Silicon rod assembly

Abstract

The utility model discloses a silicon rod assembly, which comprises a plurality of silicon square rods, the plurality of silicon square rods are arranged along the thickness direction of the silicon square rods, a bonding piece is arranged between two adjacent silicon square rods, the bonding piece comprises a plurality of first bonding sections, and a plurality of second bonding sections are arranged between the plurality of first bonding sections. The multiple first bonding sections are arranged at intervals in the length direction or the width direction of the silicon square rod. According to the silicon rod assembly, the cutting efficiency of the cutting wire net is improved, and the utilization rate of the silicon square rod is also improved.

Description

Technical Field

[0001] This utility model relates to the field of photovoltaic technology, and in particular to a silicon rod module. Background Technology

[0002] As the need to reduce costs at the photovoltaic slicing end becomes increasingly urgent, increasing the number of wafers produced per kilogram of square rod has become a requirement of the industry.

[0003] In related technologies, multiple silicon square rods are bonded together and then cut into silicon wafers of different sizes according to usage requirements. During the slicing process, due to the pressure and compression of the silicon wafers within the diamond wire mesh and the influence of the cutting fluid's moisture, the silicon wafers continuously shift towards both ends of the silicon square rod during the cutting process, forming bulging wafers. Therefore, a 2mm to 3mm thick layer needs to be reserved at both ends of the silicon square rod to prevent wafer breakage due to bulging. The current process of cutting silicon square rods into silicon wafers can only employ a central adhesive coating and a wire mesh with reserved thick layers, resulting in low cutting efficiency and waste of silicon square rods. Utility Model Content

[0004] The present invention aims to at least solve one of the technical problems existing in the prior art. Therefore, one objective of the present invention is to provide a silicon rod assembly that improves the cutting efficiency of wire mesh and also increases the utilization rate of silicon square rods.

[0005] According to the present invention, a silicon rod assembly includes: a plurality of silicon square rods, the plurality of silicon square rods being arranged along the thickness direction of the silicon square rods, and an adhesive member being provided between two adjacent silicon square rods, the adhesive member including a plurality of first adhesive segments, the plurality of first adhesive segments being arranged at intervals along the length direction or width direction of the silicon square rods.

[0006] According to the silicon rod assembly of this invention, after multiple silicon square rods are compressed, multiple first bonding segments can fill the gap between two adjacent silicon square rods. Therefore, when cutting the silicon rod assembly using a wire mesh, the wire mesh does not need to be separated into individual meshes, improving the efficiency of wire mesh cutting and reducing processing costs. Furthermore, adjacent sides of two adjacent silicon square rods can also be cut into silicon wafers, improving the utilization rate of the silicon square rods and avoiding waste.

[0007] According to some embodiments of the present invention, the length of the first adhesive segment is less than the length of the silicon square rod.

[0008] According to some embodiments of the present invention, the distance between the two ends of the first adhesive segment along its length and the corresponding edge of the silicon square rod is L1, wherein L1 satisfies: 2mm≤L1≤3mm.

[0009] According to some embodiments of the present invention, a plurality of the first adhesive segments are connected end to end in an S-shape.

[0010] According to some embodiments of the present invention, the adhesive further includes: a plurality of second adhesive segments extending from the center of the silicon square rod toward both sides in the width direction of the silicon square rod, and two first adhesive segments being connected sequentially through the plurality of second adhesive segments.

[0011] According to some embodiments of the present invention, the lengths of a plurality of first adhesive segments increase sequentially from the center of the silicon square rod toward one side of the width direction of the silicon square rod; and / or, the lengths of a plurality of second adhesive segments increase sequentially from the center of the silicon square rod toward one end of the length direction of the silicon square rod.

[0012] According to some embodiments of the present invention, after the silicon rod assembly is compressed, a plurality of first adhesive segments are connected to each other to form an adhesive layer, and the adhesive layer is bonded to the adjacent silicon square rod.

[0013] According to some embodiments of the present invention, the distance between the side of the adhesive layer along the length direction of the silicon square rod and the corresponding edge of the silicon square rod is L2, wherein L2 < L1, and 1mm ≤ L2 ≤ 2mm.

[0014] According to some embodiments of the present invention, the number of silicon rod assemblies is N, wherein N satisfies: 8≤N≤13.

[0015] According to some embodiments of the present invention, the thickness d of the adhesive is such that d satisfies: 0.1mm≤d≤0.5mm.

