Electronic device

Abstract

An electronic device is provided. The electronic device includes: a display panel; a circuit board on which at least one component is mounted and which is connected to the display panel; and a cover portion coupled to the circuit board and shielding the at least one component. The cover portion includes a protruding coupling portion, the circuit board includes a receiving portion coupled to the coupling portion, and the coupling portion is accommodated in the receiving portion.

Description

[0001] Cross-references to related applications

[0002] This application claims priority and benefit to Korean Patent Application No. 10-2023-0146993, filed on October 30, 2023, with the Korean Intellectual Property Office (KIPO), the entire contents of which are incorporated herein by reference. Technical Field

[0003] This disclosure relates to electronic devices that include a display panel and are capable of displaying images. Background Technology

[0004] Electronic devices have been widely used as both mobile and stationary electronic devices. These devices include display devices that can provide users with visual information such as images or videos to support various functions.

[0005] The display device may include a substrate divided into a display area and a peripheral area. In the display area, scan lines and data lines may be formed to be insulated from each other, and multiple pixels may be provided. Additionally, in the display area, thin-film transistors corresponding to each of the multiple pixels and pixel electrodes electrically connected to the thin-film transistors may be provided. Furthermore, in the display area, opposing electrodes may be provided together to the pixels. In the peripheral area, various wiring, scan drive units, data drive units, control units, and pad units for transmitting electrical signals to the display area may be provided. Utility Model Content

[0006] Display devices may include printed circuit boards (PCBs) for transmitting electrical signals. Various types of chip components can be mounted on the PCB. To block electromagnetic waves generated from these components, shielding covers for shielding the components can be located on the PCB. The shielding covers can be fixed to the PCB by soldering. A portion of the soldered shielding cover can be detached from the PCB. One or more embodiments include electronic devices to prevent the shielding cover from detaching from the PCB.

[0007] Additional aspects will be set forth in part in the description below, and in part will be obvious from the description, or may be learned by practice of the embodiments.

[0008] According to an embodiment, the electronic device may include: a display panel; a circuit board on which at least one component is mounted and connected to the display panel; and a cover portion coupled to the circuit board and shielding the at least one component. The cover portion may include a protruding coupling portion, and the circuit board may include a receiving portion coupled to the coupling portion, and the coupling portion may be accommodated within the receiving portion.

[0009] The electronic device may also include a first support portion located between the coupling portion and the receiving portion.

[0010] The first support portion may include gold (Au).

[0011] The circuit board may include multiple layers containing different materials, and the receiving portion may pass through at least one of the multiple layers.

[0012] The electronic device may further include a second support portion located between the coupling portion and the first support portion.

[0013] The first support portion and the second support portion may be made of different materials.

[0014] The second support section can be spaced apart from the circuit board.

[0015] The circuit board may also include a tip that protrudes toward the receiving portion.

[0016] At least a portion of the coupling can be bent.

[0017] The coupling portion may include a first coupling portion and a second coupling portion that bend from a portion of the coupling portion in different directions.

[0018] At least a portion of the first coupling portion may be located below a first tip protruding from the side surface of the circuit board facing the receiving portion toward the receiving portion, and at least a portion of the second coupling portion may be located below a second tip facing the first tip, with the receiving portion between the first tip and the second tip.

[0019] The coupling portion may include multiple coupling portions, the receiving portion may include multiple receiving portions, the multiple coupling portions may be spaced apart from each other, and the multiple receiving portions may be arranged to correspond to the multiple coupling portions respectively.

[0020] According to an embodiment, the electronic device may include: a display panel; a circuit board on which at least one component is mounted and connected to the display panel; a cover portion coupled to the circuit board, shielding at least one component and including a coupling portion projecting toward the circuit board; and a first support portion located between the coupling portion and the circuit board. In a plan view, the first support portion may include: a first protrusion projecting from a first end of the first support portion in a first direction, wherein the first support portion extends toward a second direction different from the first direction; and a second protrusion projecting from a second end of the first support portion opposite to the first end toward a direction opposite to the second direction.

[0021] The first and second directions can be perpendicular to each other.

[0022] In a plan view, the areas of the first protrusion and the second protrusion can be equal.

[0023] The first support portion may include gold (Au).

[0024] The electronic device may also include a second support portion located on the first support portion and surrounding a portion of the side surface of the coupling portion.

[0025] The first support portion and the second support portion may be made of different materials.

[0026] The second support portion may include a first portion overlapping the first protrusion and a second portion overlapping the second protrusion in the plan view.

[0027] The coupling portion may include multiple coupling portions, the first support portion may include multiple first support portions, the multiple coupling portions may be spaced apart from each other, and the multiple first support portions may be arranged to correspond to the multiple coupling portions respectively. Attached Figure Description

[0028] The above and other aspects, features, and advantages of certain embodiments will become more apparent from the following description taken in conjunction with the accompanying drawings, wherein,

[0029] Figure 1 It is a schematic diagram illustrating a plan view of an electronic device according to an embodiment;

[0030] Figure 2 This is a schematic cross-sectional view illustrating a portion of the display area of ​​an electronic device according to an embodiment;

[0031] Figure 3 This is a schematic exploded perspective view of a display circuit board according to an embodiment;

[0032] Figure 4 This is a schematic cross-sectional view illustrating the state in which the cover portion and the circuit board are coupled to each other according to the first embodiment;

[0033] Figures 5A to 5D This is a cross-sectional view illustrating the manufacturing process of an electronic device according to the first embodiment;

[0034] Figure 6 This is an enlarged perspective view of a portion of the covered portion according to the second embodiment;

[0035] Figure 7 This is a schematic cross-sectional view illustrating the state in which the coupling portion and the circuit board are coupled to each other according to the second embodiment;

[0036] Figure 8This is a plan view illustrating the state in which the cover portion and the circuit board are coupled to each other according to the second embodiment;

[0037] Figures 9A to 9D This is a schematic cross-sectional view illustrating the manufacturing process of an electronic device according to the second embodiment;

[0038] Figure 10 This is a perspective view illustrating the state in which the cover portion and the circuit board are coupled to each other according to the third embodiment; and

[0039] Figures 11A to 11F It is a plan view illustrating the state in which the cover portion and the circuit board are coupled to each other according to various embodiments. Detailed Implementation

[0040] Embodiments will now be described in detail with reference to examples illustrated in the accompanying drawings, in which similar reference numerals always refer to similar elements. In this respect, embodiments may take different forms and should not be construed as limited to the description set forth herein. Therefore, only embodiments are described below with reference to the figures to explain the aspects described.

[0041] Because this disclosure allows for various modifications and numerous implementations, certain implementations will be illustrated in the accompanying drawings and described in the detailed description. The effects and features of this disclosure, as well as methods of implementing them, will be illustrated with reference to the embodiments described in detail below with reference to the accompanying drawings. However, this disclosure is not limited to the following embodiments and may be embodied in various forms.

