Surface microstructure layer removing device

Abstract

The utility model relates to the technical field of surface microstructure layer removal, and particularly discloses a surface microstructure layer removal device which comprises a handheld roller and a bearing table, the bearing table is horizontally arranged, the handheld roller comprises a roller, a supporting frame and a handle, the roller is rotationally installed in the supporting frame, and the handle is fixedly connected to the supporting frame; the roller comprises an abrasive particle roller and a viscous roller, the abrasive particle roller comprises an abrasive particle layer used for damaging a microstructure layer on the surface of a sample, and the viscous roller comprises an adhesive layer used for adhering abrasive dust falling off from the sample. According to the surface microstructure layer removing device, the etching time needed when the surface microstructure layer of the sample is removed can be shortened, meanwhile, the risk that the non-surface microstructure layer is damaged is reduced, the removing effect of the surface microstructure layer of the sample is good, and the water vapor residual quantity of the sample is reduced to 0.

Description

Technical Field

[0001] This application relates to the technical field of surface microstructure layer removal, and in particular to a surface microstructure layer removal device. Background Technology

[0002] In the semiconductor wafer or PBC packaging process, when large-area problems or high aspect ratio structure problems occur during the manufacturing process, it is often necessary to remove the surface microstructure layers of the substrate before processing, including epitaxial layers, thick photoresist curing layers, metal films, dielectric films, organic coatings, etc.

[0003] In related technologies, methods for removing surface microstructure layers include chemical solution etching, laser etching, or plasma dry etching. However, if the surface microstructure layer is thick or has a large area, the removal time is longer; furthermore, if the surface microstructure layer has a specific passivation or oxide layer, it may also make the etching time longer, or the etching result poor, and may even damage the surface of the underlying substrate. Utility Model Content

[0004] To address the aforementioned issues, this application provides a surface microstructure layer removal device that can shorten the etching time required for removing the surface microstructure layer from a sample and reduce the risk of damage to non-surface microstructure layers.

[0005] This application provides a surface microstructure layer removal device, which adopts the following technical solution:

[0006] A surface microstructure layer removal device includes a handheld roller and a support platform. The support platform is horizontally arranged. The handheld roller includes a roller, a support frame, and a handle. The roller is rotatably mounted in the support frame, and the handle is fixedly connected to the support frame. The roller includes an abrasive roller and an adhesive roller. The abrasive roller includes an abrasive layer for destroying the microstructure layer on the sample surface, and the adhesive roller includes an adhesive layer for adhering abrasive debris detached from the sample.

[0007] By employing the above technical solution, the sample is placed on a support platform. First, an abrasive roller is used, placed against the sample surface. The handle is moved horizontally to move the support frame, which in turn drives the abrasive roller to rotate, causing it to roll back and forth once against the sample surface, thus destroying the microstructure layer on the sample surface. Then, an adhesive roller is used, placed against the sample surface. The handle is moved horizontally to move the support frame, which in turn drives the adhesive roller to rotate, causing it to roll back and forth once against the sample surface, thus adhering to the detached abrasive debris. The sample after these two treatments is then chemically etched to remove the remaining surface microstructure layer. After cleaning and hot air drying, a sample with the surface microstructure layer removed is obtained. Because the structure of the sample surface microstructure layer is destroyed after the two treatments, the specific surface area of ​​the surface microstructure layer increases, and the adhesion effect of the surface microstructure layer also deteriorates. Therefore, the etching time is shortened, and the risk of damage to non-surface microstructure layers is reduced, resulting in a good removal effect of the sample surface microstructure layer.

[0008] Optionally, the support frame includes a first connecting plate, a second connecting plate, and a connecting base plate. The first connecting plate is vertically fixed to one end of the connecting base plate, and the second connecting plate is vertically fixed to the other end of the connecting base plate. The first connecting plate and the second connecting plate are located on the same side of the connecting base plate. The abrasive roller and the adhesive roller are rotatably installed between the first connecting plate and the second connecting plate, respectively. The handle is fixedly connected to the end of the connecting base plate opposite to the first connecting plate.

[0009] By adopting the above technical solution, the roller is rotatably installed in the support frame, and the abrasive roller and the viscous roller can rotate around the axis on the support frame.