[0016] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0017] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0018] Figure 1 This is a schematic diagram of a silicon square rod of a silicon rod assembly according to an embodiment of the present utility model;

[0019] Figure 2 This is a schematic diagram of a silicon square rod of a silicon rod assembly according to another embodiment of the present invention;

[0020] Figure 3 This is a schematic diagram of a silicon square rod of a silicon rod assembly according to another embodiment of the present invention;

[0021] Figure 4 This is a schematic diagram of a silicon rod assembly subjected to tooling compression according to an embodiment of the present invention;

[0022] Figure 5 This is a schematic diagram of the silicon square rod of the silicon rod assembly according to an embodiment of the present invention after being compressed;

[0023] Figure 6 This is a cutting state diagram of the silicon rod assembly according to an embodiment of the present utility model;

[0024] Figure 7 This is a schematic diagram of a silicon rod segment of a silicon rod assembly according to an embodiment of the present utility model;

[0025] Figure 8 This is a diagram showing the undivided wire mesh cutting state of the silicon rod segment of the silicon rod assembly according to an embodiment of the present utility model.

[0026] Figure 9 This is an assembly diagram of the circulating component and the flower basket of the silicon rod assembly according to an embodiment of the present utility model;

[0027] Figure 10 This is an assembly diagram of the circulating component, flower basket, and glue boiling tank of the silicon rod assembly according to an embodiment of the present utility model;

[0028] Figure 11 This is a diagram showing the state of the circulating component of the silicon rod assembly according to an embodiment of the present invention after treatment in a glue boiling tank, wherein multiple second sub-silicon square rods in the circulating component are separated.

[0029] Figure label:

[0030] 100. Silicon rod modules;

[0031] 1. Silicon square rod; 11. First sub-silicon square rod; 12. Second sub-silicon square rod;

[0032] 2. Adhesive component; 21. First adhesive section; 22. Second adhesive section;

[0033] 23. Adhesive layer; 231. First sub-adhesive layer; 232. Second sub-adhesive layer;

[0034] 3. Circulating components; 4. Silicon rod segments;

[0035] 101. Cutting wire; 102. Cutting wire mesh; 103. Flower basket; 104. Glue boiling tank. Detailed Implementation

[0036] The embodiments of this utility model are described in detail below. The embodiments described with reference to the accompanying drawings are exemplary. Figures 1-11 Description of silicon rod assembly 100 according to an embodiment of the present utility model.

[0037] like Figure 1 and Figure 6As shown, the silicon rod assembly 100 according to this utility model includes a plurality of silicon square rods 1. In the description of this utility model, "a plurality of" means two or more.

[0038] Specifically, multiple silicon square rods 1 are arranged along the thickness direction of the silicon square rods 1 (e.g., ...). Figure 6 The silicon square rods 1 are arranged in a vertical direction (as shown), and an adhesive component 2 is provided between two adjacent silicon square rods 1. The adhesive component 2 includes multiple first adhesive segments 21, which are arranged along the length direction of the silicon square rods 1 (e.g., vertical direction). Figure 1 (as shown in the left-right direction) or width direction (e.g.) Figure 1 The arrangement is shown in front and back (interval).

[0039] For example, in Figure 1 and Figure 6 In the example, multiple silicon square rods 1 are arranged in a vertical direction. The arrangement of the multiple first adhesive segments 21 includes the following cases: First, the first adhesive segments 21 extend along the width direction of the silicon square rod 1, and the multiple first adhesive segments 21 are spaced apart along the length direction of the silicon square rod 1 (not shown in the figure). Second, the first adhesive segments 21 extend along the length direction of the silicon square rod 1, and the multiple first adhesive segments 21 are spaced apart along the width direction of the silicon square rod 1 (e.g., ...). Figure 1 (As shown).

[0040] This configuration allows for the application of multiple first adhesive segments 21 to the surface of the silicon square rod 1 facing adjacent silicon square rods 1. When multiple silicon square rods 1 are stacked and compressed along their thickness direction, the multiple first adhesive segments 21 (e.g., adhesive) are compressed and connected to fill the gap between two adjacent silicon square rods 1. That is, the space between two adjacent silicon square rods 1 is fully filled with adhesive without any gaps. Therefore, when the cutting wire mesh 102 cuts the silicon rod assembly 100, there is no need to leave gaps between the cutting wire mesh 102, i.e., there is no need for wire mesh cutting, thereby improving the cutting efficiency of the cutting wire mesh 102 and reducing processing costs. In addition, since there are no gaps between the cutting wire mesh 102, adjacent sides of two adjacent silicon square rods 1 can also be cut into silicon wafers, increasing the number of wafers produced from the silicon square rods 1, improving the utilization rate of the silicon square rods 1, and avoiding waste of silicon square rods 1.

