Magnetofluid water cooling mechanism of heating cavity of sputter coating machine

Abstract

The utility model provides a sputter coating machine heating chamber magnetofluid water cooling mechanism, the sputter coating machine comprises a heating chamber shell, the bottom of the heating chamber shell is provided with a connecting plate, the connecting plate is provided with a through hole, the heating chamber shell is internally provided with a rotating tray, the bottom of the rotating tray is provided with a first rotating shaft, and the first rotating shaft is provided with a second rotating shaft. The first rotating shaft penetrates through the through hole and is connected with the motor assembly through a synchronous belt, the motor assembly rotates and drives the first rotating shaft to rotate synchronously through the synchronous belt, the first rotating shaft is sleeved with magnetic fluid, the magnetic fluid is connected with the through hole in a sleeved mode, the magnetic fluid has a sealing effect on the through hole, and the magnetic fluid ring is provided with a water cooling mechanism. The water cooling mechanism is used for cooling the magnetic fluid, so that the temperature of the magnetic fluid is controlled at a proper temperature, the magnetism and the sealing performance of the magnetic fluid are guaranteed, the service life is prolonged, and therefore the heating cavity shell is not prone to leaking vacuum gas or losing heat.

Description

TECHNICAL FIELD

[0001] The utility model relates to sputter coating technology field, more specifically, relate to a kind of sputter coating machine's heating cavity's magnetic fluid water cooling mechanism. BACKGROUND

[0002] Sputter coating technology is to use ion bombardment target surface, the atom of target material is hit out phenomenon is called sputtering, sputtering atom deposition is formed on substrate surface film and is called sputtering coating, in order to obtain high-quality optical thin film, a certain amount of working gas is filled in magnetron sputtering device, and the gas is ionized by target gun ignition, ion is impacted target material under the action of electric field and magnetic field, and target material atom is deposited on substrate film by sputtering. Accurately control reaction gas pressure, target and substrate spacing, sputtering power and other parameters to accurately control deposition rate to obtain high-quality optical thin film material.

[0003] Magnetic fluid seal is a new type of non-contact seal, which utilizes the characteristics of magnetic fluid that has both fluidity and magnetic field responsiveness, forms a magnetic field gradient in the sealing gap, and forms several "O" liquid sealing rings in the sealing gap under the joint action of pressure and magnetic field force, realizes the sealing pressure resistance effect, has the advantages of "zero leakage", long service life and high reliability.

[0004] And the magnetic flux density of all magnetic materials will change with the increase and decrease of temperature, the performance of magnet will decrease by one percent per degree rise, and the environment used by magnetic fluid is various, if used in high-temperature environment, the heat generated by motor operation will directly affect the magnetism of magnetic fluid, thereby causing demagnetization of magnetic fluid and reducing the sealing property.

[0005] Therefore, it is necessary to provide a magnetic fluid water cooling mechanism for cooling magnetic fluid to improve its sealing property and magnetism. UTILITY MODEL CONTENTS

[0006] Therefore, in order to solve the above problems, the utility model provides a kind of magnetic fluid water cooling mechanism for the heating cavity of sputter coating machine, by setting up water cooling mechanism 57 outside magnetic fluid, continuously pass in coolant to make magnetic fluid keep at suitable temperature, thereby guarantee the magnetism and sealing performance of magnetic fluid, so that heating cavity shell 1 is not easy to leak vacuum gas or lose heat, prolongs service life.

[0007] The application discloses a magnetorheological fluid water cooling mechanism 57 of a sputtering coating machine, wherein the sputtering coating machine comprises a heating cavity shell 1, the bottom of the heating cavity shell 1 is provided with a connecting plate 51, the connecting plate 51 is provided with a through hole, the heating cavity shell 1 is provided with a rotating tray 55, the bottom of the rotating tray 55 is provided with a first rotating shaft 53, the first rotating shaft 53 is connected with a motor assembly 4 through a synchronous belt 52 and penetrates through the through hole, the motor assembly 4 rotates, and the first rotating shaft 53 is driven to rotate synchronously through the synchronous belt 52, characterized in that: the first rotating shaft 53 is provided with a magnetorheological fluid 54, the magnetorheological fluid 54 is sleeved with the through hole, the through hole is sealed by the magnetorheological fluid 54, the magnetorheological fluid 54 is provided with a water cooling mechanism 57, the water cooling mechanism 57 is used for cooling the magnetorheological fluid 54, so that the temperature of the magnetorheological fluid 54 is controlled at a suitable temperature, the magnetism and sealing performance of the magnetorheological fluid are ensured, and the service life is prolonged, so that the heating cavity shell 1 is not easy to leak vacuum air or lose heat.