[0010] Optionally, the first connecting plate, the second connecting plate, and the connecting base plate are integrally formed, and the abrasive roller and the adhesive roller are detachably installed between the first connecting plate and the second connecting plate.

[0011] By adopting the above technical solution, the first connecting plate, the second connecting plate, and the connecting base plate are integrally formed, and the abrasive roller and the adhesive roller can be detachably installed between the first connecting plate and the second connecting plate. The structure is simple and easy to manufacture.

[0012] Optionally, the first connecting plate has a first mounting hole at the end away from the connecting base plate, and the second connecting plate has a second mounting hole at the end away from the connecting base plate. The first mounting hole and the second mounting hole are coaxially arranged. The abrasive roller and the adhesive roller have protrusions at both ends, and the protrusions are respectively engaged in the first mounting hole and the second mounting hole.

[0013] By adopting the above technical solution, the support frame and the abrasive roller or adhesive roller are snapped together between the first connecting plate and the second connecting plate. The structure is simple and facilitates the disassembly and installation of the abrasive roller and the adhesive roller.

[0014] Optionally, the abrasive layer is located on the outside of the abrasive roller, and the abrasive layer consists of abrasive grains evenly distributed along the circumference of the abrasive roller, wherein the abrasive grains in the abrasive layer have a triangular conical structure.

[0015] By adopting the above technical solution, the triangular cone structure has a stable structure, can withstand greater pressure and weight, is not easily deformed, and can stably act on the surface microstructure layer of the sample.

[0016] Optionally, the support platform is a plate-shaped structure, with a sample carrying groove on one side. A vacuum adsorption hole is formed at the center of the bottom of the sample carrying groove, and the axis of the vacuum adsorption hole is perpendicular to the support platform. A vacuum connector for connecting a vacuum generator is fixedly installed at the end of the vacuum adsorption hole away from the sample carrying groove.

[0017] By adopting the above technical solution, a vacuum adsorption hole is opened in the support stage, and a vacuum connector is fixedly installed in the vacuum adsorption hole. The vacuum connector is connected to a vacuum generator. When the vacuum generator is turned on, a negative pressure environment is formed in the vacuum connector, which can fix the sample in the sample support groove without damaging the sample and prevent the sample from shifting during the removal of the surface microstructure layer.

[0018] Optionally, the diameter of the vacuum adsorption pore is 5 mm.

[0019] By adopting the above technical solution, the diameter of the vacuum adsorption pore is 5mm, which can be used for the removal of relatively precise microstructure layers on the sample surface.

[0020] Optionally, the width of the sample-bearing groove is the same as the width of the abrasive roller, and the width of the sample-bearing groove is the same as the width of the adhesive roller.

[0021] By adopting the above technical solution, the outer sides of the abrasive roller and the viscous roller can fully contact the sample during each rolling, thus improving the efficiency of the operation.

[0022] Optionally, the surface microstructure layer includes at least an epitaxial layer, a thick photoresist curing layer, a metal thin film, a dielectric thin film, and an organic coating.

[0023] In summary, this application includes at least one of the following beneficial technical effects:

[0024] 1. The abrasive layer on the abrasive roller compresses the surface microstructure layer of the sample, thereby destroying its structure. The adhesive layer on the sticky roller then adheres to the detached abrasive debris. After these two treatments, the surface microstructure layer of the sample is damaged, its specific surface area increases, and its adhesion becomes worse. During subsequent etching, the removal time of the surface microstructure layer of a single sample can be reduced by 70%, while also reducing the risk of damage to non-surface microstructure layers. The removal effect of the sample surface microstructure layer is excellent, and the residual moisture content of the sample is reduced to zero.

[0025] 2. By opening a vacuum adsorption hole in the support stage, a vacuum connector is fixedly installed in the vacuum adsorption hole. The vacuum connector is connected to a vacuum generator. When the vacuum generator is turned on, a negative pressure environment is formed in the vacuum connector, which can fix the sample in the sample support groove without damaging the sample and prevent the sample from shifting during the removal of the surface microstructure layer.