[0041] According to the silicon rod assembly 100 of this invention, after multiple silicon square rods 1 are compressed, multiple first bonding segments 21 can fill the gap between two adjacent silicon square rods 1. Therefore, when the cutting wire mesh 102 cuts the silicon rod assembly 100, the cutting wire mesh 102 does not need to be split into separate wire meshes, improving the cutting efficiency of the cutting wire mesh 102 and reducing processing costs. Furthermore, adjacent sides of two adjacent silicon square rods 1 can also be cut into silicon wafers, improving the utilization rate of the silicon square rods 1 and avoiding waste.

[0042] According to some embodiments of this utility model, refer to Figure 1The length of the first adhesive segment 21 is less than the length of the silicon square rod 1. For example, in Figure 1 In the example, when the first adhesive segment 21 extends along the length direction (i.e., the left-right direction) of the silicon square rod 1, the length of the first adhesive segment 21 is less than the length of the silicon square rod 1. This configuration, after pressing multiple silicon square rods 1 along their thickness direction (i.e., the up-down direction), prevents the first adhesive segment 21 from overflowing the edge of the silicon square rod 1 and affecting the cutting of the silicon square rod 1, thereby improving the quality of the silicon square rod 1 slices. Furthermore, it avoids the need for other processes to remove the overflowing first adhesive segment 21, further reducing production costs.

[0043] Furthermore, referring to Figure 1 The distance between the two ends of the first adhesive segment 21 along its length (i.e., the left-right direction) and the corresponding edge of the silicon square rod 1 is L1, where L1 satisfies: 2mm ≤ L1 ≤ 3mm. For example, there is a gap between the two ends of the first adhesive segment 21 along its length and the corresponding edge of the silicon square rod 1. When the distance L1 between the two ends of the first adhesive segment 21 along its length and the corresponding edge of the silicon square rod 1 is less than 2mm, the length of the first adhesive segment 21 is small. After multiple silicon square rods 1 are pressed along the thickness direction of the silicon square rod 1, there is a gap between two adjacent silicon square rods 1. When the wire mesh 102 is cut, the side of the silicon square rod 1 closest to the first adhesive segment 21 is easily damaged, resulting in waste. When the distance L1 between the two ends of the first adhesive segment 21 along its length and the corresponding edge of the silicon square rod 1 is greater than 3mm, the length of the first adhesive segment 21 is relatively large. After multiple silicon square rods 1 are pressed along their thickness direction, the first adhesive segment 21 between two adjacent silicon square rods 1 is prone to overflowing, affecting the cutting of the silicon square rods 1 and reducing the quality of the silicon wafers cut from the silicon square rods 1. In addition, it also increases the process of removing the overflowing first adhesive segment 21, increasing production costs.

[0044] Therefore, by setting the distance L1 between the two ends of the first adhesive segment 21 along its length direction and the corresponding edge of the silicon square rod 1 to satisfy 2mm≤L1≤3mm, the distance L1 between the two ends of the first adhesive segment 21 along its length direction and the corresponding edge of the silicon square rod 1 is reasonably set. After multiple silicon square rods 1 are pressed along their thickness direction, on the one hand, gaps between adjacent silicon square rods 1 are avoided, thus preventing damage to the side of the silicon square rod 1 near the first adhesive segment 21 during the cutting process, improving the wafer yield and utilization rate of the silicon square rods 1. On the other hand, the first adhesive segment 21 is prevented from being pressed to the outer periphery of multiple silicon square rods 1, thus avoiding affecting the cutting of the silicon square rods 1 and improving the quality of the silicon square rods 1 cut into wafers. Moreover, the process of removing the overflowing first adhesive segment 21 is avoided, reducing production costs. In addition, the two ends of the adhesive component 2 along its width direction (i.e., the front-to-back direction) are also spaced from the corresponding edge of the silicon square rod 1, which also prevents the first adhesive segment 21 from overflowing the silicon square rod 1.

