Laser dissipation device

Abstract

The utility model discloses a laser dissipation device, which comprises a fixed base, an outer side mounting frame, an inner side mounting frame, an optical sheet, a first elastic sheet and a second elastic sheet, the first elastic sheet is provided with a base connecting hole and a plurality of first outer frame connecting holes, the base connecting convex columns of the fixed base are fixed in the base connecting hole in a dispensing manner, and the first outer frame connecting convex columns of the outer side mounting frame are fixed in the corresponding first outer frame connecting holes in a dispensing manner respectively; a second outer frame connecting hole and a plurality of inner frame connecting holes are formed in the second elastic piece, a second outer frame connecting convex column of the outer side mounting frame is fixed in the second outer frame connecting hole in a dispensing mode, and inner frame connecting convex columns of the inner side mounting frame are fixed in the corresponding inner frame connecting holes in a dispensing mode respectively; the first elastic sheet and the second elastic sheet are non-magnetic conductive pieces respectively; and the base connecting convex columns, all or part of the first outer frame connecting convex columns and all or part of the inner frame connecting convex columns are respectively provided with convex column dispensing grooves. By means of the structural design, the device has the advantages of being novel in design, simple in structure and good in stability and reliability.

Description

Technical Field

[0001] This utility model relates to the field of optical device technology, and in particular to a laser dissipation device. Background Art

[0002] A Chinese utility model patent with patent number ZL202222670566.8 and patent title "A Galvanometer Assembly" discloses a laser dissipation device. Specifically, the galvanometer assembly discloses the following technical solution: A galvanometer assembly includes a fixed base, a lens mounting frame, a refractive lens, a first voice coil driving mechanism, and a second voice coil driving mechanism. The lens mounting frame includes a movable outer frame and a movable inner frame. The refractive lens is mounted on the movable inner frame. The first voice coil driving mechanism is driven by the movable outer frame, and the second voice coil driving mechanism is driven by the movable inner frame. Two first spring plates are installed between the movable outer frame and the fixed base, arranged opposite each other. The two first spring plates are located on opposite sides of the movable outer frame. Each first spring plate includes a first base and a first cantilever beam. The base mounting hole of the first base is engaged with the base mounting hole of the fixed base, and the first outer frame connecting hole of the first cantilever beam is connected to the movable outer frame. The outer frame connecting part is fastened; two second spring plates are installed between the movable outer frame and the movable inner frame, which are arranged opposite each other. The two second spring plates are located on opposite sides of the movable inner frame. The second spring plate includes a second base and a second cantilever beam. The outer frame mounting hole of the second base is fastened to the outer frame connecting protrusion of the movable outer frame. The second inner frame connecting hole of the second cantilever beam is fastened to the inner frame connecting part of the movable inner frame. The first voice coil drive mechanism includes a first magnet installed on the movable outer frame and a first drive coil installed on the fixed base. The second voice coil drive mechanism includes a second magnet installed on the movable inner frame and a second drive coil installed on the fixed base. The fixed base is equipped with a PCB circuit board that is electrically connected to the first drive coil and the second drive coil respectively. The movable outer frame is equipped with a first magnetic shielding plate located between the first magnet and the second spring plate. The movable inner frame is equipped with a second magnetic shielding plate located between the second magnet and the first spring plate.

[0003] It should be noted that the above-mentioned galvanometer assembly has the following drawbacks, specifically:

[0004] Defect 1: The base mounting hole of the first base is locked to the base mounting hole of the fixed base; the first outer frame connecting hole of the first cantilever beam is locked to the outer frame connecting part of the movable outer frame; the outer frame mounting hole of the second base is locked to the outer frame connecting protrusion of the movable outer frame; and the second inner frame connecting hole of the second cantilever beam is locked to the inner frame connecting part of the movable inner frame. For the above-mentioned locking connection method, due to the weight of the movable outer frame, the movable inner frame, and the refractive lens, as well as their respective vibration movements, the above-mentioned locking connection method is prone to loosening under high-frequency and large-amplitude movements, that is, there is a problem of poor stability and reliability.

