure 3-4 Fourth of the multi-chip heat source modular design cases for the pulsating heat pipe type heat spreader of the utility model embodiment 1 for multi-chip heat source cooling.

[0036] Figure 3-5 Fifth of the multi-chip heat source modular design cases for the pulsating heat pipe type heat spreader of the utility model embodiment 1 for multi-chip heat source cooling.

[0037] Figure 3-6 Sixth of the multi-chip heat source modular design cases for the pulsating heat pipe type heat spreader of the utility model embodiment 1 for multi-chip heat source cooling.

[0038] Figure 3-7 Seventh of the multi-chip heat source modular design cases for the pulsating heat pipe type heat spreader of the utility model embodiment 1 for multi-chip heat source cooling.

[0039] Figure 3-8 Eighth of the multi-chip heat source modular design cases for the pulsating heat pipe type heat spreader of the utility model embodiment 1 for multi-chip heat source cooling.

[0040] Figure 4 Six heat source chip layout and component module for the pulsating heat pipe type heat spreader of the utility model application embodiment 1 for multi-chip heat source cooling.

[0041] Figure 5 Six heat source "I" type channel layout for the pulsating heat pipe type heat spreader of the utility model application embodiment 1 for multi-chip heat source cooling.

[0042] Figure 6 Heat transfer performance test platform for the pulsating heat pipe type heat spreader of the utility model application embodiment 1 for multi-chip heat source cooling.

[0043] Figure 7 This is a wall temperature variation curve of a pulsating heat pipe type temperature equalizing plate when the heating power is increased gradually in a pulsating heat pipe type temperature equalizing plate used for cooling a multi-chip heat source in Application Example 1 of the utility model.

[0044] Figure 8 This is a performance comparison curve of a pulsating heat pipe type temperature equalizing plate and an aluminum plate for multi-chip heat source cooling in Application Example 1 of the utility model. DETAILED DESCRIPTION

[0045] Example 1

[0046] Single heat source pulsating heat pipe type temperature distribution board (meta module)

[0047] like Figure 1 , which is a schematic structural diagram of a single heat source pulsating heat pipe type temperature equalizer (elementary module) in a pulsating heat pipe type temperature equalizer for multi-chip heat source cooling in Example 1 of the present invention;

[0048] The first embodiment of the present invention is a pulsating heat pipe type heat spreader with a single heat source (elementary module) in a pulsating heat pipe type heat spreader for multi-chip heat source cooling, comprising alternating variable diameter channels, gradient channels in the heat source coverage area, and three sub-module channel layouts;

[0049] The alternating variable-diameter channels are specifically designed as follows: alternating variable-diameter channels are provided on both sides of the U-shaped elbow at the evaporation section (chip heating area), with one side having a larger channel width (wide channel) and the other side having a smaller channel width (narrow channel); the larger channel width side (wide channel) and the smaller channel width side (narrow channel) are arranged alternately;

[0050] The width ratio of the larger channel width side (wide channel) to the smaller channel width side (narrow channel) is 4:3-6:3;

[0051] The working principle of the alternating variable-diameter channel design is that the change in channel width on both sides of the U-bend generates an additional capillary pressure difference, which acts on the liquid plug, causing it to move toward the side with the smaller channel width. This pressure difference acts like gravity, driving the gas-liquid plug toward the evaporation section, effectively promoting directional circulation of the gas-liquid plug, thereby enabling the temperature distribution plate to achieve stable horizontal operation.

[0052] Taking a U-shaped elbow local unit and two adjacent U-shaped elbow units of a pulsating heat pipe type temperature distribution plate during stable operation as the analysis objects, the stress analysis is given:

[0053] The pressure difference on both sides of a single U-bend can be approximately expressed as follows (1):

[0054]

[0055] wherein, σ is surface tension, h is the channel depth, w1 and w2 are the width of the narrow channel and the wide channel respectively, θ1 and θ2 are the contact angles corresponding to the two sides of the channel;

[0056] Assuming that the contact angles in the side with larger channel width (wide channel) and the side with smaller channel width (narrow channel) remain unchanged, formula (1) can be simplified as the following formula (2);

[0057]

[0058] The superimposed pressure difference generated by the two U-shaped bends at the single-channel evaporation section and condensation section is the following formula (3):

[0059]

[0060] wherein, σ c and σ e represent the surface tension at the bend of the condensation section and the bend of the evaporation section respectively;

