Stone tin soldering embedding structure

By cutting solder grooves on the teapot body and handle and injecting molten tin to form an interlocking solid, the problem of easy breakage at the connection between the body and handle of ceramic, clay, or stone teapots is solved, achieving a more stable connection.

CN223463889UActive Publication Date: 2025-10-24FUJIAN QUANZHOU WUJIANGTANG CREATIVE CRAFT PROD CO LTD
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Patent Information

Application Number
CN202422080251.7
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-08-27
Publication Date
2025-10-24
Estimated Expiration
2034-08-27

AI Technical Summary

Technical Problem

Existing teapots made of ceramic clay or stone are prone to breakage at the connection between the body and handle, and the connection stability after separate preparation and reassembly is poor.

Method used

The structure employs a stone-tin-soldering interlocking design. Tin-soldering grooves are cut into the body and handle, and molten tin is poured in and solidified to form an interlocking solid, thereby enhancing the stability of the connection.

Benefits of technology

This improves the connection stability between the kettle body and the handle, preventing loosening after prolonged use and extending its service life.

✦ Generated by Eureka AI based on patent content.

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Abstract

A stone tin soldering embedding structure structurally comprises a pot body and a lifting beam, the lifting beam is arranged above the pot body, a connecting block is arranged at the top end of the pot body, a tin soldering embedding groove is formed between the top end of the connecting block and the bottom end of the lifting beam, and an embedding solid formed after tin injection and solidification is arranged in the tin soldering embedding groove. A tin soldering caulking groove is formed in the handle, a penetrating groove or a tin injection groove is cut in the tin soldering caulking groove, then tin liquid is injected into the penetrating groove or the tin injection groove, and after tin fills the whole tin soldering caulking groove and is solidified, an embedded solid with the wide ends and the narrow middle can be naturally formed in the tin soldering caulking groove. And the situation of loosening after long-time use can be prevented, and the service life of the connection between the kettle body and the handle is prolonged.
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Description

TECHNICAL FIELD

[0001] The utility model relates to a stone tin soldering embedded structure and belongs to the tin soldering processing field. BACKGROUND

[0002] Tin soldering is a welding method that uses low-melting-point metal solder to infiltrate and fill the gap between the connecting parts of metal parts after being heated and melted. Because the solder is usually a tin-based alloy, it is named commonly used soldering iron as a heating tool. The composition of lead-tin solder does not meet the specifications or the impurities exceed the standard, which will affect the quality of tin soldering, especially the content of some impurities, such as zinc, aluminum, and cadmium. Even if the content is 0.001%, it will significantly affect the wettability and flowability of the solder and reduce the welding quality. Different materials require different fluxes. Even if it is the same material, different fluxes are often used when the welding process is different. For example, manual soldering iron welding and immersion welding, different fluxes are required after welding, cleaning or not. For manual tin soldering, rosin and active rosin can meet the assembly requirements of most electronic products. It is also necessary to point out that the amount of flux must also be noted. Too much or too little is not conducive to tin soldering. Do not move or vibrate the welding part before the tin solder solidifies, especially when using tweezers to hold the welding part. The tweezers must be removed after the tin solder solidifies. This is because the tin solder solidification process is a crystallization process. According to the crystallization theory, the crystallization conditions will change if the welding part is moved during crystallization, which will lead to coarse crystals and cause so-called "cold welding". The appearance phenomenon is that the surface is dull and appears like bean dregs. Therefore, the welding part must be kept stationary before the tin solder solidifies. In actual operation, the welding part can be fixed by various appropriate methods or reliable clamping measures. CONTENT OF THE UTILITY MODEL

[0003] In view of the deficiencies of the prior art, the utility model aims to provide a stone tin soldering embedded structure to solve the problems that the teapot made of ceramic clay or stone has a teapot body and a teapot handle prepared by high-temperature sintering forming, one-piece cutting forming, separate preparation and combination, the connection between the teapot body and the teapot handle prepared by high-temperature sintering forming is prone to fracture, the teapot body and the teapot handle prepared by one-piece cutting forming need to be cut at multiple angles and multiple times to prevent excessive cutting, and the teapot body and the teapot handle prepared by separate preparation and combination have poor combination stability.

