Industrial computer

Abstract

The utility model relates to the technical field of electronic equipment, and discloses an industrial computer which comprises a case and a mainboard. A partition plate is arranged in the case and divides the internal space of the case into a first cavity and a second cavity; an opening is formed in the partition plate, the mainboard is arranged in the first cavity, and at least part of a CPU on the mainboard extends into the second cavity from the opening; a first radiator is arranged in the first cavity, and the first radiator is used for radiating the mainboard; and a second radiator is arranged in the second cavity and is used for radiating the CPU. Through the mode, thermal interference between the high-power-consumption heating device and the low-power-consumption heating device can be reduced, and normal work of the low-power-consumption heating device is guaranteed.

Description

Technical Field

[0001] This application relates to the field of electronic equipment technology, specifically to an industrial computer. Background Technology

[0002] Currently, some industrial computers, such as industrial PCs specifically designed for industrial environments, have various heat-generating components with different power consumptions, such as CPUs, motherboards, hard drives, and power modules. These heat-generating components generate a lot of heat when the industrial PC is working.

[0003] Existing industrial computer chassis often feature a single, integrated design, meaning the entire chassis contains only one cavity. Clearly, mixing various heat-generating components with different power consumption within the same chassis will inevitably lead to heat transfer between these components, causing the temperature throughout the chassis cavity to become almost uniform. For low-power heat-generating components, being exposed to relatively high temperatures for extended periods will undoubtedly affect their normal operation. Utility Model Content

[0004] In view of the above problems, this application provides an industrial computer that can reduce thermal interference between high-power heat-generating devices and low-power heat-generating devices, and ensure the normal operation of low-power heat-generating devices.

[0005] According to one aspect of the embodiments of this application, an industrial computer is provided, the industrial computer including a chassis and a motherboard; a partition is provided inside the chassis, the partition dividing the internal space of the chassis into a first cavity and a second cavity; an opening is provided on the partition, the motherboard is disposed in the first cavity, and the CPU on the motherboard extends at least partially into the second cavity through the opening; a first heat sink is provided in the first cavity for cooling the motherboard; a second heat sink is provided in the second cavity for cooling the CPU.

[0006] In one alternative embodiment, a first air inlet and a first air outlet are respectively provided on the two side walls of the second cavity along the first direction, wherein the first direction is parallel to the partition; the opening is opened on the partition at one end along the first direction facing the first air outlet; the second heat sink is a fan, which is used to drive external air into the second cavity from the first air inlet and absorb the heat of the CPU, and then exhaust it from the first air outlet.

[0007] In one alternative configuration, the second heatsink is a turbine fan. The second heatsink is located on the side of the CPU away from the motherboard, with its air intake facing the CPU and its exhaust port facing the first air outlet. The second heatsink is used to draw in gas located near the CPU and which has absorbed the CPU's heat through its air intake, and to exhaust the drawn-in gas to the first air outlet through its exhaust port.

[0008] In one alternative configuration, a bracket is provided on the side of the motherboard facing the partition, the bracket extends into the second cavity from the opening, and the CPU is mounted on the bracket; the second heatsink is fixed to the bracket and its air intake mask is mounted on the CPU.

[0009] In one alternative embodiment, a second air inlet is provided on the end plate opposite to the partition in the second cavity, and the second air inlet is located at the end of the end plate facing the second air inlet in the first direction.

[0010] In one alternative embodiment, a third air inlet and a second air outlet are respectively provided on the two side walls of the first cavity along the second direction, wherein the second direction is parallel to the partition; the first heat sink is a fan, which is used to drive external air into the first cavity from the third air inlet and absorb the heat of the motherboard before exhausting it from the second air outlet.

[0011] In one alternative configuration, the CPU is located on one side of the motherboard, and other components of the motherboard are located on the other side. The motherboard is fixed to the side of the partition away from the second heatsink with the side containing the CPU facing the opening, so that the CPU extends at least partially into the second cavity through the opening.

[0012] In one alternative approach, an adapter board is vertically mounted on the side of the motherboard away from the CPU, and an expansion card is mounted on one side of the adapter board. The expansion cards are parallel to the motherboard and spaced apart from each other. A fixing plate is provided in the first cavity of the chassis. The fixing plate is detachably connected to the chassis, and the fixing plate is fixedly connected to the side of the expansion card away from the adapter board, so that the expansion card is clamped and fixed between the adapter board and the fixing plate.