[0061] Since there is a temperature difference between the evaporation section and the condensation section, σ c and σ e have obvious differences, and the superimposed pressure difference cannot be ignored;The superimposed pressure difference promotes the movement of the gas-liquid plug from the side with larger channel width to the side with smaller channel width, thereby forming the overall directional (clockwise or counterclockwise) circulation movement;

[0062] When the heating power is constant and uniform, the heating power provided to each channel is proportional to its length in the heating area, so the channel heating power also changes in a gradient;

[0063] In this embodiment 1, the gradient arrangement of the heating area (square shadow area) channel is as shown in Figure 1 The length of the channel coinciding with the heating area is 10.5mm, 8.0mm, 5.5mm and 3.2mm in turn, showing a gradient change of 10:8:6:3;

[0064] In the utility model, the principle of the gradient channel design of the heat source coverage area is: based on the maximum dissimilarity analysis, compared with the channel with uniform length, the gradient channel shows higher non-uniformity in various combinations of random channel lengths, and the higher the non-uniformity of the channel in the local heating area, the more conducive to breaking the pressure stalemate under the condition of multiple heat sources, and the overall heat transfer performance and heat transfer limit are improved.

[0065] Embodiment 2

[0066] Single-heat-source pulsating heat pipe type vapor chamber (element module) and derived sub-modules for multi-chip heat source cooling

[0067] As Figure 2, which is a schematic diagram of a single heat source pulsating heat pipe type temperature equalizer (meta-module) and its derived sub-modules in a pulsating heat pipe type temperature equalizer for multi-chip heat source cooling in Example 2 of the present invention;

[0068] Embodiment 2 of the present invention is a pulsating heat pipe type heat spreader with a single heat source (meta-module) and its derived sub-modules in a pulsating heat pipe type heat spreader for cooling multiple chip heat sources. The derived sub-modules include a same-direction connection module (#1), a steering connection module (#2), and an end-closure module (#3) (i.e., based on the single-heat-source pulsating heat pipe type heat spreader (meta-module), three sub-module channel layouts are derived: a same-direction connection module, a steering connection module, and an end-closure module, and each sub-module channel layout corresponds to a chip heat source); the steering connection module (#2) includes a first steering connection module (#2-1), a second steering connection module (#2-2), and a third steering connection module (#2-3) connected in sequence; the same-direction connection module (#1) is connected to the first steering connection module (#2-1) in the steering connection module (#2), and the third steering connection module (#2-3) in the steering connection module (#2) is connected to the end-closure module (#3);

[0069] The same-direction connection module (#1) is used to connect different modules on the same axis; the steering connection module (#2) is used to connect different modules on two perpendicular axes; according to the different functions and locations, the steering connection module (#2) is subdivided into three types: the first steering connection module (#2-1), the second steering connection module (#2-2) and the third steering connection module (#2-3); the end closure module (#3) is located at the end of the channel design, closing the entire channel layout into a single loop; the dotted part is the interface boundary, which has a standard interface, and the width and position of the channel at the connection are fixed to ensure effective matching between different modules.

[0070] Example 3

[0071] like Figure 3-1 As shown, this is one of the modular design cases of multi-chip heat sources in a pulsating heat pipe type temperature equalizing plate for multi-chip heat source cooling in Example 1 of the present utility model; Figure 3-2 As shown, this is the second example of modular design of multi-chip heat source in pulsating heat pipe type temperature equalizing plate for multi-chip heat source cooling in embodiment 1 of the present invention; Figure 3-3 As shown, this is the third example of modular design of multi-chip heat source in pulsating heat pipe type temperature equalizing plate for multi-chip heat source cooling in embodiment 1 of the present invention; Figure 3-4 As shown, this is the fourth example of modular design of multi-chip heat source in pulsating heat pipe type temperature equalizing plate for multi-chip heat source cooling in embodiment 1 of the present invention; Figure 3-5 As shown, this is the fifth example of modular design of multi-chip heat source in pulsating heat pipe type temperature equalizing plate for multi-chip heat source cooling in embodiment 1 of the present invention;Figure 3-6 As shown, this is the sixth example of modular design of multi-chip heat source in pulsating heat pipe type temperature equalizing plate for multi-chip heat source cooling in embodiment 1 of the present invention; Figure 3-7 As shown, this is the seventh example of modular design of multi-chip heat source in pulsating heat pipe type temperature equalizing plate for multi-chip heat source cooling in embodiment 1 of the present invention; Figure 3-8 The figure shows the eighth modular design case of a multi-chip heat source in a pulsating heat pipe type temperature distribution plate for cooling a multi-chip heat source in Example 1 of the present utility model;

[0072] Based on the actual heat source layout, the connection and matching between sub-modules are flexibly adjusted, and the interface boundaries of the modules are overlapped to generate variant layouts: "I" type, "L" type, "T" type, "Z" type, "cross" type, "U" type, "mouth" type and "nine-square grid" type, in order to meet the heat dissipation requirements of multi-chip heat sources;

[0073] The above variant channel layouts are all single-channel closed loops and can be used after one-time processing and one-time filling and packaging.

