Rapid annealing equipment

Abstract

The utility model belongs to the technical field of heat treatment, and discloses rapid annealing equipment which comprises an annealing furnace, a thermodetector is arranged at the bottom of the annealing furnace, an automatic cavity door is arranged on one side of the annealing furnace, a cavity structure is arranged in the annealing furnace, a quartz long column is arranged on the bottom surface of the annealing furnace, and a cavity is formed in the cavity structure. A quartz module is arranged at the top end of the quartz long column, and quartz short columns are annularly arranged in the quartz module at equal angles. According to the utility model, the wafer module, the quartz module, the quartz long column, the silicon ring and the quartz needle are arranged, the silicon ring is sleeved in the thin position at the upper part of the quartz short column, the lower part of the quartz short column is inserted into the circular hole, and the quartz needle is inserted into the upward inner hole, so that the quartz ring can be directly sleeved on the quartz column at the bottom of the chamber, and the assembly and disassembly are convenient; the effect of being compatible with various wafer annealing scenes can be achieved through simple operation, so that the wafer box can be quickly disassembled after the annealing of the wafer product is completed, and the annealing efficiency of the wafer product is improved.

Description

Technical Field

[0001] This utility model belongs to the field of heat treatment technology, specifically a rapid annealing device. Background Technology

[0002] Annealing furnaces are heat treatment equipment widely used in many industrial fields. They are mainly used to heat and process various materials to change their physical and chemical properties. Annealing furnaces generate heat through electric heating, fuel oil, gas, etc., and transfer the heat to the materials inside the furnace. During the heating process, the materials undergo a series of physical and chemical changes. Among these, electric furnaces are the most widely used due to their ease of control and environmental friendliness.

[0003] In the existing electrothermal annealing furnace, the wafer product is placed inside the furnace during the annealing process. The electric heating elements (such as resistance wires or electrographite rods) inside the furnace generate heat when current passes through them. This heat is transferred to the product to be annealed through thermal conduction, thereby annealing the product.

[0004] The publication (announcement) number CN206204484U discloses an annealing device. The opening and closing of the annealing device is controlled by the up and down movement of the upper and lower insulation chambers along the lifting moving rod, which facilitates the installation and removal of the heating protection element. When the heating protection element is removed for cooling, it is fully exposed to room temperature for cooling, resulting in uniform cooling. The horizontal moving belt drives the heating protection element to move left and right, making the operation convenient.

[0005] However, existing electrothermal annealing furnaces often use wafer cassettes as the base for placing wafers, with a fixing frame on top. The wafers are fixed in the placement space between the wafer cassette and the fixing frame through snap-fit ​​connections to prevent the wafers from shaking. However, this placement method does not allow for quick disassembly of the wafer cassette. As a result, when the wafers are removed directly after annealing, they are still being heated and annealed, leading to over-annealing and making the wafers non-compliant with quality specifications. Therefore, the annealing equipment needs to be shut down when removing the wafers, which reduces the annealing efficiency. This paper proposes a rapid annealing equipment to solve the above problems. Utility Model Content

[0006] To address the problems mentioned in the background section, this invention provides a rapid annealing device that solves the problem of not being able to quickly disassemble the wafer cassette after annealing, thus reducing the annealing efficiency of the wafer products.

[0007] To achieve the above objectives, this utility model provides the following technical solution: a rapid annealing device, including an annealing furnace, a temperature measuring instrument at the bottom of the annealing furnace, an automatic chamber door on one side of the annealing furnace, a chamber structure inside the annealing furnace, a quartz long column on the bottom surface of the annealing furnace, a quartz module at the top of the quartz long column, quartz short columns arranged in a ring at equal angles inside the quartz module, a silicon ring at one end of each quartz short column, quartz needles arranged in a triangular relationship inside the quartz module, a wafer module in the cavity between the silicon ring and the quartz module, a support column in the middle of the annealing furnace, a support plate on the outer wall of the support column, a transmission component inside the support plate, and a positioning component at the top of the support column.

[0008] Preferably, the chamber structure includes a quartz tube, and a lamp tube is disposed inside the quartz tube.

[0009] Preferably, the quartz module includes a quartz ring, the quartz ring having several circular holes, the center of the quartz ring having multiple upper and lower protrusions, and one end of the quartz ring having a notch.