[0013] In one alternative embodiment, a side plate is detachably provided on one side of the first cavity along a third direction. When the side plate is removed, the expansion card extends into the first cavity from that side and is installed on the adapter plate in a manner parallel to the motherboard. A support plate is also provided in the first cavity. The support plate is located on the side of the expansion card away from the motherboard. The two ends of the support plate are fixedly connected to the two side walls of the first cavity along a fourth direction, respectively. The support plate is used to support the two side walls. The third and fourth directions are both parallel to the partition plate, and the third direction is perpendicular to the fourth direction.

[0014] In one alternative embodiment, a memory is disposed in the first cavity, the memory is connected to a partition, and a heat dissipation hole is provided on the partition opposite to the memory, the heat dissipation hole being used to allow at least part of the heat generated by the memory to enter the second cavity.

[0015] In the industrial computer provided in this application embodiment, the internal space of the chassis is divided into a first cavity and a second cavity by a partition. The motherboard is placed in the first cavity, and the CPU on the motherboard extends into the second cavity through an opening in the partition. This allows heat generated by other components on the motherboard to flow through the first cavity, and heat generated by the CPU to flow through the second cavity. Furthermore, by installing a first heat sink in the first cavity, heat can be dissipated from the first cavity, and by installing a second heat sink in the second cavity, heat can be dissipated from the second cavity. Therefore, heat generated by the CPU is not transferred to the first cavity, preventing the temperature of the first cavity from exceeding the critical temperature of other components on the motherboard, thus ensuring the normal operation of other components on the motherboard.

[0016] The above description is only an overview of the technical solution of this application. In order to better understand the technical means of this application and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this application more obvious and understandable, the following are specific embodiments of this application. Attached Figure Description

[0017] Various other advantages and benefits will become apparent to those skilled in the art upon reading the following detailed description of preferred embodiments. The accompanying drawings are for illustrative purposes only and are not intended to limit the scope of this application. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings:

[0018] Figure 1 A perspective view of an industrial computer provided in an embodiment of this application;

[0019] Figure 2 A cross-sectional view of an industrial computer provided in an embodiment of this application;

[0020] Figure 3 This is a schematic diagram of the internal structure of an industrial computer provided in an embodiment of this application;

[0021] Figure 4 Another perspective view of the industrial computer provided in an embodiment of this application;

[0022] Figure 5 A schematic diagram of the internal turbine fan of an industrial computer provided in an embodiment of this application;

[0023] Figure 6 This is a schematic diagram of the internal structure of an industrial computer provided in an embodiment of this application from another angle.

[0024] The reference numerals in the detailed embodiments are as follows:

[0025] 10. Industrial computers;

[0026] 100. Chassis; 110. Partition; 111. Opening; 112. Ventilation hole; 120. First cavity; 121. First heat sink; 122. Third air inlet; 123. Second air outlet; 124. Side panel; 130. Second cavity; 131. Second heat sink; 1311. Exhaust port; 132. First air inlet; 133. First air outlet; 140. End plate; 141. Second air inlet; 150. Mounting plate; 160. Support plate;

[0027] 200. Motherboard; 210. CPU; 220. Bracket; 230. Adapter board; 240. Expansion card; 250. Memory. Detailed Implementation

[0028] The embodiments of the technical solution of this application will now be described in detail with reference to the accompanying drawings. These embodiments are only used to more clearly illustrate the technical solution of this application and are therefore merely examples, and should not be used to limit the scope of protection of this application.

[0029] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the application; the terms “comprising” and “having”, and any variations thereof, in the specification, claims, and foregoing description of the drawings are intended to cover non-exclusive inclusion.

[0030] In the description of the embodiments of this application, technical terms such as "first" and "second" are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly specifying the number, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, "multiple" means two or more, unless otherwise explicitly defined.

[0031] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0032] In the description of the embodiments in this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent three cases: A exists, A and B exist simultaneously, and B exists. In addition, the character " / " in this document generally indicates that the related objects before and after it have an "or" relationship.

[0033] In the description of the embodiments of this application, the term "multiple" refers to two or more (including two), similarly, "multiple sets" refers to two or more (including two sets), and "multiple pieces" refers to two or more (including two pieces).

[0034] In the description of the embodiments of this application, the technical terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0035] In the description of the embodiments of this application, unless otherwise expressly specified and limited, technical terms such as "installation," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.

[0036] High-power heat-generating devices produce a large amount of heat and have a relatively wide temperature sensitivity range, allowing them to operate at higher temperatures. Conversely, low-power heat-generating devices produce less heat and have a narrower temperature sensitivity range, enabling them to operate only at relatively lower temperatures. Therefore, the temperature inside the chassis must be lowered below the temperature that the low-power heat-generating devices can withstand to meet the overall system's operating requirements. However, when multiple heat-generating devices with different power consumptions are located in the same chassis, the heat generated by the high-power devices may raise the overall temperature inside the chassis, thus affecting the normal operation of the low-power devices.

