Laser welding equipment

By setting a double-sided laser heating mechanism on both ends of the FPC board, the problems of uneven welding and low efficiency are solved, achieving more uniform heating and faster heating speed, which is suitable for a variety of welding processes and materials.

CN223476580UActive Publication Date: 2025-10-28SHENZHEN RAYSEES TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202421689308.7
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-07-16
Publication Date
2025-10-28
Estimated Expiration
2034-07-16

AI Technical Summary

Technical Problem

In the FPC board soldering process, existing technologies suffer from problems such as small soldering area, uneven heating leading to local overheating and insufficient cooling of surrounding areas, resulting in FPC board cracking and solder paste splattering, as well as low soldering efficiency.

Method used

The double-sided laser heating mechanism uses a set of surface laser emission sources on each end face of the workpiece to heat the welding area on both sides. Combined with the design of light-transmitting holes and guide slopes, it ensures uniform distribution of laser energy. The laser power and temperature are adjusted by temperature control module and cooling module.

Benefits of technology

It achieves more uniform heating in the workpiece welding zone, increases the heating speed, reduces welding unevenness, and improves welding and production efficiency. It is suitable for a variety of welding processes and materials.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model belongs to the technical field of laser welding, and discloses laser welding equipment which comprises a support. The jig is arranged on the bracket and is used for supporting and fixing a workpiece to be welded; the laser heating mechanisms are arranged on the support, and the two sets of laser heating mechanisms are symmetrically located on the two sides of the jig correspondingly; each group of laser heating mechanism comprises a shell and a surface laser emission source facing a workpiece welding area, and the surface laser emission source is arranged in the shell; and the two surface laser emitting sources are opposite to each other, so that a workpiece welding area is subjected to double-sided heating. The laser heating device has the effects that heating is uniform, the heating speed is increased, and therefore the welding efficiency is improved, and the laser heating device is suitable for various welding processes related to laser heating.
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Description

Technical Field

[0001] This application relates to the technical field of laser welding, and more specifically, to a laser welding device. Background Technology

[0002] Flexible printed circuit (FPC), also known as flexible circuit board or flexographic circuit board, is favored for its excellent characteristics such as light weight, thinness, and free bending and folding. With the rapid development of the electronics industry, circuit board design is becoming more and more precise and high-density, and the quality requirements for FPC boards are also gradually increasing.

[0003] During the production of FPC boards, surface mount soldering is required. In this process, solder paste is typically applied to the surfaces to be soldered, and a concentrated point laser is used as a heat source to heat the surface of the FPC board with the solder paste, bringing it to the required solder joints to complete the surface mount soldering process. For large-area FPC boards, because the soldering area of ​​laser soldering is relatively small, heating only the surface of the FPC board with solder paste can lead to localized overheating and insufficient cooling of surrounding areas. This results in uneven heating of the FPC board and solder paste, causing cracking of the FPC board and solder paste splattering. Furthermore, the low heating rate of point laser heating affects soldering efficiency. Utility Model Content

[0004] This application provides a laser welding device that enables more uniform heating of the workpiece welding area and increases the heating rate, thereby improving welding efficiency.

[0005] The laser welding equipment provided in this application adopts the following technical solution:

[0006] A laser welding device, comprising:

[0007] support;

[0008] A fixture, disposed on the bracket, is used to support and fix the workpiece to be welded;

[0009] A laser heating mechanism is provided on the support, and two sets of the laser heating mechanism are provided and symmetrically arranged on both sides of the fixture; each set of the laser heating mechanism includes a housing and a surface laser emission source facing the welding area of ​​the workpiece, and the surface laser emission source is provided on the housing; the two surface laser emission sources face each other to heat the welding area of ​​the workpiece on both sides.

[0010] Optionally, the fixture is provided with a light-transmitting hole, the workpiece welding area is located within the area of ​​the light-transmitting hole, and the area of ​​the light-transmitting hole is larger than the area of ​​the workpiece welding area.

[0011] Optionally, the fixture includes a first heat insulation plate and a second heat insulation plate arranged parallel to each other, the workpiece is fixed between the first heat insulation plate and the second heat insulation plate, and the light-transmitting hole is configured as a through hole opened on the coaxial axis of the first heat insulation plate and the second heat insulation plate.

[0012] Optionally, a guide slope is provided on the edge of the hole wall closest to the laser heating mechanism, and the end of the guide slope near the workpiece welding area converges toward the workpiece welding area.

[0013] Optionally, the first and second insulation panels are made of polyetherketone, ceramic, or other insulation materials.

