Wafer laser processing coaxial multi-magnification shared visual imaging module

Abstract

The utility model discloses a coaxial multi-magnification shared visual imaging module for wafer laser processing. The coaxial multi-magnification shared visual imaging module comprises a light source module, a high-magnification imaging module and a medium-magnification imaging module, the high-power imaging module comprises a high-power CCD (Charge Coupled Device), a 2X lens and an imaging focus lens which are coaxially arranged in sequence, and a spectroscope II which is arranged between the 2X lens and the imaging focus lens and is used for receiving illumination of the light source module and realizing light splitting; the medium-magnification imaging module comprises a medium-magnification CCD (Charge Coupled Device) and a 1X lens which are coaxially arranged, a spectroscope I which is arranged between the spectroscope II and the imaging focus lens and is used for receiving illumination of the light source module and realizing light splitting, and a reflector I which is arranged below the 1X lens and is used for receiving light split by the spectroscope I; and the medium-magnification CCD and the imaging focus lens are paraxial confocal. According to the utility model, integration of imaging modules with different multiplying powers is realized, and imaging can be carried out at the axis of the same visual field by using two multiplying powers.

Description

TECHNICAL FIELD

[0001] The utility model relates to laser cutting technical field, concretely is a wafer laser processing coaxial multiple common vision imaging module. BACKGROUND

[0002] In the process of silicon wafer laser processing, the wafer posture is leveled and the cutting path position is positioned, and several groups of different magnification imaging modules and focusing lenses are usually used when the incompatible grain size and cutting path width are compatible, resulting in large imaging system volume and large offset between cameras. Camera switching requires platform compensation, and platform linear positioning difference may cause inconsistent camera offset. INVENTION CONTENTS

[0003] The utility model solves the technical problems of overcoming the defects of the prior art, providing a wafer laser processing coaxial multiple common vision imaging module, comprising a light source module, a high-magnification imaging module and a medium-magnification imaging module.

[0004] The high-magnification imaging module comprises a high-magnification CCD, a 2X lens and an imaging focusing lens arranged coaxially in sequence, and a second beam splitter arranged between the 2X lens and the imaging focusing lens for receiving illumination of the light source module and realizing beam splitting.

[0005] The medium-magnification imaging module comprises a medium-magnification CCD and a 1X lens arranged coaxially, a first beam splitter arranged between the second beam splitter and the imaging focusing lens for receiving illumination of the light source module and realizing beam splitting, and a first reflector arranged below the 1X lens for receiving beam splitting of the first beam splitter. The medium-magnification CCD and the imaging focusing lens are paraxial confocal.

[0006] The 2X lens, the second beam splitter, the first beam splitter and the imaging focusing lens are arranged in a lens barrel, and the 1X lens and the first reflector are arranged in a second lens barrel.

[0007] The light source module comprises a point light source, an aperture and a second reflector arranged in sequence from top to bottom, the light emitted by the point light source enters the second reflector after adjusting the brightness by the aperture, and the light is reflected to the second beam splitter and the first beam splitter by the second reflector.

[0008] Further, it further comprises an adjusting mechanism one for axial up-down adjustment of the 2X lens in the lens barrel, and an adjusting mechanism two for axial up-down adjustment of the 1X lens in the second lens barrel, the double adjusting mechanisms can make the high-magnification CCD and the medium-magnification CCD imaging confocal, and there is no Z-direction error when the camera switches.

[0009] The adjusting mechanism one comprises a collar one axially installed inside the lens barrel one and an adjusting rod one in threaded connection with the collar one and driving the collar one to axially adjust up and down, and the 2X lens is clamped in the collar one.

[0010] The adjusting mechanism two comprises a collar two axially installed inside the lens barrel two and an adjusting rod two in threaded connection with the collar two and driving the collar two to axially adjust up and down, and the 1X lens is clamped in the collar two.

[0011] Compared with the prior art, the utility model realizes the integration of different magnification imaging modules, and can use two magnifications for imaging on the same visual axis. BRIEF DESCRIPTION OF DRAWINGS

[0012] Figure 1 It is a perspective structure schematic diagram of the utility model.

[0013] The numbers in the drawing represent: 1, middle-magnification CCD; 2, 1X lens; 3, reflecting mirror one; 4, focusing mirror; 5, light splitter one; 6, light splitter two; 7, 2X lens; 8, high-magnification CCD; 9, point light source; 10, diaphragm; 11, reflecting mirror two. DETAILED DESCRIPTION

[0014] The technical scheme in the utility model embodiment will be clearly and completely described below with reference to the drawings in the utility model embodiment.

[0015] Please refer to Figure 1 The utility model provides a wafer laser processing coaxial multi-magnification shared visual imaging module, which comprises a light source module, a high-magnification imaging module and a middle-magnification imaging module.