[0045] According to some embodiments of this utility model, refer to Figure 2 Multiple first adhesive segments 21 are connected end to end in an S-shape. For example, in Figure 2 In the example, the right end of one first adhesive segment 21 is connected to the right end of an adjacent first adhesive segment 21, the left end of the aforementioned first adhesive segment 21 is connected to the left end of an adjacent first adhesive segment 21, and the right end of the aforementioned first adhesive segment 21 is connected to the right end of yet another adjacent first adhesive segment 21, and so on. This increases the number of first adhesive segments 21 at both ends of the silicon square rod 1 along its length, ensuring that after multiple silicon square rods 1 are pressed together along their thickness direction, there are no gaps between the adhesive components 2 of adjacent silicon square rods 1, meeting the non-separating cutting requirements of the wire mesh 102, thus improving the cutting effect and avoiding material waste of the silicon square rods 1. Furthermore, it facilitates the use and installation of the adhesive components 2.

[0046] According to some embodiments of this utility model, refer to Figure 3 The adhesive component 2 also includes a plurality of second adhesive segments 22, extending from the center of the silicon square rod 1 towards both sides in the width direction of the silicon square rod 1. Two first adhesive segments 21 are sequentially connected through the plurality of second adhesive segments 22. That is, from the center of the silicon square rod 1 towards both sides in the width direction of the silicon square rod 1, a plurality of first adhesive segments 21 are sequentially connected. For example, in Figure 3 In the example, multiple first adhesive segments 21 are arranged at intervals along the width direction (i.e., the front-to-back direction) of the silicon square rod 1, and the first adhesive segments 21 extend along the length direction of the silicon square rod 1. Multiple second adhesive segments 22 are arranged at intervals along the length direction of the silicon square rod 1, and the second adhesive segments 22 extend along the length direction (i.e., the left-to-right direction) of the silicon square rod 1. Figure 3 As shown, the right end of the first adhesive segment 21 located at the center of the silicon square rod 1 is connected to the right end of the adjacent first adhesive segment 21 through a second adhesive segment 22 located on the right side of the plurality of first adhesive segments 21. The left end of the aforementioned adjacent first adhesive segment 21 is connected to the left end of another first adhesive segment 21 located away from the aforementioned adjacent first adhesive segment 21 through a second adhesive segment 22 located on the left side of the plurality of first adhesive segments 21. This process is repeated, with the plurality of first adhesive segments 21 connected end to end in sequence through the plurality of second adhesive segments 22, forming an adhesive member 2 extending outward from the center of the silicon square rod 1 along the circumference of the silicon square rod 1 (towards the outer periphery of the silicon square rod 1).

[0047] This arrangement ensures that the multiple first adhesive segments 21 and multiple second adhesive segments 22 fill the side surface of the silicon square rod 1, increasing the amount of adhesive component 2 and the contact area with the silicon square rod 1. After the multiple silicon square rods 1 are pressed together, it ensures that there are no gaps between adjacent silicon square rods 1, meeting the non-separation cutting requirements of the wire mesh 102, improving cutting efficiency, avoiding material waste of silicon square rods 1, and reducing processing costs.

[0048] According to some embodiments of this utility model, refer to Figure 3 The lengths of a plurality of first adhesive segments 21 increase sequentially from the center of the silicon square rod 1 toward one side of the width direction of the silicon square rod 1; and / or, the lengths of a plurality of second adhesive segments 22 increase sequentially from the center of the silicon square rod 1 toward one end of the length direction of the silicon square rod 1.

[0049] For example, the arrangement of the first adhesive segment 21 and the second adhesive segment 22 includes the following situations: First, from the center of the silicon square rod 1 towards one end in the width direction of the silicon square rod 1, the lengths of the multiple first adhesive segments 21 increase sequentially. Second, from the center of the silicon square rod 1 towards one end in the length direction of the silicon square rod 1, the lengths of the multiple second adhesive segments 22 increase sequentially. Third, from the center of the silicon square rod 1 towards one end in the width direction of the silicon square rod 1, the lengths of the multiple first adhesive segments 21 increase sequentially. Simultaneously, from the center of the silicon square rod 1 towards one end in the length direction of the silicon square rod 1, the lengths of the multiple second adhesive segments 22 increase sequentially (e.g., ...). Figure 3 (As shown). This arrangement allows multiple first adhesive segments 21 and multiple second adhesive segments 22 to be connected in concentric circles along the circumference of the silicon square rod 1. This facilitates the connection of two first adhesive segments 21 through the second adhesive segment 22. After the multiple silicon square rods 1 are pressed together, it further ensures that there are no gaps between adjacent silicon square rods 1, further meeting the non-separating cutting requirements of the cutting mesh 102, improving the cutting effect, and avoiding material waste of the silicon square rods 1. Moreover, the arrangement of the multiple first adhesive segments 21 and multiple second adhesive segments 22 is reasonable. In addition, the structures of the first adhesive segments 21 and the second adhesive segments 22 are simple and easy to form, improving production efficiency.