[0014] Optionally, it also includes a temperature control module for monitoring the temperature of the welding area, the temperature control module being disposed on the bracket and electrically connected to the surface laser emission source to adjust the laser power of the surface laser emission source.

[0015] Optionally, it also includes a spot adjustment mechanism, wherein two sets of the spot adjustment mechanism are provided, both sets of the spot adjustment mechanism are provided on the bracket, and the two sets of the spot adjustment mechanism are respectively provided on both sides of the fixture and located between the laser heating mechanism and the fixture.

[0016] Optionally, the spot adjustment mechanism includes multiple optical elements, the distance between adjacent optical elements is adjustable, and an optical path is formed between the multiple optical elements. The surface laser emission source irradiates the workpiece welding area along the optical path.

[0017] Optionally, the laser heating mechanism further includes a cooling module, the housing is provided with a coolant inlet and outlet, and the cooling module is connected to the coolant inlet and outlet to dissipate heat from the surface laser emission source.

[0018] Optionally, the laser heating mechanism further includes an inert gas module, the housing is provided with an inert gas inlet and outlet, and the inert gas module is connected to the inert gas inlet and outlet to maintain the surface laser emission source.

[0019] As can be seen from the above technical solutions, the embodiments of this application have the following advantages:

[0020] By setting surface laser emission sources on both ends of the workpiece, the welding area of ​​the workpiece is heated by surface laser on both sides. Surface laser heating has a larger energy distribution area than point laser heating. Secondly, heating the workpiece on both sides reduces the temperature difference between the two sides of the workpiece and reduces the occurrence of uneven heating. The combination of surface laser and double-sided heating achieves the effect of uniform heating and increases the heating speed, thereby improving welding efficiency. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the structure of a hidden support for a laser welding equipment disclosed in an embodiment of this application;

[0022] Figure 2 This is a front view of a hidden support for a laser welding equipment disclosed in an embodiment of this application;

[0023] Figure 3 This is a schematic diagram of the structure of a laser welding equipment highlighting fixture disclosed in an embodiment of this application;

[0024] Figure 4 This is a cross-sectional view of the structure of a laser welding equipment highlighting fixture disclosed in an embodiment of this application.

[0025] Explanation of reference numerals in the attached figures:

[0026] 1. Fixture; 11. Light-transmitting hole; 12. First heat insulation plate; 13. Second heat insulation plate; 14. Guide slope; 2. Laser heating mechanism; 21. Housing; 22. Surface laser emission source; 23. Coolant inlet and outlet; 24. Inert gas inlet and outlet; 3. Temperature control module; 4. Spot adjustment mechanism. Detailed Implementation

[0027] The present application will be further described in detail below with reference to the accompanying drawings.

[0028] This application provides a laser welding device that enables more uniform heating of the workpiece welding area and increases the heating rate, thereby improving welding efficiency.

[0029] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0030] The terms "first," "second," "third," "fourth," etc., used in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0031] For ease of understanding, the laser welding equipment in the embodiments of this application is described below. Please refer to [link / reference]. Figure 1 and Figure 2 This is one embodiment of the laser welding equipment in this application, including a support, a fixture 1, and a laser heating mechanism 2. Both the fixture 1 and the laser heating mechanism 2 are disposed on the support. The fixture 1 is used to support and fix the workpiece to be welded, and the laser heating mechanism 2 is used to emit laser light to provide energy for welding.

[0032] See Figure 2 Two sets of laser heating mechanisms 2 are symmetrically arranged on both sides of the fixture 1. These two sets of laser heating mechanisms 2 are used to laser heat the two end faces of the workpiece fixed to the fixture 1. Each set of laser heating mechanisms 2 includes a housing 21 and a surface laser emission source 22 facing the workpiece's welding area. The surface laser emission source 22 is located on the housing 21, and the two surface laser emission sources 22 face each other to heat the workpiece's welding area on both sides. By setting surface laser emission sources 22 on each end face of the workpiece, the welding area of ​​the workpiece is heated on both sides by surface laser. Surface laser heating has a larger energy distribution area than point laser heating. Furthermore, the double-sided heating of the workpiece reduces the temperature difference between the two sides, reducing uneven heating and preventing uneven heating of the FPC board and solder paste, which can lead to FPC board cracking and solder paste splattering. The combination of surface laser and double-sided heating achieves uniform heating and increases the heating speed, thereby improving welding efficiency. Compared with traditional reflow soldering equipment that heats the entire workpiece, this application only heats the area to be welded, greatly saving energy and space and improving production efficiency.