[0005] Defect 2: The first magnet and the second spring sheet are magnetically shielded by the first magnetic shielding sheet, and the second magnet and the first spring sheet are magnetically shielded by the second magnetic shielding sheet. As independent structural components, the first magnetic shielding sheet and the second magnetic shielding sheet increase the complexity of the overall structure and the assembly process. Utility Model Content

[0006] The purpose of this invention is to provide a laser dissipation device that addresses the shortcomings of existing technologies. This laser dissipation device has a novel design, simple structure, and good stability and reliability.

[0007] To achieve the above objectives, this utility model is implemented through the following technical solution.

[0008] A laser dissipation device includes a fixed base, an outer mounting frame, an inner mounting frame, and an optical plate. The optical plate is mounted on the inner mounting frame, which is located inside the outer mounting frame. The fixed base is connected to the outer mounting frame via two first springs arranged opposite each other at intervals, and the outer mounting frame is connected to the inner mounting frame via two second springs arranged opposite each other at intervals.

[0009] The first spring has a base connection hole and several first outer frame connection holes. The fixed base is provided with a base connection protrusion, and the outer mounting frame is provided with several first outer frame connection protrusions. The base connection protrusions are embedded in the base connection holes, and each first outer frame connection protrusion is embedded in the corresponding first outer frame connection hole.

[0010] The second spring has a second outer frame connecting hole and several inner frame connecting holes. The outer mounting frame is provided with a second outer frame connecting protrusion, and the inner mounting frame is provided with several inner frame connecting protrusions. The second outer frame connecting protrusion is embedded in the second outer frame connecting hole, and each inner frame connecting protrusion is embedded in the corresponding inner frame connecting hole.

[0011] The first and second springs are non-magnetic components;

[0012] The base connecting protrusion, all or part of the first outer frame connecting protrusion, and all or part of the inner frame connecting protrusion are respectively provided with protrusion glue grooves. The connection between the base connecting protrusion and the base connecting hole is fixed with glue. The connection between the first outer frame connecting protrusion with the protrusion glue groove and the corresponding first outer frame connecting hole is fixed with glue. The connection between the inner frame connecting protrusion with the protrusion glue groove and the corresponding inner frame connecting hole is fixed with glue.

[0013] The outer mounting frame has a glue-hiding groove at the position of the second outer frame connecting protrusion. The second outer frame connecting protrusion is located in the glue-hiding groove. The second outer frame connecting hole of the second spring extends into the glue-hiding groove, and glue is applied to fix the connection between the second outer frame connecting protrusion and the second outer frame connecting hole.

[0014] The laser dissipation device also includes an outer frame driving magnet, an inner frame driving magnet, an outer frame driving coil, an inner frame driving coil, and a PCBA circuit board.

[0015] The outer frame drive magnet is installed on the outer mounting frame, and the inner frame drive magnet is installed on the inner mounting frame. The outer frame drive coil is directly opposite the outer frame drive magnet, and the inner frame drive coil is directly opposite the inner frame drive magnet.

[0016] The outer frame driving magnet and the inner frame driving magnet are both quadrupole magnets;

[0017] The outer frame mounting frame has an outer frame mounting groove corresponding to the outer frame driving magnet. The inner wall of the outer frame mounting groove has an outer frame adhesive groove. The outer frame driving magnet is embedded in the outer frame mounting groove and is fixed in the outer frame mounting groove by adhesive.

[0018] The inner mounting frame has an inner frame mounting groove corresponding to the inner frame driving magnet. The inner wall of the inner frame mounting groove has an inner frame adhesive groove. The inner frame driving magnet is embedded in the inner frame mounting groove and is fixed in the inner frame mounting groove by adhesive.

[0019] The upper surface of the fixing base is provided with a groove whose shape is adapted to the shape of the substrate of the PCBA circuit board, and the fixing base is provided with a number of glue-coated pillars located in the groove.

[0020] The PCBA circuit board substrate is embedded into the recess of the fixing base, and the PCBA circuit board substrate is fixed in the recess of the fixing base by adhesive dispensing.

[0021] The PCBA circuit board substrate has clearance slots for the outer frame drive coil and the inner frame drive coil, respectively. The bottom surface of the recessed groove is provided with coil positioning posts corresponding to each clearance slot, and each coil positioning post passes through the corresponding clearance slot.

[0022] The outer frame drive coil and the inner frame drive coil are respectively positioned and installed on the upper surface of the PCBA circuit board substrate by coil positioning posts, and the outer frame drive coil and the inner frame drive coil are respectively glued and fixed to the upper surface of the PCBA circuit board substrate.