[0042] In the following description, embodiments will be described in detail with reference to the accompanying drawings, wherein the same or corresponding elements are always indicated by the same reference numerals and repeated descriptions thereof are omitted.

[0043] Although terms such as "first" and "second" can be used to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another.

[0044] As used in this article, the singular forms “a,” “an,” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise.

[0045] It will be understood that the terms “comprising” and “having” are intended to indicate the presence of the features or elements described in the specification and are not intended to exclude the possibility that one or more other features or elements may be present or added.

[0046] It will also be understood that when a layer, zone, or component is referred to as being "on" another layer, zone, or component, that layer, zone, or component may be directly on the other layer, zone, or component, or may be indirectly on the other layer, zone, or component in the presence of an intermediary layer, zone, or component.

[0047] When a component or layer is referred to as being "on," "connected to," or "coupled to" another component or layer, the component or layer may be directly on, directly connected to, or directly coupled to the other component or layer, or an intermediary component or layer may be present. However, when a component or layer is referred to as being "directly on," "directly connected to," or "directly coupled to" another component or layer, an intermediary component or layer is not present. Therefore, the term "connection" can refer to a physical connection, electrical connection, and / or fluid connection, with or without an intermediary component. Furthermore, when a component is referred to as being "in contact" or "in contact" with another component, the component may be in "electrical contact" or "physical contact" with the other component; or in "indirect contact" or "direct contact" with the other component.

[0048] In the specification and claims, for the purposes of their meaning and interpretation, the phrase "at least one of..." is intended to include the meaning of "at least one selected from the group of...". For example, "at least one of A and B" can be understood to mean "A, B, or A and B". In the specification and claims, for the purposes of their meaning and interpretation, the term "and / or" is intended to include any combination of the terms "and" and "or". For example, "A and / or B" can be understood to mean "A, B, or A and B". The terms "and" and "or" can be used in the sense of conjunctions or antonymous conjunctions and can be understood as equivalent to "and / or".

[0049] For ease of illustration, the dimensions of components in the accompanying drawings may be exaggerated or reduced. For example, since the dimensions and thicknesses of elements in the drawings are arbitrarily illustrated for ease of illustration, this disclosure is not limited thereto.

[0050] In the following implementation, the x-axis, y-axis, and z-axis are not limited to the three axes of a Cartesian coordinate system and can be interpreted in a broader sense. For example, the x-axis, y-axis, and z-axis can be perpendicular to each other, or they can represent different directions that are not perpendicular to each other.

[0051] When certain implementation methods can be carried out differently, the specific process sequence may differ from the described sequence. For example, two consecutively described processes may be performed substantially simultaneously, or they may be performed in the reverse order of their description.

[0052] Unless otherwise specified or implied herein, all terms used (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It will also be understood that terms (such as those defined in common dictionaries) shall be interpreted as having a meaning consistent with their meaning in the context of the relevant field and shall not be interpreted in an idealized or overly formal sense unless expressly defined in the specification.

[0053] Figure 1 This is a schematic plan view of the electronic device 1 according to an embodiment.

[0054] The electronic device 1 according to the embodiment can be a display device, such as an organic light-emitting display device. The following description and explanation will focus on the embodiment of the electronic device 1 as a display device, but the features and structure of this disclosure are not necessarily limited to display devices.

[0055] refer to Figure 1 The electronic device 1 for displaying moving or still images according to the embodiments can be used not only as a display screen for portable electronic devices such as mobile phones, smartphones, tablet PCs, mobile communication terminals, electronic notebooks, e-books, portable multimedia players (PMPs), navigation devices, or ultra-mobile PCs (UMPCs), but also as a display screen for any of a variety of products such as televisions, laptops, monitors, billboards, or Internet of Things (IoT) products. Furthermore, the electronic device 1 can be used for wearable devices such as smartwatches, wristwatch phones, glasses displays, or head-mounted displays (HMDs). Additionally, the electronic device 1 can be used as a central information display (CID) located on the instrument panel, center dashboard, or dashboard of a vehicle, an interior mirror display replacing the side mirrors of the vehicle, or a display located behind the front seats for the entertainment of people in the rear seats of the vehicle.

[0056] Electronic device 1 may include a display panel 10, a display circuit board 20, and a display driving unit 30. Electronic device 1 may also include a bracket, a main circuit board, a battery, and a bottom cover (not shown).

[0057] In a direction perpendicular to the surface of electronic device 1 (e.g., the +z direction), electronic device 1 may have the following characteristics: Figure 1 The shape shown is essentially rectangular. For example, as... Figure 1As shown, the electronic device 1 can have a substantially rectangular planar shape with a short side extending in the ±x direction and a long side extending in the ±y direction. The corners where the short side in the ±x direction and the long side in the ±y direction intersect each other can have a rounded shape with curvature or a right angle shape. However, the planar shape of the electronic device 1 is not limited to a rectangular shape, and can be other polygonal shapes, circular shapes, or elliptical shapes.

[0058] Display panel 10 can display (output) information processed by electronic device 1. For example, display panel 10 can display execution screen information of an application driven by electronic device 1 or user interface (UI) or graphical user interface (GUI) information based on the execution screen information. Display panel 10 may include a display layer for displaying images and a touch layer for detecting user touch input. Therefore, display panel 10 can be used as one of a plurality of input devices providing an input interface between electronic device 1 and the user, and can also be used as one of a plurality of output units providing an output interface between electronic device 1 and the user.

[0059] The display panel 10 may include a substrate 100 and display devices located on the substrate 100. The substrate 100 included in the display panel 10 may include an insulating material such as glass, quartz, or polymer resin.

[0060] The substrate 100 may include a display area DA and a peripheral area PA adjacent to the display area DA, and the display device may be located in the display area DA of the substrate 100.

[0061] The peripheral region PA of the substrate 100 may be an area where no image is displayed. In a plan view, the peripheral region PA may surround the display area DA. The peripheral region PA may be the area extending from the edge of the display area DA to the edge of the display panel 10. In the display area DA, not only pixels may be provided, but also scan wiring, data wiring, and power wiring connected to the pixels may be provided. In the peripheral region PA, scan drive units for applying scan signals to the scan wiring and fan-out wiring connecting the data wiring to the display drive unit 30 may be provided.

[0062] Display devices may include, for example, light-emitting elements. For example, display panel 10 may be an organic light-emitting display panel using organic light-emitting diodes including organic emission layers, a micro light-emitting diode display panel using micro light-emitting diodes (LEDs), a quantum dot light-emitting display panel using quantum dot light-emitting elements including quantum dot emission layers, or an inorganic light-emitting display panel using inorganic light-emitting devices including inorganic semiconductors.

