Novel DSP power amplifier with good heat dissipation effect

Abstract

The utility model relates to the technical field of power amplifiers, and particularly discloses a novel DSP power amplifier with a good heat dissipation effect, which comprises a power amplifier shell, a DSP power amplifier control circuit board is arranged in the power amplifier shell, a plurality of peripheral interfaces are arranged on the DSP power amplifier control circuit board, a heat dissipation fan is arranged on the inner side of the end part of the power amplifier shell, and the power amplifier shell and the DSP power amplifier control circuit board are connected through the heat dissipation fan. The heat dissipation fan is electrically connected with the DSP power amplifier control circuit board through a power line, a plurality of heat dissipation through holes communicated with the heat dissipation fan are formed in the end of the power amplifier shell, and a plurality of heat dissipation fins are arranged on the side face of the power amplifier shell. According to the DSP power amplifier, heat in the power amplifier shell is dissipated out through the heat dissipation through holes by arranging the heat dissipation fan, heat dissipation is further carried out on the power amplifier shell through the heat dissipation fins, the heat dissipation efficiency is improved, the heat dissipation effect is good, internal circuits can be prevented from being damaged, and the service life of the DSP power amplifier can be prolonged.

Description

Technical Field

[0001] This utility model relates to the field of power amplifier technology, and in particular to a new type of DSP power amplifier with good heat dissipation. Background Technology

[0002] DSP amplifiers can be understood as amplifiers with a built-in DSP microprocessor. This has been a trend in recent years, and DSP amplifiers offer many advantages, such as convenient crossover, more intuitive adjustment of delay and sound effects, allowing users to easily achieve their preferred sound signature. A DSP processor amplifier refers to an amplifier that uses a DSP chip, enabling computer-based adjustment of parameters for each channel and better management of the amplifier. DSP amplifiers have several advantages that ordinary amplifiers lack: 1. Integrating the DSP module into the amplifier saves on wiring costs and interference, as well as saving installation space in the car; 2. Amplifiers with DSP functionality can easily perform active crossover, delay processing, and EQ adjustments, improving the complex environment of the car and making the sound system more pleasant and enjoyable to listen to.

[0003] A search revealed a Chinese utility model patent with patent application number CN202222619235.1, which discloses a DSP power amplifier structure, including an amplifier box and a speaker box. The amplifier box and the speaker box are movably mounted together via a hinge. The amplifier box contains an amplifier control panel, and the speaker box contains an audio control panel. A locking latch is provided on the side of the amplifier box and the speaker box opposite the hinge. A first telescopic rod is provided on one side of the amplifier box, and a second telescopic rod is provided on the side of the speaker box. This utility model, through the hinged connection between the amplifier box and the speaker box, allows the amplifier box and the speaker box to be closed by rotating the hinge to form a trolley case. When engaging in outdoor activities, the telescopic rod can be extended, and the amplifier box and the speaker box can be moved freely by the casters at the bottom of the two boxes, making them easy to transport. The amplifier box and the speaker box also do not require separate connection, making them more convenient to use.

[0004] For example, Chinese utility model patent application CN202123036536.3 discloses a digital power amplifier with DSP, relating to the field of digital power amplifier technology. It includes a housing with a groove on the right side, inside which an interface socket is installed. The front and rear ends of the interface socket are connected to rotating shafts. A chuck is installed at the rear end of the rotating shafts, and a slot is formed inside the chuck. A protective cover is installed on the right side of the back of the housing, and a hinge is installed inside the protective cover. A limit rod is connected to the outside of the hinge, and a lifting rope is connected to the top of the limit rod. In this utility model, the interface socket is movably installed on the right side of the housing, allowing it to be reversed. After use, pulling the lifting rope upwards causes the limit rod to rotate around the hinge, disengaging it from the slot. Pressing the interface socket inwards then allows it to rotate around the rotating shaft, retracting the interface end into the housing, effectively preventing damage to the exposed interface.