[0023] Compared with the prior art, the present invention has the following beneficial effects, specifically:

[0024] 1. The first and second springs of this utility model are both non-magnetic components, which can prevent the magnetic force between the product itself or the magnets or magnetic objects in the installation environment and the springs, thereby preventing the magnetic force from affecting the product performance and improving the stability and reliability of use. Compared with the prior art, this utility model eliminates the magnetic shielding sheet structure as an independent structural component, that is, the laser dissipation device of this utility model has a simpler structure and fewer assembly steps.

[0025] 2. Since the base connecting protrusion, all or part of the first outer frame connecting protrusion, and all or part of the inner frame connecting protrusion are respectively provided with protrusion glue groove, during the glue fixing process, the glue will fill into the above protrusion glue groove. After the glue cures, the glue and the position of the protrusion glue groove will form an inverted structure to increase the stability of glue fixing, thereby improving the stability, reliability and service life of the product.

[0026] 3. Therefore, the laser dissipation device of this utility model has the advantages of novel design, simple structure and good stability and reliability. Attached Figure Description

[0027] The present invention will be further described below with reference to the accompanying drawings, but the embodiments in the drawings do not constitute any limitation on the present invention.

[0028] Figure 1 This is a schematic diagram of the structure of this utility model.

[0029] Figure 2 This is an exploded view of the present invention.

[0030] Figure 3 This is a schematic diagram of the outer mounting frame of this utility model.

[0031] Figure 4 This is a schematic diagram of the inner mounting frame of this utility model.

[0032] Figure 5 This is a partial structural schematic diagram of the present invention.

[0033] Figure 6 This is an exploded view of a partial structure of the present invention.

[0034] exist Figures 1 to 6 This includes:

[0035] 1-Fixed base; 11-Base connecting protrusion; 12-Sinking groove; 13-Glue-coated post; 14-Wire coil positioning post; 2-Outer mounting frame; 21-First outer frame connecting protrusion; 22-Second outer frame connecting protrusion; 23-Glue-concealing groove; 24-Outer frame mounting groove; 25-Outer frame glue dispensing groove; 3-Inner mounting frame; 31-Inner frame connecting protrusion; 32-Inner frame mounting groove; 33-Inner frame glue dispensing groove; 4-Optical sheet; 51-First spring; 511-Base connecting hole; 512-First outer frame connecting hole; 52-Second spring; 521-Second outer frame connecting hole; 522-Inner frame connecting hole; 6-Protrusion glue dispensing groove; 71-Outer frame driving magnet; 72-Inner frame driving magnet; 81-Outer frame driving wire coil; 82-Inner frame driving wire coil; 9-PCBA circuit board; 91-Substrate; 911-Air-avoiding groove. Detailed Implementation

[0036] The present invention will now be described in conjunction with specific embodiments.

[0037] Example 1, as Figure 1 and Figure 2 As shown, a laser dissipation device includes a fixed base 1, an outer mounting frame 2, an inner mounting frame 3, and an optical plate 4. The optical plate 4 is mounted on the inner mounting frame 3, which is located inside the outer mounting frame 2. The fixed base 1 is connected to the outer mounting frame 2 via two opposing and spaced first springs 51, and the outer mounting frame 2 is connected to the inner mounting frame 3 via two opposing and spaced second springs 52.

[0038] Among them, such as Figures 1 to 3 As shown, the first spring piece 51 has a base connection hole 511 and a plurality of first outer frame connection holes 512. The fixed base 1 is provided with a base connection protrusion 11, and the outer mounting frame 2 is provided with a plurality of first outer frame connection protrusions 21. The base connection protrusion 11 is embedded in the base connection hole 511, and each first outer frame connection protrusion 21 is embedded in the corresponding first outer frame connection hole 512.

[0039] Furthermore, such as Figure 1 , Figure 2 as well as Figure 4 As shown, the second spring 52 has a second outer frame connecting hole 521 and several inner frame connecting holes 522. The outer mounting frame 2 is provided with a second outer frame connecting protrusion 22, and the inner mounting frame 3 is provided with several inner frame connecting protrusions 31. The second outer frame connecting protrusion 22 is embedded in the second outer frame connecting hole 521, and each inner frame connecting protrusion 31 is embedded in the corresponding inner frame connecting hole 522.

