Thermocuring equipment for dispensing process

Abstract

The utility model relates to the technical field of bonding and curing, and discloses thermocuring equipment for a dispensing process, which comprises a mounting frame and a plurality of connecting frames, a plurality of first mounting pipes are fixedly connected to the mounting frame, and a first curing cover is fixedly connected to the bottom of each first mounting pipe. A mica plate glued with a mica column is placed on a first placing plate, then a first mounting pipe and a first curing cover are driven to move, then hot air is blown into the first curing cover, hot air curing is conducted on a dispensing position through hot air, and after curing is completed, the mica plate is placed on a second placing plate; and then hot air curing is conducted on the glue again through the second curing cover, so that sufficient hot air curing is conducted on the glue at the bonding position of the mica column and the mica plate, meanwhile, through cover type hot air curing, heat is more concentrated, the glue curing efficiency is greatly improved, meanwhile, energy loss is reduced, and the energy saving performance of the device is improved.

Description

Technical Field

[0001] This utility model relates to the field of adhesive curing technology, specifically to a thermosetting device for a dispensing process. Background Technology

[0002] Mica board is an insulating material made by bonding mica paper with silicone rubber, heating, and pressing. It contains approximately 90% mica and 10% silicone rubber. Mica board possesses excellent insulation properties and high-temperature resistance, with a fire resistance temperature reaching 500℃~750℃, and it maintains its performance even at high temperatures. Furthermore, mica board has low thermal conductivity, oil and corrosion resistance, and is environmentally friendly and non-toxic, making it a substitute for asbestos. In some mica board production processes, mica pillars need to be glued to the surface of the mica board. Currently, after the mica pillars are glued, the adhesive needs to be cured to produce the desired mica board.

[0003] Currently, when gluing mica columns, direct hot air curing is usually used, which results in significant heat loss, a longer curing time, and low curing efficiency. In addition, the flexibility of the adhesive bonding area during the fixing process can cause the mica columns to shift, making it impossible to correct their alignment during curing. This leads to the cured mica columns being prone to tilting, resulting in poor quality of the gluing mica sheets. Utility Model Content

[0004] The purpose of this invention is to provide a thermosetting device for dispensing processes, thereby addressing the shortcomings of the aforementioned background technology.

[0005] The objective of this utility model can be achieved through the following technical solutions:

[0006] A thermosetting device for a dispensing process includes a mounting frame and multiple connecting frames. Multiple first mounting tubes are fixedly connected to the mounting frame. A first curing cover is fixedly connected to the bottom of the first mounting tube, and a first connecting tube is fixedly connected to the outer surface of the first mounting tube.

[0007] The outer surface of the first curing cover is provided with a plurality of first vent holes. The first curing cover is provided with a functional cavity. A plurality of transmission rods are slidably connected in the functional cavity. One end of the transmission rod is fixedly connected to an alignment plate. The other end of the transmission rod is fixedly connected to a first transmission block. A spring connected to the first transmission block is fixedly sleeved on the outer surface of the transmission rod. A second transmission block is slidably connected to one side of the first transmission block. A connecting rod is fixedly connected to the top of the second transmission block. A transmission plate is fixedly connected to the top of the connecting rod.

[0008] A first placement plate is slidably connected inside the mounting frame, and a first electric telescopic rod is provided at the bottom of the mounting frame.

[0009] As a further embodiment of this utility model: the first transmission block and the second transmission block each have a chamfered edge on the opposite side.

[0010] As a further embodiment of this utility model: a second electric telescopic rod is fixedly connected to one side of the connecting frame, an installation plate is fixedly connected to the bottom end of the second electric telescopic rod, a plurality of second installation tubes are fixedly connected to the installation plate, a second curing cover is fixedly connected to the bottom of the second installation tube, a plurality of second connecting tubes are fixedly connected to the outer surface of the second installation tube, a plurality of second vent holes are opened on the outer surface of the second curing cover, and a second placement plate is provided below the second curing cover.

[0011] As a further embodiment of this utility model: the connecting frame is fixedly connected to the bracket on the outer side of the second placement plate.

[0012] As a further embodiment of this invention: the first connecting tube is connected to the output tube of the hot air blower.

[0013] As a further embodiment of this invention: the second connecting pipe is connected to the output pipe of the hot air blower.

[0014] The beneficial effects of this utility model are:

[0015] (1) By placing the mica plate with the adhesive mica column onto the first placement plate, and then moving the first installation tube and the first curing cover, hot air is blown into the first curing cover to cure the adhesive application. After curing, it is placed onto the second placement plate and then cured again with hot air through the second curing cover. This achieves full hot air curing of the adhesive at the joint between the mica column and the mica plate. At the same time, the hot air curing through the cover makes the heat more concentrated, greatly improving the curing efficiency of the adhesive and reducing energy loss, thus improving the energy efficiency of the device.