[0008] Further, the rotating tray 55 further comprises a first sealing ring 56, the first sealing ring 56 is arranged above the connecting plate 51 and located at the position where the magnetorheological fluid 54 is sleeved with the through hole, and the first sealing ring 56 is matched with the magnetorheological fluid in an up-down mode to enhance the sealing performance.

[0009] Further, the rotating tray 55 is connected with the top of the first rotating shaft 53, the rotating tray 55 can be driven to rotate by the rotation of the first rotating shaft 53, a wafer lifting tray 6 and a lifting device 7 are arranged above the rotating tray 55, one end of the wafer lifting tray 6 is connected with the lifting device 7, the wafer lifting tray 6 is controlled to ascend and descend through the lifting device 7, a wafer 61 is clamped on the wafer lifting tray 6, when the temperature of the wafer 61 reaches a set value, the wafer lifting tray 6 is controlled to descend by the lifting device 7, so that the wafer lifting tray 6 passes through the rotating tray 55 and the wafer 61 is left above the rotating tray 55.

[0010] Further, a plurality of second sealing rings 551 are arranged on the rotating tray 55 and close to the edges, so that the wafer 61 is protected when placed on the rotating tray 55, the wafer 61 is prevented from being scratched, and the friction force is increased, so that the wafer 61 is not slipped when rotating, and a plurality of through holes 552 are arranged on the rotating tray 55 and used for weight reduction.

[0011] Further, the motor assembly 4 comprises a motor 41, a motor support 42, a second rotating shaft 43, the motor support 42 is connected with the bottom of the heating cavity shell 1, the motor 41 is installed in the motor support 42, the bottom of the motor 41 is provided with the second rotating shaft 43, the bottom of the second rotating shaft 43 is provided with a driving disc, the bottom of the first rotating shaft 53 is connected with a driven disc, a synchronous belt 52 is arranged between the driving disc and the driven disc, the second rotating shaft 43, the driving disc, the synchronous belt 52, the driven disc and the first rotating shaft 53 are driven to rotate by the motor 41, so that the rotating tray 55 drives the wafer 61 to rotate, and the wafer is uniformly heated.

[0012] Further, the top of the heating cavity shell 1 is provided with a heating cavity cover plate 11, the heating cavity cover plate 11 is provided with a preheating cavity 2, the preheating cavity 2 is provided with a protective cover 21, and the preheating cavity 2 is provided with a heating assembly and a water cooling assembly.

[0013] Further, one side of the preheating cavity 2 is provided with an edge correction device 8, the edge correction device 8 is provided with a laser positioning probe, one side of the wafer 61 is provided with an edge, and the laser positioning probe detects the position of the wafer 61 according to the edge.

[0014] Further, the bottom of the edge correction device 8 is provided with a receiver 9, the receiver 9 is connected below the heating cavity shell 1, the edge correction device 8 transmits signals to the receiver 9, and the position of the wafer 61 is adjusted.

[0015] Further, one side of the heating cavity shell 1 is provided with a conveying port 12, which is used for enabling a mechanical hand to clamp and transport the wafer 61 into the heating cavity shell 1, and the other two sides of the heating cavity shell 1 are provided with observation windows 13.

[0016] Further, one side of the heating cavity shell 1 is also provided with a micro switch 14, the micro switch 14 is in contact with the heating cavity cover plate 11, when the heating cavity cover plate 11 is pressed and closed, the micro switch 14 is pressed to output a signal, and whether the heating cavity cover plate 11 is closed is detected.

[0017] The utility model discloses a working principle: external mechanical hand clamps wafer 61 to pass transport mouth 12 to heating cavity shell 1, and the position of wafer 61 is positioned through the cooperation of rectifying device 8 and receiver 9, and wafer 61 is placed to wafer lifting tray 6, and wafer 61 is moved to rotary tray 55 through lifting device 7, and wafer lifting tray 6 is withdrawn, and wafer 61 is heated through heating assembly, and motor assembly 4 drives first rotary shaft 53 to rotate to drive rotary tray 55 to rotate to make wafer 61 heat evenly, and first rotary shaft 53 is equipped with magnetic fluid 54, and magnetic fluid 54 is sleeved with the through hole at connecting plate 51, and the through hole is sealed through magnetic fluid 54, and magnetic fluid 54 is ringed with water cooling mechanism 57, and water cooling mechanism 57 is used to cool magnetic fluid 54, makes the temperature control of magnetic fluid 54 at suitable temperature, guarantees the magnetic property and sealing performance of magnetic fluid.