[0063] The display panel 10 can be a rigid display panel that is not easily bent or a flexible display panel that is easily bent, folded or rolled. For example, the display panel 10 can be a foldable display panel that can be folded and unfolded, a bent display panel that has at least a portion of a bent display surface, a bent display panel in which portions other than the display surface are bent, a rollable display panel that can be rolled or unfolded, or a stretchable display panel that can be stretched.

[0064] Display circuit board 20 can be electrically connected to display panel 10. Display circuit board 20 can be a flexible printed circuit board (FPCB) that can be bent or a rigid printed circuit board (RPCB) that is rigid and therefore not easily bent, or in another embodiment, display circuit board 20 can be a composite PCB including both RPCB and FPCB. Although in Figure 1 Although not shown, various electronic components can be mounted on the display circuit board 20, and a cover portion for shielding at least some of the electronic components can be provided.

[0065] The display driving unit 30 can receive control signals and power supply voltage, and can generate and output signals and voltages for driving the display panel 10. The display driving unit 30 may include an integrated circuit (IC).

[0066] Figure 2 This is a schematic cross-sectional view illustrating a portion of the display area DA of the electronic device 1 according to an embodiment. Figure 2 It is shown in the diagram along Figure 1 A schematic cross-sectional view of electronic device 1 taken from line II-II'.

[0067] refer to Figure 2 The organic light-emitting diode (OLED) as a display element can be located on the substrate 100. The OLED can be electrically connected to the thin-film transistor (TFT).

[0068] Barrier layer 101 and buffer layer 103 may be located on substrate 100. Barrier layer 101 and buffer layer 103 may planarize and protect the top surface of substrate 100. Each of barrier layer 101 and buffer layer 103 may include silicon oxide (SiO2). x ), silicon nitride (SiN) x Inorganic insulating materials of silicon oxynitride (SiON) and / or silicon oxynitride.

[0069] The thin-film transistor (TFT) can be located on the buffer layer 103. The TFT may include an active layer A, a gate electrode G, a source electrode S, and a drain electrode D. The TFT can be connected to an organic light-emitting diode (OLED) to drive the OLED.

[0070] The active layer A may be located on the buffer layer 103, and may include a drain region overlapping with the drain electrode D in the plan view, a source region overlapping with the source electrode S in the plan view, and a channel region located between the drain region and the source region. The drain region and the source region may be regions doped with impurities.

[0071] The gate insulating layer 105 may be located on the active layer A. The gate insulating layer 105 may comprise an inorganic material containing oxides or nitrides. For example, the gate insulating layer 105 may comprise silicon oxide (SiO2). x ), silicon nitride (SiN) x It may contain at least one of silicon oxynitride (SiON), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2), and zinc oxide (ZnO2), and may have a single-layer or multi-layer structure including the above materials.

[0072] The gate electrode G may be located on the gate insulating layer 105. In a planar view, at least a portion of the gate electrode G may overlap with the active layer A. For example, in a planar view, the gate electrode G may overlap with the channel region of the active layer A. The gate electrode G may include aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W), and / or copper (Cu), and may have a single-layer or multi-layer structure comprising the aforementioned materials.

[0073] Interlayer insulating layer 107 may cover the gate electrode G. Interlayer insulating layer 107 may comprise an inorganic material containing oxides or nitrides. For example, interlayer insulating layer 107 may comprise silicon oxide (SiO2). x ), silicon nitride (SiN) x It may contain at least one of silicon oxynitride (SiON), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2), and zinc oxide (ZnO2), and may have a single-layer or multi-layer structure including the above materials.

[0074] The gate insulating layer 105 and the interlayer insulating layer 107 may include contact holes that overlap with the source and drain regions of the active layer A in a plan view. The source electrode S and the drain electrode D may be located on the interlayer insulating layer 107. The source electrode S may overlap with the source region of the active layer A in a plan view, and the drain electrode D may overlap with the drain region of the active layer A in a plan view. The source electrode S and the drain electrode D can be connected to the active layer A through the contact holes formed in the gate insulating layer 105 and the interlayer insulating layer 107.

[0075] An organic insulating layer 109 may be located on the interlayer insulating layer 107. The organic insulating layer 109 may include a first organic insulating layer 1109 and a second organic insulating layer 2109. In an embodiment, the first organic insulating layer 1109 and the second organic insulating layer 2109 may be located sequentially on the interlayer insulating layer 107. Each of the first organic insulating layer 1109 and the second organic insulating layer 2109 may include an opening overlapping the drain electrode D in a plan view. A connection metal CM may be located between the first organic insulating layer 1109 and the second organic insulating layer 2109.

[0076] The connecting metal CM may include aluminum (Al), copper (Cu) and / or titanium (Ti), and may have a single-layer or multi-layer structure comprising the above materials.

[0077] Each of the first organic insulating layer 1109 and the second organic insulating layer 2109 may include benzocyclobutene, polyimide, hexamethyldisiloxane, a general polymer such as polymethyl methacrylate or polystyrene, a polymer derivative having phenolic groups, an acrylic polymer, an imide polymer, an aryl ether polymer, an amide polymer, a fluorinated polymer, a p-xylene polymer, or a vinyl alcohol polymer, and may have a single-layer or multi-layer structure including the above materials.

[0078] Despite Figure 2 The illustration shows two organic insulating layers and a connecting metal, but this disclosure is not limited thereto. In another embodiment, one organic insulating layer may be provided, and the connecting metal may be omitted. In yet another embodiment, three or more organic insulating layers may be provided, and two or more connecting metals may be provided.

[0079] Sub-pixel electrode 113 can be located on organic insulating layer 109. For example, sub-pixel electrode 113 can be located on second organic insulating layer 2109. Although in Figure 2 Although not shown in the diagram, the sub-pixel electrode 113 can be connected to the connecting metal CM through an opening in the second organic insulating layer 2109. Therefore, the sub-pixel electrode 113 can be electrically connected to the active layer A of the thin-film transistor TFT via the connecting metal CM and the drain electrode D to receive voltage.

[0080] The sub-pixel electrode 113 may comprise a conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In2O3), indium gallium oxide (IGO), or zinc aluminum oxide (AZO). The sub-pixel electrode 113 may comprise a reflective film containing silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), or compounds thereof. However, the configuration and materials of the sub-pixel electrode 113 are not limited thereto and various modifications can be made.

[0081] The dam layer 111 may be located on the organic insulating layer 109. For example, the dam layer 111 may be located on the second organic insulating layer 2109. The dam layer 111 may cover the edge (or edge portion) of the sub-pixel electrode 113. In other words, the dam layer 111 may have an opening through which the central portion of the sub-pixel electrode 113 is exposed. The size and shape of the emitting region of the organic light-emitting diode OLED may be determined by the opening in the dam layer 111.

