MEMS sensor and electronic product

Abstract

The utility model provides an MEMS sensor and an electronic product. The MEMS sensor comprises a first substrate, a housing and a second substrate, wherein the housing and the first substrate form a packaging structure, and the second substrate is arranged on the housing and is connected and conducted with the first substrate. Wherein a first bonding pad group is arranged on the first substrate, and a second bonding pad group is arranged on the second substrate; and the polarity of the bonding pads in the first bonding pad group is different from that of the bonding pads in the second bonding pad group. According to the utility model, the use surface of the sensor can be selected according to the installation requirement of a product, and a bonding pad of the sensor does not need to be converted through an FPC, thereby reducing the backflow frequency and reducing the risk of foreign matter introduction.

Description

Technical Field

[0001] This utility model relates to the field of sensor technology, and more specifically, to a MEMS sensor and electronic product. Background Technology

[0002] With societal progress and technological advancements, the size of MEMS electronic products such as mobile phones, computers, and wearable devices has been continuously shrinking in recent years. Consequently, the performance requirements for these portable MEMS electronic products are also increasing, necessitating further reductions in the size, performance, and consistency of the supporting electronic components. MEMS (Micro-Electro-Mechanical-System) integrated MEMS products have begun to be mass-produced and applied in these types of MEMS electronic products. Their package size is smaller than that of traditional electronic devices, making them favored by most sensor manufacturers.

[0003] However, traditional MEMS sensor packages are limited by chip pads, and the soldering polarity is fixed during use. If the product and the pads have opposite polarities, they need to be attached to the FPC for polarity conversion, which poses a risk of introducing foreign objects or product leakage due to repeated reflow. Utility Model Content

[0004] In view of the above problems, the purpose of this utility model is to provide a MEMS sensor and electronic product to solve the problem that the existing sensor pad fixation cannot meet the mounting requirements of various products.

[0005] The MEMS sensor provided by this utility model includes a first substrate, a housing forming an encapsulation structure with the first substrate, and a second substrate disposed on the housing and connected and conductive to the first substrate; wherein, a first pad group is disposed on the first substrate, and a second pad group is disposed on the second substrate; and the polarities of the pads in the first pad group and the second pad group are different.

[0006] In addition, an optional structural feature is that the first substrate and the second substrate are arranged in parallel, and vertically distributed conductive pillars are provided between the first substrate and the second substrate; one end of the conductive pillar is connected to the first substrate through a conductive element, and the other end is connected to the second substrate through a conductive element.

[0007] In addition, an optional structural feature is that the conductive post is located on the outside of the housing and spaced apart from the housing; or, the conductive post is disposed through the vertical sidewall of the housing.

[0008] In addition, an optional structural feature is that the second substrate is bonded and fixed to the upper end face of the housing by an adhesive.

[0009] In addition, an optional structural feature is that the adhesive includes glue and adhesive film.

[0010] In addition, an optional structural feature is that the first substrate and the second substrate are vertically distributed, and the second substrate is insulatedly attached to the vertical sidewall of the housing; the first substrate and the second substrate are connected and conductive by conductive adhesive or conductive flux.

[0011] In addition, an optional structural feature is that a through hole, a MEMS chip attached to the through hole, and an ASIC chip connected and conductive to the MEMS chip are provided on the first substrate; both the ASIC chip and the MEMS chip are housed within the packaging structure.

[0012] In addition, an optional structural feature is that the second substrate is a PCB or a ceramic plate.

[0013] In addition, an optional structural feature is that the pad distribution in the first pad group corresponds to the solder joint position on the first product; and the pad distribution in the second pad group corresponds to the solder joint position on the second product.

[0014] On the other hand, this utility model also provides an electronic product including the above-mentioned MEMS sensor.

[0015] By utilizing the aforementioned MEMS sensors and electronic products, a second substrate is added simultaneously with the first substrate. The pad distribution of the second pad group on the second substrate differs from the polarity distribution of the pads in the first pad group on the first substrate. This allows for the selection of either the first or second pad group for mounting based on product requirements, eliminating the need for secondary transfer of the sensor, thereby reducing reflow times and the risk of foreign matter introduction. Furthermore, it enables the same sensor to be used in different products, improving the flexibility and scope of sensor application.

[0016] To achieve the foregoing and related objectives, one or more aspects of the present invention include the features that will be described in detail below. The following description and accompanying drawings illustrate certain exemplary aspects of the present invention. However, these aspects indicate only a few of the various ways in which the principles of the present invention can be used. Furthermore, the present invention is intended to include all such aspects and their equivalents. Attached Figure Description

[0017] Other objects and results of this invention will become more apparent and readily understood with reference to the following description taken in conjunction with the accompanying drawings, and with a more complete understanding of the invention. In the drawings:

[0018] Figure 1 This is a schematic diagram of the structure of a MEMS sensor according to an embodiment of the present invention;

[0019] Figure 2 This is a comparison diagram of the first substrate and the second substrate according to an embodiment of the present invention.