[0040] It should be noted that the first spring 51 and the second spring 52 are non-magnetic components.

[0041] In addition, if Figure 1and Figure 2 As shown, the base connecting protrusion 11, all or part of the first outer frame connecting protrusion 21, and all or part of the inner frame connecting protrusion 31 are respectively provided with protrusion glue grooves 6. The base connecting protrusion 11 is glued and fixed at the connection with the base connecting hole 511. The first outer frame connecting protrusion 21 with protrusion glue grooves 6 is glued and fixed at the connection with the corresponding first outer frame connecting hole 512. The inner frame connecting protrusion 31 with protrusion glue grooves 6 is glued and fixed at the connection with the corresponding inner frame connecting hole 522.

[0042] Since both the first spring 51 and the second spring 52 in this embodiment are non-magnetic components, they have the following advantages: they prevent magnetic forces from being generated between the product itself or magnets or magnetic objects in the installation environment and the springs, thereby preventing magnetic forces from affecting product performance and improving stability and reliability. Compared with the prior art, this embodiment eliminates the magnetic shielding sheet structure as an independent structural component, meaning that the laser dissipation device in this embodiment has a simpler structure and fewer assembly steps.

[0043] It should be emphasized that, since the base connecting protrusion 11, all or part of the first outer frame connecting protrusion 21, and all or part of the inner frame connecting protrusion 31 are respectively provided with protrusion glue grooves 6, during the glue dispensing and fixing process, the glue will fill into the above-mentioned protrusion glue grooves 6. After the glue has cured, the glue and the position of the protrusion glue groove 6 will form an inverted structure to increase the stability of glue dispensing and fixing, thereby improving the stability, reliability and service life of the product.

[0044] In summary, the laser dissipation device of this embodiment has the advantages of novel design, simple structure, and good stability and reliability through the above structural design.

[0045] Example 2, as Figures 1 to 3 As shown, the difference between this embodiment 2 and embodiment 1 is that: the outer mounting frame 2 has a glue-hiding groove 23 at the position of the second outer frame connecting protrusion 22, the second outer frame connecting protrusion 22 is located in the glue-hiding groove 23, the second outer frame connecting hole 521 of the second spring piece 52 extends into the glue-hiding groove 23, and the connection between the second outer frame connecting protrusion 22 and the second outer frame connecting hole 521 is fixed with glue.

[0046] When the second outer frame connecting protrusion 22 is connected to the second outer frame connecting hole 521 by dispensing adhesive, the adhesive will fill into the adhesive groove 23. The structure of the adhesive groove 23 can effectively increase the stability of the cured adhesive during dispensing adhesive fixation, thereby improving the connection stability and reliability between the second spring 52 and the outer mounting frame 2.

[0047] Example 3, as Figure 1 , Figure 2 , Figure 5 as well as Figure 6 As shown, the difference between this embodiment three and embodiment one is that the laser dissipation device further includes an outer frame driving magnet 71, an inner frame driving magnet 72, an outer frame driving coil 81, an inner frame driving coil 82, and a PCBA circuit board 9; wherein, the substrate 91 of the PCBA circuit board 9 is a single-layer PCB board.

[0048] The outer frame drive magnet 71 is installed on the outer mounting frame 2, the inner frame drive magnet 72 is installed on the inner mounting frame 3, the outer frame drive coil 81 is directly opposite the outer frame drive magnet 71, and the inner frame drive coil 82 is directly opposite the inner frame drive magnet 72.

[0049] Example 4, as Figure 3 and Figure 4 As shown, the difference between this embodiment four and embodiment three is that the outer frame driving magnet 71 and the inner frame driving magnet 72 are quadrupole magnets.

[0050] The outer frame mounting frame 2 has an outer frame mounting groove 24 corresponding to the outer frame driving magnet 71. The inner wall of the outer frame mounting groove 24 has an outer frame adhesive groove 25. The outer frame driving magnet 71 is embedded in the outer frame mounting groove 24 and is fixed in the outer frame mounting groove 24 by adhesive dispensing.

[0051] In addition, the inner frame mounting frame 3 has an inner frame mounting groove 32 corresponding to the inner frame driving magnet 72. The inner wall of the inner frame mounting groove 32 has an inner frame adhesive groove 33. The inner frame driving magnet 72 is embedded in the inner frame mounting groove 32 and is fixed in the inner frame mounting groove 32 by adhesive.