[0016] (2) At the same time, when the mica column is initially cured by the first curing cover, the transmission plate inside the first curing cover is moved, thereby driving multiple alignment plates inside the first curing cover to align the mica column with the center position of the bond, thereby achieving precise alignment of the bonded mica column and achieving precise bonding of the mica column, which greatly improves the bonding effect of the mica column. Attached Figure Description

[0017] The present invention will be further described below with reference to the accompanying drawings.

[0018] Figure 1 This is a perspective view of the external structure of this utility model;

[0019] Figure 2This is a front view of the external structure of the mounting bracket of this utility model;

[0020] Figure 3 This is a front view of the internal structure of the first curing cover of this utility model.

[0021] In the diagram: 1. Mounting bracket; 2. Connecting bracket; 3. First mounting tube; 4. First curing cover; 5. First connecting tube; 6. First vent hole; 7. Functional cavity; 8. Transmission rod; 9. Alignment plate; 10. First transmission block; 11. Spring; 12. Second transmission block; 13. Connecting rod; 14. Transmission plate; 15. First placement plate; 16. First electric telescopic rod; 17. Second electric telescopic rod; 18. Mounting plate; 19. Second mounting tube; 20. Second curing cover; 21. Second connecting tube; 22. Second vent hole; 23. Second placement plate. Detailed Implementation

[0022] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0023] Example 1

[0024] Please see Figure 1-Figure 3 As shown, this utility model is a thermosetting device for a dispensing process, including a mounting frame 1 and a connecting frame 2. Multiple first mounting tubes 3 are fixedly connected to the mounting frame 1. A first curing cover 4 is fixedly connected to the bottom of each first mounting tube 3. A first connecting tube 5 is fixedly connected to the outer surface of each first mounting tube 3 and is connected to the output pipe of a hot air blower. Multiple first vent holes 6 are provided on the outer surface of the first curing cover 4. A functional cavity 7 is provided on the first curing cover 4. Multiple transmission rods 8 are slidably connected within the functional cavity 7. One end of each transmission rod 8 is fixedly connected to... The alignment plate 9 and the other end of the transmission rod 8 are fixedly connected to the first transmission block 10. The outer surface of the transmission rod 8 is fixedly sleeved with a spring 11 connected to the first transmission block 10. The first transmission block 10 is slidably connected to one side of the first transmission block 10. The top of the second transmission block 12 is fixedly connected to the connecting rod 13. The top of the connecting rod 13 is fixedly connected to the transmission plate 14. The opposite sides of the first transmission block 10 and the second transmission block 12 are both beveled. The mounting frame 1 is slidably connected to the first placement plate 15. The bottom of the mounting frame 1 is provided with the first electric telescopic rod 16.

[0025] By placing a mica plate, which is glued to a mica column, onto a first placement plate 15, and then moving the first placement plate 15 upward via a first electric telescopic rod 16, the first placement plate 15 moves the mica plate upward, and the mica plate moves the mica column into the first curing chamber 4. At this time, the mica column presses against the transmission plate 14 inside the first curing chamber 4, moving the transmission plate 14 upward. The transmission plate 14 moves the connecting rod 13 upward, and the second transmission block 12 of the connecting rod 13 moves upward. The second transmission block 12 moves the transmission rod 8 and the alignment plate 9 into the first curing chamber 4, thereby causing the multiple alignment plates 9 inside the first curing chamber 4 to move towards the first curing chamber 4. The curing hood 4 is moved to the center position to align the mica pillars, thereby achieving precise alignment and bonding of the mica pillars and greatly improving the bonding effect. Then, hot air is blown into the first connecting pipe 5 through the first mounting pipe 3, and the hot air is blown into the first curing hood 4 to cure the adhesive bonded to the mica pillars inside the first curing hood 4. The hood-type hot air curing makes the heat more concentrated, greatly improving the curing efficiency of the adhesive and reducing energy loss, thus improving the energy efficiency of the device.

[0026] Example 2

[0027] Based on Example 1, please refer to Figure 1 As shown, a second electric telescopic rod 17 is fixedly connected to one side of the connecting frame 2. A mounting plate 18 is fixedly connected to the bottom end of the second electric telescopic rod 17. Multiple second mounting tubes 19 are fixedly connected to the mounting plate 18. A second curing cover 20 is fixedly connected to the bottom of the second mounting tubes 19. Multiple second connecting tubes 21 are fixedly connected to the outer surface of the second mounting tubes 19. The second connecting tubes 21 are connected to the output tube of the hot air blower. Multiple second vent holes 22 are opened on the outer surface of the second curing cover 20. A second placement plate 23 is provided below the second curing cover 20.