[0020] The reference numerals in the figures include: first substrate 1, pad 11, pad 12, adhesive 21, adhesive 22, adhesive 23, ASIC chip 3, MEMS chip 4, copper foil 5, conductive component 61, conductive component 62, outer shell 7, pad 81, pad 82, second substrate 9, solder joint 10, solder joint 13, and conductive post 14.

[0021] In all the accompanying drawings, the same reference numerals indicate similar or corresponding features or functions. Detailed Implementation

[0022] In the following description, numerous specific details are set forth for illustrative purposes and to provide a thorough understanding of one or more embodiments. However, it will be apparent that these embodiments may also be implemented without these specific details. In other instances, well-known structures and devices are shown in block diagram form for ease of description of one or more embodiments.

[0023] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation to the present invention.

[0024] Those skilled in the art will understand that, unless specifically stated otherwise, the singular forms “a,” “an,” “the,” and “the” used herein may also include the plural forms. It should be further understood that the term “comprising” as used in this specification means the presence of the stated features, integers, steps, operations, elements, and / or components, but does not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. It should be understood that the term “and / or” as used herein includes any and all combinations of one or more of the associated listed items.

[0025] It will be understood by those skilled in the art that, unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. It should also be understood that terms such as those defined in general dictionaries should be understood to have the same meaning as in the context of the prior art, and should not be interpreted in an idealized or overly formal sense unless defined as herein.

[0026] To provide a detailed description of the MEMS sensor and electronic product of this utility model, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0027] Figure 1 and Figure 2 The overall and partial schematic structures of the MEMS sensor according to embodiments of the present invention are shown from different angles.

[0028] like Figure 1 and Figure 2 As shown in the figure, the MEMS sensor of this utility model embodiment mainly includes a first substrate 1, a housing 7 forming an encapsulation structure with the first substrate 1, and a second substrate 9 disposed on the housing 7 and connected to the first substrate 1. A first pad group (including pads 11 and 12, hereinafter the same) is disposed on the first substrate 1, and a second pad group (including pads 81 and 82, hereinafter the same) is disposed on the second substrate 9. The first and second pad groups each include a plurality of pads. Furthermore, the polarities of the pads in the first and second pad groups are different. Since the signals transmitted by different pads may differ, including ground pads and pads transmitting different signals, the distribution of the pads in the first and second pad groups can be adjusted to meet the sensor mounting requirements of different products, thereby improving the flexibility of sensor use.

[0029] Since the pads themselves do not have polarity, the polarity description of the pads in this invention can be understood as the polarity of the components connected to the current pad. The polarity of the pads in the first pad group and the second pad group is different, including the difference in the pads caused by the different components connected to the pads, and the different distribution positions of pads with the same function. The specific polarity or distribution position of the pads can be set according to the mounting requirements of the product.

[0030] Specifically, the first substrate 1 and the second substrate 9 can be arranged in parallel. The open end of the outer shell 7 is fixed on the first substrate 1 and forms a package structure with the substrate to accommodate each chip. The second substrate 9 can be arranged on the upper surface of the outer shell 7. The second substrate 9 and the upper surface of the outer shell 7 are glued and fixed together by adhesive 23. Vertically distributed conductive pillars 14 are arranged between the first substrate 1 and the second substrate 9. One end of the conductive pillar 14 is connected to the first substrate 1 through a conductive element and conducts through a conductive element. The other end is connected to the second substrate 9 through a conductive element, which can realize signal conduction between the two substrates with the same pad distribution.

[0031] The conductive component can be made of various structures such as a welding machine or conductive adhesive. The solder point 13 located at the upper end of the conductive post 14 can be connected to the corresponding solder point 10 on the second substrate 9 through the conductive component 62. Similarly, the solder point located at the lower end of the conductive post 14 can also be connected to the corresponding solder point on the first substrate 1 through the conductive component, thereby realizing the connection between the first substrate 1 and the second substrate 9.

[0032] In addition, at least one conductive post 14 may be provided, which may be distributed on any side and / or both sides of the housing 7, and the conductive post 14 may be spaced apart from the vertical sidewall in the housing 7; or, the conductive post may be directly provided through the vertical sidewall of the housing 7, so that the conductive post is insulated through the sidewall of the housing 7, and then its two ends extend out to communicate with the first substrate 1 and the second substrate 9. In this case, the conductive post may be a flexible or deformable conductive element, and is not limited to the specific structure shown in the figure.

[0033] In another specific embodiment of this utility model, the first substrate 1 and the second substrate 9 can also be vertically distributed. In this case, the second substrate 9 can be vertically distributed and insulatedly attached to the outside of the vertical sidewall of the housing 7. The first substrate 1 and the second substrate 9 are connected and conductive by conductive adhesive or conductive flux. The vertical distribution of the second substrate 9 can make the distribution direction of the second pad group on it perpendicular to the first pad group, which can meet the product mounting requirements of limited space and realize the horizontal or vertical mounting of the sensor.

