Horizontal electroplating equipment

Abstract

The utility model provides horizontal electroplating equipment and relates to the technical field of electroplating equipment. The horizontal electroplating equipment disclosed by the utility model can comprise a main tank body, at least one overflow box and at least one conductive brush assembly. The main tank body is filled with electroplating liquid, the target object floats on the electroplating liquid when being conveyed to the main tank body, and the bottom surface of the target object is soaked in the electroplating liquid. Due to the existence of the overflow box, when the electroplate liquid continuously overflows from the overflow box, the liquid level of the electroplate liquid in the main tank body is higher than the highest point of the overflow box, so that when the target object floats on the electroplate liquid, the target object is continuously conveyed to the overflow box from the electroplate liquid and is conveyed to the overflow box. The conductive brush assembly is arranged above the overflow box, and the height of the lowest point of the conductive brush assembly is higher than that of the highest point of the overflow box, so that the conductive brush assembly is always kept dry, the conductive brush assembly is prevented from being wetted by liquid, a layer of metal is prevented from being electroplated on the conductive brush assembly in the electroplating process, and a battery piece is further prevented from being damaged.

Description

TECHNICAL FIELD

[0001] The utility model relates to electroplating equipment technical field, in particular to a horizontal electroplating equipment. BACKGROUND

[0002] With the development of photovoltaic industry, the demand of battery piece continues to grow. The traditional battery piece usually adopts silk screen printing to print copper grid line, but the silver paste consumption of silk screen printing is large, and the cost is high. Based on this, a light-induced horizontal electroplating equipment is proposed, which realizes the electroplating effect through photoelectric conversion.

[0003] In the existing light-induced horizontal electroplating equipment, since the cathode and anode are located in the electroplating solution, continuous electroplating and deplating are required during the electroplating process. In the process of continuous electroplating and deplating, the corresponding metal layer is inevitably plated on the brush. In this process, the brush will become hard due to the existence of the metal layer, and then damage the battery piece. SUMMARY

[0004] One object of the first aspect of the utility model is to provide a horizontal electroplating equipment to solve the technical problem of brush damage to battery piece in the prior art.

[0005] In particular, the utility model provides a horizontal electroplating equipment, comprising:

[0006] A main tank body has an electroplating solution therein, and when a target object is delivered to the position of the main tank body, the target object floats on the liquid surface of the electroplating solution, and the electroplating solution wets the bottom of the target object;

[0007] At least one overflow box is arranged in the main tank body, and the highest position of the overflow box is not higher than the liquid level of the electroplating solution in the flowing state, so as to control the height of the electroplating solution within a preset range and keep the liquid surface of the electroplating solution smooth; and

[0008] At least one conductive brush assembly is located at the top of each overflow box. The lowest point of each conductive brush assembly is higher than the highest point of the overflow box, so that when the target object is delivered to the top of the overflow box, the lowest point of the conductive brush assembly is in contact with the top surface of the target object.

[0009] Optionally, a flow guide structure is arranged in the overflow box to discharge the electroplating solution in the overflow box.

[0010] Optionally, a liquid collecting groove is further included, which is located below the main groove body and communicates with the overflow box; when the height of the liquid in the main groove body is higher than the overflow box, the electroplating liquid in the main groove body enters the overflow box and flows into the liquid collecting groove along the flow guide structure, so that the height of the electroplating liquid in the main groove body is always not lower than the height of the top position of the overflow box.

[0011] Optionally, the height difference between the liquid level of the electroplating liquid and the highest position of the overflow box is not greater than 2 mm.

[0012] Optionally, at least one transmission assembly is further included, which is located in the overflow box to support the target object and drive the target object in the horizontal direction.

[0013] Optionally, each overflow box comprises:

[0014] an upper box body with an opening on the top; and

[0015] a lower box body in communication with the upper box body, wherein an installation structure is arranged on the outer surface of the lower box body to arrange the overflow box at the main groove body.

[0016] Optionally, a support component is further arranged on the upper box body to support the transmission assembly located on the upper box body.

[0017] Optionally, at least one overflow structure is arranged around the opening to improve the overflow efficiency.