[0010] Preferably, the bottom of the protruding structure is provided with a downward inner hole, the top of the protruding structure is provided with an upward inner hole, the quartz ring is a ring-shaped structure and not a complete ring, and the circular hole is a circle with a diameter of 1 to 2 mm.

[0011] Preferably, the wafer module includes a wafer box, a cover is provided on the top of the wafer box, an annealed wafer is disposed in the cavity formed between the wafer box and the cover, and a robotic arm is provided at the bottom of the wafer box.

[0012] Preferably, the transmission assembly includes a first motor, the output end of the first motor is provided with a first rotating shaft, the outer wall of the first rotating shaft is provided with a first gear, one side of the first gear is meshed with a second gear, and the middle of the second gear is provided with a second rotating shaft.

[0013] Preferably, the positioning component includes a positioning rod, the outer wall of the positioning rod is provided with a positioning plate, the interior of the positioning plate is provided with a limiting rod at equal angles in a ring shape, one end of the limiting rod is provided with a positioning post, and the other end of the limiting rod is provided with a positioning block.

[0014] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0015] This invention comprises a wafer module, a quartz module, a quartz long pillar, a silicon ring, and a quartz needle. The silicon ring is fitted onto the narrower upper part of the quartz short pillar, and the lower part of the quartz short pillar is inserted into a circular hole. The quartz needle is inserted into an upward-facing inner hole. After assembly, the downward-facing inner hole is fitted onto the quartz long pillar. An automated mechanical structure places the annealed wafer into the wafer cassette. The annealed wafer is directly fed into the cavity by a robotic arm and placed above the quartz needle of the quartz ring, concentric with the quartz ring. This allows the quartz ring to be directly fitted onto the quartz pillar at the bottom of the cavity, facilitating easy assembly and disassembly. Through simple operation, it achieves compatibility with various wafer annealing scenarios, enabling rapid disassembly of the wafer cassette after annealing and improving the annealing efficiency of the wafer products. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall positional relationship structure of this utility model;

[0017] Figure 2 This is a schematic diagram showing the positional relationship of the chamber structure of this utility model;

[0018] Figure 3 This is a schematic diagram showing the positional relationship of the quartz column of this utility model;

[0019] Figure 4 This is a schematic diagram showing the structural relationship of the split positions of the wafer module of this utility model;

[0020] Figure 5 This is a schematic diagram showing the installation position relationship of the quartz short column of this utility model;

[0021] Figure 6 This is a schematic diagram of the structure of the quartz module of this utility model;

[0022] Figure 7 This is a schematic diagram of the positional relationship structure of the positioning component of this utility model;

[0023] Figure 8 This is a schematic diagram showing the positional relationship of the transmission components of this utility model;

[0024] Figure 9 This is a cross-sectional view of the positioning component of this utility model.

[0025] In the diagram: 1. Wafer module; 101. Wafer box; 102. Box cover; 103. Annealed wafer; 104. Robotic arm; 2. Quartz module; 201. Quartz ring; 202. Circular hole; 203. Protrusion structure; 2031. Downward inner hole; 2032. Upward inner hole; 204. Notch; 3. Quartz long pillar; 31. Quartz short pillar; 4. Silicon ring; 5. Quartz needle; 6. Annealing furnace; 7. Temperature measuring instrument; 8. Automatic cavity door 9. Chamber structure; 901. Quartz tube; 902. Lamp tube; 10. Support column; 11. Support plate; 12. Transmission assembly; 1201. First motor; 1202. First rotating shaft; 1203. First gear; 1204. Second gear; 1205. Second rotating shaft; 13. Positioning assembly; 1301. Positioning rod; 1302. Positioning plate; 1303. Limiting rod; 1304. Positioning column; 1305. Positioning block. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0027] like Figures 1 to 9 As shown, this utility model provides a rapid annealing device, including an annealing furnace 6, a temperature measuring instrument 7 at the bottom of the annealing furnace 6, an automatic chamber door 8 on one side of the annealing furnace 6, a chamber structure 9 inside the annealing furnace 6, a quartz long column 3 on the bottom surface of the annealing furnace 6, a quartz module 2 at the top of the quartz long column 3, quartz short columns 31 arranged in a ring at equal angles inside the quartz module 2, a silicon ring 4 at one end of the quartz short columns 31, quartz needles 5 arranged in a triangular relationship inside the quartz module 2, a wafer module 1 in the cavity between the silicon ring 4 and the quartz module 2, a support column 10 in the middle of the annealing furnace 6, a support plate 11 on the outer wall of the support column 10, a transmission component 12 inside the support plate 11, and a positioning component 13 at the top of the support column 10.

