Laser welding line positioning jig
By designing a laser wire bonding positioning fixture, the problems of low welding positioning efficiency and poor consistency of micro-semiconductor cooling devices are solved, achieving precise positioning and efficient welding, which is suitable for mass production of micro-semiconductor cooling devices.
Patent Information
- Application Number
- CN202422251936.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-13
- Publication Date
- 2025-10-24
- Estimated Expiration
- 2034-09-13
AI Technical Summary
Traditional methods for welding and positioning micro-semiconductor cooling devices rely on manual handling, resulting in low production efficiency, poor positioning consistency, and unstable welding quality.
The laser wire bonding positioning fixture includes a base, a three-dimensional displacement stage, a wire positioning device, and a device positioning device. Through three sets of single-axis displacement adjustment and magnetic attraction design, it achieves precise positioning of wires and devices. Combined with the precise control of the three-dimensional displacement stage, it ensures accurate welding position.
It improves the positioning accuracy and efficiency of welding, ensures the stability of welding quality, adapts to micro-semiconductor cooling devices of different sizes, and supports mass production.
Smart Images
Figure CN223465770U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model belongs to but is not limited to laser welding technical field, especially, relates to a laser wire welding positioning jig. BACKGROUND
[0002] The micro semiconductor refrigeration device includes a first substrate, a second substrate, and a crystal grain welded between the first substrate and the second substrate. After the semiconductor refrigeration device is assembled, wire welding is needed to facilitate power use.
[0003] The wires of the micro semiconductor refrigeration device are welded by electric irons or lasers. The traditional welding positioning method is mostly a manual holding method, which has low production efficiency, poor positioning consistency, and unstable welding quality.
[0004] In view of the above analysis, the existing technical problems to be solved urgently are that the traditional welding positioning method is mostly a manual holding method, which has low production efficiency, poor positioning consistency, and unstable welding quality. INVENTION CONTENTS
[0005] To solve the problems of poor positioning accuracy and low efficiency in wire welding, the utility model provides a laser wire welding positioning jig to replace the traditional manual holding positioning for wire welding of the micro semiconductor refrigeration device.
[0006] The utility model is implemented in the following manner. A laser wire welding positioning jig includes a base, a three-dimensional displacement table, a wire positioning device, and a device positioning device.
[0007] The base is used for fixing the three-dimensional displacement table and the device positioning device.
[0008] The three-dimensional displacement table includes three single-axis displacement tables assembled together by locking members and can be adjusted in three directions.
[0009] The wire positioning device includes a gland and a base. The wire positioning device is also provided with a horizontal shaft member. One side of the gland is hinged to one side of the base through the horizontal shaft member, so that the gland can be flipped in the vertical plane relative to the base.
[0010] The device positioning device includes a device placement groove, an adjusting baffle, and a spring pressing device. The adjusting baffle is provided with an adjusting hole, which can be compatible with micro semiconductor refrigeration devices of different sizes.
[0011] Further, the wire positioning device is provided with a magnet on the gland and the base, so that the gland can be attracted to the base to ensure firm wire positioning.
[0012] Further, the wire positioning device is provided with a rubber pad on the gland to prevent wire injury, and a V-shaped groove on the base to ensure accurate wire positioning.
[0013] Further, the three-dimensional displacement table upper surface is provided with a positioning pin, facilitating the replacement of the wire positioning device.
[0014] Further, the base upper surface is provided with a positioning pin, facilitating the replacement of the device positioning device.
[0015] In combination with the above technical solutions and the technical problems solved, the technical solutions to be protected by the utility model have the following advantages and positive effects:
[0016] First, the wire positioning jig can accurately position the wire and the miniature semiconductor refrigeration device, the three-axis displacement table can accurately control the displacement of the wire, ensuring accurate welding position and good welding effect. The wire positioning device and the device positioning device adopt pin hole positioning design, which is convenient for taking out and feeding, and multiple groups of spare parts can also be used to improve production efficiency.
[0017] The utility model has reasonable structure, is based on the optimization design of miniature semiconductor refrigeration device welding wire, can quickly and accurately clamp the wire and the miniature semiconductor refrigeration device, ensures the quality of miniature semiconductor refrigeration device wire welding, and lays a foundation for batch production of miniature semiconductor refrigeration devices. BRIEF DESCRIPTION OF DRAWINGS
[0018] Fig. 1 is the structure diagram of the laser wire positioning jig provided by the utility model embodiment;
[0019] Fig. 2 is the structure diagram of the three-dimensional displacement table provided by the utility model embodiment;
[0020] Fig. 3 is the structure diagram of the wire positioning device provided by the utility model embodiment;
[0021] Fig. 4 is the structure diagram of the device positioning device provided by the utility model embodiment;
[0022] In the drawing: 1, three-dimensional displacement platform; 2, positioning pin; 3, magnet; 4, gland; 5, rubber pad; 6, base; 7, adjusting baffle; 8, knurled screw; 9, top block; 10, spring; 11, positioning table; 12, base; 13, horizontal rotating shaft. DETAILED DESCRIPTION
[0023] In order to make the purpose, technical scheme and advantages of the utility model more clear and obvious, the utility model will be further described in detail in combination with embodiments. It should be understood that the specific embodiments described herein are only used to explain the utility model, and are not used to limit the utility model.