[0004] In order to achieve the above object, the utility model is through the following technical scheme to realize: a stone tin solder embedded structure, its structure includes the kettle body, the beam, the beam is equipped with the top of kettle body, the top of kettle body is equipped with the connecting block, the connecting block top end and the beam bottom end between be equipped with tin solder embedded groove, the tin solder embedded groove inside be equipped with the embedded solid formed after tin injection solidification, the beam is inverted U type structure.

[0005] Further, the tin solder embedded groove includes first tin solder embedded groove, second tin solder embedded groove, the first tin solder embedded groove is equipped with the through groove between the second tin solder embedded groove, the first tin solder embedded groove is equipped with the second tin solder embedded groove between horizontal, the first tin solder embedded groove is equipped with the second tin solder embedded groove, the second tin solder embedded groove is equipped with the tin injection groove on one side.

[0006] Further, the tin solder embedded groove includes first tin solder embedded groove, second tin solder embedded groove, the first tin solder embedded groove is equipped with the through groove between the second tin solder embedded groove, the first tin solder embedded groove is equipped with the second tin solder embedded groove between horizontal, the first tin solder embedded groove is equipped with the second tin solder embedded groove, the second tin solder embedded groove is equipped with the tin injection groove on one side.

[0007] Further, the embedded solid includes first tin embedded body, second tin embedded body, the first tin embedded body is equipped with the second tin embedded body between horizontal, the first tin embedded body and second tin embedded body are connected with disc type tin solder embedded body, the disc type tin solder embedded body is located in the through groove, the first tin embedded body is located in the first tin solder embedded groove, the second tin embedded body is located in the second tin solder embedded groove.

[0008] Further, the embedded solid includes first tin embedded body, second tin embedded body, the first tin embedded body is equipped with the second tin embedded body between horizontal, the first tin embedded body and second tin embedded body are connected with disc type tin solder embedded body, the disc type tin solder embedded body is located in the through groove, the first tin embedded body is located in the first tin solder embedded groove, the second tin embedded body is located in the second tin solder embedded groove.

[0009] Further, the connecting block and the beam are spaced apart by 2-5mm.

[0010] Further, the diameter of the tin injection groove is 5-8mm.

[0011] Further, the outer wall of the beam and the connecting block is provided with a plurality of small grooves.

[0012] The utility model discloses a beneficial effect is: when using, cut out the tin solder embedding groove on the outer wall of the kettle body and the carrying beam, and cut out the through groove or tin injection groove in tin solder embedding groove, then inject tin liquid at the through groove or tin injection groove, after tin fills up entire tin solder embedding groove and solidifies, the embedding solid of one end wide, middle narrow can be formed in tin solder embedding groove naturally, this embedding solid not only strengthens the connecting stability between the carrying beam and the kettle body, but also helps to prevent the loose situation after long -time use, prolongs the service life of the kettle body and the carrying beam connection. BRIEF DESCRIPTION OF DRAWINGS

[0013] Other features, objects and advantages of the utility model will become more apparent through reading the following detailed description of non-limiting embodiments with reference to the accompanying drawings:

[0014] Figure 1 It is the structural diagram of a kind of stone tin solder embedding structure of the utility model;

[0015] Figure 2 It is the front view cross-sectional structure diagram of a kind of stone tin solder embedding structure of the utility model;

[0016] Figure 3 It is the connection cross-sectional structure diagram of example 1;

[0017] Figure 4 It is the connection cross-sectional structure diagram of example 2;

[0018] Figure 5 It is the tin solder embedding groove cross-sectional structure diagram in example 1;

[0019] Figure 6 It is the tin solder embedding groove cross-sectional structure diagram in example 2;

[0020] Figure 7 It is the embedding solid three-dimensional structure diagram in example 1;

[0021] Figure 8 It is the embedding solid three-dimensional structure diagram in example 2; DETAILED DESCRIPTION

[0022] The embodiments of the utility model are described in detail below, the example of embodiment is shown in the drawing, wherein same or similar label indicates same or similar element or element with same or similar function throughout. The embodiment described below by referring to the drawing is exemplary, and it is intended to explain the embodiment of the utility model, and can not be understood as the limitation of the utility model.