[0026] 3. The roller and support frame are detachably installed between the first connecting plate and the second connecting plate by snap-fit ​​connection. The structure is simple and facilitates the disassembly and installation of the roller. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the overall structure of the handheld roller and the support platform, wherein the roller in the handheld roller is an abrasive roller;

[0028] Figure 2 This is a schematic diagram of the overall structure of the handheld roller and the support platform, wherein the roller in the handheld roller is an adhesive roller;

[0029] Figure 3 This is a schematic diagram of the structure of the abrasive roller and its support frame;

[0030] Figure 4 This is a structural diagram of the viscous roller and its support frame;

[0031] Figure 5 This is a schematic diagram of the bottom structure of the support platform.

[0032] Reference numerals: 1. Handheld roller; 11. Support frame; 111. First connecting plate; 112. Second connecting plate; 113. Connecting base plate; 114. First mounting hole; 115. Second mounting hole; 12. Handle; 13. Abrasive roller; 131. Abrasive layer; 14. Adhesive roller; 141. Adhesive layer; 15. Protrusion; 2. Support platform; 21. Sample support groove; 22. Vacuum adsorption hole; 3. Vacuum connector; 31. Connecting pipe; 32. Flange. Detailed Implementation

[0033] The following is combined with Figure 1-4 This application is described in further detail.

[0034] This application discloses a surface microstructure layer removal device, referring to... Figure 1 and Figure 2 It includes a handheld roller 1 and a support platform 2. The support platform 2 is horizontally set and is used for placing samples. The handheld roller 1 acts on the sample on the support platform 2. The handheld roller 1 includes a support frame 11, a roller and a handle 12. The roller is rotatably installed in the support frame 11. The handle 12 is fixedly connected to the end of the support frame 11 away from the roller.

[0035] The rollers include an abrasive roller 13 and an adhesive roller 14. The abrasive roller 13 includes an abrasive layer 131, which is used to destroy the surface microstructure layer of the sample, such as an epitaxial layer, a thick photoresist curing layer, a metal film, a dielectric film, and an organic coating. The adhesive roller 14 includes an adhesive layer 141, which is used to adhere the abrasive debris that falls off the sample. The appropriate roller is selected according to the actual application.

[0036] In operation, the sample is placed on the support stage 2. First, the abrasive roller 13 is used, placed against the sample surface. The handle 12 is moved to move the support frame 11 horizontally, causing the abrasive roller 13 to rotate and roll back and forth against the sample surface once, thus destroying the microstructure layer on the sample surface. Next, the adhesive roller 14 is used, placed against the sample surface. The handle 12 is moved to move the support frame 11 horizontally, causing the adhesive roller 14 to rotate and roll back and forth against the sample surface once, thus adhering the detached abrasive debris to the sample. The sample after the two treatments is then chemically etched to remove the remaining surface microstructure layer. After cleaning and hot air drying, a sample with the surface microstructure layer removed is obtained. Because the structure of the sample surface microstructure layer is destroyed after the two treatments, the specific surface area increases, and the adhesion effect of the surface microstructure layer also deteriorates. Therefore, the etching time is shortened, and the risk of damage to non-surface microstructure layers is reduced, resulting in a good removal effect of the surface microstructure layer.

[0037] Specifically, refer to Figure 3 and Figure 4 The support frame 11 includes a first connecting plate 111, a second connecting plate 112, and a connecting base plate 113. The first connecting plate 111 is vertically fixed to one end of the connecting base plate 113, and the second connecting plate 112 is vertically fixed to the other end of the connecting base plate 113. The first connecting plate 111 and the second connecting plate 112 are both located on the same side of the connecting base plate 113. In this embodiment, the first connecting plate 111, the second connecting plate 112, and the connecting base plate 113 are integrally formed.

[0038] A threaded hole is provided in the center of the side of the connecting base plate 113 opposite to the first connecting plate 111 and the second connecting plate 112, and an external thread is provided at one end of the handle 12. The connecting base plate 113 and the handle 12 are threaded together.

[0039] The first connecting plate 111 has a first mounting hole 114 at one end away from the connecting base plate 113, and the second connecting plate 112 has a second mounting hole 115 at one end away from the connecting base plate 113. The first mounting hole 114 and the second mounting hole 115 are coaxially arranged. The abrasive roller 13 and the adhesive roller 14 have protrusions 15 at both ends, which are respectively engaged in the first mounting hole 114 and the second mounting hole 115 to install the abrasive roller 13 or the adhesive roller 14 between the first connecting plate 111 and the second connecting plate 112.