[0024] A laser wire positioning jig, such asFigs. 1 to 4 As shown, including base 12, three-dimensional displacement table 1, wire positioning device Fig. 3 ), device positioning device Fig. 4 );
[0025] The three-dimensional displacement table 1 is fixed on the base 12 by fasteners, and the upper surface of the three-dimensional displacement table 1 is provided with two positioning pins 2.
[0026] The wire positioning device is positioned by a pin hole and is installed on the upper surface of the three-dimensional displacement table 1. The wire positioning device comprises a magnet 3, a gland 4, a rubber pad 5, a base 6 and a horizontal pivot 13. The gland 4 and the base 6 are hinged through the horizontal pivot 13, and the magnet 3 is embedded on the gland 4 and the base 6. The gland 4 is provided with the rubber pad.
[0027] The device positioning device is positioned by a pin hole and is installed on the upper surface of the base 12. The device positioning device comprises an adjusting baffle 7, knurled screws 8, a top block 9, a spring 10 and a positioning table 11. The knurled screws 8 pass through the through holes in the positioning table 11 and are threadedly connected with the top block 10. The spring is arranged between the top block 10 and the knurled screws 8 to adjust the pressing force. The adjusting baffle 7 is provided with adjusting hole positions, and the knurled screws 8 are threadedly connected with the positioning table 11.
[0028] The adjusting baffle 8 is adjusted to the appropriate position through the adjusting hole, the knurled screws 8 are fastened, the miniature semiconductor refrigeration device is placed on one side of the top block 9, and the device is pressed through the spring 10. The wire is placed in the V-shaped groove on the upper surface of the base 6, the rubber pad 5 is pressed against the wire by turning over the gland 4, and at this time the gland 4 and the base 6 are attracted by the magnet 3. The three-dimensional displacement table 1 is adjusted to move the wire to the welding position, and the position alignment is completed. The jig is placed on the platform of the laser welding machine to weld the wire.
[0029] Generally, the wire positioning device and the device positioning device can be provided with several pieces for turnover material preparation, so as to improve the production efficiency.
[0030] In the description of the utility model, unless otherwise specified, the meaning of "a plurality of" is two or more than two; the terms "upper", "lower", "left", "right", "inner", "outer", "front end", "rear end", "head", "tail" and the like indicate the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the utility model and simplifying the description, and cannot be understood as indicating or implying that the indicated device or element must have a specific orientation, a specific orientation and operation, therefore it cannot be understood as a limitation on the utility model. In addition, the terms "first", "second", "third" and the like are only for the purpose of description, and cannot be understood as indicating or implying relative importance.
[0031] The above merely describes a specific implementation of the present application, but the protection scope of the present application is not limited thereto, and any modification, equivalent replacement, and improvement within the technical range disclosed by the present application and within the spirit and principle of the present application should be encompassed within the protection scope of the present application.
Claims
1. A laser wire bonding positioning jig, characterized by, The utility model relates to a three-dimensional displacement platform for micro semiconductor refrigeration device, which comprises a base, a three-dimensional displacement platform, a wire positioning device and a device positioning device. The base is used for fixing the three-dimensional displacement platform and the device positioning device. The three-dimensional displacement platform comprises three groups of single-axis displacement platforms, which are assembled together through locking members and can be adjusted in three directions. The wire positioning device comprises a cover and a base, and is further provided with a horizontal rotating shaft member. The device positioning device comprises a device placing groove, an adjusting baffle and a spring pressing device.
2. The laser wire bonding positioning jig of claim 1, wherein, The wire positioning device is provided with magnets on the cover and the base, so that the cover can be attracted to the base to ensure firm positioning of the wire.
3. The laser wire bonding positioning jig of claim 1, wherein, The wire positioning device is provided with a rubber pad on the cover to prevent the wire from being pressed, and is provided with a V-shaped groove on the base to ensure accurate positioning of the wire.
4. The laser wire bonding positioning jig of claim 1, wherein, The three-dimensional displacement platform is provided with a positioning pin on the upper surface to facilitate replacement of the wire positioning device.
5. The laser wire bonding positioning jig of claim 1, wherein, The base is provided with a positioning pin on the upper surface to facilitate replacement of the device positioning device.