[0037] To solve the above problems, the chassis can be divided into two chambers. The CPU, motherboard, power supply module, etc. can be placed in one chamber, and the hard drive can be placed in the other chamber. Each chamber can then provide heat dissipation for the heat-generating components, thereby reducing thermal interference between the heat-generating components and allowing low-power heat-generating components to work normally.

[0038] In the aforementioned design, since the CPU is typically mounted on the motherboard and is the primary heat-generating component, it is usually placed in the same cavity as the motherboard. However, the applicant has discovered that the CPU generates a significant amount of heat, with its junction temperature (i.e., maximum operating temperature) reaching 100 degrees Celsius, while the power supply module and other components on the motherboard (such as memory) generate less heat, with junction temperatures typically around 60 degrees Celsius. Therefore, placing the CPU and motherboard in the same cavity could cause the heat generated by the CPU to exceed the critical temperatures of other components on the motherboard, affecting their normal operation.

[0039] Based on this, this application provides an industrial computer that, by opening an opening in a partition that divides the chassis into two cavities, and by placing the motherboard in one cavity and extending the CPU on the motherboard into the other cavity through the opening, and by installing heat sinks in each cavity to dissipate heat from the motherboard and the CPU, allows the heat generated by the CPU to diffuse to its cavity and be carried away by its corresponding heat sink, thus avoiding the impact of the heat generated by the CPU on the motherboard and ensuring the normal operation of other components on the motherboard.

[0040] Please see Figure 1 and Figure 2 , Figure 1 A perspective view of the industrial computer provided in an embodiment of this application is shown. Figure 2 A cross-sectional view of an industrial computer provided in an embodiment of this application is shown. As shown, the industrial computer 10 includes a chassis 100 and a motherboard 200. A partition 110 is provided inside the chassis 100, which divides the internal space of the chassis 100 into a first cavity 120 and a second cavity 130.

[0041] Please refer to the following: Figure 3 , Figure 3 This diagram illustrates the internal structure of an industrial computer provided in an embodiment of this application. An opening 111 is provided on a partition 110. A motherboard 200 is disposed within a first cavity 120, and at least partially, a CPU 210 on the motherboard 200 extends into a second cavity 130 through the opening 111. A first heat sink 121 is disposed within the first cavity 120 for cooling the motherboard 200. A second heat sink 131 is disposed within the second cavity 130 for cooling the CPU 210.

[0042] The partition 110 can be made of hot-dip galvanized steel. Specifically, the edge of the partition 110 can be bent, and corresponding threaded holes can be made on the edge of the partition 110 and the inner wall of the chassis 100, respectively. The partition 110 is then connected and fixed to the chassis 100 with screws, thereby fixing the partition 110 inside the chassis 100 and dividing the internal space of the chassis 100 into a first cavity 120 and a second cavity 130. Optionally, the first cavity 120 and the second cavity 130 can be arranged horizontally or vertically. For example, the first cavity 120 can be arranged as follows: Figure 1 It is positioned below the second cavity 130 as shown.

[0043] The opening 111 is preferably rectangular, and the size of the opening 111 is adapted to the CPU 210. This can reduce the communication area between the first cavity 120 and the second cavity 130 while ensuring that the CPU 210 can pass through the opening 111, thereby reducing the heat transfer between the first cavity 120 and the second cavity 130.

[0044] like Figure 2 As shown, the motherboard 200 can be fixedly mounted on the partition 110. For example, threaded holes can be made in the motherboard 200 and the partition 110, and then the motherboard 200 and the partition 110 can be threadedly connected and fixed with screws. Alternatively, the motherboard 200 can be fixedly mounted on the bottom of the first cavity 120, that is, on the bottom inner wall of the chassis 100, or a fixing plate can be provided on the inner wall of the chassis 100, and then the motherboard 200 can be fixed on the fixing plate.

[0045] The motherboard 200, with the CPU 210 facing the partition 110, allows the CPU 210 to extend into the second cavity 130 through the opening 111. In this way, the heat generated by the motherboard 200 is first transferred to the first cavity 120, and the heat generated by the CPU 210 first flows through the second cavity 130. This prevents the heat generated by the CPU 210 from significantly affecting the temperature of the first cavity 120, thus avoiding the temperature of the first cavity 120 exceeding the critical temperature of other components on the motherboard 200 and ensuring that other components on the motherboard 200 can always function normally.