[0018] Optionally, each conductive brush assembly comprises:

[0019] a fixed shaft arranged directly above the overflow box and fixed with the main groove body; and

[0020] a conductive brush arranged on the fixed shaft; the conductive brush is detachably connected with the fixed shaft.

[0021] Optionally, at least one liquid roller assembly is further included, which is located in the electroplating liquid to apply a force to the electroplating liquid to make the electroplating liquid flow.

[0022] Optionally, the screw thread directions of two adjacent liquid roller assemblies are opposite.

[0023] Optionally, at least one light induction assembly is further included behind each overflow box in the flow direction of the electroplating liquid, and the light induction assembly is arranged above the electroplating liquid surface.

[0024] Optionally, each light induction assembly comprises:

[0025] a light source emitting light with a preset wavelength; the preset wavelength is 300-500 nm; and

[0026] A protective shell is arranged outside the light source to fix the light source.

[0027] Optionally, the height of the light induction assembly from the surface of the electroplating solution is 50-100 mm. The horizontal electroplating device can include a main tank, at least one overflow box, and at least one conductive brush assembly. The main tank contains the electroplating solution, and the target object floats on the electroplating solution when it is transported to the main tank and its bottom surface is immersed in the electroplating solution. Due to the presence of the overflow box, the electroplating solution is continuously overflowing from the overflow box, and the height of the surface of the electroplating solution in the main tank is higher than the highest point of the overflow box, so that when the target object floats on the electroplating solution, it is continuously transported by the electroplating solution towards the overflow box and is transported to the overflow box. The conductive brush assembly is arranged above the overflow box, and since the height of the lowest point of the conductive brush assembly is higher than the height of the highest point of the overflow box, the conductive brush assembly is always kept dry, avoiding the conductive brush assembly from being wetted by the liquid and avoiding the conductive brush assembly from being plated with a layer of metal during the electroplating process, thereby avoiding damage to the battery piece.

[0028] The above and other objects, advantages and features of the present application will become more apparent from the following detailed description of some embodiments thereof, taken in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS

[0029] Some specific embodiments of the present application will be described in detail below with reference to the accompanying drawings, which are presented by way of illustration and not of limitation. The same reference numbers in the drawings indicate the same or similar components or parts. Those skilled in the art should understand that these drawings are not necessarily drawn to scale. In the drawings:

[0030] Figure 1 is a schematic perspective view of a horizontal electroplating device according to one specific embodiment of the present application;

[0031] Figure 2 is a front view of a horizontal electroplating device according to one specific embodiment of the present application;

[0032] Figure 3 is a partial schematic view of a horizontal electroplating device according to one specific embodiment of the present application;

[0033] Figure 4 is a partial enlarged schematic view of a horizontal electroplating device according to one specific embodiment of the present application;

[0034] Figure 5 is a schematic view of an overflow box according to one specific embodiment of the present application.

[0035] BRIEF DESCRIPTION OF DRAWINGS

[0036] Horizontal electroplating equipment-100; frame structure-101; feed port-102; discharge port-103; transmission component-110; liquid roller component-111; thread-1111; first transmission component-112; second transmission component-113; main tank body-120; water baffle-121; liquid collecting tank-130; overflow box-140; overflow structure-141; guide structure-142; upper box body-143; lower box body-144; support component-145; mounting structure-146; conductive brush assembly-150; fixed shaft-151; conductive brush-152; light-induced component-160. DETAILED DESCRIPTION

[0037] In the description of this embodiment, it should be understood that the terms "length", "width", "height", "up", "down", "left", "right", "vertical", "horizontal", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0038] As a specific embodiment of the present invention, Figures 1-5 As shown, this embodiment provides a horizontal electroplating apparatus 100. The horizontal electroplating apparatus 100 may include a main tank 120, at least one overflow box 140, and at least one conductive brush assembly 150. Specifically, the main tank 120 contains a plating solution. When an object is transferred to the main tank 120, the object floats on the surface of the plating solution, and the plating solution wets the bottom of the object. Each overflow box 140 is disposed within the main tank 120, and the highest point of the overflow box 140 is located no higher than the level of the plating solution in a flowing state, thereby controlling the height of the plating solution within a preset range and maintaining a stable level. At least one conductive brush assembly 150 is located at the top of each overflow box 140. The lowest point of each conductive brush assembly 150 is located higher than the highest point of the overflow box 140, so that when the object is transferred to the top of the overflow box 140, the lowest point of the conductive brush assembly 150 contacts the top surface of the object.