[0040] Furthermore, the support frame 11 is flexible, allowing the protrusions 15 at both ends of the abrasive roller 13 or the adhesive roller 14 to be removed from the first mounting hole 114 and the second mounting hole 115 respectively, thus separating the abrasive roller 13 or the adhesive roller 14 from the support frame 11. Then, the protrusions 15 at both ends of another abrasive roller 13 or the adhesive roller 14 can be engaged in the first mounting hole 114 and the second mounting hole 115 respectively, thereby enabling the replacement of the abrasive roller 13 and the adhesive roller 14.

[0041] The abrasive layer 131 is located on the outer periphery of the abrasive roller 13. The abrasive layer 131 consists of abrasive grains evenly distributed along the periphery of the abrasive roller 13, and the abrasive grains have a triangular cone structure. In use, the apex of the triangular cone of the abrasive grain is pressed against the surface microstructure layer of the sample. The apex of the abrasive grain compresses the surface microstructure layer, causing damage to the structure of the surface microstructure layer, but without affecting the non-surface microstructure layer.

[0042] The adhesive layer 141 is located on the outer periphery of the adhesive roller 14, and the adhesive layer 141 does not easily leave adhesive residue during use. When in use, the adhesive layer is applied to the damaged surface microstructure layer of the sample. The adhesive layer is sticky and can adhere to the abrasion debris that falls off the sample.

[0043] Reference Figure 1 and Figure 5 The support platform 2 is a rectangular plate structure. A rectangular sample carrying groove 21 is provided on one side of the support platform 2. A vacuum adsorption hole 22 is provided at the center of the bottom of the sample carrying groove 21. The axis of the vacuum adsorption hole 22 is set perpendicular to the support platform 2. A vacuum connector 3 is fixedly installed at the end of the vacuum adsorption hole 22 away from the sample carrying groove 21. The vacuum connector 3 is used to connect to a vacuum generator to generate a negative pressure environment, which can fix the sample in the sample carrying groove 21 without damaging the sample.

[0044] The vacuum connector 3 includes a connecting pipe 31 and a flange 32. The flange 32 is fixed to the periphery of one end of the connecting pipe 31 and is used to connect to the vacuum generator. The periphery of the end of the connecting pipe 31 away from the flange 32 is provided with external threads, and the inner wall of the vacuum adsorption hole 22 is provided with internal threads, and the two are threaded together. In this embodiment, the diameter of the vacuum adsorption hole 22 is 5mm.

[0045] In use, place the end of the sample away from the surface microstructure layer in the sample support groove 21, and completely cover the vacuum adsorption hole 22 with the sample. Turn on the vacuum generator, and a negative pressure environment is formed in the vacuum connector 3, so that the sample is stably adsorbed on the sample support groove 21, preventing the sample from shifting during the removal of the surface microstructure layer. First, the abrasive roller 13 is mounted on the support, with the apex of the abrasive grains on the roller 13 abutting against the sample surface. The handle 12 is moved to move the support frame 11 horizontally, thereby rotating the abrasive roller 13. This causes the abrasive layer 131 of the roller 13 to roll back and forth once against the sample surface, thus destroying the microstructure layer on the sample surface. The abrasive roller 13 is then removed and replaced with an adhesive roller 14. The adhesive layer 141 of the adhesive roller 14 is abutted against the sample surface. The handle 12 is moved to move the support frame 11 horizontally, thereby rotating the adhesive roller 14. This causes the adhesive layer 141 of the adhesive roller 14 to roll back and forth once against the sample surface, thus adhering the detached abrasive debris to the sample. The vacuum generator is then turned off, and the sample, after two treatments, is subjected to chemical etching to remove the remaining surface microstructure layer. The sample is then cleaned and dried with hot air to obtain a sample with the surface microstructure layer removed.

[0046] Preferably, the width of the sample-bearing groove 21 is the same as the width of the abrasive roller 13 and the adhesive roller 14, so that the outer side of the abrasive roller 13 or the adhesive roller 14 can fully contact the sample each time it rolls, thereby improving the efficiency of the operation.