[0028] Using the above scheme: The silicon ring 4 is fitted into the thinner upper part of the quartz short pillar 31, the lower part of the quartz short pillar 31 is inserted into the circular hole 202, and the quartz needle 5 is inserted into the upward inner hole 2032. After assembly, the downward inner hole 2031 is fitted onto the quartz long pillar 3. An automated mechanical structure places the annealed wafer 103 into the wafer cassette 101. The robot, via its robotic arm 104, automatically feeds the wafer cassette 101 into the annealing furnace chamber, placing it on top of the three quartz long pillars 3 within the chamber. The transmission assembly 12 drives the first gear 1203 to rotate via the first rotating shaft 1202. The first gear 1203 drives the second gear 1204 to rotate, and the second gear 1204 drives the positioning pillar. When 1304 rotates, the positioning plate 1302 limits the limiting rod 1303. The limiting rod 1303 drives the positioning block 1305 to move along the limiting groove through the positioning column 1304, so that the positioning column 1304 is close to the center of the second gear 1204, and the positioning block 1305 positions the quartz module 2 and the silicon ring 4. The annealed wafer 103 is heated by the lamp tube 902, thereby realizing the annealing treatment of the annealed wafer 103. The quartz ring can be directly fitted onto the quartz column at the bottom of the chamber, which is convenient for disassembly and assembly. Through simple operation, it can achieve the effect of being compatible with various wafer annealing scenarios, so that the wafer box can be quickly disassembled after the wafer product is annealed, improving the annealing efficiency of the wafer product.

[0029] like Figures 1 to 3 As shown, the chamber structure 9 includes a quartz tube 901, and a lamp tube 902 is disposed inside the quartz tube 901;

[0030] The above-mentioned solution differs from conventional annealing furnaces. This equipment incorporates a quartz module 2 structure, allowing the chamber to anneal products with graphite wafer boxes under the typical annealing conditions for third-generation compound semiconductors SiC and GaN, as well as single-crystal Si-type wafers. Furthermore, the temperature compensation of the silicon ring 4 can improve the uniformity of the wafer surface temperature. The quartz module 2 can be directly fitted onto the quartz pillar 3 at the bottom of the chamber, making it easy to install and remove. Through simple operation, it can achieve compatibility with various wafer annealing scenarios.

[0031] If the surface temperature distribution of the annealed wafer 103 is uneven, the devices in different areas of the annealed wafer 103 will be affected by different heats during the manufacturing process, resulting in differences in device performance and directly reducing product quality. Uneven heat distribution will also accelerate the aging of components in the annealed wafer 103. This accelerated aging may cause the overall performance of the annealed wafer 103 to decline to the point where it can no longer be used, thereby increasing the product failure rate and maintenance costs. This device can make the temperature around the wafer less affected by the cold walls of the chamber, and the silicon ring 4 can play a certain role in temperature uniformity, making the surface temperature of the wafer more uniform during annealing.

[0032] like Figure 3 , Figure 5 and Figure 6 As shown, the quartz module 2 includes a quartz ring 201, which has several circular holes 202 on its ring, multiple upper and lower protrusions 203 at its center, and a notch 204 at one end of its ring.

[0033] The bottom of the protruding structure 203 is provided with a downward inner hole 2031, and the top of the protruding structure 203 is provided with an upward inner hole 2032. The quartz ring 201 is a ring structure and is not a complete ring. The diameter of the round hole 202 is 1 to 2 mm.