[0039] Specifically, the horizontal electroplating device 100 of the embodiment can include a main tank body 120, at least one overflow box 140, and at least one conductive brush assembly 150. The main tank body 120 contains electroplating liquid, and when a target object is transported to the main tank body 120, the target object floats on the electroplating liquid and the bottom surface is wetted by the electroplating liquid. Moreover, due to the presence of the overflow box 140, the electroplating liquid is constantly overflowing from the overflow box 140, and the liquid level of the electroplating liquid in the main tank body 120 is higher than the highest point of the overflow box 140, so that when the target object floats on the electroplating liquid, the target object is constantly transported in the direction of the overflow box 140 by the electroplating liquid and is transported to the overflow box 140. The conductive brush assembly 150 is arranged above the overflow box 140, and because the lowest point of the conductive brush assembly 150 is higher than the highest point of the overflow box 140, the conductive brush assembly 150 is always kept dry, avoiding the conductive brush assembly 150 from being wetted by the liquid and avoiding the conductive brush assembly 150 from being plated with a layer of metal during the electroplating process, thereby avoiding damage to the battery piece.

[0040] Specifically, the height difference between the liquid level of the electroplating liquid and the highest position of the overflow box 140 is not greater than 2 mm. Specifically, the liquid level of the electroplating liquid is higher than the highest position of the overflow box 140 because the electroplating liquid is relatively thick and has a large tension, so that the height of the electroplating liquid is higher than a certain value before overflow occurs. In this way, the battery piece can be smoothly transported from the electroplating liquid in the main tank body 120 to the overflow box 140.

[0041] Specifically, the target object of the embodiment can be a battery piece. The battery piece of the embodiment is in the form of floating on the electroplating liquid, and the lower surface of the battery piece is attached with the electroplating liquid. When the battery piece is transported to above the overflow box 140, the conductive brush assembly 150 is used to brush the upper surface of the battery piece to attach negative ions, and then under the action of the light-induced lamp, electrons are transferred to the lower surface of the battery piece, and the copper ions in the electroplating liquid move to the lower surface of the silicon piece to form electroplating. In this process, the conductive brush assembly 150 is above the overflow box 140 and has a height higher than the highest point of the overflow box 140, so the conductive brush assembly 150 is always dry and does not need to be removed, thereby avoiding the situation that the conductive brush assembly 150 becomes hard and damages the battery piece.

[0042] As a specific embodiment of the utility model, the overflow box 140 of the embodiment is internally provided with a flow guide structure 142 to discharge the electroplating liquid in the overflow box 140. Specifically, the flow guide structure 142 can be at least one flow guide pipe, and the electroplating liquid overflowing from the main tank body 120 to the overflow box 140 is discharged by the flow guide structure 142, so that there is almost no liquid in the overflow box 140, ensuring the dryness of the conductive brush assembly 150.

[0043] As a specific embodiment of the utility model, the horizontal electroplating equipment 100 of the embodiment can further include a liquid collecting groove 130, which is located below the main groove body 120 and is in communication with the overflow box 140. When the height of the liquid in the main groove body 120 is higher than the overflow box 140, the electroplating liquid in the main groove body 120 enters the overflow box 140 and flows into the liquid collecting groove 130 along the flow guide structure 142, so that the height of the electroplating liquid in the main groove body 120 is always not lower than the height of the top position of the overflow box 140.

[0044] Specifically, the horizontal electroplating equipment 100 of the embodiment can further include at least one transmission assembly 110, which (i.e., the second transmission assembly 113) can be located in the overflow box 140 to support the target object and drive the target object in the horizontal direction.

[0045] Specifically, the transmission assembly is located in the overflow box 140, and since there is no electroplating liquid in the overflow box 140, when the target object is transmitted to the overflow box 140, it must be gradually transmitted by transmission, so as to avoid that the target object cannot be transmitted forward.