[0018] The utility model discloses a sputter coating machine's magnetic fluid water cooling mechanism 57, the sputter coating machine includes heating cavity shell 1, the bottom of heating cavity shell 1 is equipped with connecting plate 51, the place of connecting plate 51 is equipped with the through -hole, be equipped with rotary tray 55 in heating cavity shell 1, the bottom of rotary tray 55 is equipped with first rotary shaft 53, first rotary shaft 53 passes through the through -hole and is connected with motor assembly 4 through synchronous belt 52, motor assembly 4 rotates, through synchronous belt 52 drive first rotary shaft 53 synchronous rotation, first rotary shaft 53 is equipped with magnetic fluid 54, and magnetic fluid 54 is sleeved with the through -hole, and the through -hole is sealed through magnetic fluid 54, magnetic fluid 54 is ringed with water cooling mechanism 57, water cooling mechanism 57 is used to cool magnetic fluid 54, makes the temperature control of magnetic fluid 54 at suitable temperature, guarantees the magnetic property and sealing performance of magnetic fluid, prolongs the life, to make heating cavity shell 1 not easy to leak vacuum gas or loss heat. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 It is the overall structural drawing of the heating cavity of the sputter coating machine of the utility model.

[0020] Figure 2 It is the structure diagram of the magnetic fluid water cooling mechanism of the heating cavity of the sputter coating machine of the utility model.

[0021] Figure 3 It is the partial structural drawing of the heating cavity of the sputter coating machine of the utility model.

[0022] Figure 4 It is the overall structural drawing of the heating cavity of the sputter coating machine of the utility model.

[0023] MAIN ELEMENT SYMBOL EXPLANATION

[0024] Heating cavity shell 1, heating cavity cover plate 11, transport port 12, observation window 13, micro switch 14, preheating cavity 2, protective cover 21, water cooling mechanism 573, motor assembly 4, motor 41, motor support 42, second rotating shaft 43, connecting plate 51, synchronous belt 52, first rotating shaft 53, magnetic fluid 54, rotating tray 55, first sealing ring 56, second sealing ring 551, through hole 552, water cooling mechanism 57, wafer lifting tray 6, wafer 61, lifting device 7, edge correction device 8, receiver 9.

[0025] The following specific embodiments will further illustrate the present application in conjunction with the above-mentioned drawings. Specific embodiments

[0026] As shown in Figure 1 , it is the overall structure diagram of the heating cavity of the sputtering coating machine of the present application; as shown in Figure 2 , it is the structure diagram of the magnetic fluid water cooling mechanism of the heating cavity of the sputtering coating machine of the present application; as shown in Figure 3 , it is the partial structure diagram of the heating cavity of the sputtering coating machine of the present application; as shown in Figure 4 , it is the overall structure diagram of the heating cavity of the sputtering coating machine of the present application. Example 1

[0027] A kind of magnetic fluid water cooling mechanism of the heating cavity of sputtering coating machine, the sputtering coating machine includes heating cavity shell 1, the bottom of the heating cavity shell 1 is equipped with connecting plate 51, the connecting plate 51 is equipped with through hole, the rotating tray 55 is equipped in the heating cavity shell 1, the bottom of the rotating tray 55 is equipped with first rotating shaft 53, the first rotating shaft 53 passes through through hole and is connected with motor assembly 4 by synchronous belt 52, the motor assembly 4 rotates, drives the first rotating shaft 53 synchronous rotation by synchronous belt 52, characterized by: the first rotating shaft 53 is equipped with magnetic fluid 54 and the magnetic fluid 54 is connected with through hole, through the magnetic fluid 54 to the sealing effect of through hole, the magnetic fluid 54 is equipped with water cooling mechanism 57, the water cooling mechanism 57 is used to cool magnetic fluid 54, so that the temperature of magnetic fluid 54 is controlled at appropriate temperature, guarantee the magnetic property and sealing performance of magnetic fluid, prolong service life, so that heating cavity shell 1 is not easy to leak vacuum gas or loss of heat.

[0028] The rotating tray 55 further includes first sealing ring 56, the first sealing ring 56 is arranged above the connecting plate 51 and located at the magnetic fluid 54 and through hole connection, and the first sealing ring 56 is matched with the magnetic fluid up and down to enhance the sealing property.

[0029] The rotating tray 55 is connected to the top of the first rotating shaft 53, and the first rotating shaft 53 can drive the rotating tray 55 to rotate. The rotating tray 55 is provided above with a wafer lifting tray 6 and a lifting device 7. One end of the wafer lifting tray 6 is connected to the lifting device 7, and the wafer lifting tray 6 is controlled to rise and fall by the lifting device 7. The wafer lifting tray 6 clamps a wafer 61. When the temperature of the wafer 61 reaches a set value after being heated, the lifting device 7 controls the wafer lifting tray 6 to descend, so that the wafer lifting tray 6 passes through the rotating tray 55, and the wafer 61 remains above the rotating tray 55.