[0046] Optionally, the CPU 210 can be mounted on one side of the motherboard 200, while other components such as memory, graphics card, and sound card can be mounted on the other side. The side of the motherboard 200 with the CPU 210 facing the partition 110 is then fixed to the partition 110. In this case, since the CPU 210 is not on the same side as the other components, and the CPU 210 extends into the second cavity 130, the heat generated by the CPU 210 can be prevented from affecting other components. Furthermore, since there are no other components separating the motherboard 200 from the partition 110, the motherboard 200 can be placed closer to the partition 110, resulting in a more compact overall structure.

[0047] The motherboard 200 is fixedly mounted on the partition 110. Other components of the motherboard 200 are located on one side, and the CPU 210 of the motherboard 200 is located on the other side. When the CPU 210 extends into the second cavity 130 through the opening 111, it can... Figure 1 The end plates 140 at both ends of the chassis 100 (only one is shown in the figure) are designed to be detachable. For example, the end plates 140 can be threadedly fixed to other side plates of the chassis 100. This allows the end plates 140 of the chassis 100 to be disassembled when the motherboard 200 and other components or the CPU 210 need to be repaired. Then, the motherboard 200 and other components or the CPU 210 can be repaired from both ends of the chassis 100, which facilitates the maintenance of the industrial computer 10 by the maintenance personnel.

[0048] In this configuration, the CPU 210 may be partially located in the opening 111 and partially extended into the second cavity 130. In this case, the heat generated by the CPU 210 in the opening 111 is likely to be transferred to the first cavity 120, affecting the motherboard 200. To avoid this, a bracket can be installed on the motherboard 200, with the CPU 210 positioned within it. By extending the bracket into the second cavity 130, the CPU 210 is completely contained within the second cavity 130, preventing the heat it generates from being transferred to the first cavity 120. In this configuration, the heat generated by the CPU 210 first flows through the second cavity 130, rather than being transferred to the first cavity 120 through the opening 111, thus reducing the impact of the heat generated by the CPU 210 on the motherboard 200.

[0049] The first radiator 121 can be as follows Figure 2The heatsink 121 is configured as a fan and mounted on the side wall of the first cavity 120. It draws external air into the first cavity 120 to absorb the heat generated by the motherboard 200 and then exhausts the heat-absorbing air, thus dissipating heat from the motherboard 200. By using the first heatsink 121 to dissipate heat from the motherboard 200, the heat generated by the motherboard 200 can be promptly carried away from the first cavity 120 without being transferred to the second cavity 130. Furthermore, when the first heatsink 121 is a fan, it improves the airflow effect of the first cavity 120, thereby enhancing the heat dissipation capacity of the motherboard 200 and further reducing heat transfer to the second cavity 130. Alternatively, the first heatsink 121 can be a heat-conducting block (not shown in the figure), which is disposed between the inner wall of the end plate 140 in the first cavity 120 and the motherboard. It absorbs the heat generated by the motherboard 200 and dissipates the heat to the outside through the end plate 140, thus achieving heat dissipation for the motherboard 200.

[0050] The second heat sink 131 can be implemented in the same way as the first heat sink 121, and the specific heat dissipation principle is the same, so it will not be described again here.

[0051] In the industrial computer 10 provided in this embodiment, a partition 110 divides the internal space of the chassis 100 into a first cavity 120 and a second cavity 130. The motherboard 200 is housed in the first cavity 120, and the CPU 210 on the motherboard 200 extends into the second cavity 130 through an opening 111 in the partition 110. This allows heat generated by other components on the motherboard 200 to flow through the first cavity 120, while heat generated by the CPU 210 flows through the second cavity 130. Furthermore, a first heat sink 121 is installed in the first cavity 120 to dissipate heat, and a second heat sink 131 is installed in the second cavity 130 to dissipate heat. This prevents heat generated by the CPU 210 from being transferred to the first cavity 120, thus avoiding a temperature in the first cavity 120 exceeding the critical temperature of other components on the motherboard 200 and ensuring the normal operation of these components.

[0052] To reduce the transfer of heat generated by the CPU 210 to the first cavity 120, this application further proposes an implementation method, please refer to the following: Figure 1 and combined Figure 4 , Figure 4This figure shows a perspective view of the industrial computer provided in an embodiment of this application. As shown, a first air inlet 132 and a first air outlet 133 are respectively provided on the two side walls of the second cavity 130 along a first direction, wherein the first direction is parallel to the partition 110. An opening 111 is formed on the partition 110 at one end along the first direction facing the first air outlet 133. A second heat sink 131 is used to drive external air into the second cavity 130 from the first air inlet 132, absorb the heat of the CPU 210, and then exhaust it from the first air outlet 133.