[0046] Specifically, each overflow box 140 can include an upper box body 143 and a lower box body 144, wherein the upper box body 143 has an opening above. The lower box body 144 is in communication with the upper box body 143, and the lower box body 144 is provided with a mounting structure 146 outside, which sets the overflow box 140 at the main groove body 120. The overflow box 140 and the main groove body 120 can be connected to each other by adjusting screws to adjust the overall height of the overflow box 140 in the main groove body 120.

[0047] Specifically, the upper box body 143 is also provided with a support component 145 for supporting the transmission assembly located in the upper box body 143.

[0048] The structure and size of the upper box body 143 can match the structure and size of the transmission assembly 110 located in the upper box body 143. The upper box body 143 in the embodiment is formed as a cuboid structure with an opening. And the support component 145 is provided at the upper box body 143. The support component 145 is mainly a support plate, which is provided with a U-shaped groove, and the rotating roller 151 is rotatably arranged on the U-shaped groove of the support component 145.

[0049] Specifically, at least one overflow structure 141 is arranged around the opening of the box 143 to improve the overflow efficiency. Specifically, the overflow structure 141 can be an overflow groove. Specifically, the number of overflow grooves in the embodiment can be one or more. Preferably, the number of overflow grooves in the embodiment is multiple. The structure and size of the overflow groove can be designed according to the actual situation. Specifically, the size of the overflow groove is designed such that the liquid level of the electroplating solution cannot flow out of the overflow groove when it does not exceed the highest point of the overflow box 143, avoiding the liquid level of the electroplating solution from exceeding the highest point of the overflow box 140, thereby causing the battery piece to be unable to reach the overflow box 140 from the main groove body 120.

[0050] As a specific embodiment of the utility model, each conductive brush assembly 150 in the embodiment can include a fixed shaft 151 and a conductive brush 152. The fixed shaft 151 is arranged directly above the overflow box 140 and is fixed with the main groove body 120. The conductive brush 152 is arranged on the fixed shaft 151. The conductive brush 152 is detachably connected with the fixed shaft 151. The conductive brush 152 can be a titanium wire or other metal wire bundle.

[0051] As a specific embodiment of the utility model, the horizontal electroplating equipment 100 in the embodiment can further include at least one liquid roller assembly 111 located in the electroplating solution for applying a force to the electroplating solution to make the electroplating solution flow.

[0052] Specifically, the liquid roller assembly 111 in the embodiment is arranged in the electroplating solution, and when the number of liquid roller assemblies 111 is multiple, the rotation directions of the liquid roller assemblies 111 are in the same direction, so that the liquid roller assemblies 111 can ensure that the electroplating solution flows in the preset direction, thereby driving the target object floating on the surface of the electroplating solution to move in the preset direction.

[0053] Specifically, each liquid roller assembly 111 is provided with a thread 1111, and the directions of the threads 1111 on the adjacent two liquid roller assemblies 111 are opposite.

[0054] Specifically, the liquid roller assembly 111 in the embodiment is provided with a thread 1111, which disturbs the flow of the electroplating solution, and the directions of the threads 1111 on the adjacent two liquid roller assemblies 111 are opposite, so that the flow of the liquid in the axial direction of the liquid roller assembly 111 is offset, thereby making the liquid flow only in the direction of the target object.

[0055] As a specific embodiment of the utility model, each overflow box 140 further includes at least one light-induced assembly 160 in the flow direction of the electroplating solution, and the light-induced assembly 160 is arranged above the surface of the electroplating solution.

[0056] Specifically, the height of the light induction assembly 160 from the surface of the electroplating solution is about 50-100 mm. For example, the height of the light induction assembly 160 from the electroplating solution can be 50 mm, 60 mm, 80 mm, or 100 mm, etc. The specific distance can be designed according to the actual situation.

[0057] Specifically, the light induction assembly 160 of the embodiment can include a light source and a protective shell. The light source can emit light of a predetermined wavelength.

[0058] In one embodiment, the predetermined wavelength can be 300-500 nm. Specifically, the light source of this wavelength is green light. The role of the green light is to irradiate the copper sulfate solution with light of the appropriate waveband, thereby assisting in inducing the copper plating effect.