[0050] Optionally, refer to Figure 3 The first adhesive segment 21 extends linearly along the length of the silicon square rod 1. The second adhesive segment 22 extends linearly along the width of the silicon square rod 1. This arrangement improves the uniformity of the arrangement of the multiple first adhesive segments 21 and multiple second adhesive segments 22, and improves the uniformity of the arrangement of the adhesive components 2 between adjacent silicon square rods 1, thereby further improving the bonding effect.

[0051] According to some embodiments of this utility model, refer to Figure 5After the silicon rod assembly 100 is compressed, multiple first adhesive segments 21 connect to each other to form an adhesive layer 23, which adheres to the adjacent silicon square rods 1. This arrangement ensures that the adhesive layer 23 completely fills the space between two adjacent silicon square rods 1, eliminating gaps between their contact surfaces. This improves the bonding effect, avoids gaps between adjacent silicon square rods 1, thereby increasing cutting efficiency and the number of silicon wafers that can be cut from the silicon square rods 1. It should be noted that the adhesive component 2 and the adhesive layer 23 use the same adhesive. The adhesive component 2 and the adhesive layer 23 represent different states of the adhesive. After being compressed, the adhesive component 2 fully fills the space to form the adhesive layer 23.

[0052] According to some embodiments of this utility model, the distance between the side of the adhesive layer 23 along the length direction of the silicon square rod 1 and the corresponding edge of the silicon square rod 1 is L2, where L2 < L1, and 1mm ≤ L2 ≤ 2mm. For example, when the distance L2 between the side of the adhesive layer 23 along the length direction of the silicon square rod 1 and the corresponding edge of the silicon square rod 1 is less than 1mm, the distance between the side of the adhesive layer 23 along the length direction of the silicon square rod 1 and the corresponding edge of the silicon square rod 1 is small. When the silicon rod segment 4 of the silicon rod assembly 100 (i.e., the silicon rod segment 4 is formed after being cut from the silicon rod assembly 100) needs to be polished, the distance for polishing the first sub-adhesive layer 231 of the silicon rod segment 4 (i.e., the first sub-adhesive layer 231 is formed after being cut from the adhesive layer 23) together increases the polishing difficulty and reduces work efficiency. When the distance L2 between the side edge of the adhesive layer 23 along the length direction of the silicon square rod 1 and the corresponding edge of the silicon square rod 1 is greater than 2mm, the edge of the first sub-silicon square rod 11 (i.e., the first sub-silicon square rod 11 is formed by cutting the silicon square rod 1) of the silicon rod segment 4 needs to be polished a longer distance to make the outer peripheral edge of the first sub-silicon square rod 11 flush with the outer peripheral edge of the first sub-adhesive layer 231. This prolongs the polishing time, reduces work efficiency, and increases the amount of silicon square rod 1 that is ground away, thus reducing the utilization rate of the silicon square rod 1. In contrast, there is a gap between the two ends of the adhesive layer 23 in the width direction and the corresponding edge of the silicon square rod 1, and also a gap between the two ends of the adhesive layer 23 in the length direction and the corresponding edge of the silicon square rod 1. This gap between the outer peripheral edge of the adhesive layer 23 and the outer peripheral edge of the silicon square rod 1 prevents the adhesive layer 23 from overflowing the silicon square rod 1.

[0053] Therefore, by setting the distance L2 between the side edge of the adhesive layer 23 along the length direction of the silicon square rod 1 and the corresponding edge of the silicon square rod 1 to satisfy 1mm≤L2≤2mm, the setting is reasonable. When polishing the silicon rod segment 4 of the silicon rod assembly 100, the distance for polishing the first sub-adhesive layer 231 of the silicon rod segment 4 together is shortened, reducing the polishing difficulty and improving work efficiency. In addition, when the outer peripheral edge of the first sub-silicon square rod 11 of the silicon rod segment 4 is aligned with the outer peripheral edge of the first sub-adhesive layer 231 of the silicon rod segment 4, the polishing distance of the first sub-silicon square rod 11 is shortened, the amount of material removed is reduced, the utilization rate of the silicon square rod 1 is improved, and work efficiency is further improved.