[0053] The first air inlet 132 and the first air outlet 133 can be configured as a heat dissipation hole array, which can ensure the entry and exit of gas and reduce the entry of dust into the second cavity 130.

[0054] The first direction is Figure 1 The direction indicated by arrow x. The first air inlet 132 and the first air outlet 133 are respectively opened on the two side walls of the second cavity 130 along the first direction, so that the gas in the second cavity 130 can flow from the first air inlet 132 to the first air outlet 133.

[0055] like Figure 3 As shown, the opening 111 is opened between the first air inlet 132 and the first air outlet 133, and the opening 111 is opened on the partition 110 at a position closer to the first air outlet 133, so that the CPU 210 can follow the position of the opening 111 and be set at a position closer to the first air outlet 133.

[0056] When the second heatsink 131 is a fan, it can be placed on the side wall where the first air outlet 133 is located, opposite to the first air outlet 133, or it can be placed on the side wall where the first air inlet 132 is located, opposite to the first air inlet 132. The second heatsink 131 can draw external air from one side of the chassis 100 into the second cavity 130 through the first air inlet 132 to absorb the heat of the CPU 210, and exhaust the heat-absorbing air to the other side of the chassis 100 through the first air outlet 133.

[0057] In the above process, external gas flows sequentially through the first air inlet 132, the CPU 210, and the first air outlet 133. Therefore, by positioning the CPU 210, following the opening 111, closer to the first air outlet 133, the gas, after absorbing heat from the CPU 210, can be discharged more quickly from the first air outlet 133 to the outside of the second cavity 130. This allows the heat generated by the CPU 210 to be discharged promptly through the first air outlet 133, reducing heat flow in the second cavity 130 and consequently reducing heat transfer to the first cavity 120.

[0058] To reduce the transfer of heat generated by the CPU 210 to the first cavity 120, this application further proposes an implementation method, please refer to... Figure 5 , Figure 5 A schematic diagram of the internal turbine fan of the industrial computer provided in this application embodiment is shown. As shown in the figure, the second heat sink 131 is a turbine fan. The second heat sink 131 is located on the side of the CPU 210 away from the motherboard 200, and the air inlet (not shown in the figure) of the second heat sink 131 is facing the CPU 210, and the exhaust port 1311 is facing the first air outlet 133. The second heat sink 131 is used to draw in gas located near the CPU 210 and which has absorbed the heat of the CPU 210 through the air inlet, and to exhaust the drawn-in gas to the first air outlet 133 through the exhaust port 1311.

[0059] When the second heatsink 131, i.e. the turbine fan, is as Figure 2 When the CPU 210 is positioned on the side away from the motherboard 200, the air intake of the turbine fan can absorb the heat generated by the CPU 210 upwards and exhaust the heat-absorbing gas from the side to the first air outlet 133, preventing the heat generated by the CPU 210 from being transferred to the first cavity 120, thereby avoiding the heat generated by the CPU 210 from affecting other components on the motherboard 200.

[0060] Furthermore, when the CPU 210 is positioned closer to the first air outlet 133 following the opening 111, the exhaust port 1311 of the turbine fan can be closer to the first air outlet 133, thereby allowing the heat generated by the CPU 210 to be discharged to the outside of the second cavity 130 more quickly, further reducing the possibility of the heat generated by the CPU 210 being transferred to the first cavity 120.

[0061] It can also be like Figure 1 A second air inlet 141 is provided on the end plate 140 in the second cavity 130, and the second air inlet 141 is located at one end of the end plate 140 facing the second air inlet 141 in the first direction. In this case, the second heat sink 131 can not only draw low-temperature external gas from one side of the chassis 100 into the second cavity 130 through the first air inlet 132, but also draw low-temperature external gas from one end of the chassis 100 into the second cavity 130 through the second air inlet 141, thereby increasing the airflow speed in the second cavity 130 and quickly removing heat, thus improving the heat dissipation capacity of the CPU 210. The structure and shape of the second air inlet 141 can be referenced from the first air inlet 132, and will not be described in detail here.

[0062] To reduce the heat generated by the CPU 210 flowing through the second cavity 130, this application further proposes an implementation method; please refer to the following. Figure 2 and Figure 3 As shown in the figure, a bracket 220 is provided on the side of the motherboard 200 facing the partition 110. The bracket 220 extends into the second cavity 130 from the opening 111, and the CPU 210 is mounted on the bracket 220. The second heat sink 131 is fixed to the bracket 220, and its air intake mask is located on the CPU 210.