[0082] Intermediate layer 115 may be located on sub-pixel electrode 113. Intermediate layer 115 may include an organic emission layer comprising low molecular weight material or high molecular weight material. In some embodiments, intermediate layer 115 may include a single-layer or multi-layer structure comprising at least one of hole injection layer, hole transport layer, organic emission layer, electron transport layer and / or electron injection layer.

[0083] The counter electrode 117 may be located on the intermediate layer 115. In some embodiments, the counter electrode 117 may be configured to extend across the entire display area DA. The counter electrode 117 may comprise a conductive material having a low work function. For example, the counter electrode 117 may comprise a (semi-)transparent layer comprising silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), or alloys thereof. In embodiments, the counter electrode 117 may also comprise a layer comprising ITO, IZO, ZnO, or In2O3 on the (semi-)transparent layer.

[0084] The encapsulation layer TFE may be located on the counter electrode 117. The encapsulation layer TFE may include at least one inorganic layer and at least one organic layer. In an embodiment, the encapsulation layer TFE may include a first inorganic encapsulation layer 119 and a second inorganic encapsulation layer 123, and an organic encapsulation layer 121 located between the first inorganic encapsulation layer 119 and the second inorganic encapsulation layer 123. Each of the first inorganic encapsulation layer 119 and the second inorganic encapsulation layer 123 may include, for example, silicon oxide (SiO2). x ), silicon nitride (SiN) xThe organic encapsulation layer 121 may comprise at least one inorganic insulating material, such as silicon oxynitride (SiON), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2), or zinc oxide (ZnO2). Examples of polymeric materials include silicone resins, acrylic resins, epoxy resins, polyimides, and polyethylene.

[0085] Despite Figure 2 Not shown, but in another embodiment, the capping layer may be additionally located between the counter electrode 117 and the encapsulation layer TFE.

[0086] Figure 3 This is a schematic exploded perspective view of the display circuit board 20 according to an embodiment.

[0087] refer to Figure 3 The display circuit board 20 may include a circuit board 21, a cover portion 22, a support portion 23, and electronic components 24.

[0088] Circuit board 21 may provide a substrate on which electronic components 24 may be located, and may have a substantially cuboid shape having surfaces extending in the ±x and ±y directions in a plan view. Circuit board 21 may include a metal such as copper (Cu), tin (Sn), or gold (Au), and may include circuit patterns formed on circuit board 21. Circuit board 21 may include a protective coating for protecting the circuit patterns, such as photoresist (PSR) ink. In some embodiments, circuit board 21 may be rigid or flexible.

[0089] Various electronic components 24 can be mounted on the circuit board 21. Figure 3 The electronic component 24 shown in the figure is an embodiment, and this disclosure is not limited to... Figure 3 The number, shape, and pattern of the electronic components 24 are shown in the diagram.

[0090] The cover portion 22 may be located on the circuit board 21 to cover the electronic component 24. In some embodiments, the cover portion 22 may be coupled to the circuit board 21. The cover portion 22 may block electromagnetic waves or noise generated from the electronic component 24 to reduce the impact of electromagnetic waves or noise on other adjacent components. In some embodiments, the cover portion 22 may be a shield. In some embodiments, the cover portion 22 may include metal and may have a rigid structure. In some embodiments, the cover portion 22 may have a flexible structure that can be bent together with the circuit board 21.

[0091] The support portion 23 may be located on the circuit board 21 and may protrude toward the cover portion 22 (e.g., in the +z direction). With the cover portion 22 located on the circuit board 21, the support portion 23 can securely fasten the cover portion 22 to the circuit board 21. In some embodiments, multiple support portions 23 may be provided and may be arranged along the outer periphery of the circuit board 21. In some embodiments, in a plan view, the support portion 23 may surround the electronic component 24. In some embodiments, in a plan view, the support portion 23 may extend in a direction parallel to the edge of the circuit board 21 (e.g., the ±x or ±y direction). In some embodiments, in a plan view, the support portion 23 may extend in directions parallel to both edges of the circuit board 21 (e.g., the ±x and ±y directions) to have a substantially L-shape.

[0092] The cover portion 22 may include a coupling portion 221 corresponding to the support portion 23. In some embodiments, the cover portion 22 may include a coupling portion 221 that protrudes toward the support portion 23 or the circuit board 21 (e.g., in the -z direction). In other words, the cover portion 22 may include a plurality of slots 223 formed in the +z direction, and the portion of the cover portion 22 located between two adjacent slots 223 may be the coupling portion 221. In some embodiments, a plurality of coupling portions 221 may be provided and may be arranged to correspond to a plurality of support portions 23 respectively. Thus, the coupling portions 221 and the support portions 23 may have shapes extending in the same direction. For example, the coupling portions 221 may have a linear shape extending in the ±x or ±y direction, or may have a substantially L-shaped shape extending in both the ±x and ±y directions.

[0093] When the cover portion 22 is coupled to the circuit board 21, a portion of the coupling portion 221 may be housed in and coupled to the support portion 23, as will be described in detail below.

[0094] although Figure 3 The illustration shows a cover portion 22 covering the entire circuit board 21, but this disclosure is not limited thereto. In another embodiment, the circuit board 21 may include multiple regions, with corresponding electronic components and corresponding cover portions located in some regions, and other electronic components and / or other cover portions not located in some regions.

[0095] Figure 4 This is a schematic cross-sectional view illustrating the state in which the cover portion 22 and the circuit board 21 are coupled to each other according to the first embodiment.

[0096] refer to Figure 4The circuit board 21 may include a receiving portion 21-OP, and a portion of the coupling portion 221 may be located in the receiving portion 21-OP. The receiving portion 21-OP may be an opening formed in the circuit board 21. In some embodiments, the circuit board 21 may include multiple layers, such as a first layer 211 and a second layer 212. In some embodiments, the first layer 211 and the second layer 212 may include different materials. For example, the first layer 211 may include a metal and may be a layer on which a circuit pattern is formed. The second layer 212 may be a layer for protecting the first layer 211 and may include a photoresist.

[0097] In some implementations, such as Figure 4 As shown, the receiving portion 21-OP may be formed only in the second layer 212 and may pass through the second layer 212. In another embodiment, with Figure 4 Unlike other layers, the receiving section 21-OP can be formed in the second layer 212 and the first layer 211, and the receiving section 21-OP can pass through the second layer 212 but can not pass through the first layer 211.

[0098] The support portion 23 may include a first support portion 231 and a second support portion 232.