[0016] The high-magnification imaging module comprises a high-magnification CCD 8, a 2X lens 7 and an imaging focusing mirror 4 arranged coaxially in sequence, and a light splitter two 6 arranged between the 2X lens 7 and the imaging focusing mirror 4 for accepting illumination of the light source module and realizing light splitting.

[0017] The middle-magnification imaging module comprises a middle-magnification CCD 1 and a 1X lens 2 arranged coaxially, a light splitter one 5 arranged between the light splitter two 6 and the imaging focusing mirror 4 for accepting illumination of the light source module and realizing light splitting, and a reflecting mirror one 3 arranged below the 1X lens 2 and used for accepting light splitting of the light splitter one 5.

[0018] The 2X lens 7, the light splitter two 6, the light splitter one 5 and the imaging focusing mirror 4 are arranged in a lens barrel one, and the 1X lens 2 and the reflecting mirror one 3 are arranged in a lens barrel two.

[0019] The light source module comprises a point light source 9, a diaphragm 10 and a reflecting mirror 11 arranged in sequence from top to bottom.

[0020] The adjusting mechanism one is used for adjusting the 2X lens 7 in the lens barrel one in the axial direction, and the adjusting mechanism two is used for adjusting the 1X lens 2 in the lens barrel two in the axial direction.

[0021] The adjusting mechanism one comprises a ring one axially arranged in the lens barrel one and an adjusting rod one in threaded connection with the ring one and used for driving the ring one to adjust in the axial direction, and the 2X lens 7 is clamped in the ring one.

[0022] When the utility model works, the diaphragm 10 is below the point light source 9 and coaxial structure, and the diaphragm 10 is adjustable zoom diaphragm structure, and the lower the diaphragm passing property is, the lower the light source brightness is, and the greater the object side depth of field obtained is simultaneously.

[0023] The above is only the embodiment of the utility model, and does not limit the patent range of the utility model, and any equivalent structure or equivalent flow conversion using the utility model specification and drawing contents, or direct or indirect application in other related technical fields, are also included in the patent protection range of the utility model.

Claims

1. A coaxial multi-magnification shared visual imaging module for wafer laser processing, characterized by: The light source module, the high-magnification imaging module and the medium-magnification imaging module are included. The high-magnification imaging module includes a high-magnification CCD (8), a 2X lens (7) and an imaging focusing lens (4) arranged coaxially in sequence, and a second light splitter (6) arranged between the 2X lens (7) and the imaging focusing lens (4) for accepting the light source module illumination and realizing light splitting. The medium-magnification imaging module includes a medium-magnification CCD (1) and a 1X lens (2) arranged coaxially, a first light splitter (5) arranged between the second light splitter (6) and the imaging focusing lens (4) for accepting the light source module illumination and realizing light splitting, and a first reflector (3) arranged below the 1X lens (2) and used for accepting the light splitting of the first light splitter (5); and the medium-magnification CCD (1) and the imaging focusing lens (4) are paraxial confocal. The 2X lens (7), the second light splitter (6), the first light splitter (5) and the imaging focusing lens (4) are arranged in a lens barrel one, and the 1X lens (2) and the first reflector (3) are arranged in a lens barrel two. 2.The laser processing coaxial multi-magnification shared vision imaging module for wafer according to claim 1, wherein: The light source module includes a point light source (9), a diaphragm (10) and a second reflector (11) arranged in sequence from top to bottom, the light emitted by the point light source (9) enters the second reflector (11) after the brightness is adjusted by the diaphragm (10), and the light is reflected to the second light splitter (6) and the first light splitter (5) by the second reflector (11). 3.The laser processing coaxial multi-magnification shared vision imaging module for wafer according to claim 1, wherein: Further including an adjusting mechanism one for adjusting the 2X lens (7) axially up and down in the lens barrel one, and an adjusting mechanism two for adjusting the 1X lens (2) axially up and down in the lens barrel two, the double adjusting mechanisms can make the imaging of the high-magnification CCD and the medium-magnification CCD confocal, and there is no Z-direction error when the camera is switched. 4.The laser processing coaxial multi-magnification shared vision imaging module for wafer according to claim 3, wherein: The adjusting mechanism one includes a collar one axially mounted in the lens barrel one, and an adjusting rod one in threaded connection with the collar one and driving the collar one to adjust axially up and down, and the 2X lens (7) is clamped in the collar one.

5. The laser processing coaxial multi-magnification shared vision imaging module for wafer according to claim 3, characterized in that: The adjusting mechanism two includes a collar two axially mounted in the lens barrel two, and an adjusting rod two in threaded connection with the collar two and driving the collar two to adjust axially up and down, and the 1X lens (2) is clamped in the collar two.

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