[0059] Specifically, the protective shell is sleeved outside the light source for fixing the light source. The protective shell can be a corrosion-resistant airtight protective shell. Preferably, the light induction device of the embodiment is regularly and uniformly distributed along the advancing direction of the battery piece. Specifically, the structure and working principle of the horizontal electroplating device 100 of the embodiment are as follows:

[0060] The horizontal electroplating device 100 of the embodiment can include a tank body, which can include a corrosion-resistant plastic frame structure 101, a main tank body 120, and a liquid collection tank 130. The corrosion-resistant plastic frame structure 101 is provided with an inlet 102 and an outlet 103 on both sides. The main tank body 120 is provided with an adjustable water baffle 121 on both sides. The adjustable water baffle 121 can be used to adjust the liquid level height of the electroplating solution in the main tank body 120.

[0061] The horizontal electroplating device 100 of the embodiment can include a transmission assembly 110, which can include a first transmission assembly 112 located outside the main tank body 120 and a second transmission assembly 113 located inside the overflow box 140. Specifically, the first transmission assembly 112 and the second transmission assembly 113 are substantially at the same horizontal plane and horizontally transmit the battery piece.

[0062] The transmission assembly 110 is driven by a servo motor to make horizontal linear motion through meshing gears. Specifically, it is divided into an outer main transmission and an inner slave transmission, and the outer main transmission is installed with a transmission sprocket and a bevel gear, and the inner slave transmission is composed of a transmission wheel piece assembly, a transmission roller, and a gear, and the inner and outer transmissions work together through gear meshing.

[0063] In the device, the first transmission assembly first transmits the target object to the main tank body 120. After the target object reaches the main tank body 120, it directly floats above the electroplating solution in the main tank body 120 and is wetted by the electroplating solution below.

[0064] A plurality of liquid carrying roller assemblies 111 and a plurality of overflow boxes 140 are arranged in the main tank body 120. Preferably, the plurality of liquid carrying roller assemblies 111 and the plurality of overflow boxes 140 are arranged alternately, and at least one second transmission assembly 113 is arranged in each overflow box 140.

[0065] When the target object floats on the electroplating liquid in the main tank body 120, the liquid carrying roller assemblies in the main tank body 120 rotate to push the electroplating liquid to flow, thereby making the target object constantly flow towards the rear overflow box 140 until the target object reaches above the overflow box 140, the target object is transmitted by the second transmission assembly in the overflow box 140, and if the electroplating liquid in the main tank body 120 is higher, the electroplating liquid will constantly flow into the liquid collecting tank 130 through the flow guide structure 142 of the overflow box 140.

[0066] An electrically conductive brush assembly 150 is arranged above the overflow box 140, and the electrically conductive brush assembly 150 is located above the overflow box 140. Due to the existence of the overflow box 140, there is almost no electroplating liquid at the overflow box 140, which ensures that the electrically conductive brush assembly 150 is dry. When the target object is transmitted at the overflow box 140, the electrically conductive brush assembly 150 contacts the upper surface of the target object to brush electrons to the upper surface of the target object.

[0067] A light induction assembly 160 is further arranged above the horizontal electroplating device 100, and the light induction assembly 160 is arranged at the main tank body 120 and above the electrically conductive brush assembly 150. The light induction assembly 160 functions to irradiate the copper sulfate liquid with light of a suitable wave band, thereby assisting in inducing the copper plating effect. The light induction assembly 160 is fixed to the middle part of the entire tank body (the inner side of the water baffle on both sides), and the electroplating liquid is about 50 mm (adjustable) above the light induction assembly 160. When working, the lower surface of the battery piece in the electroplating liquid tank in this area contacts the electroplating liquid, and the upper surface of the battery piece is dry. The light induction light source irradiates towards the electroplating liquid in the tank, and copper electroplating is achieved through photoelectric conversion assisted by light induction. The light induction light source is also regularly and uniformly distributed along the advancing direction of the battery piece.