[0099] A portion of the first support portion 231 may be located within the receiving portion 21-OP and may be located on the circuit board 21. The first support portion 231 may cover the side surface of the second layer 212 and the top surface of the first layer 211. The first support portion 231 may contact (e.g., directly contact) the top surface of the first layer 211. A portion of the first support portion 231 may protrude beyond the top surface of the circuit board 21 (e.g., the top surface of the second layer 212) in the +z direction and may cover a portion of the top surface of the circuit board 21 (e.g., the top surface of the second layer 212). Although Figure 4 The illustration shows a portion of the first support portion 231 protruding beyond the top surface of the second layer 212, having side surfaces that gradually taper relative to the top surface of the second layer 212; however, this disclosure is not necessarily limited thereto. The first support portion 231 may have a substantially constant thickness within the receiving portion 21-OP. Therefore, the receiving portion 21-OP may be defined by an opening formed in the circuit board 21, and another opening may be defined by the first support portion 231 having a substantially constant thickness within the receiving portion 21-OP. The first support portion 231 may comprise metal. In some embodiments, the first support portion 231 may comprise gold (Au).

[0100] A portion of the coupling portion 221 may be located in an opening defined by the receiving portion 21-OP or the first support portion 231. In other words, the first support portion 231 may be located between the coupling portion 221 and the receiving portion 21-OP.

[0101] The second support portion 232 may be located between the coupling portion 221 and the first support portion 231. In some embodiments, the second support portion 232 may fill the space between the coupling portion 221 and the opening defined by the first support portion 231. In some embodiments, the second support portion 232 may include metal. In some embodiments, the second support portion 232 and the first support portion 231 may include different metals. In some embodiments, the second support portion 232 may include flux. In some embodiments, the flux of the second support portion 232 may include lead (Pb).

[0102] A portion of the first support portion 231 may be located in the receiving portion 21-OP of the circuit board 21 and fixed to the circuit board 21, and the coupling portion 221 may be fixed to the first support portion 231 via the second support portion 232. Therefore, the coupling portion 221 may be coupled to the receiving portion 21-OP via the first support portion 231 and the second support portion 232, and thus may be fixed to the circuit board 21.

[0103] Figures 5A to 5D This is a cross-sectional view illustrating the manufacturing process of the electronic device 1 according to the first embodiment. In the following text, reference will be made to... Figures 5A to 5D The described process can be achieved by covering part 22 (see...) Figure 4 Coupled to circuit board 21 (see) Figure 4 To achieve Figure 4 The process of the first embodiment.

[0104] refer to Figure 5A The receiving portion 21-OP can be formed by opening a portion of the circuit board 21. In some embodiments, the process of forming the receiving portion 21-OP may include etching, for example, dry etching or wet etching. The receiving portion 21-OP can penetrate the second layer 212, and therefore, a portion of the top surface of the first layer 211 can be exposed.

[0105] refer to Figure 5B The first support portion 231 may be formed on the circuit board 21. The process for forming the first support portion 231 may include an electroplating process. In some embodiments, the first support portion 231 may be formed by an electroplating process such as metal deposition or electrodeposition. The first support portion 231 may include, but is not limited to, gold (Au) atoms. In some embodiments, the first support portion 231 may cover the entire side surface of the second layer 212 facing the receiving portion 21-OP. In some embodiments, the first support portion 231 may cover the top surface of the first layer 211 exposed by the receiving portion 21-OP.

[0106] refer to Figure 5C The second support portion 232 can be provided in the opening defined by the receiving portion 21-OP or the first support portion 231. In some embodiments, the second support portion 232 may include flux. At the current step of the process, the second support portion 232 may be in a molten state, for example, in a liquid state. Therefore, in other words, the second support portion 232 may be within the first support portion 231. Although in Figure 5C In this case, the top surface of the second support portion 232 is lower than the top surface of the second layer 212 (in the +z direction), but this disclosure is not limited thereto.

[0107] refer to Figure 5D The coupling portion 221 can move downwards (in the -z direction) into the second support portion 232. At this current step of the process, since the second support portion 232 is in a liquid state, as the coupling portion 221 moves downwards (in the -z direction), the second support portion 232 can be pushed outwards by the volume of the coupling portion 221 immersed in the second support portion 232. Therefore, as the coupling portion 221 moves downwards (in the -z direction), the position of the top surface of the second support portion 232 can move upwards (in the +z direction). In other words, the level of the second support portion 232 can be raised. When the coupling portion 221 moves to the desired position in the receiving portion 21-OP, the volume of the second support portion 232 can be appropriately adjusted so that the top surface of the second support portion 232 is not higher than the top surface of the first support portion 231. For example, in Figure 5C The volume of the second support portion 232 provided in the step can be appropriately adjusted so that the second support portion 232 does not overflow. After the coupling portion 221 is lowered to the desired position, the second support portion 232 can be solidified to fix the coupling portion 221 to the first support portion 231 and further to the receiving portion 21-OP, thereby achieving... Figure 4 The implementation method.

[0108] Figure 6 This is an enlarged perspective view of a portion of the covering portion 22 according to the second embodiment.

[0109] refer to Figure 6 A portion of the coupling portion 221 may be cut. For example, the coupling portion 221 may include a cut portion 221c located at the center in the ±x direction. In some embodiments, the cut portion 221c may be formed along the entire thickness direction of the coupling portion 221 (e.g., in the ±y direction). Therefore, the cut portion 221c may pass through the coupling portion 221 in the ±y direction, but may not pass through the coupling portion 221 in the ±z direction.

[0110] The coupling portion 221 can be divided by the cutting portion 221c into a first coupling portion 221-1 and a second coupling portion 221-2. In some embodiments, the coupling portion 221 may include a first coupling portion 221-1 disposed in the -x direction relative to the cutting portion 221c and a second coupling portion 221-2 disposed in the +x direction. In some embodiments, the lengths of the first coupling portion 221-1 in the ±x direction and the lengths of the second coupling portion 221-2 in the ±x direction may be substantially the same.

[0111] The height (or length in the ±z direction) of the cut portion 221c may be less than the height (or length in the ±z direction) of the coupling portion 221. In some embodiments, the height h2 of the cut portion 221c may be less than the height h1 of the coupling portion 221 or the height h1 of the groove 223. Therefore, a portion of the coupling portion 221 may be divided into a first coupling portion 221-1 and a second coupling portion 221-2 relative to the cut portion 221c, and the other portions may be integrally formed.

[0112] Figure 7 This is a schematic cross-sectional view illustrating the state in which the cover portion 22 and the circuit board 21 are coupled to each other according to the second embodiment.

[0113] Figure 8 This is a plan view illustrating the state in which the cover portion 22 and the circuit board 21 are coupled to each other according to the second embodiment.