[0005] While the existing DSP power amplifiers can meet basic usage requirements, they all use natural heat dissipation. The heat generated during operation can only be dissipated through the heat dissipation holes on the casing, resulting in poor heat dissipation. The heat cannot be dissipated in time, which can easily cause damage to the internal circuitry and affect the service life of the DSP power amplifier. Utility Model Content

[0006] The technical problem to be solved by this utility model is to provide a new type of DSP power amplifier with good heat dissipation, in order to solve the problems of poor heat dissipation and easy damage to internal circuits in existing DSP power amplifiers.

[0007] To solve the above-mentioned technical problems, the technical solution of this utility model is as follows:

[0008] A novel DSP power amplifier with good heat dissipation includes a power amplifier housing, a DSP power amplifier control circuit board disposed inside the power amplifier housing, a plurality of peripheral interfaces disposed on the DSP power amplifier control circuit board, a cooling fan disposed on the inner side of the end of the power amplifier housing, the cooling fan being electrically connected to the DSP power amplifier control circuit board via a power cable, a plurality of heat dissipation through holes communicating with the cooling fan being opened at the end of the power amplifier housing, and a plurality of heat dissipation fins disposed on the side of the power amplifier housing.

[0009] Preferably, the left and right ends of the power amplifier housing are respectively provided with a left baffle and a right baffle, and both the left and right baffles are provided with a plurality of peripheral interface through holes adapted to the peripheral interface.

[0010] Preferably, the cooling fan is fixedly connected to the right baffle by screws, and the heat dissipation holes are distributed on the right baffle.

[0011] Preferably, the left baffle has a plurality of air inlet holes that communicate with the cooling fan.

[0012] Preferably, both the left and right baffles are fixedly connected to the amplifier housing by screws.

[0013] Preferably, the inner side of the power amplifier housing is provided with a fixing plate that snaps into the DSP power amplifier control circuit board, and the fixing plate is fixedly connected to the power amplifier housing by screws.

[0014] By adopting the above technical solution, the present invention provides a novel DSP power amplifier with good heat dissipation, which has the following beneficial effects: A cooling fan is provided on the inner side of the end of the power amplifier housing. The cooling fan is electrically connected to the DSP power amplifier control circuit board via a power cable. Several heat dissipation holes communicating with the cooling fan are opened at the end of the power amplifier housing. Several heat dissipation fins are provided on the side of the power amplifier housing. The cooling fan dissipates the heat inside the power amplifier housing through the heat dissipation holes, and the heat dissipation fins further dissipate heat from the power amplifier housing, thereby improving heat dissipation efficiency and achieving good heat dissipation. This avoids damage to internal circuitry and helps extend the service life of the DSP power amplifier, resulting in a longer service life. Attached Figure Description

[0015] Figure 1 This is an exploded view of the present invention;

[0016] Figure 2 This is a perspective view of the present utility model;

[0017] Figure 3 This is a perspective view of the present invention from another angle;

[0018] In the diagram, 1-Amplifier housing, 2-DSP amplifier control circuit board, 3-Peripheral interface, 4-Cooling fan, 5-Power cord, 6-Cooling hole, 7-Cooling fins, 8-Left baffle, 9-Right baffle, 10-Peripheral interface hole, 11-Air inlet hole, 12-Fixing plate. Detailed Implementation

[0019] The specific embodiments of this utility model will be further described below with reference to the accompanying drawings. It should be noted that these descriptions are for the purpose of aiding understanding of this utility model, but do not constitute a limitation thereof. Furthermore, the technical features involved in the various embodiments of this utility model described below can be combined with each other as long as they do not conflict with each other.