[0028] After initial curing on the first placement plate 15, the mica is then placed onto the second placement plate 23 by a robotic arm. Subsequently, the second electric telescopic rod 17 drives the mounting plate 18 and the second mounting tube 19 downwards. The second mounting tube 19 drives the second curing cover 20 downwards, and the second curing cover 20 is fitted into the mica pillars on the mica board. Then, a hot air blower supplies hot air to the second connecting tube 21, which in turn supplies hot air into the second mounting tube 19. The second mounting tube 19 then passes the hot air into the second curing cover 20 for drying and curing. Simultaneously, through the four-group design, the mica board after hot air curing is buffered and cured again, further improving the adhesive effect on the mica pillars on the mica board.

[0029] The working principle of this utility model is as follows: A mica plate, with mica pillars glued together, is placed onto a first placement plate 15. Then, a first electric telescopic rod 16 moves the first placement plate 15 upwards. The first placement plate 15 moves the mica plate upwards, and the mica plate moves the mica pillars into the first curing chamber 4. At this time, the mica pillars press against the transmission plate 14 inside the first curing chamber 4, causing the transmission plate 14 to move upwards. The transmission plate 14 then moves the connecting rod 13 upwards, and the second transmission block 12 of the connecting rod 13 moves upwards. The second transmission block 12 moves the transmission rod 8 and the alignment plate 9 into the first curing chamber 4, thereby allowing multiple [mica pillars] inside the first curing chamber 4 to move. The alignment plate 9 moves towards the center of the first curing cover 4, aligning the mica column at the center position, thereby achieving precise alignment and bonding of the mica column and greatly improving the bonding effect. Then, hot air is blown into the first connecting pipe 5 through the first mounting pipe 3, and the hot air is blown into the first curing cover 4 to cure the adhesive bonded to the mica column inside the first curing cover 4. The hot air curing through the cover makes the heat more concentrated, greatly improving the curing efficiency of the adhesive and reducing energy loss, thus improving the energy efficiency of the device.

[0030] The above description provides a detailed account of one embodiment of the present invention. However, this description is merely a preferred embodiment and should not be construed as limiting the scope of the present invention. All equivalent variations and improvements made within the scope of the claims of the present invention should still fall within the patent coverage of the present invention.

Claims

1. A thermosetting device for a dispensing process, characterized in that, It includes a mounting bracket (1) and multiple connecting brackets (2). Multiple first mounting tubes (3) are fixedly connected to the mounting bracket (1). A first curing cover (4) is fixedly connected to the bottom of the first mounting tube (3). A first connecting tube (5) is fixedly connected to the outer surface of the first mounting tube (3). The outer surface of the first curing cover (4) is provided with a plurality of first ventilation holes (6), and the first curing cover (4) is provided with a functional cavity (7). A plurality of transmission rods (8) are slidably connected in the functional cavity (7). One end of the transmission rod (8) is fixedly connected to an alignment plate (9), and the other end of the transmission rod (8) is fixedly connected to a first transmission block (10). The outer surface of the transmission rod (8) is fixedly sleeved with a spring (11) connected to the first transmission block (10). A second transmission block (12) is slidably connected to one side of the first transmission block (10). A connecting rod (13) is fixedly connected to the top of the second transmission block (12), and a transmission plate (14) is fixedly connected to the top of the connecting rod (13). The mounting frame (1) is slidably connected to a first placement plate (15), and the bottom of the mounting frame (1) is provided with a first electric telescopic rod (16).

2. The thermosetting equipment for a dispensing process according to claim 1, characterized in that, The first transmission block (10) and the second transmission block (12) are both chamfered on the opposite side.

3. The thermosetting equipment for a dispensing process according to claim 1, characterized in that, A second electric telescopic rod (17) is fixedly connected to one side of the connecting frame (2). A mounting plate (18) is fixedly connected to the bottom end of the second electric telescopic rod (17). A plurality of second mounting tubes (19) are fixedly connected to the mounting plate (18). A second curing cover (20) is fixedly connected to the bottom of the second mounting tube (19). A plurality of second connecting tubes (21) are fixedly connected to the outer surface of the second mounting tube (19). A plurality of second ventilation holes (22) are opened on the outer surface of the second curing cover (20). A second placement plate (23) is provided below the second curing cover (20).

4. The thermosetting equipment for a dispensing process according to claim 3, characterized in that, The connecting frame (2) is fixedly connected to the support on the outside of the second placement plate (23).

5. The thermosetting equipment for a dispensing process according to claim 1, characterized in that, The first connecting pipe (5) is connected to the output pipe of the hot air blower.

6. The thermosetting equipment for a dispensing process according to claim 3, characterized in that, The second connecting pipe (21) is connected to the output pipe of the hot air blower.

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