[0114] refer to Figure 7 and Figure 8 The circuit board 21 may include an undercut structure. In some embodiments, the receiving portion 21-OP may have a substantially T-shape in cross-sectional view. For example, the receiving portion 21-OP may include a first opening 21-OP1 and a second opening 21-OP2. The width (or length in the ±y direction) of the first opening 21-OP1 may be smaller than the width (or length in the ±y direction) of the second opening 21-OP2. The first opening 21-OP1 may be positioned higher than the second opening 21-OP2 in the +z direction. In other words, the second layer 212 may define a substantially T-shaped space by means of the receiving portion 21-OP formed in the second layer 212.

[0115] Therefore, circuit board 21 or second layer 212 may include a tip T projecting toward receiving portion 21-OP. In some embodiments, second layer 212 may include a first tip T1 and a second tip T2 defining a first opening 21-OP1. The first tip T1 may be located on the -y side of the first opening 21-OP1. The second tip T2 may be located on the +y side of the first opening 21-OP1.

[0116] The first support portion 231 may be located on the first layer 211 and the second layer 212. Since the receiving portion 21-OP can pass through the second layer 212, the first support portion 231 can contact (e.g., directly contact) the top surface of the first layer 211 and can cover the top surface of the first layer 211. The first support portion 231 may cover the side surface of the second layer 212 facing the second opening 21-OP2. The first support portion 231 may cover the side surface of the second layer 212 facing the first opening 21-OP1, for example, the side surface of the tip T. The first support portion 231 may also cover the bottom surface of the tip T. The first support portion 231 may protrude beyond the top surface of the second layer 212, as shown in the reference. Figure 4 The thickness of the first support portion 231 can be substantially constant. Therefore, like the receiving portion 21-OP, the first support portion 231 can define a space having a substantially T-shape.

[0117] The coupling portion 221 may be bent within the receiving portion 21-OP. The coupling portion 221 may include a first coupling portion 221-1 and a second coupling portion 221-2. In some embodiments, the first coupling portion 221-1 and the second coupling portion 221-2 may be bent and extended in different directions. In some embodiments, the coupling portion 221 may extend along the ±z direction, and the first coupling portion 221-1 may be bent and extended substantially in the -y direction, and the second coupling portion 221-2 may be bent and extended substantially in the +y direction. The first coupling portion 221-1 may extend further in the -x direction than the second coupling portion 221-2.

[0118] A portion of the coupling portion 221 may be located in the second opening 21-OP2 or below the tip T. A portion of the first coupling portion 221-1 may overlap with the first tip T1 in the plan view and may be located below the first tip T1. A portion of the second coupling portion 221-2 may overlap with the second tip T2 in the plan view and may be located below the second tip T2.

[0119] However, this disclosure is not limited thereto. In another embodiment, the first coupling portion 221-1 may be bent in the +y direction and may be located below the second tip T2, and the second coupling portion 221-2 may be bent in the -y direction and may be located below the first tip T1.

[0120] The second support portion 232 may be located between the first support portion 231 and the coupling portion 221. In some embodiments, the second support portion 232 may fill the space between the first support portion 231 and the coupling portion 221.

[0121] The coupling portion 221 can be fixed to the circuit board 21 via the first support portion 231 and the second support portion 232. Furthermore, due to this curved structure of the coupling portion 221, the first coupling portion 221-1 and / or the second coupling portion 221-2 can be fixed by the tip T even when an external force (e.g., a force in the +z direction) is applied. Because of this structure, even when a considerable external force is applied to the coupling portion 221 and further to the covering portion 22, the coupling portion 221 and the covering portion 22 can remain attached to the circuit board 21.

[0122] Figures 9A to 9D This is a schematic cross-sectional view illustrating the manufacturing process of the electronic device 1 according to the second embodiment. In the following text, reference will be made to... Figures 9A to 9D The described process can be achieved by covering part 22 (see...) Figure 7 Coupled to circuit board 21 (see) Figure 7 To achieve Figure 7 The process of implementing the method.

[0123] refer to Figure 9A The receiving portion 21-OP may include a first opening 21-OP1 and a second opening 21-OP2, and the first support portion 231 may be configured to cover a portion of the top surface of the second layer 212 and the receiving portion 21-OP. A second support portion 232 may be provided in the space defined by the first support portion 231. In other words, the second support portion 232 may fill a portion of the space defined by the first support portion 231. At the current step of the process, the second support portion 232 may be in a liquid state. The coupling portion 221 may be lowered (or moved in the -z direction).

[0124] refer to Figure 9B The coupling portion 221 can be further lowered and moved into the second support portion 232. At this current step of the process, since the second support portion 232 is in a liquid state, as the coupling portion 221 moves downward, the second support portion 232 can be pushed outward with the volume of the coupling portion 221 immersed in the second support portion 232. Therefore, as the coupling portion 221 moves downward (in the -z direction), the position of the top surface of the second support portion 232 can move upward (in the +z direction). In other words, the level of the second support portion 232 can be raised. When the coupling portion 221 moves to the desired position in the receiving portion 21-OP, the volume of the second support portion 232 can be appropriately adjusted so that the top surface of the second support portion 232 is not higher than the top surface of the first support portion 231. For example, in Figure 9A The volume of the second support portion 232 provided in the step can be adjusted appropriately so that the second support portion 232 does not overflow.

[0125] refer to Figure 9C The coupling portion 221 can contact the top surface of the first support portion 231. For example, the coupling portion 221 can be located in the second opening 21-OP2 and can contact the top surface of the first support portion 231 adjacent to the top surface of the first layer 211. Therefore, the first support portion 231 can no longer move downward (in the -z direction). In this state, if a force is continuously applied in the -z direction, the coupling portion 221 may bend due to the force in the -z direction. In an embodiment, the coupling portion 221 may include a reference... Figure 6 The described cutting portion 221c (see Figure 6 Therefore, the coupling portion 221 can be bent by a force in the -z direction, and the first coupling portion 221-1 and the second coupling portion 221-2 can be bent in different directions. In the embodiment, as... Figure 9C As shown, the first coupling portion 221-1 can be bent towards the -y direction, and the second coupling portion 221-2 can be bent towards the +y direction. In another embodiment, with... Figure 9C Unlike other coupling parts, the first coupling portion 221-1 can be bent in the +y direction, and the second coupling portion 221-2 can be bent in the -y direction.

[0126] refer to Figure 9D Force can be continuously applied in the -z direction until the coupling portion 221 bends. Subsequently, force can be continuously applied in the -z direction until the first coupling portion 221-1 and the second coupling portion 221-2 are respectively located below the first tip T1 and the second tip T2. In other words, the coupling portion 221 can be pushed into the receiving portion 21-OP until a considerable portion of the first coupling portion 221-1 and the second coupling portion 221-2 are located below the tip T. After the first coupling portion 221-1 and the second coupling portion 221-2 are pushed to the desired position, the second support portion 232 can be solidified to fix the coupling portion 221. Therefore, it is possible to achieve... Figure 7 The implementation method.