[0034] The above scheme is adopted as follows: the quartz ring 201 is a ring structure made of quartz with good light transmission performance; the quartz short pillars 31 are several quartz pillars with steps, and the thinner part at the bottom is inserted into the round hole 202 of the quartz ring 201; the silicon ring 4 is a ring structure made of the same material as or with similar performance to the annealed wafer 103; the silicon ring 4 has several small holes and fits into the thinner part at the top of the quartz short pillars 31; the quartz needle 5 is inserted into the upward inner hole 2032 set inside the quartz ring 201; after the whole assembly is completed, the downward inner hole 2031 inside the quartz ring 201 is fitted onto the three quartz long pillars 3 at the bottom of the cavity.

[0035] like Figure 1 , Figure 3 and Figure 4 As shown, the wafer module 1 includes a wafer box 101, a box cover 102 is provided on the top of the wafer box 101, an annealed wafer 103 is provided in the cavity formed between the wafer box 101 and the box cover 102, and a robot arm 104 is provided at the bottom of the wafer box 101.

[0036] Using the above scheme: The inner surface of the annealing furnace 6 is gold-plated aluminum alloy vacuum chamber, which consists of three parts: upper, middle and lower. The lamp tubes 902 and quartz tubes 901 are installed vertically and alternately. A temperature measuring instrument 7 is installed below the bottom plate of the annealing furnace 6 to detect the temperature of the product. Three high-temperature resistant cylinders made of quartz or ceramic are arranged above the bottom plate. The cylinders pass through the gaps of the lamp tubes 902 below. The three cylinders are evenly distributed. The annealing wafer 103 or wafer box 101 can be automatically transported by the robot and placed on the top of the quartz long column 3. The lamp tubes 902 heat the annealing wafer 103.

[0037] The wafer box 101 is made of graphite or silicon carbide and is resistant to high temperatures; the box cover 102 is made of graphite or silicon carbide and is resistant to high temperatures; the annealed wafer 103 is the wafer product to be annealed. The annealed wafer 103 is placed in the wafer box 101 by an automated mechanical structure and sent into the annealing furnace chamber by a robot arm 104, and placed on the three quartz pillars 3 in the chamber for annealing.

[0038] like Figures 7 to 9As shown, the transmission assembly 12 includes a first motor 1201, a first rotating shaft 1202 is provided at the output end of the first motor 1201, a first gear 1203 is provided on the outer wall of the first rotating shaft 1202, a second gear 1204 is meshed on one side of the first gear 1203, and a second rotating shaft 1205 is provided in the middle of the second gear 1204.

[0039] The positioning component 13 includes a positioning rod 1301, a positioning plate 1302 is provided on the outer wall of the positioning rod 1301, a limiting rod 1303 is provided in a ring at equal angles inside the positioning plate 1302, a positioning post 1304 is provided at one end of the limiting rod 1303, and a positioning block 1305 is provided at the other end of the limiting rod 1303.

[0040] The above scheme is adopted. It is worth noting that the transmission component 12 and the positioning component 13 are made of the same material as the quartz module 2 and the silicon ring 4. The bottom end of the first rotating shaft 1202 is rotatably connected to the annealing furnace 6. The first rotating shaft 1202 is limited and supported by the annealing furnace 6. The outside of the first motor 1201 is connected and fixed to the annealing furnace 6. The first motor 1201 is located outside the annealing furnace 6, which can avoid the high temperature inside the annealing furnace 6 from affecting the operation of the first motor 1201.

[0041] The first motor 1201 drives the first gear 1203 to rotate via the first rotating shaft 1202. The first gear 1203 drives the second gear 1204 to rotate, and the second gear 1204 drives the positioning post 1304 to rotate. Because the positioning plate 1302 limits the limiting rod 1303, the limiting rod 1303 drives the positioning block 1305 to move along the limiting groove via the positioning post 1304, so that the positioning post 1304 is close to the center of the second gear 1204, and the positioning block 1305 positions the quartz module 2 and the silicon ring 4. The interior of the second gear 1204 is provided with an arc-shaped groove that matches the size of the positioning post 1304 at equal angles. The interior of the positioning plate 1302 is provided with a limiting groove that matches the size of the limiting rod 1303 at equal angles. The bottom end of the positioning rod 1301 is fixedly installed with the support column 10, and the positioning plate 1302 is fixed in place by the positioning rod 1301 and the support column 10.