[0063] When the bracket 220 is as Figure 3 and Figure 4 When the CPU 210 extends into the second cavity 130, it is completely contained within the second cavity 130, thus preventing heat generated by the CPU 210 from being transferred to the first cavity 120. When the CPU 210 is completely within the second cavity 130, its heat flows first within the second cavity 130 and is not transferred to the first cavity 120 through the opening 111, thereby reducing the impact of the heat generated by the CPU 210 on the motherboard 200. Specifically, a slot can be provided on the bracket 220 for mounting the CPU 210.

[0064] In this configuration, when the second heatsink 131 is a turbine fan, fixing the second heatsink 131 to the bracket 220 and placing the air intake mask of the second heatsink 131 on the CPU 210 allows the air intake to completely cover the CPU 210. Thus, the second heatsink 131 can draw in all the gas that has absorbed heat from the CPU 210 and its vicinity through the air intake and exhaust it from the exhaust port 1311 to the first exhaust port 133, effectively reducing the flow of heat generated by the CPU 210 within the second cavity 130.

[0065] To achieve heat dissipation for the motherboard 200, this application further proposes an implementation method, please refer to [further details]. Figure 1 and Figure 4 As shown in the figure, a third air inlet 122 and a second air outlet 123 are respectively provided on the two side walls of the first cavity 120 along the second direction, wherein the second direction is parallel to the partition 110. The first heat sink 121 is used to drive external air into the first cavity 120 from the third air inlet 122, absorb the heat of the motherboard 200, and then exhaust it from the second air outlet 123.

[0066] The third air inlet 122 and the second air outlet 123 can be configured in the same way as the first air inlet 132 and the first air outlet 133 mentioned above, and will not be described again here.

[0067] The second direction is the direction indicated by arrow y in the figure. The third air inlet 122 and the second air outlet 123 are respectively opened on the two side walls of the first cavity 120 along the first direction, so that the gas in the first cavity 120 can flow from the third air inlet 122 to the second air outlet 123.

[0068] Please see Figure 6 , Figure 6 The figure shows another perspective of the internal structure of the industrial computer provided in this application embodiment. As shown, the first heat sink 121 can be installed on the side wall where the third air inlet 122 is located, and in a position opposite to the third air inlet 122. Thus, the first heat sink 121 can draw external air from one side of the chassis 100 into the first cavity 120 through the third air inlet 122 to absorb the heat generated by other components on the motherboard 200, and exhaust the heat-absorbing air through the second air outlet 123 to the other side of the chassis 100, thereby carrying away the heat generated by other components on the motherboard 200 and achieving heat dissipation for the motherboard 200.

[0069] To facilitate heat dissipation for the components on the expansion card 240, this application further proposes an implementation method; please refer to the following: Figure 2 and Figure 6 As shown in the figure, an adapter plate 230 is vertically mounted on the side of the motherboard 200 opposite to the CPU 210. An expansion card 240 is mounted on one side of the adapter plate 230, and the expansion card 240 is parallel to the motherboard 200 and spaced apart from it. A fixing plate 150 is provided in the first cavity 120 of the chassis 100. The fixing plate 150 is detachably connected to the chassis 100, and the fixing plate 150 is fixedly connected to the side of the expansion card 240 opposite to the adapter plate 230, so that the expansion card 240 is clamped and fixed between the adapter plate 230 and the fixing plate 150.

[0070] The adapter board 230 provides an additional slot for the motherboard 200 to connect the expansion card 240. The expansion card 240 is a device used to enhance the functionality of the industrial computer 10 or to provide additional connectivity and functionality to the industrial computer 10.

[0071] Specifically, one side of the adapter plate 230 can be fixedly connected to the motherboard 200 using screws, so that the adapter plate 230 is vertically positioned on the side of the motherboard 200 away from the CPU 210 and perpendicular to the partition plate 110. A slot with an opening facing the expansion card 240 can be provided on one side of the adapter plate 230, through which the expansion card 240 can be installed and fixed on the adapter plate 230 in a manner parallel to the motherboard 200.

[0072] Specifically, the fixing plate 150 can be fixed to the end plate screws of the chassis 100, and the fixing plate 150 can be fixed at any position on the end plate of the chassis 100. A slot with an opening facing the adapter plate 230 can be made on the fixing plate 150, and one side of the expansion card 240 can be inserted into the slot, thereby clamping the expansion card 240 between the fixing plate 150 and the adapter plate 230, realizing support for the expansion card 240, and improving the stability of the expansion card 240.