[0074] For ease of explanation, the modular design examples presented above all use square heat source areas and basic modules. In practice, variables that can be redesigned to meet specific requirements include the number of heat sources, heat source geometry, the ratio of channel to heated area overlap, the geometry of the base modules, the number of U-bends, and channel width and spacing.

[0075] Application Example 1

[0076] like Figure 4 As shown in FIG. 1 , the layout and component modules of six heat source chips in a pulsating heat pipe type temperature distribution plate for multi-chip heat source cooling are shown in FIG. 2 . Figure 5 As shown, the layout of the six heat source "I"-shaped channels in the pulsating heat pipe type temperature distribution plate for multi-chip heat source cooling in the first embodiment of the present invention is shown;

[0077] On a PCB substrate measuring 220mm × 60mm, there are six heat-generating chips arranged in an "I" shape. The chip heating area is 15mm × 15mm, the chip spacing is 15mm, and the maximum heat output of a single chip is 45W. Based on this actual working condition, a modular design method is used to propose a six-heat-source "I" pulsating heat pipe-type temperature vapor chamber. The specific steps are as follows:

[0078] S1: divide the design area: the "I" channel layout only needs to design the co-directional connection module (#1) and the end closing module (#3), therefore, the design area of the co-directional connection module (#1) of 60mm*30mm and the end closing module of 60mm*50mm are respectively constructed, the end closing module (#3) is applied at both ends and four co-directional connection modules (#1) are applied in the middle; under the actual working condition, the design size of the end closing module (#3) is slightly larger than that of the co-directional connection module (#1), therefore, in order to maximize the condensation area and reduce the flow resistance, the U-shaped bend of the condensation area of the end closing module (#3) is different from the co-directional connection module (#1), and a filling channel is reserved on one side of the end closing module (#3);

[0079] S2: determine the channel width and the gradient channel length, the width of the wide channel is 1mm, the width of the narrow channel is 0.75mm, and the width ratio is 4:3; the gradient channel lengths are 10.5mm, 8.0mm, 5.5mm and 3.2mm in turn, and the length ratio is 10:8:6:3;

[0080] S3: connect the co-directional connection module (#1) and the end closing module (#3) (a total of six pieces) to obtain the single-loop closed channel layout as shown in Figure 5 ;

[0081] S4: precisely mill the channel with a depth of 1.3mm on the aluminum base plate with a size of 220mm*60mm*1.65mm, then, use the aluminum cover plate with a size of 220mm*60mm*0.35mm to perform welding packaging to obtain the pulsating heat pipe type vapor chamber with a size of 220mm*60mm*2mm; finally, through vacuumizing and working medium filling packaging, 2.6ml of R1233zd is injected into the pulsating heat pipe type vapor chamber, and the actual liquid filling rate is about 51%;

[0082] S5: the heat transfer performance test platform in the pulsating heat pipe type vapor chamber for multi-chip heat source cooling of the utility model application embodiment 1 is as shown in Figure 6 ; the copper block, the ceramic heating sheet and the water cooling plate (the inlet water temperature is 25℃, and the flow rate is 1.5 liters / minute) are used to heat and cool the pulsating heat pipe type vapor chamber respectively, the wall temperature at the steady state is recorded, and the heat transfer capacity is measured;

[0083] As shown in Figure 7 , the wall temperature change curve of the pulsating heat pipe type vapor chamber when the heat transfer power is increased in the pulsating heat pipe type vapor chamber for multi-chip heat source cooling of the utility model application embodiment 1, for the pulsating heat pipe type vapor chamber, Figure 6 , the wall temperature measuring point appears oscillation phenomenon under the condition that the single-chip heat power is 15W (the upper limit is 90W), and the working medium can realize the overall directional circulation movement, which indicates that the pulsating heat pipe type vapor chamber has good starting performance;