[0127] Figure 10 This is a perspective view illustrating the state in which the cover portion 22 and the circuit board 21 are coupled to each other according to the third embodiment.

[0128] refer to Figure 10 The circuit board 21 may not include an opening, and the first support portion 231 may be located on the top surface of the circuit board 21. The second support portion 232 and the cover portion 22 (or coupling portion 221) may be located on the top surface of the first support portion 231.

[0129] The first support portion 231 may be located (e.g., directly on) the top surface of the circuit board 21. The first support portion 231 may extend in one direction (e.g., a first direction DR1 or a ±x direction). The second support portion 232 and the coupling portion 221 may also extend in the first direction DR1 or a ±x direction. The first support portion 231 may include a first protrusion 231-1 projecting in one direction (e.g., a second direction DR2 (or a -y direction)). The first protrusion 231-1 may project from one end of the first support portion 231 in the first direction DR1 (e.g., one end in the +x direction) toward the second direction DR2.

[0130] The coupling portion 221 may be located on the top surface of the first support portion 231, and in some embodiments, may contact (e.g., directly contact) the top surface of the first support portion 231. In a plan view, the coupling portion 221 may not overlap with the first protrusion 231-1 of the first support portion 231.

[0131] The second support portion 232 may be located on the top surface of the first support portion 231 and may surround a portion of the side surface of the coupling portion 221. The second support portion 232 may include a first portion 232-1 located on the first protrusion 231-1 of the first support portion 231. Like the first protrusion 231-1, the first portion 232-1 may protrude toward the second direction DR2.

[0132] The second support portion 232 may include an inclined side surface. In some embodiments, the height (length in the ±z direction) of the first portion 232-1 of the second support portion 232 may decrease along the second direction DR2.

[0133] The arrangement order of the second support portion 232 and the coupling portion 221 can be the same as that of the reference. Figure 5C and Figure 5D The described arrangement sequence is similar. For example, a second support portion 232, which is a liquid flux, can be located on the top surface of the first support portion 231. The coupling portion 221 can be lowered to push a portion of the second support portion 232 to the surrounding area. After the coupling portion 221 is sufficiently lowered such that the second support portion 232 surrounds the side surface of the coupling portion 221, the second support portion 232 can be cured.

[0134] In the step of setting the second support portion 232 in a liquid state on the first support portion 231, flux may be applied to the first protrusion 231-1 to form the first portion 232-1. The first portion 232-1 may overlap with the first protrusion 231-1 in a plan view to increase the thickness of the second support portion 232 in the ±y direction, thereby providing additional support for the coupling portion 221.

[0135] Figures 11A to 11F This is a plan view illustrating the state in which the cover portion 22 and the circuit board 21 are coupled to each other according to various embodiments.

[0136] refer to Figures 11A to 11F The support portion 23 may include a first support portion 231 and a second support portion 232 located on the first support portion 231. In the plan view, the second support portion 232 may surround the coupling portion 221. The first support portion 231 and the second support portion 232 may extend generally in a first direction DR1.

[0137] The first support portion 231 may include a first protrusion 231-1 projecting from one end in the +x direction toward the second direction DR2. The first support portion 231 may also include a second protrusion 231-2 projecting from one end in the -x direction toward a direction opposite to the second direction DR2 or toward the +y direction. Therefore, the first protrusion 231-1 and the second protrusion 231-2 may project from each end of the first support portion 231 in opposite directions. Although Figures 11A to 11F The illustration shows that the first protrusion 231-1 and the second protrusion 231-2 have similar shapes but extend in opposite directions, but this disclosure is not limited thereto. In some embodiments, the second direction DR2 and the first direction DR1 may be perpendicular to each other.

[0138] The second support portion 232 may include a first portion 232-1 protruding from one end in the +x direction toward the second direction DR2 and overlapping with the first protrusion 231-1. The second support portion 232 may include a second portion 232-2 protruding from one end in the -x direction toward the +y direction and overlapping with the second protrusion 231-2. Therefore, the first portion 232-1 and the second portion 232-2 may protrude from their respective ends of the second support portion 232 in opposite directions. Although Figures 11A to 11F The illustration shows that the first part 232-1 and the second part 232-2 have similar shapes but extend in opposite directions, but this disclosure is not necessarily limited thereto. Although Figures 11A to 11F The illustration shows that the first portion 232-1 and the second portion 232-2 have shapes substantially similar to the first protrusion 231-1 and the second protrusion 231-2, but this disclosure is not limited thereto.

[0139] In some embodiments, in a plan view, the area of ​​the first protrusion 231-1 and the area of ​​the second protrusion 231-2 of the first support portion 231 may be the same. In some embodiments, in a plan view, the area (or volume) of the first portion 232-1 and the area (or volume) of the second portion 232-2 of the second support portion 232 may be the same.

[0140] Since the first portion 232-1 is located on the first protrusion 231-1, the second support portion 232 can have an additional thickness in the ±y direction at one end in the +x direction. Since the second portion 232-2 is located on the second protrusion 231-2, the second support portion 232 can have an additional thickness in the ±y direction at one end in the -x direction. Due to the additional thickness (or volume) of the second support portion 232, the coupling portion 221 can receive additional support in the ±y direction. Therefore, the coupling portion 221 can be more securely fixed to the first support portion 231 in the presence of the first portion 232-1 and the second portion 232-2 of the second support portion 232 than in the absence of the first portion 232-1 and the second portion 232-2 of the second support portion 232.

[0141] In the following text, reference will be made to Figures 11A to 11F A detailed description is given of embodiments of the shapes of the first protrusion 231-1 and the second protrusion 231-2 of the first support portion 231, and the first portion 232-1 and the second portion 232-2 of the second support portion 232. Although Figures 11A to 11F The illustration shows that the first protrusion 231-1 and the second protrusion 231-2 of the first support portion 231 have the same shape and size, but this disclosure is not limited thereto, and the first protrusion 231-1 and the second protrusion 231-2 may have different shapes and / or sizes. Although Figures 11A to 11F The illustration shows that the first part 232-1 and the second part 232-2 of the second support portion 232 have the same shape and size, but this disclosure is not limited thereto, and the first part 232-1 and the second part 232-2 may have different shapes and / or sizes.

[0142] refer to Figure 11A In the plan view, the first protrusion 231-1 and the second protrusion 231-2 of the first support portion 231, and the first portion 232-1 and the second portion 232-2 of the second support portion 232, can substantially have a triangular shape. Although the first protrusion 231-1 and the second protrusion 231-2, and the first portion 232-1 and the second portion 232-2... Figure 11A While the portion 231-1 and the second protrusion 231-2, as well as the first portion 232-1 and the second portion 232-2, may have any of a variety of shapes, such as a right-angled triangle, an isosceles triangle, an acute-angled triangle, or an obtuse-angled triangle.