[0047] The implementation principle of the surface microstructure layer removal device disclosed in this application is as follows: the surface microstructure layer of the sample is squeezed by the abrasive layer 131 on the abrasive roller 13, thereby destroying the structure of the surface microstructure layer; the abrasive debris detached from the sample is adhered by the adhesive layer 141 of the adhesive roller 14; after the sample is processed twice, the surface microstructure layer structure of the sample is destroyed, which increases the specific surface area of ​​the surface microstructure layer and the adhesion effect of the surface microstructure layer also deteriorates. During subsequent etching, the surface microstructure layer removal time of a single sample can be reduced by 70%, while reducing the risk of damage to non-surface microstructure layers. The surface microstructure layer removal effect of the sample is good, and the water vapor residue of the sample is reduced to 0.

[0048] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A surface microstructure layer removal device, characterized in that, The device includes a handheld roller (1) and a support platform (2). The support platform (2) is horizontally positioned. The handheld roller (1) includes a roller, a support frame (11), and a handle (12). The roller is rotatably mounted in the support frame (11), and the handle (12) is fixedly connected to the support frame (11). The roller includes an abrasive roller (13) and an adhesive roller (14). The abrasive roller (13) includes an abrasive layer (131) for destroying the microstructure layer on the sample surface, and the adhesive roller (14) includes an adhesive layer (141) for adhering the abrasive debris that falls off the sample.

2. The surface microstructure layer removal device according to claim 1, characterized in that, The support frame (11) includes a first connecting plate (111), a second connecting plate (112), and a connecting base plate (113). The first connecting plate (111) is vertically fixed to one end of the connecting base plate (113), and the second connecting plate (112) is vertically fixed to the other end of the connecting base plate (113). The first connecting plate (111) and the second connecting plate (112) are located on the same side of the connecting base plate (113). The abrasive roller (13) and the adhesive roller (14) are rotatably installed between the first connecting plate (111) and the second connecting plate (112), respectively. The handle (12) is fixedly connected to the end of the connecting base plate (113) away from the first connecting plate (111).

3. The surface microstructure layer removal device according to claim 2, characterized in that, The first connecting plate (111), the second connecting plate (112), and the connecting base plate (113) are integrally formed, and the abrasive roller (13) and the adhesive roller (14) are detachably installed between the first connecting plate (111) and the second connecting plate (112).

4. The surface microstructure layer removal device according to claim 3, characterized in that, The first connecting plate (111) has a first mounting hole (114) at one end away from the connecting base plate (113), and the second connecting plate (112) has a second mounting hole (115) at one end away from the connecting base plate (113). The first mounting hole (114) and the second mounting hole (115) are coaxially arranged. The abrasive roller (13) and the adhesive roller (14) have protrusions (15) at both ends, and the protrusions (15) are respectively engaged in the first mounting hole (114) and the second mounting hole (115).

5. The surface microstructure layer removal device according to claim 1, characterized in that, The abrasive layer (131) is located on the outside of the abrasive roller (13). The abrasive layer (131) consists of abrasive grains evenly distributed along the circumference of the abrasive roller (13). The abrasive grains of the abrasive layer (131) have a triangular cone structure.

6. The surface microstructure layer removal device according to claim 1, characterized in that, The support platform (2) is a plate-shaped structure. A sample carrying groove (21) is provided on one side of the support platform (2). A vacuum adsorption hole (22) is provided at the center of the bottom of the sample carrying groove (21). The axis of the vacuum adsorption hole (22) is set perpendicular to the support platform (2). A vacuum connector (3) for connecting a vacuum generator is fixedly installed at the end of the vacuum adsorption hole (22) away from the sample carrying groove (21).

7. The surface microstructure layer removal device according to claim 6, characterized in that, The diameter of the vacuum adsorption hole (22) is 5 mm.

8. The surface microstructure layer removal device according to claim 6, characterized in that, The width of the sample bearing groove (21) is the same as the width of the abrasive roller (13), and the width of the sample bearing groove (21) is the same as the width of the adhesive roller (14).

9. The surface microstructure layer removal device according to claim 1, characterized in that, The surface microstructure layer includes at least an epitaxial layer, a thick photoresist curing layer, a metal thin film, a dielectric thin film, and an organic coating.

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