[0030] A plurality of second sealing rings 551 are arranged on the rotating tray 55 near the edge, so that when the wafer 61 is placed on the rotating tray 55, the wafer 61 is protected from being scratched, and the friction is increased so that the wafer 61 does not slip when rotating.

[0031] A plurality of through holes 552 are arranged on the rotating tray 55 for weight reduction.

[0032] The motor assembly 4 includes a motor 41, a motor support 42, and a second rotating shaft 43. The motor support 42 is connected to the bottom of the heating cavity shell 1, and the motor 41 is installed in the motor support 42. The second rotating shaft 43 is arranged at the bottom of the motor 41. The bottom of the second rotating shaft 43 is provided with a driving disc, and the bottom of the first rotating shaft 53 is connected with a driven disc. The driving disc and the driven disc are provided with a synchronous belt 52. The second rotating shaft 43, the driving disc, the synchronous belt 52, the driven disc, and the first rotating shaft 53 are driven to rotate by the motor 41, so that the rotating tray 55 drives the wafer 61 to rotate, and the wafer is uniformly heated.

[0033] The heating cavity shell 1 is provided at the top with a heating cavity cover plate 11. The heating cavity cover plate 11 is provided with a preheating cavity 2. The preheating cavity 2 is provided with a protective cover 21. The preheating cavity 2 is provided with a heating assembly and a water cooling assembly.

[0034] One side of the preheating cavity 2 is provided with an edge correction device 8. The edge correction device 8 is provided with a laser positioning probe. One side of the wafer 61 is provided with a cutting edge. The laser positioning probe detects the position of the wafer 61 according to the cutting edge.

[0035] The edge correction device 8 is provided at the bottom with a receiver 9. The receiver 9 is connected below the heating cavity shell 1. The edge correction device 8 transmits signals to the receiver 9 for adjusting the position of the wafer 61.

[0036] One side of the heating cavity shell 1 is provided with a transportation port 12 for enabling a mechanical hand to clamp and transport the wafer 61 into the heating cavity shell 1. The other two sides of the heating cavity shell 1 are provided with observation windows 13.

[0037] A micro switch 14 is also provided on one side of the heating chamber housing 1. The interior of the micro switch 14 is in contact with the heating chamber cover 11. When the heating chamber cover 11 is pressed down and closed, the micro switch 14 is pressed down and outputs a signal to detect whether the heating chamber cover 11 is closed.

[0038] The beneficial effects of the present utility model are as follows: a magnetic fluid water cooling mechanism 57 of a sputtering coating machine, the sputtering coating machine includes a heating chamber shell 1, a connecting plate 51 is provided at the bottom of the heating chamber shell 1, a through hole is provided at the connecting plate 51, a rotating tray 55 is provided in the heating chamber shell 1, a first rotating shaft 53 is provided at the bottom of the rotating tray 55, the first rotating shaft 53 passes through the through hole and is connected to the motor assembly 4 through a synchronous belt 52, the motor assembly 4 rotates, and the first rotating shaft 53 is driven to rotate synchronously through the synchronous belt 52, characterized in that: a magnetic fluid 54 is provided on the outer sleeve of the first rotating shaft 53 and the magnetic fluid 54 is socketed with the through hole, and the through hole is sealed by the magnetic fluid 54, and a water cooling mechanism 57 is provided around the magnetic fluid 54, and the water cooling mechanism 57 is used to cool the magnetic fluid 54 so that the temperature of the magnetic fluid 54 is controlled at an appropriate temperature, thereby ensuring the magnetic and sealing properties of the magnetic fluid and extending the service life, thereby making it difficult for the heating chamber shell 1 to leak vacuum gas or lose heat.

[0039] The above-described embodiments merely represent several implementation methods of the present invention. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that a person skilled in the art would be able to make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements fall within the scope of protection of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

Claims

1. A kind of magnetic fluid water cooling mechanism of heating cavity of sputtering coater, the sputtering coater includes heating cavity shell (1), the bottom of the heating cavity shell (1) is equipped with connecting plate (51), the connecting plate (51) is equipped with through hole, the inside of the heating cavity shell (1) is equipped with rotating tray (55), the bottom of the rotating tray (55) is equipped with first rotation shaft (53), the first rotation shaft (53) passes through through hole and motor assembly (4) are connected through synchronous belt (52), the motor assembly (4) rotates, the first rotation shaft (53) is driven to rotate synchronously by synchronous belt (52), it is characterized by: The first rotating shaft (53) is sleeved with a magnetic fluid (54), and the magnetic fluid (54) is sleeved with the through hole, the magnetic fluid (54) plays a sealing role on the through hole, the magnetic fluid (54) is annularly provided with a water cooling mechanism (57), the water cooling mechanism (57) is used for cooling the magnetic fluid (54), so that the temperature of the magnetic fluid (54) is controlled at a suitable temperature, the magnetic property and sealing performance of the magnetic fluid (54) are ensured, and the service life is prolonged, so that the heating cavity shell (1) is not easy to leak vacuum air or lose heat.