[0033] Laser welding is an advanced non-contact welding technology. The laser welding equipment described in this application is suitable not only for reflow soldering but also for CO2 laser welding, YAG (neodymium glass) laser welding, UV (ultraviolet) laser welding, laser brazing, laser spot welding, laser hybrid welding, and micro-plasma welding (MBPW). Depending on the material of the workpiece to be welded, a corresponding medium or suitable surface laser emission source is selected. The laser beam generated by the surface laser emission sources on both sides heats the material on both sides, ensuring uniform heating while accelerating the heating rate, thus melting and bonding the material to achieve welding. This welding method is suitable not only for welding FPC circuit boards and PCB circuit boards but also for welding composite material structures.

[0034] See also Figure 1 To control and protect the temperature and safety of the surface laser emission source 22 during high-energy laser processing, the laser heating mechanism 2 also includes a cooling module and an inert gas module. The housing 21 is provided with a coolant inlet / outlet 23 and an inert gas inlet / outlet 24. The cooling module is connected to the coolant inlet / outlet 23 to dissipate heat from the surface laser emission source 22, and the inert gas module is connected to the inert gas inlet / outlet 24 to maintain the surface laser emission source 22.

[0035] When a laser cuts or melts a material, it generates a lot of heat. The cooling module removes this heat through a circulation system. The coolant in the cooling module absorbs the heat generated by the laser, preventing the laser source 22 from overheating and keeping the temperature of the laser head within an acceptable range. This extends the life of the equipment, prevents structural damage caused by overheating, and ensures processing accuracy.

[0036] Inert gases such as nitrogen and helium in inert gas modules are typically used as protective gases in laser processing. When lasers cut or weld metals, these gases create an insulating layer (called plasma) that prevents oxygen in the air from oxidizing the material surface, reducing oxidation, slowing down laser decay, and improving processing quality. Furthermore, inert gases also prevent the laser from directly irradiating other areas, protecting operators and equipment from unnecessary light radiation damage.

[0037] See also Figure 3 and Figure 4The fixture 1 is square and has a light-transmitting hole 11. The workpiece welding area is located within the area of ​​the light-transmitting hole 11, and the area of ​​the light-transmitting hole 11 is larger than the area of ​​the workpiece welding area. The laser emitted by the surface laser source 22 directly irradiates the workpiece welding area through the light-transmitting hole 11, allowing the laser to directly reach the target area to be heated and reducing heat loss. In this embodiment, the fixture 1 includes a first heat insulation plate 12 and a second heat insulation plate 13 arranged parallel to each other. The workpiece is fixed between the first heat insulation plate 12 and the second heat insulation plate 13. The light-transmitting hole 11 is configured as a through hole opened coaxially on the first heat insulation plate 12 and the second heat insulation plate 13. The two coaxial through holes are combined to form the light-transmitting hole 11 to achieve double-sided heating of the workpiece welding area. The first heat insulation plate 12 and the second heat insulation plate 13 are made of polyetherketone, ceramic, or other heat-insulating materials to ensure that the laser irradiates the welding area through the light-transmitting hole 11 and prevent stray light from affecting the parts of the workpiece other than the welding area.

[0038] Furthermore, a guide slope 14 is provided on the edge of the hole wall near the laser heating mechanism 2. The end of the guide slope 14 near the workpiece welding area converges towards the workpiece welding area. Through the guide slope 14, the thickness of the light-transmitting hole 11 gradually decreases towards the center of the light-transmitting hole, which can control the heat diffusion along the flow direction of the guide slope 14. On the other hand, the design of the guide slope 14 makes the beam propagate along the preset direction, ensuring the efficient transfer of laser energy and avoiding unnecessary scattering or deviation from the target path. At the same time, the guide slope 14 helps to maintain the stability of the laser focus and improve the accuracy and consistency of the heating process.

[0039] In some other embodiments, the workpiece to be welded is held by a fixture 1, the workpiece welding area does not contact the fixture 1, and the workpiece welding area is located between two sets of laser heating mechanisms 2 so that the two sets of laser heating mechanisms 2 can heat the workpiece welding area on both sides.

[0040] See also Figure 1 and Figure 2 To meet the welding requirements at different temperatures, the circuit board laser welding equipment also includes a temperature control module 3 for monitoring the temperature of the welding area. The temperature control module 3 is mounted on a support and electrically connected to the surface laser emitter 22 to adjust the laser power of the surface laser emitter 22. By monitoring the temperature of the welding area through the temperature control module 3 and adjusting the laser power in real time based on the temperature data, the laser power can be quickly and freely adjusted to adapt to welding requirements at different temperatures, preventing adverse effects of excessively high or low temperatures on the welding process.