[0054] It should be noted that the silicon rod assembly is cut into 100mm pieces (e.g., ...). Figure 6 After cutting in the direction indicated by arrow A, multiple silicon rod segments 4 and two recycling components 3 are obtained. The recycling components 3 refer to the recycled materials obtained by cutting off both ends of the silicon rod assembly 100 along its length, which can be recycled and reused after further processing. The silicon rod segments 4 refer to the portion of the silicon rod assembly 100 located between the two recycling components 3.

[0055] The silicon rod segment 4 includes a plurality of first sub-silicon square rods 11, which are arranged along the thickness direction of the silicon rod segment 4 (i.e., Figure 7 Arranged in a left-right direction, a first sub-adhesive layer 231 is formed between two adjacent first sub-silicon square rods 11. The circulation component 3 includes a plurality of second sub-silicon square rods 12, which are arranged along the thickness direction of the circulation component 3 (i.e., in the left-right direction). Figure 9 The first silicon square rods 11 and 12 are arranged in the left-right direction. A second sub-adhesive layer 232 is formed between two adjacent second sub-silicon square rods 12. That is, the first silicon square rods 11 and 12 are formed by cutting silicon square rods 1, and the first sub-adhesive layer 231 and 232 are formed by cutting adhesive layer 23.

[0056] According to some embodiments of this utility model, refer to Figure 4The number of silicon rod assemblies 100 is N, where N satisfies: 8 ≤ N ≤ 13. For example, when the number of silicon rod assemblies 100, N, is less than 8, the number of silicon rod assemblies 100 is small, reducing the number of cuts per wire mesh 102 and lowering work efficiency. When the number of silicon rod assemblies 100, N, is greater than 13, the number of silicon rod assemblies 100 is large, and when multiple silicon square rods 1 are extruded, the stability of the multiple silicon square rods 1 is reduced, the extrusion effect is weakened, and subsequent processing of the silicon rod assembly 100 (e.g., cutting into silicon wafers) is inconvenient. Therefore, by setting the number of silicon rod assemblies 100, N, to satisfy: 8 ≤ N ≤ 13, the number of silicon rod assemblies 100 is reasonably set, increasing the number of cuts per wire mesh 102 and improving work efficiency. In addition, when multiple silicon square rods 1 are extruded, the stability of the multiple silicon square rods 1 is improved, the extrusion effect is enhanced, and subsequent processing of the silicon rod assembly 100 is facilitated.

[0057] Optionally, refer to Figure 6 The thickness of the silicon rod assembly 100 is H, where H satisfies: 60mm ≤ H ≤ 600mm. The reasonable thickness setting of the silicon square rod 1 facilitates its acquisition, reduces its production difficulty, and improves its production efficiency. Furthermore, increasing the thickness of the silicon rod assembly 100 increases the number of wafers that can be assembled from the assembly, thereby improving the wafer assembly efficiency.

[0058] According to some embodiments of this utility model, refer to Figure 2 The thickness d of the adhesive component 2 satisfies the condition: 0.1mm ≤ d ≤ 0.5mm. For example, when the thickness d of the adhesive component 2 is less than 0.1mm, the thickness of the adhesive component 2 is too small, which reduces the connection stability between two adjacent silicon square rods 1 and increases the difficulty of cutting the wire mesh 102. When the thickness d of the adhesive component 2 is greater than 0.5mm, the thickness of the adhesive component 2 is too large, which increases the material consumption of the adhesive component 2 and the production cost of the adhesive component 2. Therefore, by setting the thickness d of the adhesive component 2 to satisfy 0.1mm ≤ d ≤ 0.5mm, the thickness setting of the adhesive component 2 is reasonable, which improves the connection stability between two adjacent silicon square rods 1, increases the stability of the silicon rod assembly 100, reduces the difficulty of cutting the wire mesh 102, and improves the cutting efficiency. In addition, it reduces the material consumption of the adhesive component 2, reduces the production cost of the adhesive component 2, and reduces the production cost of the silicon rod assembly 100.

[0059] Optionally, the adhesive component 2 includes component A and component B. Component A includes epoxy resin, an expanding agent, silica, aluminum hydroxide, and pigment. The epoxy resin content is ≥70%, the aluminum hydroxide content is ≤30%, the expanding agent content is ≥5%, the silica content is ≤0.5%, and the pigment content is ≥5%. Component B includes silica, an expanding agent, polythiol, an amine catalyst, calcium carbonate, aluminum hydroxide, and pigment. The silica content is ≤0.5%, the expanding agent content is ≥5%, the polythiol content is ≥70%, the amine catalyst content is 10%–20%, the calcium carbonate content is 30%–40%, the aluminum hydroxide content is ≤30%, and the pigment content is ≥5%.