[0084] like Figure 8 The following is a performance comparison curve of the aluminum pulsating heat pipe type temperature plate and the aluminum plate used for multi-chip heat source cooling in the first embodiment of the present invention; compared with the aluminum plate of the same size, Figure 6 Under the condition that the heating power of a single chip is 45W (total power is 270W), the average temperature of the six heating areas of the aluminum pulsating heat pipe type temperature equalizer of the present invention is 46.2°C, which is 10.2°C lower than that of the aluminum plate; the temperature difference between the heating area and the edge area is 10.3°C, which is 10.4°C lower than that of the aluminum plate; the pulsating heat pipe type temperature equalizer of the present invention exhibits good heat source temperature control capability and overall temperature uniformity.

[0085] The above is only a detailed description of the preferred embodiments of the present invention, but the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by ordinary technicians in this field, various changes can be made without departing from the purpose of the present invention, and various changes should be included in the scope of protection of the present invention.

Claims

1. A pulsating heat pipe type heat spreader for multi-chip heat source cooling, characterized by: The single heat source pulsating heat pipe type vapor chamber comprises alternating variable diameter channels and heat source coverage area gradient channels; the alternating variable diameter channels are arranged at both sides of a U-shaped bend at an evaporation section, one side being a wide channel with a larger channel width and the other side being a narrow channel with a smaller channel width; the wide channels and the narrow channels are arranged alternately.

2. The pulsating heat pipe type heat spreader for multi-chip heat source cooling according to claim 1, characterized by, The heat source coverage area gradient channel is designed as follows: the length ratio of the channel coinciding with the heating area presents a gradient change of 10:8:6:

3.

3. The pulsating heat pipe type heat spreader for multi-chip heat source cooling according to claim 1, characterized by, The width ratio of the wide channel to the narrow channel is 4:3-6:

3.

4. The pulsating heat pipe type heat spreader for multi-chip heat source cooling according to claim 1, wherein Taking a local unit of a pulsating heat pipe type vapor chamber at a U-shaped bend and two adjacent U-shaped bend units as analysis objects in stable working conditions, a stress analysis is given: The pressure difference on both sides of a single U-shaped bend is approximately expressed as formula (1): Wherein, σ is the surface tension, h is the channel depth, w1 and w2 are the widths of the narrow channel and the wide channel respectively, and θ1 and θ2 are the contact angles of the two sides of the channel.

5. The pulsating heat pipe type heat spreader for multi-chip heat source cooling according to claim 1, wherein Assuming that the contact angles in the wide channel and the narrow channel remain unchanged, formula (1) can be simplified as formula (2): Wherein, σ is the surface tension, w1 and w2 are the widths of the narrow channel and the wide channel respectively, and θ is the contact angle of the two sides of the channel.

6. The pulsating heat pipe type heat spreader for multi-chip heat source cooling according to claim 1, wherein The superimposed pressure difference generated by two U-shaped bends at the evaporation section and the condensation section of a single channel is formula (3): where σ c and σ e represent the surface tension at the bend of the condensation section and the evaporation section, respectively.

7. The pulsating heat pipe type heat spreader for multi-chip heat source cooling according to claim 1, wherein The pulsating heat pipe type vapor chamber for multi-chip heat source cooling comprises three kinds of sub-module channel layouts: same direction connection module, turning connection module and end closing module, and each sub-module channel layout corresponds to a chip heat source.

8. The pulsating heat pipe type uniform heat spreader for multi-chip heat source cooling according to claim 7, characterized by The turning connection module comprises a first turning connection module, a second turning connection module and a third turning connection module connected in sequence; the same direction connection module is connected with the first turning connection module in the turning connection module, and the third turning connection module in the turning connection module is connected with the end closing module.

9. The pulsating heat pipe type uniform heat spreader for multi-chip heat source cooling according to claim 8, wherein The same direction connection module is used to connect different modules on the same axis; the turning connection module is used to connect different modules on two mutually perpendicular axes; and the end closing module is located at the end of the channel design and closes the entire channel layout into a single loop.

10. The pulsating heat pipe type heat spreader for multi-chip heat source cooling according to claim 1, characterized by, According to the actual heat source arrangement, the connection and matching between the sub-modules are adjusted flexibly, the interface boundaries of the modules are overlapped, a variant layout is generated, including "I" type, "L" type, "T" type, "Z" type, "cross" type, "U" type, "mouth" type and "nine-square" type; the variant layout is a single channel closed loop; and the heat source area and the basic module are square designs.

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