[0023] In the description of the utility model, it is understood that the terms "upper", "lower", "front", "rear", "vertical", "parallel", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the utility model and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the utility model.

[0024] In addition, the terms "first" and "second" are only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" can explicitly or implicitly include one or more of the features. In the description of the utility model, the meaning of "multiple" is two or more, unless otherwise explicitly specified.

[0025] Embodiment 1

[0026] The embodiment provides a stone tin soldering embedded structure, referring to Figure 1 , Figure 2 , Figure 3 , the structure comprises a kettle body 1 and a lifting beam 2, the lifting beam 2 is arranged above the kettle body 1, the top end of the kettle body 1 is provided with a connecting block 101, a tin soldering embedded groove 3 is arranged between the top end of the connecting block 101 and the bottom end of the lifting beam 2, an embedded solid 4 formed after tin solidification is arranged in the tin soldering embedded groove 3, and the lifting beam 2 is in an inverted U-shaped structure.

[0027] In order to reduce the time of cutting the tin soldering embedded groove 3 in the early stage, referring to Figure 5 , the tin soldering embedded groove 3 comprises a first tin soldering embedded groove 301 and a second tin soldering embedded groove 302, the first tin soldering embedded groove 301 is arranged above the second tin soldering embedded groove 302 at intervals, a through groove 303 is horizontally arranged between the first tin soldering embedded groove 301 and the second tin soldering embedded groove 302, the first tin soldering embedded groove 301 is arranged at the bottom end of the lifting beam 2, and the second tin soldering embedded groove 302 is arranged at the top end of the connecting block 101.

[0028] In order to be able to more uniformly form the embedded solid 4, referring to Figure 7 , the embedded solid 4 comprises a first tin embedded body 401 and a second tin embedded body 402, the first tin embedded body 401 is arranged above the second tin embedded body 402 at intervals, a disc-shaped tin soldering embedded body 403 is connected between the first tin embedded body 401 and the second tin embedded body 402, the disc-shaped tin soldering embedded body 403 is located in the through groove 303, the first tin embedded body 401 is located in the first tin soldering embedded groove 301, and the second tin embedded body 402 is located in the second tin soldering embedded groove 302.

[0029] In order to facilitate welding and save material cost, the connecting block 101 is spaced 2-5 mm from the lifting beam 2.

[0030] In order to increase the roughness of the welding surface, thereby providing better adhesion in the tin injection process, the outer wall of the lifting beam 2 and the connecting block 101 is provided with a plurality of small grooves.

[0031] Embodiment 2

[0032] The difference between this embodiment and embodiment 1 is that, with reference to Figure 1 , Figure 2 , Figure 4 , the structure includes a kettle body 1, a lifting beam 2, the lifting beam 2 is arranged above the kettle body 1, the top end of the kettle body 1 is provided with a connecting block 101, the top end of the connecting block 101 and the bottom end of the lifting beam 2 are provided with a tin solder embedding groove 3, the tin solder embedding groove 3 is provided with an embedded solid 4 formed after tin solidification, and the lifting beam 2 is an inverted U-shaped structure.

[0033] In order to ensure that the solder directly acts on the area that needs to be welded, reduce waste, with reference to Figure 6 , the tin solder embedding groove 3 includes a first tin solder embedding groove 301 and a second tin solder embedding groove 302, the first tin solder embedding groove 301 is connected to the upper end of the second tin solder embedding groove 302, the first tin solder embedding groove 301 and the second tin solder embedding groove 302 are provided with a tin injection groove 304 on one side, the first tin solder embedding groove 301 is arranged at the bottom end of the lifting beam 2, and the second tin solder embedding groove 302 is arranged at the top end of the connecting block 101.

[0034] In order to reduce the bubbles or cavities inside the embedded solid 4, with reference to Figure 8 , further, the embedded solid 4 includes a first tin embedding body 401 and a second tin embedding body 402, the first tin embedding body 401 is connected to the upper end of the second tin embedding body 402, the first tin embedding body 401 and the second tin embedding body 402 are provided with a column-shaped tin solder embedding body 404 on one side, the column-shaped tin solder embedding body 404 is located in the tin injection groove 304, the first tin embedding body 401 is located in the first tin solder embedding groove 301, and the second tin embedding body 402 is located in the second tin solder embedding groove 302.