[0143] refer to Figure 11BIn the plan view, the first protrusion 231-1 and the second protrusion 231-2 of the first support portion 231, and the first portion 232-1 and the second portion 232-2 of the second support portion 232, can substantially have a semi-circular shape. Although the first protrusion 231-1 and the second protrusion 231-2, and the first portion 232-1 and the second portion 232-2... Figure 11B The protrusions are substantially semi-circular in shape with smooth surfaces, but this disclosure is not limited thereto. Various modifications can be made. In another embodiment, in a plan view, the first protrusion 231-1 and the second protrusion 231-2, as well as the first portion 232-1 and the second portion 232-2, can have a semi-circular shape, wherein the protrusions are formed on a semi-elliptical surface.

[0144] refer to Figure 11C In the plan view, the first protrusion 231-1 and the second protrusion 231-2 of the first support portion 231, and the first portion 232-1 and the second portion 232-2 of the second support portion 232, can substantially have a quadrilateral shape. Although the first protrusion 231-1 and the second protrusion 231-2, and the first portion 232-1 and the second portion 232-2... Figure 11C While the protrusions are substantially rectangular in shape, this disclosure is not limited thereto. In another embodiment, the first protrusion 231-1 and the second protrusion 231-2, as well as the first portion 232-1 and the second portion 232-2, can have any of a variety of shapes (such as square, rhomboid, parallelogram, or trapezoidal). For example, in a plan view, the first protrusion 231-1 and the second protrusion 231-2, as well as the first portion 232-1 and the second portion 232-2, can have a trapezoidal shape, such as... Figure 11D The diagram is shown in the image.

[0145] refer to Figure 11D In the plan view, the first protrusion 231-1 and the second protrusion 231-2 of the first support portion 231, and the first portion 232-1 and the second portion 232-2 of the second support portion 232, can substantially have a trapezoidal shape. Although the lengths of the first protrusion 231-1 and the second protrusion 231-2, and the first portion 232-1 and the second portion 232-2 in the ±x direction are far apart. Figure 11D The coupling portion 221 is reduced, but this disclosure is not limited thereto. In another embodiment, the lengths of the first protrusion 231-1 and the second protrusion 231-2, as well as the first portion 232-1 and the second portion 232-2 in the ±x direction, can be increased by moving away from the coupling portion 221.

[0146] refer to Figure 11E and Figure 11FIn the plan view, the first protrusion 231-1 and the second protrusion 231-2 of the first support portion 231 and the first part 232-1 and the second part 232-2 of the second support portion 232 can have shapes obtained by combining multiple shapes.

[0147] For example, refer to Figure 11E The first protrusion 231-1 and the second protrusion 231-2, as well as the first portion 232-1 and the second portion 232-2, can have a shape in which right-angled triangles of the same size in the plan view are symmetrically arranged around the y-axis. Figure 11E In this context, two right-angled triangles that are symmetrical to each other have overlapping portions. The two symmetrical shapes can have different shapes or sizes.

[0148] For example, refer to Figure 11F The first protrusion 231-1 and the second protrusion 231-2, as well as the first portion 232-1 and the second portion 232-2, can have a shape in which a substantially rectangular shape and a semi-circular shape are combined in the plan view. The rectangular shape of the first protrusion 231-1 and the second protrusion 231-2, as well as the first portion 232-1 and the second portion 232-2, can be closer to the coupling portion 221 than the semi-circular shape. The rectangular shape can be modified into any of a variety of shapes such as a trapezoidal shape or a parallelogram shape. Furthermore, the semi-circular shape can be modified into any of a variety of shapes such as a semi-elliptical shape.

[0149] According to the above embodiments, an electronic device having a structure in which the shielding cover can be securely fixed without being separated from the PCB can be provided.

[0150] The above description is an example of the technical features of this disclosure, and those skilled in the art to which this disclosure pertains will be able to make various modifications and changes. Therefore, the embodiments of this disclosure described above can be implemented individually or in combination with each other.

[0151] Therefore, the embodiments disclosed herein are not intended to limit the technical spirit of this disclosure, but rather to describe it, and the scope of the technical spirit of this disclosure is not limited by these embodiments. The scope of protection of this disclosure should be interpreted by the appended claims, and should be construed as including all technical spirit within the equivalent scope within the scope of this disclosure.

Claims

1. An electronic device, characterized in that, include: Display panel; A circuit board on which at least one component is mounted and connected to the display panel; as well as A cover portion, which is coupled to the circuit board and shields the at least one component. The covering portion includes a protruding coupling portion. The circuit board includes a receiving portion coupled to the coupling portion, and The coupling portion is housed within the receiving portion.

2. The electronic device according to claim 1, characterized in that, Also includes: A first support portion is located between the coupling portion and the receiving portion.

3. The electronic device according to claim 2, characterized in that, A portion of the first support portion is located within the receiving portion and has a constant thickness within the receiving portion.

4. The electronic device according to claim 1, characterized in that, The circuit board comprises multiple layers, and The receiving portion passes through at least one of the plurality of layers.

5. The electronic device according to claim 2, characterized in that, Also includes: The second support portion is located between the coupling portion and the first support portion.

6. The electronic device according to claim 5, characterized in that, The second support portion fills the space between the coupling portion and the opening defined by the first support portion.

7. The electronic device according to claim 1, characterized in that, The coupling portion includes a first coupling portion and a second coupling portion that bend from a portion of the coupling portion in different directions.

8. The electronic device according to claim 7, characterized in that, At least a portion of the first coupling portion is located below a first tip protruding from the side surface of the circuit board facing the receiving portion toward the receiving portion, and At least a portion of the second coupling portion is located below the second tip facing the first tip, and the receiving portion is between the first tip and the second tip.

9. The electronic device according to claim 1, characterized in that, The coupling portion includes multiple coupling portions. The receiving section includes multiple receiving sections. The plurality of coupling portions are spaced apart from each other, and The plurality of receiving portions are arranged to correspond to the plurality of coupling portions respectively.

10. An electronic device, characterized in that, include: Display panel; A circuit board on which at least one component is mounted and connected to the display panel; A cover portion, the cover portion being coupled to the circuit board, shielding the at least one component, and including a coupling portion protruding toward the circuit board; as well as A first support portion is located between the coupling portion and the circuit board. In the plan view, the first support portion includes: A first protrusion, the first protrusion projecting from a first end of the first support portion in a first direction, wherein the first support portion extends in a second direction different from the first direction; and The second protrusion protrudes from the second end of the first support portion opposite to the first end in a direction opposite to the second direction.

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