[0042] Working principle and usage process of this utility model:

[0043] First, the silicon ring 4 is fitted into the thinner part of the upper part of the quartz short pillar 31, and the round hole 202 is inserted into the lower part of the quartz short pillar 31. The quartz needle 5 is inserted into the upward inner hole 2032. After the whole assembly is completed, the downward inner hole 2031 is fitted into the quartz long pillar 3. At this time, the automated mechanical structure places the annealed wafer 103 into the wafer box 101. The robot automatically sends the wafer box 101 into the annealing furnace chamber through the robotic arm 104 and places it on the top of the three quartz long pillars 3 in the chamber.

[0044] After placing the wafer box 101 on the top of the quartz column 3, the first motor 1201 drives the first gear 1203 to rotate through the first rotating shaft 1202. The first gear 1203 drives the second gear 1204 to rotate. At this time, the second gear 1204 drives the positioning post 1304 to rotate. Since the positioning plate 1302 limits the limiting rod 1303, the limiting rod 1303 drives the positioning block 1305 to move along the limiting groove through the positioning post 1304, so that the positioning post 1304 is close to the center of the second gear 1204, and the positioning block 1305 positions the quartz module 2 and the silicon ring 4.

[0045] After the quartz module 2 and silicon ring 4 are positioned, the annealed wafer 103 can be heated by the lamp tube 902, thereby realizing the annealing treatment of the annealed wafer 103 and completing the operation.

[0046] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that includes a list of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus.

[0047] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A rapid annealing apparatus, comprising an annealing furnace (6), characterized in that: A temperature measuring instrument (7) is provided at the bottom of the annealing furnace (6). An automatic chamber door (8) is provided on one side of the annealing furnace (6). A chamber structure (9) is provided inside the annealing furnace (6). A quartz long column (3) is provided on the bottom surface of the annealing furnace (6). A quartz module (2) is provided at the top of the quartz long column (3). Quartz short columns (31) are arranged in a ring at equal angles inside the quartz module (2). A silicon ring (4) is provided at one end of the quartz short column (31). Quartz needles (5) are arranged in a triangular relationship inside the quartz module (2). A wafer module (1) is provided in the cavity between the silicon ring (4) and the quartz module (2). A support column (10) is provided in the middle of the annealing furnace (6). A support plate (11) is provided on the outer wall of the support column (10). A transmission component (12) is provided inside the support plate (11). A positioning component (13) is provided at the top of the support column (10).

2. The rapid annealing equipment according to claim 1, characterized in that: The chamber structure (9) includes a quartz tube (901), and a lamp tube (902) is disposed inside the quartz tube (901).

3. The rapid annealing equipment according to claim 1, characterized in that: The quartz module (2) includes a quartz ring (201), which has several circular holes (202) on its ring, and multiple upper and lower protrusions (203) at the center of the quartz ring (201). One end of the quartz ring (201) has a notch (204).

4. The rapid annealing equipment according to claim 3, characterized in that: The bottom of the protruding structure (203) is provided with a downward inner hole (2031), the top of the protruding structure (203) is provided with an upward inner hole (2032), the quartz ring (201) is a ring structure and is not a complete ring, and the circular hole (202) is a circle with a diameter of 1 to 2 mm.

5. The rapid annealing equipment according to claim 1, characterized in that: The wafer module (1) includes a wafer box (101), a cover (102) is provided on the top of the wafer box (101), an annealed wafer (103) is provided in the cavity formed between the wafer box (101) and the cover (102), and a robot arm (104) is provided at the bottom of the wafer box (101).

6. The rapid annealing equipment according to claim 1, characterized in that: The transmission assembly (12) includes a first motor (1201), the output end of the first motor (1201) is provided with a first rotating shaft (1202), the outer wall of the first rotating shaft (1202) is provided with a first gear (1203), a second gear (1204) meshes with one side of the first gear (1203), and a second rotating shaft (1205) is provided in the middle of the second gear (1204).

7. The rapid annealing equipment according to claim 1, characterized in that: The positioning component (13) includes a positioning rod (1301), a positioning plate (1302) is provided on the outer wall of the positioning rod (1301), and a limiting rod (1303) is provided in a ring at equal angles inside the positioning plate (1302). A positioning post (1304) is provided at one end of the limiting rod (1303), and a positioning block (1305) is provided at the other end of the limiting rod (1303).

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