2. The magnetic fluid water cooling mechanism of the heating cavity of the sputter coating machine according to claim 1, wherein: The rotating tray (55) further comprises a first sealing ring (56), which is arranged above the connecting plate (51) and located at the position where the magnetic fluid (54) is sleeved with the through hole, and the first sealing ring (56) is matched with the magnetic fluid up and down to enhance the sealing performance.

3. The magnetic fluid water cooling mechanism of the heating cavity of the sputter coating machine according to claim 1, wherein: The rotating tray (55) is connected with the top of the first rotating shaft (53), the rotating tray (55) can be rotated by rotating the first rotating shaft (53), the wafer lifting tray (6) and the lifting device (7) are arranged above the rotating tray (55), one end of the wafer lifting tray (6) is connected with the lifting device (7), the wafer lifting tray (6) is lifted by controlling the lifting device (7), the wafer (61) is clamped on the wafer lifting tray (6), when the temperature of the wafer (61) reaches the set value, the wafer lifting tray (6) is lowered by the lifting device (7), so that the wafer lifting tray (6) passes through the rotating tray (55) and the wafer (61) is left above the rotating tray (55).

4. The magnetic fluid water cooling mechanism of the heating cavity of the sputter coating machine according to claim 1, wherein: A plurality of second sealing rings (551) are arranged on the rotating tray (55) near the edge.

5. The magnetic fluid water cooling mechanism of the heating cavity of the sputter coating machine according to claim 1, wherein: The motor assembly (4) comprises a motor (41), a motor support (42) and a second rotating shaft (43), the motor support (42) is connected with the bottom of the heating cavity shell (1), the motor (41) is installed in the motor support (42), the second rotating shaft (43) is arranged at the bottom of the motor (41), the second rotating shaft (43) is provided with a driving disc at the bottom, the first rotating shaft (53) is connected with a driven disc at the bottom, a synchronous belt (52) is arranged between the driving disc and the driven disc, the second rotating shaft (43), the driving disc, the synchronous belt (52), the driven disc and the first rotating shaft (53) are rotated by the motor (41), so that the rotating tray (55) drives the wafer (61) to rotate.

6. The magnetic fluid water cooling mechanism of the heating cavity of the sputter coating machine according to claim 1, wherein: The heating cavity shell (1) is provided with a heating cavity cover plate (11) at the top, the heating cavity cover plate (11) is provided with a preheating cavity (2), the preheating cavity (2) is provided with a protective cover (21), and the preheating cavity (2) is provided with a heating assembly and a water cooling assembly.

7. The magnetic fluid water cooling mechanism of the heating cavity of the sputter coating machine according to claim 6, wherein: One side of the preheating cavity (2) is provided with an edge correction device (8), the edge correction device (8) is provided with a laser positioning probe, one side of the wafer (61) is provided with an edge, and the laser positioning probe detects the position of the wafer (61) according to the edge.

8. The magnetic fluid water cooling mechanism of the heating cavity of the sputter coating machine according to claim 7, wherein: The edge correction device (8) is provided with a receiver (9) connected to the lower part of the heating cavity shell (1), the edge correction device (8) transmits signals to the receiver (9) for adjusting the position of the wafer (61).

9. The magnetic fluid water cooling mechanism of the heating cavity of the sputter coating machine according to claim 1, wherein: The heating cavity shell (1) is provided with a transport port (12) on one side for enabling the mechanical hand to clamp and transport the wafer (61) into the heating cavity shell (1), and the other two sides of the heating cavity shell (1) are provided with observation windows (13).

10. The magnetic fluid water cooling mechanism of a heating cavity of a sputter coating machine according to claim 1, wherein: The heating cavity shell (1) is further provided with a micro switch (14) on one side, the micro switch (14) is in contact with the heating cavity cover plate (11) inside, when the heating cavity cover plate (11) is pressed to close, the micro switch (14) is pressed to output signals, for detecting whether the heating cavity cover plate (11) is closed.

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