[0060] The preparation process of adhesive component 2 is roughly as follows:

[0061] The preparation process of component A is roughly as follows:

[0062] First, slowly add epoxy resin and aluminum hydroxide to the reaction vessel while stirring continuously for approximately 30 minutes. After stirring for 30 minutes, slowly add the pigment while continuously stirring. Then, add silica while continuously stirring until the filler is uniformly mixed. Next, after the filler is uniformly mixed, add the expanding agent while continuously stirring until uniformly mixed. All of the above steps must be performed at a temperature below 40°C.

[0063] The preparation process of component B is roughly as follows:

[0064] First, add curing agents such as polythiol while stirring. Simultaneously add amine catalysts and silica, stirring for approximately 30 minutes. Then, add the required pigment and stir until homogeneous. Next, add calcium carbonate and aluminum hydroxide in the predetermined ratio, stirring continuously until the filler is uniformly mixed. Then, add the expanding agent, stirring continuously until homogeneous. All of the above steps must be performed at a temperature below 40°C, and the pigment color must be significantly different from component A.

[0065] It should be noted that component A is white and component B is blue, but not limited to these colors. At 25℃, the viscosity of component A is 20000 mPa·s to 210000 mPa·s, and the viscosity of component B is 100000 mPa·s to 3000000 mPa·s. It is insoluble in water but soluble in organic solvents such as ethanol. The working time is 6 min to 30 min, the Shore hardness (D) is greater than or equal to 82, the shear strength is greater than or equal to 13 MPa, the dispensing and mixing temperature is 20℃ to 30℃, and the bonding temperature for the silicon rod assembly is 10℃ to 30℃. This improves the brittleness, heat resistance, and water resistance of the bonded component 2, meeting the requirement of gapless cutting in the cutting wire mesh 102 during the cutting process and improving cutting efficiency.

[0066] The process of forming and slicing the silicon rod assembly 100 is roughly as follows:

[0067] S1, the edge scrap of the silicon rod is recycled and after removing the arc top and ear, it is obtained as follows: Figure 1 The silicon square rod 1 shown; wherein, when the edge skin is recycled and the ear is removed, the edge width allowance can be increased by 1mm to 2mm compared with the edge width allowance in the traditional technology.

[0068] S2, place the silicone square rod 1 on the adhesive platform, and the dispensing machine sprays multiple first adhesive segments 21 and multiple second adhesive segments 22 of the bonded component 2 according to the pattern set in the program. Figures 1-3 Any of the ones shown, but not limited to this.

[0069] S3, stack the silicon square rods 1 coated with adhesive 2 one by one along the thickness direction (i.e., the vertical direction) of the silicon square rods 1, and then press the multiple silicon square rods 1 together using a fixture (e.g., ...). Figure 4 As shown), a silicon rod assembly 100 is obtained, wherein the adhesive between two adjacent silicon square rods 1 is an adhesive layer 23.

[0070] S4. After the adhesive layer 23 has cured, the silicon rod assembly 100 is cut using an integrated adhesive-cutting machine. The machine uses a vertical cutting method, with the cutting line 101 starting from the top of the silicon rod assembly 100 and cutting through it from the bottom according to the set process line speed, process position, and process feed speed. The cutting direction is as follows: Figure 6 As shown by the middle arrow A, two cyclic elements 3 and multiple silicon rod segments 4 are obtained (e.g., Figure 6 (As shown).

[0071] S5, when polishing silicon rod segment 4 using a grinding and polishing integrated machine, grinding is performed according to the set process feed speed and process target size until the circumferential edge of the first sub-adhesive layer 231 is flush with the circumferential edge of the first sub-silicon square rod 11 of silicon rod segment 4 (e.g., Figure 7(as shown); wherein, the width of the first sub-silicon square rod 11 can be 90mm to 110mm, the length can be 182mm to 220mm, and the thickness can be 20mm to 60mm.

[0072] S6, along the thickness direction of silicon rod segment 4, the thickness direction of silicon rod segment 4 (i.e. Figure 7 On both sides of the first silicon square rod 11 (in the left and right directions), an amino or ABS resin part with the same area (i.e., the product of the length and width of the first silicon square rod 11) is bonded, and then sliced; wherein, during slicing, the diamond wire cutting mesh 102 is cut in a non-mesh manner (e.g. Figure 8 As shown), the above two sides of the silicon rod segment 4 no longer have reserved thick sheets, and the thickness of the amino part or ABS resin part can be 3mm to 8mm to avoid sheet expansion and cracking.