[0041] The circuit board laser welding equipment also includes a spot adjustment mechanism 4. This mechanism optimizes the laser output from the surface laser source 22 to obtain a spot size and power more suitable for the workpiece welding area. Two sets of spot adjustment mechanisms 4 are provided, each mounted on a support frame, positioned on either side of the fixture 1, between the laser heating mechanism 2 and the fixture 1. Specifically, the spot adjustment mechanism 4 includes multiple optical elements. The distance between adjacent optical elements is adjustable, forming an optical path. The surface laser source 22 illuminates the workpiece welding area along this optical path. These optical elements are one or more of prisms, lenses, or mirrors. The spot adjustment mechanism 4 uses these optical elements to adjust the focal length of the laser beam to create a focused spot and shape, ensuring the spot size and shape meet different workpiece sizes or welding requirements.

[0042] The implementation principle of a laser welding device according to an embodiment of this application is as follows: by setting a set of laser heating mechanisms 2 on each of the two ends of the workpiece, the two sets of laser heating mechanisms 2 are set corresponding to the welding area of ​​the workpiece. The welding area of ​​the workpiece is heated by a surface laser emission source 22 facing the welding area of ​​the workpiece, which reduces the temperature difference between the two sides of the workpiece, reduces the occurrence of uneven heating on both sides of the workpiece, and at the same time, the energy distribution area of ​​surface laser heating is larger, the heating of the welding area of ​​the workpiece is more uniform, and the heating speed of the welding area of ​​the workpiece is increased, thereby improving the welding efficiency.

[0043] As described above, the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that the technical solutions described in the above embodiments can still be modified, or some of the technical features thereof can be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A laser welding device, characterized in that, include: support; A fixture (1) is provided on the bracket for supporting and fixing the workpiece to be welded; A laser heating mechanism (2) is provided on the bracket. Two sets of laser heating mechanisms (2) are provided and are symmetrically arranged on both sides of the fixture (1). Each set of laser heating mechanisms (2) includes a housing (21) and a surface laser emission source (22) facing the workpiece welding area. The surface laser emission source (22) is provided on the housing (21). The two surface laser emission sources (22) are opposite each other to heat the workpiece welding area on both sides.

2. The laser welding equipment according to claim 1, characterized in that, The fixture (1) is provided with a light-transmitting hole (11), the workpiece welding area is located in the area of ​​the light-transmitting hole (11), and the area of ​​the light-transmitting hole (11) is larger than the area of ​​the workpiece welding area.

3. The laser welding equipment according to claim 2, characterized in that, The fixture (1) includes a first heat insulation plate (12) and a second heat insulation plate (13) arranged in parallel with each other. The workpiece is fixed between the first heat insulation plate (12) and the second heat insulation plate (13). The light-transmitting hole (11) is configured as a through hole opened on the coaxial axis of the first heat insulation plate (12) and the second heat insulation plate (13).

4. The laser welding equipment according to claim 3, characterized in that, The light-transmitting hole (11) is provided with a guide slope (14) at the edge of the hole wall closest to the laser heating mechanism (2), and the end of the guide slope (14) near the workpiece welding area converges toward the workpiece welding area.

5. The laser welding equipment according to claim 1, characterized in that, It also includes a temperature control module (3) for monitoring the temperature of the welding area. The temperature control module (3) is disposed on the bracket and is electrically connected to the surface laser emission source (22) to adjust the laser power of the surface laser emission source (22).

6. The laser welding equipment according to claim 1, characterized in that, It also includes a spot adjustment mechanism (4), which is provided in two sets. Both sets of the spot adjustment mechanism (4) are provided on the bracket. The two sets of the spot adjustment mechanism (4) are respectively provided on both sides of the fixture (1) and located between the laser heating mechanism (2) and the fixture (1).

7. The laser welding equipment according to claim 6, characterized in that, The light spot adjustment mechanism (4) includes multiple optical elements, the distance between adjacent optical elements is adjustable, and an optical path is formed between the multiple optical elements. The surface laser emission source (22) irradiates the workpiece welding area along the optical path.

8. The laser welding equipment according to claim 1, characterized in that, The laser heating mechanism (2) also includes a cooling module. The housing (21) is provided with a coolant inlet and outlet (23). The cooling module is connected to the coolant inlet and outlet (23) to dissipate heat from the surface laser emission source (22).

9. A laser welding device according to claim 1 or 8, characterized in that, The laser heating mechanism (2) also includes an inert gas module. The housing (21) is provided with an inert gas inlet and outlet (24). The inert gas module is connected to the inert gas inlet and outlet (24) to maintain the surface laser emission source (22).