[0034] In addition, a through hole is provided on the first substrate 1, a MEMS chip 4 is attached to the through hole, and an ASIC chip 3 is connected and conductive to the MEMS chip 4; the ASIC chip 3 and the MEMS chip 4 are both housed in the package structure. The ASIC chip 3 and the MEMS chip 4 can be fixedly connected to the first substrate 1 by adhesive 21 and adhesive 22 respectively, and can be conductive by electrical connection wires. The opening end of the outer shell 7 can be insulated from the first substrate 1, or can be electrically connected by the cooperation of copper foil 5 and conductive element 61.

[0035] The adhesive may include glue or PSA-type adhesive film to improve the packaging accuracy of the sensor. The first substrate 1 and the second substrate 9 may be made of PCB or ceramic plate to improve the overall compressive strength of the sensor. The conductive pillars may be made of copper pillars or other conductive materials, and anti-static insulating materials may be wrapped around them to prevent damage or interference with external signals during installation or use.

[0036] It should be noted that in the MEMS sensor of this utility model, the pad distribution in the first pad group corresponds to the solder joint position on the first product; the pad distribution in the second pad group corresponds to the solder joint position on the second product. However, since the structures of the first and second products are different, the requirements for the position of the pads when installing the MEMS sensor are also different. In this case, the two pad groups can improve the versatility of the sensor and enable it to meet the mounting requirements of different types of products. In addition, the distribution of the pads in the second pad group can also be set according to the requirements of the product to be used. This utility model does not specifically limit the distribution and structure of the pads in the second pad group.

[0037] Corresponding to the aforementioned MEMS sensor, this utility model also provides an electronic product including the aforementioned MEMS sensor. It should be noted that embodiments of the electronic product can be found in the descriptions of the MEMS sensor embodiments, and will not be repeated here.

[0038] According to the MEMS sensor and electronic product of the present invention, a first substrate and a second substrate are disposed on the MEMS sensor, and the polarity or distribution position of the pads in the first pad group on the first substrate and the second pad group on the second substrate are different. The first substrate and the second substrate can be arranged in parallel or perpendicular to each other. Thus, according to the product requirements, the first pad group or the second pad group can be selected as the application surface for mounting to the product without the need for secondary transfer of the sensor, thereby reducing the number of reflows and reducing the risk of foreign matter introduction. In addition, the multi-pad structure can also realize the use of the same sensor on different products, improving the flexibility and applicability of the sensor.

[0039] The MEMS sensor and electronic product according to the present invention have been described above by way of example with reference to the accompanying drawings. However, those skilled in the art should understand that various modifications can be made to the MEMS sensor and electronic product proposed in the present invention without departing from the scope of the present invention. Therefore, the scope of protection of the present invention should be determined by the contents of the appended claims.

Claims

1. A MEMS sensor, characterized in that, It includes a first substrate, a housing forming a package structure with the first substrate, and a second substrate disposed on the housing and connected and electrically connected to the first substrate; wherein, A first set of pads is provided on the first substrate, and a second set of pads is provided on the second substrate; and... The pads in the first pad group and the second pad group have different polarities.

2. The MEMS sensor according to claim 1, characterized in that, The first substrate and the second substrate are arranged in parallel, and vertically distributed conductive pillars are provided between the first substrate and the second substrate; One end of the conductive post is connected to the first substrate via a conductive element, and the other end is connected to the second substrate via a conductive element.

3. The MEMS sensor according to claim 2, characterized in that, The conductive post is located on the outside of the housing and spaced apart from the housing; or, The conductive post is disposed through the vertical sidewall of the outer casing.

4. The MEMS sensor according to claim 2, characterized in that, The second substrate is bonded and fixed to the upper surface of the outer casing with an adhesive.

5. The MEMS sensor according to claim 4, characterized in that, The adhesive includes glue and adhesive film.

6. The MEMS sensor according to claim 1, characterized in that, The first substrate and the second substrate are perpendicularly distributed, and the second substrate is insulatedly attached to the vertical sidewall of the outer casing; The first substrate and the second substrate are connected and conductive by conductive adhesive or conductive solder.

7. The MEMS sensor according to claim 1, characterized in that, A through hole, a MEMS chip attached to the through hole, and an ASIC chip connected to the MEMS chip are provided on the first substrate. Both the ASIC chip and the MEMS chip are housed within the packaging structure.

8. The MEMS sensor according to claim 1, characterized in that, The second substrate is a PCB or a ceramic plate.

9. The MEMS sensor according to claim 1, characterized in that, The pad distribution in the first pad group corresponds to the solder joint positions on the first product; The pad distribution in the second pad group corresponds to the solder joint positions on the second product.

10. An electronic product, characterized in that, Including the MEMS sensor as described in any one of claims 1 to 9.

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