[0035] In order to facilitate the injection of solder, the diameter of the tin injection groove 304 is 5-8 mm.

[0036] During use, a soldering groove 3 is cut on the outer wall of the pot body 1 and the handle 2, and a through groove 303 or a tin injection groove 304 is cut in the soldering groove 3. Then, tin liquid is injected into the through groove 303 or the tin injection groove 304. After the tin fills the entire soldering groove 3 and solidifies, a mosaic solid 4 with a wider end and a narrower middle can be naturally formed in the soldering groove 3. This mosaic solid 4 not only enhances the connection stability between the handle 2 and the pot body 1, but also helps to prevent loosening after long-term use, thereby extending the service life of the connection between the pot body 1 and the handle 2.

[0037] The above shows and describes the basic principles and main features of the present invention and the advantages of the present invention. It is obvious to those skilled in the art that the present invention is not limited to the details of the above exemplary embodiments and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention. Therefore, from all perspectives, the embodiments should be regarded as illustrative and non-restrictive. The scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes that fall within the meaning and range of equivalents of the claims be included in the present invention. Any reference signs in the claims should not be construed as limiting the claim to which they relate.

[0038] In addition, it should be understood that although this specification is described in terms of implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

Claims

1. A stone-solder hybrid structure, characterized by: Its structure includes kettle body (1), the carrying beam (2), the carrying beam (2) is located at the top of kettle body (1), the top of kettle body (1) is equipped with connecting block (101), the top of connecting block (101) and the bottom of carrying beam (2) are equipped with tin soldering slot (3), the tin soldering slot (3) is equipped with the embedded solid (4) formed after tin injection solidification, the carrying beam (2) is inverted U-shaped structure.

2. A stone-solder hybrid structure according to claim 1, characterized in that: The tin soldering slot (3) includes first tin soldering slot (301), second tin soldering slot (302), the first tin soldering slot (301) is spaced above the second tin soldering slot (302), the first tin soldering slot (301) and the second tin soldering slot (302) are horizontally equipped with through groove (303), the first tin soldering slot (301) is equipped at the bottom of carrying beam (2), the second tin soldering slot (302) is equipped at the top of connecting block (101).

3. A stone-solder hybrid structure according to claim 1, wherein: The tin soldering slot (3) includes first tin soldering slot (301), second tin soldering slot (302), the first tin soldering slot (301) is connected to the upper end of second tin soldering slot (302), the first tin soldering slot (301) and the second tin soldering slot (302) are simultaneously equipped with tin injection groove (304) on one side, the first tin soldering slot (301) is equipped at the bottom of carrying beam (2), the second tin soldering slot (302) is equipped at the top of connecting block (101).

4. A stone-solder hybrid structure according to claim 2, wherein: The embedded solid (4) includes first tin embedded body (401), second tin embedded body (402), the first tin embedded body (401) is spaced above the second tin embedded body (402), the first tin embedded body (401) and the second tin embedded body (402) are connected with disc-shaped tin soldering embedded body (403), the disc-shaped tin soldering embedded body (403) is located in through groove (303), the first tin embedded body (401) is located in the first tin soldering slot (301), the second tin embedded body (402) is located in the second tin soldering slot (302).

5. A stone-solder hybrid structure according to claim 3, wherein: The embedded solid (4) includes first tin embedded body (401), second tin embedded body (402), the first tin embedded body (401) is connected to the upper end of second tin embedded body (402), the first tin embedded body (401) and the second tin embedded body (402) are simultaneously equipped with column-shaped tin soldering embedded body (404) on one side, the column-shaped tin soldering embedded body (404) is located in tin injection groove (304), the first tin embedded body (401) is located in the first tin soldering slot (301), the second tin embedded body (402) is located in the second tin soldering slot (302).

6. A stone-solder hybrid structure according to claim 2, wherein: The interval between connecting block (101) and carrying beam (2) is 2-5mm.

7. A stone-solder hybrid structure according to claim 3, wherein: The diameter of tin injection groove (304) is 5-8mm.

8. A stone-solder hybrid structure according to claim 1, wherein: The outer wall of connecting block (101) and carrying beam (2) is equipped with a plurality of small grooves.