[0052] When the outer frame drive magnet 71 is glued and fixed in the outer frame mounting groove 24 of the outer mounting frame 2, the outer frame glue groove 25 can effectively increase the stability and reliability of the glue fixation between the two; similarly, when the inner frame drive magnet 72 is glued and fixed in the inner frame mounting groove 32 of the inner mounting frame 3, the inner frame glue groove 33 can effectively increase the stability and reliability of the glue fixation between the two.

[0053] Example 5, such as Figure 5 and Figure 6 As shown, the difference between this fifth embodiment and the third embodiment is that: the upper surface of the fixing base 1 is provided with a groove 12 whose shape is adapted to the shape of the substrate 91 of the PCBA circuit board 9, and the fixing base 1 is provided with a plurality of glue-coated pillars 13 located in the groove 12.

[0054] The substrate 91 of the PCBA circuit board 9 is embedded in the recess 12 of the fixing base 1, and the substrate 91 of the PCBA circuit board 9 is fixed in the recess 12 of the fixing base 1 by dispensing glue.

[0055] When the substrate 91 of the PCBA circuit board 9 is fixedly installed in the recess 12 of the fixing base 1 by dispensing adhesive, the adhesive will cover the glue-coated pillar 13 in the recess 12 after curing. The connection between the glue-coated pillar 13 and the adhesive can further improve the fixing strength of the substrate 91 of the PCBA circuit board 9.

[0056] Example 6, as Figure 5 and Figure 6 As shown, the difference between this embodiment six and embodiment five is that: the substrate 91 of the PCBA circuit board 9 is provided with clearance slots 911 corresponding to the outer frame drive coil 81 and the inner frame drive coil 82, and the bottom surface of the recess 12 is provided with coil positioning posts 14 corresponding to each clearance slot 911, and each coil positioning post 14 passes through the corresponding clearance slot 911.

[0057] The outer frame drive coil 81 and the inner frame drive coil 82 are respectively positioned and installed on the upper surface of the substrate 91 of the PCBA circuit board 9 by the coil positioning post 14, and the outer frame drive coil 81 and the inner frame drive coil 82 are respectively fixed to the upper surface of the substrate 91 of the PCBA circuit board 9 by dispensing glue.

[0058] During the installation of the outer frame drive coil 81 and the inner frame drive coil 82, the outer frame drive coil 81 and the inner frame drive coil 82 are positioned by corresponding coil positioning posts 14, so that the outer frame drive coil 81 and the inner frame drive coil 82 can be quickly and accurately positioned in the installation position. Then, the outer frame drive coil 81 and the inner frame drive coil 82 are fixed by applying adhesive. In addition, the coil positioning posts 14 can also increase the bonding strength of the adhesive, thereby increasing the fixing strength of the outer frame drive coil 81 and the inner frame drive coil 82.

[0059] For the clearance slot 911 on the substrate 91 of the PCBA circuit board 9, it can facilitate the lead-out of the outer frame drive coil 81 and the inner frame drive coil 82, so as to achieve lead-out clearance and thus ensure the flatness of the installation of the outer frame drive coil 81 and the inner frame drive coil 82.

[0060] The above description is only a preferred embodiment of this utility model. For those skilled in the art, there will be changes in the specific implementation method and application scope based on the idea of ​​this utility model. The content of this specification should not be construed as a limitation of this utility model.