[0068] When the target object needs to be electroplated, the transmission assembly 110 transmits the target object to the main tank body 120, the target object floats on the electroplating liquid, the liquid carrying roller assembly 111 constantly rotates to make the target object constantly advance towards the liquid flow direction, and reaches above the overflow box 140. The target object is transmitted by the second transmission assembly 113 at the overflow box 140. The electrically conductive brush assembly 150 above the overflow box 140 brushes electrons to the upper side of the target object. Due to the existence of the overflow box 140, the electrically conductive brush assembly 150 is always dry. Under the action of the light induction assembly 160, the electrons will be transferred to the opposite side of the target object, and when the target object is transmitted in the horizontal direction, enters the electroplating liquid, and gradually electroplated metal on the target object.

[0069] Up to now, the person skilled in the art should recognize that, although the multiple exemplary embodiments of the utility model have been shown and described in detail herein, many other variants or modifications conforming to the principles of the utility model can still be directly determined or deduced according to the content disclosed by the utility model without departing from the spirit and scope of the utility model. Therefore, the scope of the utility model should be understood and recognized as covering all these other variants or modifications.

Claims

1. A horizontal electroplating apparatus, characterized by, The horizontal electroplating device comprises: a main tank with electroplating solution inside, and when a target object is transferred to the position of the main tank, the target object floats on the surface of the electroplating solution, and the bottom of the target object is wetted by the electroplating solution; at least one overflow box, each of which is arranged in the main tank, and the highest position of the overflow box is not higher than the height of the surface of the electroplating solution in a flowing state, so as to control the height of the electroplating solution within a preset range and keep the surface of the electroplating solution smooth; and at least one conductive brush assembly arranged at the top of each overflow box, and the lowest position of each conductive brush assembly is higher than the highest position of the overflow box, so that when the target object is transferred to the top of the overflow box, the lowest position of the conductive brush assembly is in contact with the top surface of the target object.

2. The horizontal electroplating device according to claim 1, wherein a flow guide structure is arranged in the overflow box to discharge the electroplating solution inside the overflow box.

3. The horizontal electroplating device according to claim 2, further comprising a liquid collecting tank arranged below the main tank and in communication with the overflow box, and when the height of the liquid in the main tank is higher than that of the overflow box, the electroplating solution in the main tank enters the overflow box and flows into the liquid collecting tank along the flow guide structure, so that the height of the electroplating solution in the main tank is always not lower than the height of the top position of the overflow box.

4. The horizontal electroplating device according to claim 1, wherein the height difference between the surface of the electroplating solution and the highest position of the overflow box is not greater than 2 mm. Further comprising:

5. The horizontal electroplating apparatus of claim 1, wherein, at least one transmission assembly arranged in the overflow box to support the target object and transfer the target object in a horizontal direction.

6. The horizontal electroplating device according to claim 5, wherein each overflow box comprises: an upper box with an opening above; and a lower box in communication with the upper box, and a mounting structure is arranged outside the lower box to arrange the overflow box at the main tank.

7. The horizontal electroplating device according to claim 6, wherein a support component is further arranged at the upper box to support the transmission assembly arranged at the upper box.

8. The horizontal electroplating device according to claim 6, wherein at least one overflow structure is arranged around the opening to improve the overflow efficiency.

9. The horizontal electroplating device according to any one of claims 1-8, wherein each conductive brush assembly comprises: a fixed shaft arranged directly above the overflow box and fixed with the main tank; and a conductive brush arranged on the fixed shaft, and the conductive brush is detachably connected with the fixed shaft. Further comprising at least one liquid roller assembly arranged in the electroplating solution to apply a force to the electroplating solution to make the electroplating solution flow.

10. The horizontal electroplating apparatus according to any one of claims 1 to 8, characterized by, 11. The horizontal electroplating device according to any one of claims 1-8, wherein ​ Each overflow box further comprises at least one light-induced component arranged above the surface of the electroplating solution in the flow direction of the electroplating solution.

12. The horizontal electroplating apparatus of claim 11, wherein, Each light-induced component comprises: a light source emitting light of a preset wavelength; the preset wavelength is 300-500 nm; and a protective shell sleeved outside the light source for fixing the light source.

13. The horizontal electroplating apparatus of claim 11, wherein, The height of the light-induced component from the surface of the electroplating solution is 50-100 mm.

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