[0020] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0021] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0022] like Figure 1-2 As shown, this novel DSP power amplifier with good heat dissipation includes a power amplifier housing 1, inside which is a DSP power amplifier control circuit board 2. The DSP power amplifier control circuit board 2 has several peripheral interfaces 3. A cooling fan 4 is located on the inner side of the end of the power amplifier housing. The cooling fan 4 is electrically connected to the DSP power amplifier control circuit board 2 via a power cable. Several heat dissipation holes 6 are opened at the end of the power amplifier housing 1, communicating with the cooling fan 4. Several heat dissipation fins 7 are provided on the side of the power amplifier housing 1. It is understood that the DSP power amplifier control circuit board 2 can be a general-purpose power amplifier circuit board, and the cooling fan 4 can be a general-purpose cooling fan.

[0023] Specifically, the power amplifier housing 1 has a left baffle 8 and a right baffle 9 at its left and right ends, respectively. Both the left and right baffles 8 and 9 have several peripheral interface through holes 10 that are compatible with the peripheral interface 3. The cooling fan 4 is fixedly connected to the right baffle 9 with screws, and the heat dissipation through holes 6 are distributed on the right baffle 9. The left baffle 8 has several air inlet holes 11 that communicate with the cooling fan 4. Airflow enters the power amplifier housing 1 through the air inlet holes 11 and is dissipated through the heat dissipation through the heat dissipation through holes 6 under the drive of the cooling fan 4, thereby carrying away the heat generated by the DSP power amplifier control circuit board 2 during operation and accelerating heat dissipation. Both the left and right baffles 8 and 9 are fixedly connected to the power amplifier housing 1 with screws. The inner side of the power amplifier housing 1 has a fixing plate 12 that engages with the DSP power amplifier control circuit board 2, and the fixing plate 12 is fixedly connected to the power amplifier housing 1 with screws. It is understood that the amplifier housing 1, the left baffle 8, and the right baffle 9 can all be made of aluminum alloy or other materials, and this utility model does not limit them.

[0024] Understandably, this utility model has a reasonable design and unique structure. By setting a cooling fan 4, the heat inside the power amplifier housing 1 is dissipated through the heat dissipation holes 6, and the heat dissipation fins 7 are used to further dissipate heat from the power amplifier housing 1, thereby improving the heat dissipation efficiency and heat dissipation effect. This can avoid damage to the internal circuitry and help extend the service life of the DSP power amplifier, resulting in a longer service life.

[0025] The embodiments of this utility model have been described in detail above with reference to the accompanying drawings, but this utility model is not limited to the described embodiments. For those skilled in the art, various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of this utility model, and these variations still fall within the protection scope of this utility model.

Claims

1. A novel DSP power amplifier with good heat dissipation, comprising a power amplifier housing, wherein a DSP power amplifier control circuit board is disposed inside the power amplifier housing, and the DSP power amplifier control circuit board is provided with a plurality of peripheral interfaces, characterized in that: A cooling fan is provided on the inner side of the end of the power amplifier housing. The cooling fan is electrically connected to the DSP power amplifier control circuit board via a power cable. Several heat dissipation holes communicating with the cooling fan are opened at the end of the power amplifier housing. Several heat dissipation fins are provided on the side of the power amplifier housing.

2. The novel DSP power amplifier with good heat dissipation effect according to claim 1, characterized in that: The amplifier housing has a left baffle and a right baffle at its left and right ends, respectively. Each of the left and right baffles has several peripheral interface through holes that are compatible with the peripheral interface.

3. The novel DSP power amplifier with good heat dissipation effect according to claim 2, characterized in that: The cooling fan is fixedly connected to the right baffle by screws, and the heat dissipation holes are distributed on the right baffle.

4. The novel DSP power amplifier with good heat dissipation effect according to claim 2, characterized in that: The left baffle has several air inlet holes that communicate with the cooling fan.

5. The novel DSP power amplifier with good heat dissipation effect according to claim 2, characterized in that: Both the left and right baffles are fixedly connected to the amplifier housing by screws.

6. The novel DSP power amplifier with good heat dissipation effect according to claim 1, characterized in that: The inner side of the power amplifier housing is provided with a fixing plate that snaps into the DSP power amplifier control circuit board. The fixing plate is fixedly connected to the power amplifier housing by screws.

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