[0073] When it is necessary to install or replace the expansion card 240, first remove the mounting plate 150 from the chassis 100, and insert the expansion card 240 into the slot of the adapter plate 230 in a parallel manner with the motherboard 200. Then, install the mounting plate 150 on the chassis 100, and insert one side of the expansion card 240 into the slot, thereby clamping the expansion card 240 between the adapter plate 240 and the mounting plate 150 in a parallel manner with the motherboard 200.

[0074] When the expansion card 240 is suspended and fixed in the first cavity 120 in a manner parallel to the motherboard 200 in the above manner, when the first heat sink 121 drives the external gas to flow in the first cavity 120 in the second direction, the external gas can flow along the extension direction of the expansion card 240 through the components on the expansion card 240 and carry away the heat generated by the components on it, which facilitates heat dissipation of the expansion card 240.

[0075] To facilitate the installation or replacement of the expansion card 240, this application proposes an implementation method, such as... Figure 1 As shown, a side plate 124 is detachably disposed on one side of the first cavity 120 along a third direction. When the side plate 124 is removed, the expansion card 240 is inserted into the first cavity 120 from this side and installed onto the adapter board 240 in a manner parallel to the motherboard 200. The third direction is also the first direction shown in the above embodiment. Figure 1 The direction indicated by arrow x.

[0076] like Figure 6 As shown, when side panel 124 is removed, expansion card 240 is inserted into the first cavity 120 parallel to the motherboard and placed in the slot of adapter board 230. Side panel 124 can be threadedly connected and fixed to other side panels of chassis 100. When the end plate of chassis 100 opposite to partition 110 is detachably connected to the side panel of chassis 100, side panel 124 and end plate of chassis 100 can be integrally formed into an L-shaped plate. The L-shaped plate, which facilitates installation and removal, improves the efficiency of maintenance personnel in maintaining components within the first cavity 120.

[0077] Since the motherboard 200, adapter board 230, expansion card 240, power module, memory 250, first heat sink 121, and other components of the industrial computer 10 are all housed within the first cavity 120, requiring a large volume, a taller first cavity 120 is needed to accommodate these components. In this case, the side panels of the first cavity 120 are prone to inward or outward bending or deformation during the transportation of the industrial computer 10. Furthermore, when the side panel 124 along the third direction of the first cavity 120 is a detachable side panel, the first heat sink 121 is a fan, and the first heat sink 121 is located on one of the side panels along the fourth direction (i.e., the second direction) of the first cavity 120, the two side panels along the fourth direction of the first cavity 120 are more prone to deformation during the transportation or maintenance of the industrial computer 10.

[0078] Therefore, to reduce the degree of deformation of the chassis 100, this application further proposes an implementation method, such as... Figure 2 and Figure 6 As shown, a support plate 160 is also provided inside the first cavity 120. The support plate 160 is located on the side of the expansion card 240 opposite to the motherboard 200. Both ends of the support plate 160 are fixedly connected to the two side walls of the first cavity 120 along the fourth direction, respectively. The support plate 160 is used to support these two side walls. Both the third and fourth directions are parallel to the partition, and the third direction is perpendicular to the fourth direction. The fourth direction is also the second direction shown in the above embodiment. Figure 1 The direction indicated by arrow y.

[0079] The two ends of the support plate 160 can be detachably connected to the two side walls, for example, by screws or threads. By using the support plate 160 to tighten the two side walls when they deform outward, and to hold them against the two side walls when they deform outward, the degree of deformation of the two side walls can be reduced.

[0080] When a support plate 160 is provided inside the first cavity 120, a fixing plate 150 can be fixedly connected to the support plate 160. Specifically, an elongated hole can be provided on the support plate 160, and the fixing plate 150 can be fixed at any position on the support plate 160 through the elongated hole.

[0081] To improve the heat dissipation capability of the memory 250, this application further proposes an implementation method, please refer to the following: Figure 2 and Figure 3 As shown in the figure, a memory 250 is provided in the first cavity 120. The memory 250 is connected to the partition 110. A heat dissipation hole 112 is provided on the partition 110 at a position opposite to the memory 250. The heat dissipation hole 112 is used to allow at least part of the heat generated by the memory 250 to enter the second cavity 130.

[0082] The memory 250 can be a solid-state drive. Specifically, the memory 250 can be threadedly connected to the partition 110, thereby fixing the memory 250 to the partition 110.

[0083] Heat dissipation holes 112 are formed on the partition 110 at a position opposite to the memory 250. The heat generated by the memory 250 can be transferred to the second cavity 130 through the heat dissipation holes 112 and carried away by the gas flowing in the second cavity 130, thereby improving the heat dissipation capacity of the memory 250. Multiple heat dissipation holes 112 can be provided to form a heat dissipation hole array, facilitating the transfer of heat generated by the memory 250 to the second cavity 130.

