Pressing plate for preventing chip from jumping due to vibration in braiding process
By installing a fixing plate and a pressing plate on the chip conveying device, the problem of chips vibrating and jumping in the material tank is solved, and the chips are placed stably before sealing, reducing chip damage and the quality risk of the whole roll of material.
Patent Information
- Application Number
- CN202422769508.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-14
- Publication Date
- 2025-10-24
- Estimated Expiration
- 2034-11-14
AI Technical Summary
The chip bounces and flips in the material tank due to vibration, causing damage and reversal of direction during sealing, which affects the quality of the entire roll of material.
Design a pressure plate structure, including a fixing plate and a pressure plate. The fixing plate is installed on the chip conveying device, and the pressure plate extends to the top of the material tank. The pressure plate cooperates with the limiting protrusion to ensure that the chip is stably placed in the material tank and reduce the impact of vibration.
It effectively reduces damage to chips caused by vibration before sealing, ensures chip stability in the material tank, and reduces the quality risk of the entire roll of material.
Smart Images
Figure CN223467416U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to chip technical field, specifically point to a kind of for preventing chip ribbon process from jumping due to vibration pressure plate. BACKGROUND
[0002] In the process of chip burning and component trans-ribbon packaging, the unsealed film chip will be shaken up in the process of pressing by heat-sealing sealing knife, so that the material is turned over when sealing film in the subsequent, resulting in chip damage and direction reversal.
[0003] The present application provides a kind of for preventing chip ribbon process from jumping due to vibration pressure plate, reduce the vibration of hot knife pressure to ribbon, so that chip can be stably placed in the trough before sealing film;So as to reduce chip damage and the quality risk of whole roll material. UTILITY MODEL CONTENT
[0004] The utility model aims at at least solving the problem of chip in the trough in prior art.
[0005] The present application provides a kind of for preventing chip ribbon process from jumping due to vibration pressure plate, by following specific technical means is achieved: including fixed plate installed on chip conveying device, the fixed plate front side is fixed with the pressure plate extending to the trough top opening of mobile ribbon belt opened on conveying device, fixed plate is located at the rear of trough, and pressure plate is located between chip burning device and chip packaging.
[0006] Preferred technical solutions one: the rear end of the pressure plate is fixed with transverse limiting convex plate away from the side of heat-sealing knife, the transverse limiting convex plate is perpendicular to the pressure plate, and the transverse limiting convex plate is placed along the rear wall of the trough top opening when in use.
[0007] Preferred technical solutions two: mounting hole is opened on the fixed plate, and the fixed plate is installed on the chip conveying device by bolt passing through the mounting hole.
[0008] Preferred technical solutions three: the bottom of the pressure plate is chamfered away from the side edge of transverse limiting convex plate.
[0009] The above structure makes the present application have the following beneficial effects:
[0010] 1, reduce the vibration of hot knife pressure to ribbon, so that chip can be stably placed in the trough before sealing film, so as to reduce chip damage and the quality risk of whole roll material;
[0011] 2, the pressure plate presses ribbon, on the one hand, reduces ribbon vibration, and on the other hand, makes material be shaken up only in the trough, and will not be separated from the trough until sealing is completed. DRAWING DESCRIPTION
[0012] The accompanying drawings are used to provide further understanding of the present application, and constitute a part of the specification, and are used to explain the present application together with embodiments of the present application, and do not constitute a limitation to the present application. In the drawings:
[0013] Fig. 1 It is a whole structure schematic view of the present application;
[0014] Fig. 2 It is a use state view of the present application;
[0015] Fig. 3 It is a front view of the present application.
[0016] Among them, 1, fixed plate, 11, mounting hole, 2, pressing plate, 21, chamfer, 3, transverse limiting convex plate. Specific implementation
[0017] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application; based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.
[0018] Please refer to Figs. 1-2 , the pressing plate for preventing the chip from jumping up in the process of chip ribbon coding, comprising a fixed plate 1 mounted on a chip conveying device, a pressing plate 2 extending to the top opening of a material groove on the moving material ribbon on the front side of the fixed plate 1, the length of the pressing plate 2 is longer than the length of the material groove, that is, it extends to the front of the material groove, and the pressing plate 2 is located between the chip burning device and the chip packaging, so that the chips shaken up by the hot sealing knife in the burning device are pressed back into the material groove, on the one hand, reducing the vibration of the material ribbon, on the other hand, even if the chips are shaken up, they will only shake in the material groove and will not fall out of the material groove until the sealing is completed.
[0019] The bottom of the pressing plate 2 away from the side edge of the transverse limiting convex plate 3 is provided with a chamfer 21, the chamfer 21 is a circular chamfer, and the corresponding angle is 135°, the side edge of the chip shaken up in the material groove first contacts the chamfer 21 of the pressing plate 2 in the movement, pushing the chip back into the material groove, avoiding the problem that the straight angle of the side edge is easy to collide with the chip and cause damage.
[0020] Please refer to Figs. 2-3 , the pressing plate for preventing the chip from jumping up in the process of chip ribbon coding, the rear end of the pressing plate 2 away from the side of the hot sealing knife is fixed with a transverse limiting convex plate 3, the transverse limiting convex plate 3 is perpendicular to the pressing plate 2, in use, the transverse limiting convex plate 3 is placed along the rear wall of the top opening of the material groove, for ensuring that the pressing plate 2 is parallel to the material groove, and at the same time, the top surface of the transverse limiting convex plate 3 is an inclined surface, and the bottom end of the inclined surface is away from the pressing plate 2.
[0021] Please refer to Figs. 1-3 , for preventing the chip from jumping up in the process of banded due to vibration pressing plate, fixed plate 1 is provided with multiple types of mounting hole 11, through bolt through mounting hole 11, fixed plate 1 is installed on chip conveying device, mounting hole 11 includes round hole and long hole, when using long hole installation, the left and right positions of fixed plate 1 can be fine adjusted.
[0022] Although the embodiments of the present application have been shown and described, it should be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present application, and the scope of the present application is defined by the appended claims and their equivalents.
Claims
1. A pressure plate for preventing chips from jumping up due to vibration during the chip taping process, characterized by: The application relates to a fixing plate (1) installed on a chip conveying device, wherein a pressing plate (2) extending to the top opening of a material groove on a moving material belt is fixed on the front side of the fixing plate (1), and the pressing plate (2) is located between a chip burning device and a chip package.
2. The press plate for preventing the chip from jumping up due to vibration during the process of taping according to claim 1, wherein: A transverse limiting convex plate (3) is fixed on the rear end of the pressing plate (2) away from the side of the heat sealing cutter, the transverse limiting convex plate (3) is perpendicular to the pressing plate (2), and the transverse limiting convex plate (3) is arranged along the rear wall of the top opening of the material groove.
3. The press plate for preventing the chip from jumping up due to vibration during the process of taping according to claim 1, wherein: A plurality of mounting holes (11) are arranged on the fixing plate (1).
4. The press plate for preventing the chip from jumping up due to vibration during the process of taping according to claim 3, wherein: The mounting holes (11) include round holes and long holes.
5. The press plate for preventing the chip from jumping up due to vibration during the process of taping according to claim 1, wherein: The length of the pressing plate (2) is longer than the length of the material groove.
6. The press plate for preventing the chip from jumping up due to vibration during the process of taping according to claim 1, wherein: The bottom of the pressing plate (2) is provided with a chamfer (21) away from the side edge of the transverse limiting convex plate (3).