[0073] In step S4, two loop components 3 are obtained. The processing procedure for loop components 3 is roughly as follows:

[0074] Place the recirculating component 3 into the flower basket 103 (e.g., ...). Figure 9 (as shown); wherein, the length of the circulating component 3 can be 60mm to 600mm and the width can be 90mm to 110mm, and the flower basket 103 can be filled with 1 to 5 circulating components 3 at a time.

[0075] After the tap water or circulating water in the glue boiling tank 104 boils, place the flower basket 103 into the glue boiling tank 104 for degumming, and immerse the circulating component 3 completely in the tap water or circulating water (e.g., Figure 10 (as shown); wherein, the bottom or outer periphery of the flower basket 103 is honeycomb-shaped or hollowed out, so that tap water or circulating water can fully contact the circulating component 3, and the temperature of tap water or circulating water in the glue boiling tank 104 needs to reach 80℃~100℃.

[0076] After the circulation component 3 is boiled in high-temperature tap water or circulating water for a period of time, the multiple second sub-silicon square rods 12 of the circulation component 3 are separated, resulting in the second sub-silicon square rods 12 (e.g., Figure 11 (as shown); the boiling time can be 5 min to 20 min. The expansion agent in the second sub-adhesive layer 232 expands rapidly under high temperature to generate bubbles. The bubbles burst quickly, squeezing the second sub-silicon square rods 12 on both sides of the second sub-adhesive layer 232 in the circulation component 3, and the multiple second sub-silicon square rods 12 in the circulation component 3 separate.

[0077] An expanding agent is added to the adhesive layer 23. Under high temperature tap water or circulating water, the expanding agent expands rapidly and squeezes and separates the second silicon square rods 12 on both sides of the second sub-adhesive layer 232 in the circulation component 3, which improves the degumming efficiency. Compared with the degumming method in the traditional technology, the degumming efficiency is improved by about 660%. Moreover, the degumming method in this application does not cause any material loss in the second silicon square rods 12, and also reduces the cost of manual input, thereby effectively reducing the cost of degumming the circulation component 3.

[0078] Other configurations and operations of the silicon rod assembly 100 according to embodiments of the present invention are known to those skilled in the art and will not be described in detail here.

[0079] In the description of this utility model, it should be understood that the terms "center", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0080] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example.

[0081] Although embodiments of the present invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A silicon rod assembly, characterized in that, include: Multiple silicon square rods are arranged along the thickness direction of the silicon square rods. An adhesive is provided between two adjacent silicon square rods. The adhesive includes multiple first adhesive segments, which are arranged at intervals along the length or width direction of the silicon square rods.

2. The silicon rod assembly according to claim 1, characterized in that, The length of the first adhesive segment is less than the length of the silicon square rod.

3. The silicon rod assembly according to claim 2, characterized in that, The distance between the two ends of the first adhesive segment along its length and the corresponding edge of the silicon square rod is L1, wherein L1 satisfies: 2mm≤L1≤3mm.

4. The silicon rod assembly according to claim 1, characterized in that, Multiple first adhesive segments are connected end to end in an S-shape.

5. The silicon rod assembly according to claim 1, characterized in that, The adhesive also includes: Multiple second adhesive segments extend from the center of the silicon square rod toward both sides in the width direction of the silicon square rod, and two first adhesive segments are connected sequentially through multiple second adhesive segments.

6. The silicon rod assembly according to claim 5, characterized in that, From the center of the silicon square rod toward one side of the width direction of the silicon square rod, the lengths of the plurality of first adhesive segments increase sequentially; and / or The lengths of the plurality of second adhesive segments increase sequentially from the center of the silicon square rod toward one end along its length.

7. The silicon rod assembly according to claim 1, characterized in that, When the silicon rod assembly is compressed, multiple first adhesive segments are connected to each other to form an adhesive layer, which is then bonded to the adjacent silicon square rod.

8. The silicon rod assembly according to claim 7, characterized in that, The distance between the side of the adhesive layer along the length of the silicon square rod and the corresponding edge of the silicon square rod is L2, wherein L2 < L1, and 1mm ≤ L2 ≤ 2mm.

9. The silicon rod assembly according to claim 1, characterized in that, The number of silicon rod assemblies is N, wherein N satisfies: 8≤N≤13.

10. The silicon rod assembly according to any one of claims 1-9, characterized in that, The thickness d of the adhesive component satisfies: 0.1mm ≤ d ≤ 0.5mm.

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