Claims

1. A laser dissipation device, comprising a fixed base (1), an outer mounting frame (2), an inner mounting frame (3), and an optical plate (4), wherein the optical plate (4) is mounted on the inner mounting frame (3), the inner mounting frame (3) is located inside the outer mounting frame (2), the fixed base (1) is connected to the outer mounting frame (2) by two first springs (51) arranged opposite each other at intervals, and the outer mounting frame (2) is connected to the inner mounting frame (3) by two second springs (52) arranged opposite each other at intervals; The first spring (51) has a base connection hole (511) and several first outer frame connection holes (512). The fixed base (1) is provided with a base connection protrusion (11), and the outer mounting frame (2) is provided with several first outer frame connection protrusions (21). The base connection protrusions (11) are embedded in the base connection hole (511), and each first outer frame connection protrusion (21) is embedded in the corresponding first outer frame connection hole (512). The second spring (52) has a second outer frame connecting hole (521) and several inner frame connecting holes (522). The outer mounting frame (2) is provided with a second outer frame connecting protrusion (22), and the inner mounting frame (3) is provided with several inner frame connecting protrusions (31). The second outer frame connecting protrusion (22) is embedded in the second outer frame connecting hole (521), and each inner frame connecting protrusion (31) is embedded in the corresponding inner frame connecting hole (522). Its features are: The first spring (51) and the second spring (52) are non-magnetic components; The base connecting protrusion (11), all or part of the first outer frame connecting protrusion (21), and all or part of the inner frame connecting protrusion (31) are respectively provided with protrusion glue groove (6). The base connecting protrusion (11) is glued and fixed at the connection with the base connecting hole (511). The first outer frame connecting protrusion (21) with the protrusion glue groove (6) is glued and fixed at the connection with the corresponding first outer frame connecting hole (512). The inner frame connecting protrusion (31) with the protrusion glue groove (6) is glued and fixed at the connection with the corresponding inner frame connecting hole (522).

2. The laser dissipation device according to claim 1, characterized in that: The outer mounting frame (2) has a glue-hiding groove (23) at the position of the second outer frame connecting protrusion (22). The second outer frame connecting protrusion (22) is located in the glue-hiding groove (23). The second outer frame connecting hole (521) of the second spring piece (52) extends into the glue-hiding groove (23), and glue is applied to the connection between the second outer frame connecting protrusion (22) and the second outer frame connecting hole (521) for fixation.

3. The laser dissipation device according to claim 1, characterized in that: The laser dissipation device also includes an outer frame drive magnet (71), an inner frame drive magnet (72), an outer frame drive coil (81), an inner frame drive coil (82), and a PCBA circuit board (9). The outer frame drive magnet (71) is installed on the outer mounting frame (2), and the inner frame drive magnet (72) is installed on the inner mounting frame (3). The outer frame drive coil (81) is directly opposite the outer frame drive magnet (71), and the inner frame drive coil (82) is directly opposite the inner frame drive magnet (72).

4. The laser dissipation device according to claim 3, characterized in that: The outer frame driving magnet (71) and the inner frame driving magnet (72) are both quadrupole magnets; The outer mounting frame (2) has an outer frame mounting groove (24) corresponding to the outer frame driving magnet (71). The inner wall of the outer frame mounting groove (24) has an outer frame glue groove (25). The outer frame driving magnet (71) is embedded in the outer frame mounting groove (24) and the outer frame driving magnet (71) is glued and fixed in the outer frame mounting groove (24). The inner mounting frame (3) has an inner frame mounting groove (32) corresponding to the inner frame driving magnet (72). The inner wall of the inner frame mounting groove (32) has an inner frame adhesive groove (33). The inner frame driving magnet (72) is embedded in the inner frame mounting groove (32) and the inner frame driving magnet (72) is fixed in the inner frame mounting groove (32) by adhesive.

5. The laser dissipation device according to claim 3, characterized in that: The upper surface of the fixed base (1) is provided with a groove (12) whose shape is adapted to the shape of the substrate (91) of the PCBA circuit board (9), and the fixed base (1) is provided with a plurality of glue-coated pillars (13) located in the groove (12). The substrate (91) of the PCBA circuit board (9) is embedded in the groove (12) of the fixing base (1), and the substrate (91) of the PCBA circuit board (9) is fixed in the groove (12) of the fixing base (1) by dispensing glue.

6. The laser dissipation device according to claim 5, characterized in that: The substrate (91) of the PCBA circuit board (9) is provided with clearance slots (911) corresponding to the outer frame drive coil (81) and the inner frame drive coil (82). The bottom surface of the recess (12) is provided with coil positioning posts (14) corresponding to each clearance slot (911). Each coil positioning post (14) passes through the corresponding clearance slot (911). The outer frame drive coil (81) and the inner frame drive coil (82) are respectively positioned and installed on the upper surface of the substrate (91) of the PCBA circuit board (9) by the coil positioning post (14), and the outer frame drive coil (81) and the inner frame drive coil (82) are respectively glued and fixed to the upper surface of the substrate (91) of the PCBA circuit board (9).

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