[0084] When multiple memories 250 are provided in the first cavity 120, for example... Figure 2 When there are two or more memory units 250 as shown, the heat generated by the multiple memory units 250 may cause the temperature of the first cavity 120 to exceed the critical temperature of other components within the cavity, affecting the normal operation of other components within the first cavity 120. Therefore, heat dissipation holes 112 are provided on the partition 110. The heat generated by the multiple memory units 250 is not only carried away by the gas flowing within the first cavity 120, but can also be transferred to the second cavity 130 through the heat dissipation holes 112, and carried away by the gas flowing within the second cavity 130. This achieves a dual heat dissipation effect for the multiple memory units 250, ensuring that the heat generated by the multiple memory units 250 does not affect other components within the first cavity 120.

Claims

1. An industrial computer, characterized in that, The industrial computer includes: a chassis and a motherboard; The chassis is equipped with a partition that divides the internal space of the chassis into a first cavity and a second cavity; The partition has an opening, the motherboard is disposed in the first cavity, and the CPU on the motherboard extends at least partially into the second cavity through the opening; The first cavity is provided with a first heat sink, which is used to dissipate heat from the motherboard; The second cavity is equipped with a second heat sink, which is used to dissipate heat from the CPU.

2. The industrial computer according to claim 1, characterized in that, The second cavity has a first air inlet and a first air outlet respectively opened on the two side walls along the first direction, wherein the first direction is parallel to the partition. The opening is located on the partition at one end facing the first air outlet along the first direction; The second heat sink is a fan. The second heat sink is used to drive external air into the second cavity from the first air inlet and absorb the heat of the CPU, and then exhaust it from the first air outlet.

3. The industrial computer according to claim 2, characterized in that, The second heat sink is a turbine fan. The second heat sink is located on the side of the CPU away from the motherboard, with the air intake of the second heat sink facing the CPU and the exhaust port facing the first air outlet. The second heat sink is used to draw in gas located near the CPU and which has absorbed the heat of the CPU through the air intake, and to exhaust the drawn-in gas to the first air outlet through the exhaust port.

4. The industrial computer according to claim 3, characterized in that, The motherboard has a bracket on the side facing the partition, the bracket extends into the second cavity from the opening, and the CPU is mounted on the bracket; The second heat sink is fixed to the bracket and its air intake mask is mounted on the CPU.

5. The industrial computer according to claim 3, characterized in that, A second air inlet is provided on the end plate opposite to the partition in the second cavity. The second air inlet is located at the end of the end plate facing the second air inlet along the first direction.

6. The industrial computer according to claim 1, characterized in that, The first cavity has a third air inlet and a second air outlet respectively opened on the two side walls along the second direction, wherein the second direction is parallel to the partition. The first heat sink is a fan. The first heat sink is used to drive external air into the first cavity from the third air inlet and absorb the heat of the motherboard, and then exhaust it from the second air outlet.

7. The industrial computer according to claim 1, characterized in that, The CPU is located on one side of the motherboard, and other components of the motherboard are located on the other side. The motherboard is fixed to the side of the partition away from the second heat sink with the side where the CPU is located facing the opening, so that the CPU extends at least partially into the second cavity from the opening.

8. The industrial computer according to claim 7, characterized in that, An adapter board is vertically mounted on the side of the motherboard away from the CPU. An expansion card is mounted on one side of the adapter board, and the expansion card is parallel to the motherboard and spaced apart from each other. The chassis has a fixing plate inside the first cavity. The fixing plate is detachably connected to the chassis, and the fixing plate is fixedly connected to the side of the expansion card away from the adapter plate, so that the expansion card is clamped and fixed between the adapter plate and the fixing plate.

9. The industrial computer according to claim 8, characterized in that, A side plate is detachably provided on one side of the first cavity along a third direction. When the side plate is removed, the expansion card extends into the first cavity from that side and is installed on the adapter plate in a manner parallel to the motherboard. The first cavity is also provided with a support plate, which is located on the side of the expansion card away from the motherboard. The two ends of the support plate are respectively fixedly connected to the two side walls of the first cavity along the fourth direction. The support plate is used to support the two side walls. The third direction and the fourth direction are both parallel to the partition, and the third direction is perpendicular to the fourth direction.

10. The industrial computer according to claim 1, characterized in that, The first cavity contains a memory, which is connected to the partition. The partition has a heat dissipation hole at a position opposite to the memory, which allows at least a portion of the heat generated by the memory to enter the second cavity.

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